LMH6572
Triple 2:1 High Speed Video Multiplexer
General Description
The LMH®6572 is a high performance analog multiplexer op-
timized for professional grade video and other high fidelity
high bandwidth analog applications. The LMH6572 provides
a 290MHz bandwidth at 2 VPP output signal levels. The 140
MHz of .1 dB bandwidth and a 1500 V/µs slew rate make this
part suitable for High Definition Television (HDTV) and High
Resolution Multimedia Video applications.
The LMH6572 supports composite video applications with its
0.02% and 0.02° differential gain and phase errors for NTSC
and PAL video signals while driving a single, back terminated
75 load. The LM6572 can deliver 80 mA linear output current
for driving multiple video load applications.
The LMH6572 has an internal gain of 2 V/V (+6 dBv) for driv-
ing back terminated transmission lines at a net gain of 1 V/V
(0 dBv).
The LMH6572 is available in the SSOP package.
Features
350 MHz, 250 mV −3 dB bandwidth
290 MHz, 2 VPP −3 dB bandwidth
10 ns channel switching time
90 dB channel to channel isolation @ 5 MHz
0.02%, 0.02° diff. gain, phase
0.1 dB gain flatness to 140 MHz
1400 V/μs slew rate
Wide supply voltage range: 6V (±3V) to 12V (±6V)
−78 dB HD2 @ 10 MHz
−75 dB HD3 @ 10 MHz
Applications
RGB video router
Multi input video monitor
Fault tolerant data switch
Connection Diagram
16-Pin SSOP
20109605
Top View
Truth Table
SEL EN OUT
0 0 CH 1
1 0 CH 0
X 1 Disable
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing
16-Pin SSOP LMH6572MQ LH6572MQ 95 Units/Rail MQA16
LMH6572MQX 2.5 Units Tape and Reel
LMH® is a registered trademark of National Semiconductor Corporation.
PRODUCTION DATA information is current as of
publication date. Products conform to specifications per
the terms of the Texas Instruments standard warranty.
Production processing does not necessarily include
testing of all parameters.
201096 SNCS102E Copyright © 1999-2012, Texas Instruments Incorporated
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for
availability and specifications.
ESD Tolerance (Note 4)
Human Body Model 2000V
Machine Model 200V
Supply Voltage (V+ − V)13.2V
IOUT (Note 3)130 mA
Input Voltage Range ±(VS)
Maximum Junction Temperature +150°C (Note 4)
Storage Temperature Range −65°C to +150°C
Soldering Information
Infrared or Convection (20 sec) 235°C
Wave Soldering (10 sec) 260°C
Operating Ratings
(Note 1)
Operating Temperature −40 °C to 85 °C
Supply Voltage Range 6V to 12V
Thermal Resistance
Package (θJA) (θJC)
16-Pin SSOP 125°C/W 36°C/W
±5V Electrical Characteristics
Unless otherwise specified, VS = ±5V, RL = 100Ω.
Symbol Parameter Conditions (Note 2)Min Typ Max Units
Frequency Domain Performance
SSBW −3 dB Bandwidth VOUT = 0.25 VPP 350 MHz
LSBW –3 dB Bandwidth (Note 6) VOUT = 2 VPP 250 290 MHz
.1 dBBW 0.1 dB Bandwidth VOUT = 0.25 VPP 140 MHz
DG Differential Gain RL = 150Ω, f = 4.43 MHz 0.02 %
DP Differential Phase RL = 150Ω, f = 4.43MHz 0.02 deg
Time Domain Response
TRS Channel to Channel Switching Time Logic Transition to 90% Output 10 ns
Enable and Disable Times Logic Transition to 90% or 10% Output 11 ns
TRL Rise and Fall Time 2V Step 1.5 ns
TSS Settling Time to 0.05% 2V Step 17 ns
OS Overshoot 4V Step 5 %
SR Slew Rate (Note 6) 4V Step 1200 1400 V/μs
Distortion
HD2 2nd Harmonic Distortion 2 VPP , 10 MHz −78 dBc
HD3 3rd Harmonic Distortion 2 VPP , 10 MHz −75 dBc
IMD 3rd Order Intermodulation Products 10 MHz, Two tones 2 VPP at Output −80 dBc
Equivalent Input Noise
VN Voltage >1 MHz, Input Referred 5 nV
ICN Current >1 MHz, Input Referred 5 pA/
Static, DC Performance
GAIN Voltage Gain 2.0 V/V
Gain Error (Note 5)No load, with respect to nominal gain of
2.00 V/V.
±0.3 ±0.5
±0.7 %
LMH6572
2 Copyright © 1999-2012, Texas Instruments Incorporated
Symbol Parameter Conditions (Note 2)Min Typ Max Units
Gain Error RL = 50Ω, with respect to nominal gain
of 2.00 V/V
0.3 %
VIO Output Offset Voltage(Note 5) VIN = 0V 1 ±14
±17.5 mV
DVIO Average Drift 27 µV/°C
IBN Input Bias Current (Note 5, Note 7) VIN = 0V −1.4 ±5.0
±5.6
µA
DIBN Average Drift 7 nA/°C
PSRR Power Supply Rejection Ratio (Note
5)
DC, Input referred 50
48
54 dB
ICC Supply Current(Note 5) No load 20 23 25
28.5 mA
Supply Current Disabled (Note 5) No load 2.0 2.2
2.3 mA
VIH Logic High Threshold(Note 5) Select & Enable Pins 2.0 V
VIL Logic Low Threshold (Note 5) Select & Enable Pins 0.8 V
IiL Logic Pin Input Current Low (Note 7) Logic Input = 0V −1 ±5.0
±15 µA
IiH Logic Pin Input Current High (Note 7) Logic Input = 2.0V 112
100
150 200
210 µA
Miscellaneous Performance
RF Internal Feedback and Gain Set
Resistor Values
650
620
800 940
1010
RODIS Disabled Output Resistance Internal Feedback and Gain Set
Resistors in Series to Ground
1.3 1.6 1.88 k
RIN+ Input Resistance 100 k
CIN Input Capacitance 0.9 pF
ROUT Output Resistance 0.26
VO Output Voltage Range No Load ±3.83
±3.80
±3.9 V
VOL RL = 100Ω ±3.52
±3.5
±3.53 V
CMIR Input Voltage Range ±2 ±2.5 V
IO Linear Output Current (Note 5, Note
7)
VIN = 0V +70
40
±80 mA
ISC Short Circuit Current (Note 3) VIN = ±2V, Output Shorted to Ground ±230 mA
XTLK Channel to Channel Crosstalk VIN = 2 VPP @5 MHz -90 dBc
XTLK Channel to Channel Crosstalk VIN = 2 VPP @ 100 MHz -54 dBc
XTLK All Hostile Crosstalk In A, C. Out B, VIN = 2 VPP @ 5 MHz -95 dBc
±3.3V Electrical Characteristics
Unless otherwise specified, VS = ±3.3V, RL = 100Ω.
Symbol Parameter Conditions (Note 2)Min Typ Max Units
Frequency Domain Performance
SSBW −3 dB Bandwidth VOUT = 0.25 VPP 360 MHz
LSBW −3 dB Bandwidth VOUT = 2.0 VPP 270 MHz
0.1 dBBW 0.1 dB Bandwidth VOUT = 0.5 VPP 80 MHz
GFP Peaking DC to 200 MHz 0.3 dB
DG Differential Gain RL = 150Ω, f=4.43 MHz 0.02 %
DP Differential Phase RL = 150Ω, f=4.43 MHz 0.03 deg
LMH6572
Copyright © 1999-2012, Texas Instruments Incorporated 3
Symbol Parameter Conditions (Note 2)Min Typ Max Units
Time Domain Response
TRL Rise and Fall Time 2V Step 2.0 ns
TSS Settling Time to 0.05% 2V Step 15 ns
OS Overshoot 2V Step 5 %
SR Slew Rate 2V Step 1000 V/μs
Distortion
HD2 2nd Harmonic Distortion 2 VPP, 10 MHz −70 dBc
HD3 3rd Harmonic Distortion 2 VPP, 10 MHz −74 dBc
IMD 3rd Order Intermodulation Products 10 MHz, Two tones 2 VPP at Output -79 dBc
Static, DC Performance
GAIN Voltage Gain 2.0 V/V
VIO Output Offset Voltage VIN = 0V 1 mV
DVIO Average Drift 36 µV/°C
IBN Input Bias Current (Note 7) VIN = 0V 2 μA
DIBN Average Drift 24 nA/°C
PSRR Power Supply Rejection Ratio DC, Input Referred 54 dB
ICC Supply Current RL = 20 mA
VIH Logic High Threshold Select & Enable Pins 1.3 V
VIL Logic Low Threshold Select & Enable Pins 0.4 V
Miscellaneous Performance
RIN+ Input Resistance 100 k
CIN Input Capacitance 0.9 pF
ROUT Output Resistance 0.27
VO Output Voltage Range No Load ±2.5 V
VOL RL = 100Ω ±2.2 V
CMIR Input Voltage Range ±1.2 V
IO Linear Output Current VIN = 0V ±60 mA
ISC Short Circuit Current VIN = ±1V, Output Shorted to Ground ±150 mA
XTLK Channel to Channel Crosstalk 5 MHz -90 dBc
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.
Note 2: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where TJ >
TA. See Applications Section for information on temperature de-rating of this device. Min/Max ratings are based on product testing, characterization and simulation.
Individual parameters are tested as noted.
Note 3: The maximum output current (IOUT) is determined by the device power dissipation limitations. See the Power Dissipation section of the Application Section
for more details. A short circuit condition should be limited to 5 seconds or less.
Note 4: Human Body Model, 1.5 k in series with 100 pF. Machine Model 0 In series with 200 pF.
Note 5: Parameters guaranteed by electrical testing at 25° C.
Note 6: Parameters guaranteed by design.
Note 7: Positive Value is current into device.
LMH6572
4 Copyright © 1999-2012, Texas Instruments Incorporated
Typical Performance Characteristics
Unless otherwise specified, VS = ±5V, RL = 100Ω.
Frequency Response vs. VOUT
20109602
Frequency Response vs. VOUT
20109601
Frequency Response vs. Capacitive Load
20109613
Suggested RS vs. Capacitative Load
Load = 1k || CL
20109604
LMH6572
Copyright © 1999-2012, Texas Instruments Incorporated 5
Harmonic Distortion vs. Output Voltage
20109611
Harmonic Distortion vs. Output Voltage
20109612
Harmonic Distortion vs. Frequency
20109603
Harmonic Distortion vs. Frequency
20109610
Harmonic Distortion vs. Supply Voltage
20109616
Channel Switching Time
20109621
LMH6572
6 Copyright © 1999-2012, Texas Instruments Incorporated
Disable Time
20109626
Pulse Response
20109625
Crosstalk
20109614
PSRR
20109607
PSRR
20109606
Closed Loop Output Impedance
20109609
LMH6572
Copyright © 1999-2012, Texas Instruments Incorporated 7
Closed Loop Output Impedance
20109608
LMH6572
8 Copyright © 1999-2012, Texas Instruments Incorporated
Application Notes
GENERAL INFORMATION
The LMH6572 is a high-speed triple 2:1 analog multiplexer, optimized for very high speed and low distortion. With a fixed gain of
2 and excellent AC performance, the LMH6572 is ideally suited for switching high resolution, presentation grade video signals. The
LMH6572 has no internal ground reference. Single or split supply configurations are both possible. The LMH6572 features very
high speed channel switching and disable times. When disabled the LMH6572 output is high impedance, making multiplexer
expansion possible by combining multiple devices.
SINGLE SUPPLY OPERATION
The LMH6572 uses mid-supply referenced circuits for the select and disable pins. In order to use the LMH6572 in single supply
configuration, it is necessary to use a circuit similar to Figure 3. In this configuration the logical inputs are compatible with high
breakdown open collector TTL, or open drain CMOS logic. In addition, the default logic state is reversed since there is a pull-up
resistor on those pins. Single supply operation also requires the input to be biased to within the common mode input range of
roughly ±2V from the mid-supply point.
20109622
FIGURE 1. Typical Application
20109623
FIGURE 2. Single Supply Application
LMH6572
Copyright © 1999-2012, Texas Instruments Incorporated 9
VIDEO PERFORMANCE
The LMH6572 has been designed to provide excellent performance with production quality video signals in a wide variety of formats
such as HDTV and High Resolution VGA. Best performance will be obtained with back-terminated loads. The back termination
reduces reflections from the transmission line and effectively masks transmission line and other parasitic capacitances from the
amplifier output stage. Figure 1 shows a typical configuration for driving a 75 cable. The output buffer is configured for a gain of
2, so using back terminated loads will give a net gain of 1.
GAIN ACCURACY
The gain accuracy of the LMH6572 is accurate to ±0.5% (0.3% typical) and stable over temperature. The internal gain setting
resistors, RF and RG, match very well; however, over process and temperature their absolute value will change.
EXPANDING THE MULTIPLEXER
It is possible to build higher density multiplexers by paralleling several LMH6572s. Figure 3 shows a 4:1 RGB MUX using two
LMH6572s:
20109618
FIGURE 3. RGB MUX Using Two LMH6572's
If it is important in the end application to make sure that no two inputs are presented to the output at the same time, an optional
delay block can be added prior to the ENABLE (EN) pin of each device, as shown. Figure 4 shows one possible approach to this
delay circuit. The delay circuit shown will delay ENABLE’s H to L transitions (R1 and C1 decay) but will not delay its L to H transition.
20109619
FIGURE 4. Delay Circuit Implementation
LMH6572
10 Copyright © 1999-2012, Texas Instruments Incorporated
R2 should be kept small compared to R1 in order to not reduce the ENABLE voltage and to produce little or no delay to the
ENABLE L to H transition.
With the ENABLE pin putting the output stage into a high impedance state, several LMH6572’s can be tied together to form a larger
input MUX. However, there is a slight loading effect on the active output caused by the off-channel feedback and gain set resistors,
as shown in Figure 4. Figure 5 is assuming there are four LMH6572 devices tied together to form a triple 8:1 MUX. With the internal
resistors valued at approximately 800, the gain error is about -0.57 dB, or about −6%.
20109617
FIGURE 5. Multiplexer Input Expansion by Combining Outputs
An alternate approach would be to tie the outputs directly together and let all devices share a common back termination resistor in
order to alleviate the gain error issue above.
The drawback in this case is the increased capacitive load presented to the output of each LMH6572 due to the offstate capacitance
of the LMH6572.
Other Applications
The LMH6572 may be utilized in systems that involve a single RGB channel as well whenever there is a need to switch between
different “flavors” of a single RGB input.
Here are some examples:
1. RGB positive polarity, negative polarity switch
2. RGB full resolution, high-pass filter switch
In each of these applications, the same RGB input occupies one set of inputs to the LMH6572 and the other “flavor” would be tied
to the other input set.
DRIVING CAPACITIVE LOADS
Capacitive output loading applications will benefit from the use of a series output resistor. Figure 6 shows the use of a series output
resistor, ROUT, to stabilize the amplifier output under capacitive loading. Capacitive loads of 5 to 120 pF are the most critical, causing
ringing, frequency response peaking and possible oscillation. Figure 7 gives a recommended value for selecting a series output
resistor for mitigating capacitive loads. The values suggested in the charts are selected for .5 dB or less of peaking in the frequency
response. This gives a good compromise between settling time and bandwidth. For applications where maximum frequency re-
sponse is needed and some peaking is tolerable, the value of ROUT can be reduced slightly from the recommended values.
20109624
FIGURE 6. Decoupling Capacitive Loads
LMH6572
Copyright © 1999-2012, Texas Instruments Incorporated 11
20109604
FIGURE 7. Recommended ROUT vs. Capacitive Load
20109613
FIGURE 8. Frequency Response vs. Capacitive Load
LAYOUT CONSIDERATIONS
Whenever questions about layout arise, use the LMH730151 evaluation board as a guide. To reduce parasitic capacitances, ground
and power planes should be removed near the input and output pins. For long signal paths controlled impedance lines should be
used, along with impedance matching elements at both ends. Bypass capacitors should be placed as close to the device as possible.
Bypass capacitors from each rail to ground are applied in pairs. The larger electrolytic bypass capacitors can be located farther
from the device; however, the smaller ceramic capacitors should be placed as close to the device as possible. In Figure 1 and
Figure 2, the capacitor between V+ and V is optional, but is recommended for best second harmonic distortion. Another way to
enhance performance is to use pairs of .01 μF and 0.1 μF ceramic capacitors for each supply bypass.
POWER DISSIPATION
The LMH6572 is optimized for maximum speed and performance in the small form factor of the standard SSOP package. To achieve
its high level of performance, the LMH6572 consumes 23 mA of quiescent current, which cannot be neglected when considering
the total package power dissipation limit. To ensure maximum output drive and highest performance, thermal shutdown is not
provided. Therefore, it is of utmost importance to make sure that the TJMAX is never exceeded due to the overall power dissipation.
Follow these steps to determine the Maximum power dissipation for the LMH6572:
1. Calculate the quiescent (no-load) power: PAMP = ICC* (VS), where VS = V+ - V.
2. Calculate the RMS power dissipated in the output stage: PD (rms) = rms ((VS - VOUT) * IOUT), where VOUT and IOUT are the
voltage across and the current through the external load and VS is the total supply voltage.
3. Calculate the total RMS power: PT = PAMP + PD.
The maximum power that the LMH6572 package can dissipate at a given temperature can be derived with the following equation:
PMAX = (150° – TAMB)/ θJA, where TAMB = Ambient temperature (°C) and θJA = Thermal resistance, from junction to ambient, for a
given package (°C/W). For the SSOP package θJA is 125 °C/W.
LMH6572
12 Copyright © 1999-2012, Texas Instruments Incorporated
ESD PROTECTION
The LMH6572 is protected against electrostatic discharge (ESD) on all pins. The LMH6572 will survive 2000V Human Body model
and 200V Machine model events. Under normal operation the ESD diodes have no effect on circuit performance. There are oc-
casions, however, when the ESD diodes will be evident. If the LMH6572 is driven by a large signal while the device is powered
down the ESD diodes will conduct. The current that flows through the ESD diodes will either exit the chip through the supply pins
or will flow through the device, hence it is possible to power up a chip with a large signal applied to the input pins. Shorting the
power pins to each other will prevent the chip from being powered up through the input.
EVALUATION BOARDS
Texas Instruments provides the following evaluation boards as a guide for high frequency layout and as an aid in device testing
and characterization. Many of the datasheet plots were measured with these boards.
Device Package Evaluation Board Part Number
LMH6572 TSSOP LMH730151
An evaluation board can be shipped when a device sample request is placed with Texas Instruments.
LMH6572
Copyright © 1999-2012, Texas Instruments Incorporated 13
Physical Dimensions inches (millimeters) unless otherwise noted
14-Pin SOIC
NS Package Number M14A
LMH6572
14 Copyright © 1999-2012, Texas Instruments Incorporated
Notes
LMH6572
Copyright © 1999-2012, Texas Instruments Incorporated 15
Notes
Copyright © 1999-2012, Texas Instruments
Incorporated
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