For FPC FPC connectors (0.3mm pitch) Back lock with FPC holding contacts Y3BW Series 2. High holding force has been achieved in addition to a structure able to temporarily hold the FPC. 3. Excellent workability New Structure to lock notches on both ends of the FPC with holding contacts Applicable FPC shapes (1) The inserted FPC can be temporarily held until the lever is closed. (2) When the lever is closed, the holding contacts lock the FPC by its notches, enhancing the FPC holding force. 4. Mechanical design freedom achieved by top and bottom double contacts 5. Easy-to-handle back lock structure 6. Wiring patterns can be located underneath the connector. 7. Man-hours for assembly can be reduced by delivering the connectors with their levers opened. Compliance with RoHS Directive FEATURES APPLICATIONS Compact mobile devices "Cellular phones, Smartphones, Tablet PC, Digital cameras and DVC, etc" 0.9 1. Ultra slim and low profile design (Pitch: 0.3 mm) The adoption of the back lock has achieved the ultra-slim body with a 3.15 mm depth (including the lever). The 0.9 mm low-profile facilitates the thickness and size reduction of target equipment. 5 3.1 Unit: mm ORDERING INFORMATION AYF 3 3 6 5 33: FPC Connector 0.3 mm pitch (Back lock) Number of contacts (2 digits) Contact direction 6: Top and bottom contacts, lock holding type Surface treatment (Contact portion / Terminal portion) 5: Au plating/Au flash plating (Ni barrier) ACCTB16E 201109-T 2011.09 panasonic-electric-works.net/ac 1 AYF33 PRODUCT TYPES Height Number of contacts Part number 0.9 mm 11 25 51 AYF331165 AYF332565 AYF335165 Packing Inner carton (1-reel) Outer carton 5,000 pieces 10,000 pieces Notes: 1. Order unit; For mass production: in 1-inner carton (1-reel) units Samples for mounting check: in 50-connector units. Please contact our sales office. 2. Please contact our sales office for connectors having a number of contacts other than those listed above. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Insulation resistance Specifications 0.2A/contact 50V AC/DC Min. 1,000M (initial) Breakdown voltage 150V AC for 1 min. Contact resistance Max. 100m FPC holding force Min. 0.13N/contacts x contacts + 1.00N (initial) Contact holding force Min. 0.20N/contacts Ambient temperature -55C to +85C -55C to +85C (product only) -40C to +50C (emboss packing) No freezing at low temperatures. No dew condensation. 5 cycles, insulation resistance min. 100M, contact resistance max. 100m Sequence 1. -55 -30 C, 30 minutes 2. ~ , Max. 5 minutes 3. 85 +30 C, 30 minutes 4. ~ , Max. 5 minutes Storage temperature Thermal shock resistance (with FPC inserted) Environmental characteristics Humidity resistance (with FPC inserted) Saltwater spray resistance (with FPC inserted) H2S resistance (with FPC inserted) Soldering heat resistance Lifetime characteristics Unit weight Insertion and removal life 120 hours, insulation resistance min. 100M, contact resistance max. 100m 24 hours, insulation resistance min. 100M, contact resistance max. 100m 48 hours, contact resistance max. 100m Peak temperature: 260C or less 300C within 5 sec. 350C within 3 sec. 20 times Conditions Using 250V DC megger (applied for 1 min.) No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C 5402. Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed Measuring the maximum force. As the contact and holding contact are axially pull out. Bath temperature 402C, humidity 90 to 95% R.H. Bath temperature 352C, saltwater concentration 51% Bath temperature 402C, gas concentration 31 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated insertion and removal: min. 10 sec./time 51-contact type: 0.09 g 2. Material and surface treatment Part name Molded portion Material Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Contact Copper alloy Holding contact Copper alloy Surface treatment -- Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Base: Ni plating, Surface: Au plating ACCTB16E 201109-T AYF33 DIMENSIONS (Unit: mm) A 0.600.10 (Contact pitch) 0.300.10 (Contact pitch) 0.600.10 (Contact pitch) (3.15) 0.900.10 Holding contacts (The holding contacts cannot be used as conductors.) (1.84) (1.35) (Suction area) Terminal coplanarity (1.35) (FPC insertion depth) 0.1 (2.95) (Contact and holding contact) (0.40) B0.20 (0.10) General tolerance: 0.3 (0.10) A B C D 5.40 3.00 2.40 3.60 25 51 9.60 17.40 7.20 15.00 6.60 14.40 7.80 15.60 A B C (0.30) C0.20 (0.10) Number of contacts/ dimension 11 D0.20 0.45 +0.03 -0.05 0.900.07 0.600.02 (Pitch) ACCTB16E 201109-T 0.10 max. 0.200.02 0.30 +0.04 -0.03 (Contact width) 0.200.03 3.000.50 (Support plates) .20 .20 R0 1.450.10 0.750.05 0.15 max. 20 0. R 2- R0 1.350.15 1.450.15 1.550.15 2.000.30 (Exposed part of the conductor) 0.600.07 A0.05 B0.03 C0.03 0.600.02 (Pitch) 0.300.02 (Pitch) 0.30 +0.04 -0.03 (Contact width) 0.10 max. 0.650.10 0.750.10 Recommended FPC dimensions (Finished thickness: t = 0.20.03) The conductive parts should be based by Ni plating and then Au plating. Number of contacts/ dimension 11 4.20 3.00 2.40 25 51 8.40 16.20 7.20 15.00 6.60 14.40 AYF33 EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type) * Specifications for taping Tape I Tape II A: Max. 24 mm (A0.3) A: 32 mm (A0.3) 28.40 (1.75) (B) * Specifications for the plastic reel (In accordance with EIAJ ET-7200B) (C1) (1.75) (B) Taping reel (2.0) (4.0) Embossed carrier tape Embossed mounting-hole (8.0) (8.0) 380 dia. (2.0) (4.0) Leading direction after packaging Top cover tape Label a. i .1 d +0 0.0 0 1.5 a. i .1 d +0 0.0 0 1.5 * Dimension table (Unit: mm) Number of contacts 11 contacts 25 contacts 51 contacts Type of taping Tape I Tape I Tape II A 16.0 24.0 32.0 B 7.5 11.5 14.2 C 17.4 25.4 33.4 Quantity per reel 5,000 5,000 5,000 * Connector orientation with respect to embossed tape feeding direction Type Y3BW Direction of tape progress NOTES Connector outline (lever opened) 0.300.03 0.300.03 0.300.03 0.600.03 : Insulation area Contacts 0.300.03 0.600.01 0.270.01 0.300.01 0.700.03 0.500.03 0.300.03 0.600.03 B0.05 : Insulation area 0.270.01 0.600.01 Number of contacts/ dimension 11 3.00 2.40 3.60 25 51 7.20 15.00 6.60 14.40 7.80 15.60 C (0.29) 3.200.03 Holding contacts 2.260.01 2.940.01 0.600.03 0.300.03 Recommended metal mask pattern Metal mask thickness: When 120 m (Terminal opening ratio: 50%) (Metal-part opening ratio: 51%) (0.39) D0.05 C0.05 0.300.03 B 0.500.03 0.600.03 0.300.03 3.200.03 Recommended PC board pattern (Mount pad arrangement pattern) (TOP VIEW) Recommended PC board pattern (TOP VIEW) 0.700.03 1. Recommended PC board and metal mask patterns Appropriate control of solder amount is required to minimize solder bridges and other defects for connectors with 0.2 mm or 0.3 mm pitch terminals, which require high-density mounting. Refer to the recommended pattern. D ACCTB16E 201109-T AYF33 2. Holding contacts The holding contacts cannot be used as conductors. The holding contacts are located on both ends of the contacts, and the shape of the soldered portions is the same as that of the other contacts. Therefore, be careful to avoid any confusion. 3. Precautions for insertion/removal of FPC Avoid touching the lever (applying any external force) until an FPC is inserted. Do not open/close the lever without an FPC inserted. Failure to follow this instruction will cause the contacts to warp, leading to the contact tips interfering with the insertion of an FPC, deforming the terminals. Failure to follow this instruction may cause the lever to be removed, terminals to be deformed, and/or the FPC insertion force to increase. Without an FPC inserted These connectors are of the back lock type, which has the FPC insertion section on the opposite side of the lever. Be careful not to make a mistake in the FPC insertion position or the lever opening/closing position. Otherwise, a contact failure or connector breakage may occur. These connectors have top and bottom double contacts. Do not insert an FPC upside down. Inserting an FPC in a direction opposite to that you intended may cause an operation failure or malfunction. Insert an FPC with the lever opened at right angle, that is, in the factory default position. Completely insert the FPC horizontally. An FPC inserted at an excessive angle to the board may cause the deformation of metal parts, FPC insertion failures, and FPC circuit breakages. Insert the FPC to the full depth of the connector without altering the angle. Do not apply an excessive load to the lever in the opening direction beyond its open position; otherwise, the lever may be deformed or removed. Do not apply an excessive load to the lever in a direction perpendicular to the lever rotation axis or in the lever opening direction; otherwise, the terminals may be deformed, and the lever may be removed. To close the lever, turn down the lever by pressing the entire lever or both sides of the lever with the balls of fingers. Be careful. If pressure to the lever is applied unevenly, such as to an edge only, it may deform or break. Also, make sure that the lever is closed completely. Not doing so will cause a faulty connection. Avoid applying an excessive load to the top of the lever during or after closing the lever. Otherwise, the terminals may be deformed. When opening the lever to remove the FPC, ensure that the lever will not go over the initial position; otherwise, the lever may be removed. To open the lever, a load applied to the lever unevenly or on only one side may deform and break the lever. Remove the FPC at parallel with the lever fully opened. If the lever is closed, or if the FPC is forcedly pulled, the product or FPC may break. If a lever is accidentally detached during the handling of a connector, do not use the connector any longer. After an FPC is inserted, carefully handle it so as not to apply excessive stress to the base of the FPC. Please follow the precautions below when wiring the connected FPC. Depending on the conditions of use, conduction failures, connector breakage, removal of the lever lock, FPC breaks/ damage, or other problems may be caused. * Carefully wiring the FPC so as not to apply a load directly to the connector. * Avoid sharply bending the FPC by the base at the FPC insertion point of the connector. * Keep the wired points of the FPC free from a load. * Fix the FPC if it is possible that a load may be applied to the FPC. * Keep the FPC notches free from a bending load. Bending stress tends to concentrate on notches and may cause the FPC to be broken or damaged. FPC notches portion For other details, please verify with the product specification sheets. ACCTB16E 201109-T AYF33 NOTES FOR USE (COMMON) 1. PC board design Design the recommended foot pattern in order to secure the mechanical strength in the soldered areas of the terminal. * The recommended reflow temperature profile is given in the figure below. Recommended reflow temperature profile Upper limit (Soldering heat resistance) Lower limit (Solder wettability) 2. FPC and equipment design Design the FPC based on the recommended dimensions to ensure the required connector performance. In addition, carefully check the equipment design and take required measures for the equipment to prevent the FPC from being removed subsequent to a fall, vibration, or other impact due to the FPC size, weight, or the reaction force of the routed FPC. 3. Connector mounting In case the connector is picked up by chucking during mounting, an excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. 4. Soldering 1) Manual soldering * Due to the low profile, if an excessive amount of solder is applied to this product during manual soldering, the solder may creep up to near the contact points, or interference by solder may cause imperfect contact. * Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. * Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use. * Be aware that a load applied to the connector terminals while soldering may displace the contact. * Thoroughly clean the iron tip. 2) Reflow soldering * Screen-printing is recommended for printing paste solder * To determine the relationship between the screen opening area and the PC board foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks when setting. * Note that excess solder on the terminals prevents complete insertion of the FPC, and that excess solder on the metal clips prevents the lever from rotating. * Note that excess solder inhibits the slider lock operation. Terminal Temperature 260C 230C 180C * Screen thickness of 120m is recommended for paste solder printing. * Consult us when using a screen-printing thickness other than that recommended. * Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. Preheating 220C 200C 25 sec. 150C 60 to 120 sec. 70 sec. Time * The temperature is measured on the surface of the PC board near the connector terminal. * Some solder and flux types may cause serious solder creeping. Take the solder and flux characteristics into consideration when setting the reflow soldering conditions. * When performing reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector using, for example, an adhesive. (Double reflow soldering on the same side is possible) 3) Reworking on a soldered portion * Finish reworking in one operation. * For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise, the flux may creep to the contact parts. * Use a soldering iron whose tip temperature is within the temperature range specified in the specifications. 5. Do not drop the product or handle carelessly. Otherwise, the terminals may become deformed due to excessive force or the solderability during reflow soldering may degrade. 6. Don't open/close the lever or insert/remove an FPC until the connector is soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. In addition, do not insert an FPC into the connector before soldering the connector. 7. When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive forces. Paste solder PC board foot pattern Peak temperature Do not the soldered areas to be subjected to forces 8. Other notes When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching. For other details, please verify with the product specification sheets. Panasonic Electric Works Co., Ltd. Automation Controls Business Unit Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan 6 Telephone: +81-6-6908-1050 panasonic-electric-works.net/ac Facsimile: +81-6-6908-5781 All Rights Reserved (c) 2011 COPYRIGHT Panasonic Electric Works ACCTB16E 201109-T Specifications are subject to change without notice. ACCTB16E 201109-T Printed in Japan.