DMC3021LSD
Document number: DS32152 Rev. 1 - 2 1 of 8
www.diodes.com May 2010
© Diodes Incorporated
DMC3021LSD
NEW PRODUCT
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
N-Channel: 21m @ 10V
32m @ 4.5V
P-Channel: 39m @ 10V
53m @ 4.5V
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Complementary Pair MOSFET
Lead Free/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals Connections: See Diagram
Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 6
Ordering Information: See Page 6
Weight: 0.072 grams (approximate)
Maximum Ratings N-CHANNEL – Q1 @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Drain-Source Voltage VDSS 30 V
Gate-Source Voltage VGSS ±20 V
Continuous Drain Current (Note 3) Steady
State TA = 25°C
TA = 85°C ID 8.5
7.1 A
Pulsed Drain Current (Note 4) IDM 26 A
Maximum Ratings P-CHANNEL – Q2 @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Drain-Source Voltage VDSS -30 V
Gate-Source Voltage VGSS ±20 V
Continuous Drain Current (Note 3) Steady
State TA = 25°C
TA = 85°C ID -7.0
-4.5 A
Pulsed Drain Current (Note 4) IDM -25 A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Power Dissipation (Note 3) PD 2.5 W
Thermal Resistance, Junction to Ambient (Note 3) RθJA 50 °C/W
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, with minimum recommended pad layout.
4. Repetitive rating, pulse width limited by junction temperature.
SO-8
Top View Top View
D
1
S
1
G
1
D
2
S
2
G
2
N-Channel MOSFET P-Channel MOSFET
S2
D1
S1
D2
G1
G2 D2
D1
DMC3021LSD
Document number: DS32152 Rev. 1 - 2 2 of 8
www.diodes.com May 2010
© Diodes Incorporated
DMC3021LSD
NEW PRODUCT
Electrical Characteristics N-CHANNEL – Q1 @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage BVDSS 30 - - V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = 25°C IDSS - - 1.0
μA VDS = 30V, VGS = 0V
Gate-Source Leakage IGSS - - ±100 nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage VGS
(
th
)
1 1.45 2.1 V
VDS = VGS, IC = 250μA
Static Drain-Source On-Resistance RDS (ON) - 14 21 mΩ VGS = 10V, IC = 7A
18 32 VGS = 4.5V, IC = 5.6A
Forward Transfer Admittance |Yfs| - 8.1 - S
VDS = 5V, IC = 7A
Diode Forward Voltage (Note 5) VSD - 0.7 1.0 V
VGS = 0V, IS = 1A
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance Ciss - 767 - pF VDS = 10V, VGS = 0V,
f = 1.0MHz
Output Capacitance Coss - 110 - pF
Reverse Transfer Capacitance Crss - 105 - pF
Gate Resistance R
g
- 1.4 - Ω VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (4.5V) Q
g
- 7.8 - nC VGS = 10V, VDS = 15V,
ID = 9A
Total Gate Charge (10V) Q
g
- 16.1 - nC
Gate-Source Charge Q
g
s - 1.8 - nC
Gate-Drain Charge Q
g
d - 2.5 - nC
Turn-On Delay Time tD
(
on
)
- 5.0 - ns
VGS = 10V, VDS = 15V,
RG = 6 , ID = 1A
Turn-On Rise Time t
r
- 4.5 - ns
Turn-Off Delay Time tD
(
off
)
- 26.3 - ns
Turn-Off Fall Time tf - 8.55 - ns
0 0.5 1 1.5 2
Fig. 1 Typical Output Characteristics
V , DRAIN-SOURCE VOL TAGE (V)
DS
0
5
10
15
30
I, D
R
AI
N
C
U
R
R
E
N
T
(A)
D
25
20
V = 2.0V
GS
V = 2.5V
GS
V = 3.0V
GS
V = 4.5V
GS
V = 8.0V
GS
0
5
10
15
20
25
30
012 34
Fig. 2 Typical Transfer Characteristics
V , GA T E SOURCE VOL TAGE (V)
GS
I, D
R
AIN
C
U
R
R
EN
T
(A)
D
V = 5V
DS
T = -55°C
A
T = 25°C
A
T = 125°C
A
T = 150°C
A
T = 85°C
A
DMC3021LSD
Document number: DS32152 Rev. 1 - 2 3 of 8
www.diodes.com May 2010
© Diodes Incorporated
DMC3021LSD
NEW PRODUCT
0.01
0.1
1
0 5 10 15 20 25 30
Fig. 3 Typical On-Resistance
vs . Dr ai n Cu rrent and G at e Vol t age
I , DRAIN-SOURCE CURRENT (A)
D
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
Ω
V = 4.5V
GS
V = 2.5V
GS
0 5 10 15 20 25 30
I , DRAIN CURRENT (A)
Fig. 4 Typical Drain-Source On-Resistance
vs . Dr ai n Cu rrent and Tem per at ur e
D
0
0.01
0.02
0.03
0.06
R
, D
R
AI
N
-S
O
U
R
C
E
O
N
-
R
ESIS
T
A
N
C
E ( )
DS(ON)
Ω
0.05
0.04
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
V = 4.5V
GS
0.6
0.8
1.0
1.2
1.4
1.6
Fig. 5 On-Resistance V ariation with Temperature
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
R , DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
DS(ON)
V = 10V
I = 11.6A
GS
D
V = 4.5V
I = 10A
GS
D
Fig. 6 On-R esist ance Variat io n with Tem per at ur e
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
0
0.01
0.02
0.03
0.0
R
, D
R
AI
N
-S
O
U
R
C
E
O
N
-
R
ESIS
T
A
N
C
E ( )
DS(ON)
Ω
0.04
V = 10V
I = 11.6 A
GS
D
V = 4.5V
I = 10A
GS
D
0
0.4
0.8
1.2
1.6
2.0
2.4
Fig. 7 Gate Threshold V ariation vs. Ambient Temperature
-50 -25 0 25 50 75 100 125 150
T , AMBIENT TEMPERA TURE (°C)
A
V , GATE THRESHOLD VOLT AGE (V)
GS(TH)
I = 1mA
D
I = 250µA
D
0
4
8
12
16
20
0 0.2 0.4 0.6 0.8 1.0 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fi g. 8 Dio de For war d Vol t ag e vs. Cur r ent
I, S
O
U
R
C
E
C
U
R
R
ENT (A)
S
T = 25°C
A
DMC3021LSD
Document number: DS32152 Rev. 1 - 2 4 of 8
www.diodes.com May 2010
© Diodes Incorporated
DMC3021LSD
NEW PRODUCT
10
100
1,000
10,000
0 5 10 15 20 25 30
Fig. 9 Typical Capacitance
V , DRAIN-SOURCE VOLTAGE (V)
DS
C
,
C
A
P
A
C
I
T
AN
C
E (p
F
)
f = 1MHz
C
iss
C
oss
C
rss
0 5 10 15 20 25 30
Fig. 10 Typical Drain-Source Leakage Current
vs. Drain-Source Voltage
V , DRAIN-SOURCE VOLTAGE (V)
DS
1
10
100
1,000
10,000
I, D
R
AIN-S
O
U
R
C
E LEAKA
G
E
C
U
R
R
EN
T
(nA)
DSS
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
Electrical Characteristics P-CHANNEL @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage BVDSS -30 - - V
VGS = 0V, ID = -250μA
Zero Gate Voltage Drain Current TJ = 25°C IDSS - - -1.0
μA VDS = -30V, VGS = 0V
Gate-Source Leakage IGSS - - ±100 nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage VGS
(
th
)
-1 -1.7 -2.2 V
VDS = VGS, ID = -250μA
Static Drain-Source On-Resistance RDS (ON) - 30 39 mΩ VGS = -10V, ID = -4.3A
42 53 VGS = -4.5V, ID = -3.7A
Forward Transfer Admittance |Yfs| - 7 - S
VDS = -5V, ID = -4.3A
Diode Forward Voltage (Note 5) VSD - -0.75 -1.0 V
VGS = 0V, IS = -1.7A
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance Ciss - 1002 - pF VDS = -10V, VGS = 0V,
f = 1.0MHz
Output Capacitance Coss - 125 - pF
Reverse Transfer Capacitance Crss - 118 - pF
Gate Resistance R
g
- 13 - Ω VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (4.5V) Q
g
- 10.1 - nC VGS = -4.5V, VDS = -15V,
ID = -6A
Total Gate Charge (10V) Q
g
- 21.1 - nC
Gate-Source Charge Q
g
s - 2.8 - nC
Gate-Drain Charge Q
g
d - 3.2 - nC
Turn-On Delay Time tD
(
on
)
- 10.1 - ns
VGS = -10V, VDS = -15V,
RG = 6 , ID = -1A
Turn-On Rise Time t
r
- 6.5 - ns
Turn-Off Delay Time tD
(
off
)
- 50.1 - ns
Turn-Off Fall Time tf - 22.2 - ns
Notes: 5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to production testing.
DMC3021LSD
Document number: DS32152 Rev. 1 - 2 5 of 8
www.diodes.com May 2010
© Diodes Incorporated
DMC3021LSD
NEW PRODUCT
0
5
10
15
20
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Fig . 11 Typi ca l O ut put C har act eristics
V , DRAIN-SOURCE VOL TAGE (V)
DS
I, D
R
AI
N
C
U
R
R
E
N
T
(A)
D
V = 2.5V
GS
V = 3.0V
GS
V = 4.5V
GS
V = 10V
GS
V = 3.5V
GS
V = 4.0V
GS
0
5
10
15
20
0123456
Fig. 12 Typical Transfer Characteristics
V , GATE SOURCE VOLTAGE (V)
GS
I, D
R
AIN
C
U
R
R
EN
T
(A)
D
V = 5V
DS
T = -55°C
A
T = 25°C
A
T = 125°C
A
T = 150°C
A
T = 85°C
A
0 5 10 15 20
Fig. 13 Typical On-Resistance
vs . Dr ai n Cu r re nt and G at e Voltage
I , DRAIN-SOURCE CURRENT (A)
D
0
0.02
0.04
0.06
0.10
R
, D
R
AIN-S
O
U
R
C
E
O
N-
R
ESIS
T
AN
C
E ( )
DS(ON)
Ω
0.08
V = 10V
GS
V = 4.5V
GS
0
0.02
0.04
0.06
0.08
0.10
0 5 10 15 20
R
, D
R
AIN-S
O
U
R
C
E
O
N-
R
ESIS
T
AN
C
E ( )
DS(ON)
Ω
I , DRAIN CURRENT (A)
Fig. 14 Typical Drain-Source On-Resistance
vs . Dr ain C urr ent and Temp er atu r e
D
V = 10V
GS
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
0.5
0.7
0.9
1.1
1.3
1.5
1.7
Fig. 15 On-Resistance Variation with Temperature
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERA TURE (°C)
J
R , DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
DS(ON)
V = 10V
I = 10A
GS
D
V = 4.5V
I = 5A
GS
D
Fig. 16 On-Resistance Variation with Temperature
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
0
0.01
0.02
0.03
0.04
0.05
0.08
R
, D
R
AIN-S
O
U
R
C
E
O
N-
R
ESIS
T
AN
C
E ( )
DS(ON)
Ω
0.07
0.06
V = 10V
I = 10A
GS
D
V = 4.5V
I = 5A
GS
D
DMC3021LSD
Document number: DS32152 Rev. 1 - 2 6 of 8
www.diodes.com May 2010
© Diodes Incorporated
DMC3021LSD
NEW PRODUCT
0
0.5
1.0
1.5
2.0
2.5
Fig. 17 Gate Threshold Variation vs. Ambient Temperature
-50 -25 0 25 50 75 100 125 150
T , AMBIENT TEMPERA TURE (°C)
A
V , GATE THRESHOLD VOLTAGE (V)
GS(TH)
I = 1mA
D
I = 250µA
D
0.4 0.6 0.8 1.0 1.2 1.4
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 18 Diode Forward Voltage vs. Current
0
4
8
12
16
20
I, S
O
U
R
C
E
C
U
R
R
EN
T
(A)
S
T = 25°C
A
10
100
1,000
10,000
0 5 10 15 20 25 30
Fig. 19 Typical Capacitance
V , DRAIN-SOURCE VOLTAGE (V)
DS
C
,
C
A
P
A
C
I
T
AN
C
E (p
F
)
f = 1MHz
C
iss
C
oss
C
rss
0 5 10 15 20 25 30
Fig. 20 Typical Drain-Source Leakage Current
vs. D r ai n- So ur ce Volta g e
V , DRAIN-SOURCE VOL TAGE (V)
DS
1
10
100
1,000
I, D
R
AIN-S
O
U
R
C
E LEAKA
G
E
C
U
R
R
EN
T
(nA)
DSS
10,000
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
Ordering Information (Note 7)
Part Number Case Packaging
DMC3021LSD-13 SO-8 2500/Tape & Reel
Notes: 7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
Top View
Logo
Part no.
Year:10” = 2010
Xth week: 01 ~ 53
1 4
8 5
C3021LD
YY WW
DMC3021LSD
Document number: DS32152 Rev. 1 - 2 7 of 8
www.diodes.com May 2010
© Diodes Incorporated
DMC3021LSD
NEW PRODUCT
Package Outline Dimensions
Suggested Pad Layout
SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
θ 0° 8°
All Dimensions in mm
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Gauge Plane
Seating Plane
Det ail ‘A
Det ail ‘A
E
E1
h
L
D
eb
A2
A1
A
45
°
7
°~
9
°
A3
0.254
X
C1
C2
Y
DMC3021LSD
Document number: DS32152 Rev. 1 - 2 8 of 8
www.diodes.com May 2010
© Diodes Incorporated
DMC3021LSD
NEW PRODUCT
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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