A PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 76007012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76007012A SNJ54LS 139AFK 7600701EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7600701EA SNJ54LS139AJ 7600701FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7600701FA SNJ54LS139AW 7700401EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7700401EA SNJ54S139J 7700401FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7700401FA SNJ54S139W JM38510/30702B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30702B2A JM38510/30702BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30702BEA JM38510/30702BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30702BFA JM38510/30702SEA ACTIVE CDIP J 16 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30702SEA JM38510/30702SFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30702SFA M38510/30702B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30702B2A M38510/30702BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30702BEA M38510/30702BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30702BFA M38510/30702SEA ACTIVE CDIP J 16 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30702SEA M38510/30702SFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30702SFA SN54LS139AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS139AJ SN54S139J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S139J Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) SN74LS139AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS139A SN74LS139ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS139A SN74LS139ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS139A SN74LS139ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS139A SN74LS139ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS139A SN74LS139ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS139A SN74LS139AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS139AN SN74LS139AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS139ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS139AN SN74LS139ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS139A SN74LS139ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS139A SN74LS139ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS139A SN74S139AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S139A SN74S139ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S139A SN74S139ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S139A SN74S139AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S139AN SN74S139AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S139ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SNJ54LS139AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 Addendum-Page 2 SN74S139AN 76007012A SNJ54LS Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 139AFK SNJ54LS139AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7600701EA SNJ54LS139AJ SNJ54LS139AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7600701FA SNJ54LS139AW SNJ54S139FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 139FK SNJ54S139J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7700401EA SNJ54S139J SNJ54S139W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7700401FA SNJ54S139W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF SN54LS139A, SN54LS139A-SP, SN74LS139A : * Catalog: SN74LS139A, SN54LS139A * Military: SN54LS139A * Space: SN54LS139A-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS139ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS139ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS139ADR SN74LS139ANSR SOIC D 16 2500 333.2 345.9 28.6 SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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