INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1218-R06 1
CPC1218
Voltage-Controlled, Single-Pole,
Normally Open, 4-Pin SIP OptoMOS® Relay
e3
Pb
Part # Description
CPC1218Y 4-Pin SIP (8-Pin Body) (25/tube)
CPC1218 Units
Blocking Voltage 60 VP
Load Current 600 mArms / mADC
On-Resistance (max) 1.1
Input Voltage to operate 5-12 V
Applications
Features
Description
Ordering Information
Pin Configuration
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Energy Meters
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• Voltage-Controlled Operation
• Designed for use in Security Systems Complying
with EN50130-4
• 2500Vrms Input/Output Isolation
• 100% Solid State
• Matches Popular Reed Relay Pin-Out
• TTL/CMOS Compatible Input
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• Small 4-Pin SIP Package
• Auto Pick & Place, Wave Solderable
The CPC1218 is a miniature voltage-controlled,
single-pole, normally open (1-Form-A) Solid State
Relay in a 4-pin Single In-line Package (SIP) that
employs optically coupled MOSFET technology to
provide 2500Vrms of input to output isolation. The
super efficient MOSFET switches and photovoltaic
die use IXYS Integrated Circuits Division’s patented
OptoMOS architecture. The optically-coupled output is
controlled by the input's highly efficient GaAlAs infrared
LED with a built-in series resistor to provide input
voltage-controlled operation.
Featuring a pin-out that matches many popular reed
relays, CPC1218 is a "drop-in" solid state replacement.
Because the input is solid state there is no need for
snubbers or "catch" diodes to suppress the inductive
fly-back transient voltage normally associated with
EMR coils.
CPC1218 Pinout
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
Approvals
• UL 508 Approved Component: File E69938
• CSA Certified Component: Certificate 1172007
1234
–+
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R06
CPC1218
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Voltage 15 V
Input Power Dissipation 225 mW
Total Power Dissipation 1800 mW
Isolation Voltage, Input to Output 2500 Vrms
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 6.67 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1VIN=5V IL- - 600 mArms / mADC
Peak t=10ms ILPK - - ±1 AP
On-Resistance 2IL=600mA RON - - 1.1
Off-State Leakage Current VL=60VPILEAK --1 A
Switching Speeds
Turn-On VIN=5V, VL=10V ton --5 ms
Turn-Off toff --5
Output Capacitance VL=50V, f=1MHz COUT -25 - pF
Input Characteristics
Input Control Voltage (must operate) IL=600mA VOP - - 3.75 V
Off Voltage (must be off) - VOFF 1- - V
Reverse Input Current VR=5V IR--10A
Input Resistor - - 900 1000 1100
Common Characteristics
Capacitance, Input to Output - - - 1 - pF
1 Load current derates linearly from 600mA @ 25oC to 480mA @80oC.
2 Measurement taken within 1 second of on-time.
Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION
CPC1218
www.ixysic.com 3
R06
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
0.41 0.45 0.49 0.530.43 0.47 0.51
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, VIN=5V, IL=100mA, TA=25ºC)
0.19 0.21 0.23 0.250.240.220.20
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, VIN=5V, IL=100mA, TA=25ºC)
35
30
25
20
15
10
5
0
Device Count (N)
0.54 0.56 0.600.58 0.660.62 0.64
Typical On-Resistance Distribution
(N=50, VIN=5V, IL=100mA, TA=25ºC)
On-Resistance (:)
1.55 1.65 1.751.5 1.6 1.7 1.8
Input Voltage (V)
Device Count (N)
25
20
15
10
5
0
Typical VIN for Switch Operation
(N=50, IL=100mA, TA=25ºC)
25
20
15
10
5
0
1.55 1.65 1.751.5 1.6 1.7 1.8
Input Voltage (V)
Device Count (N)
Typical VIN for Switch Dropout
(N=50, IL=100mA, TA=25ºC)
35
30
25
20
15
10
5
0
63.5 64.5 65.5 66.564.0 65.0 66.0
Device Count (N)
Blocking Voltage (VP)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
VIN (V)
Turn-On (ms)
05101520
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-On vs. VIN
(IL=100mA)
VIN (V)
-40 -20 0 20 40 60 80 100
1.45
1.40
1.35
1.30
1.25
1.20
1.15
Temperature (ºC)
Typical VIN for Switch Operation
vs. Temperature
(IL=100mA)
VIN = 5V
VIN = 10V
Turn-On (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Turn-On vs. Temperature
(IL=100mA)
VIN (V)
Turn-Off (ms)
024681012141618
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
20
Typical Turn-Off vs. VIN
(IL=100mA)
VIN (V)
-40
1.45
1.40
1.35
1.30
1.25
1.20
1.15
-20 0 20 40 60 80 100
Temperature (ºC)
Typical VIN for Switch Dropout
vs. Temperature
(IL=100mA)
Turn-Off (ms)
-40
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
-20 0 20 40 60 80 100
VIN = 5V
VIN = 10V
Temperature (ºC)
Typical Turn-Off vs. Temperature
(IL=100mA)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R06
CPC1218
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
-40
1.0
0.8
0.7
0.6
0.5
0.4
0.3
-20 0 20 40 60 80 100
Steady State VIN = 10V
VIN = 5V
Temperature (ºC)
On-Resistance (:)
0.9
Typical On-Resistance vs. Temperature
(IL=Max Rated @ Temperature)
Load Voltage (V)
Load Current (mA)
600
400
200
0
-200
-400
-600
-0.3 -0.2 -0.1 0 0.1 0.2 0.3
Typical Load Current
vs. Load Voltage
(VIN=5V, TA=25ºC)
Load Current (A)
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
V
IN
=5V
V
IN
=10V
Typical Maximum Load Current
vs. Temperature
-40
72
70
68
66
64
62
60
58
-20 0 20 40 60 80 100
Temperature (ºC)
Blocking Voltage (VP)
Typical Blocking Voltage
vs. Temperature
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 1&4
(VL=Max Rated)
Time
Load Current (A)
10Ps
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
INTEGRATED CIRCUITS DIVISION
CPC1218
www.ixysic.com 5
R06
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1218Y MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1218Y 245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e3
Pb
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1218-R06
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/14/2012
For additional information please visit our website at: www.ixysic.com
6
CPC1218
MECHANICAL DIMENSIONS
DIMENSIONS
mm
(inches)
19.202 ± 0.381
(0.756 ± 0.015)
6.401 ± 0.127
(0.252 ± 0.005)
5.944 ± 0.127
(0.234 ± 0.005)
2.642 ± 0.127
(0.104 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003) 3.251 ± 0.102
(0.128 ± 0.004)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.013
(0.010 ± 0.0005)
5.08
(0.200) 10.16
(0.400) 15.24
(0.600)
1.30
(0.051)
FINISHED HOLE
0.80 DIA x4
(0.031 DIA x4)
Pin 1 Pin 7
PCB Hole Pattern
CPC1218Y
