AT93C56B/AT93C66B Three-Wire Automotive Temperature Serial EEPROM 2Kbit (256 x 8 or 128 x 16) and 4-Kbit (512 x 8 or 256 x 16) Features * * * * * * * * * * Medium-Voltage and Standard-Voltage Operations: - VCC = 2.5V to 5.5V User-Selectable Internal Organization: - 2K: 256 x 8 or 128 x 16 - 4K: 512 x 8 or 256 x 16 Automotive Temperature Range: -40C to +125C Three-Wire Serial Interface Sequential Read Operation 2 MHz Clock Rate (5V) Self-Timed Write Cycle within 5 ms Maximum Automotive AEC-Q100 Qualified High Reliability: - Endurance: 1,000,000 write cycles - Data retention: 100 years Green Package Options (Lead-free/Halide-free/RoHS compliant) Packages * 8-Lead SOIC and 8-Lead TSSOP (c) 2019 Microchip Technology Inc. DS20006278A-page 1 AT93C56B/AT93C66B Table of Contents Features......................................................................................................................................................... 1 Packages........................................................................................................................................................1 1. Package Types (not to scale)..................................................................................................................4 2. Pin Descriptions...................................................................................................................................... 5 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 2.7. 3. Description.............................................................................................................................................. 7 3.1. 4. READ......................................................................................................................................... 12 Erase/Write Enable (EWEN)...................................................................................................... 13 Erase/Write Disable (EWDS)..................................................................................................... 13 ERASE....................................................................................................................................... 14 WRITE........................................................................................................................................14 Write All (WRAL)........................................................................................................................ 15 Erase All (ERAL)........................................................................................................................ 15 Packaging Information.......................................................................................................................... 17 6.1. 7. Absolute Maximum Ratings..........................................................................................................8 DC and AC Operating Range.......................................................................................................8 DC Characteristics....................................................................................................................... 8 AC Characteristics........................................................................................................................9 Synchronous Data Timing.......................................................................................................... 10 Electrical Specifications..............................................................................................................10 Device Commands and Addressing......................................................................................................12 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. 6. Block Diagram.............................................................................................................................. 7 Electrical Characteristics.........................................................................................................................8 4.1. 4.2. 4.3. 4.4. 4.5. 4.6. 5. Chip Select (CS)...........................................................................................................................5 Serial Data Clock (SK)................................................................................................................. 5 Serial Data Input (DI)....................................................................................................................5 Serial Data Output (DO)............................................................................................................... 5 Ground (GND).............................................................................................................................. 5 Internal Organization (ORG)........................................................................................................ 5 Device Power Supply (VCC)......................................................................................................... 6 Package Marking Information.....................................................................................................17 Revision History.................................................................................................................................... 23 The Microchip Website.................................................................................................................................24 Product Change Notification Service............................................................................................................24 Customer Support........................................................................................................................................ 24 Product Identification System.......................................................................................................................25 Microchip Devices Code Protection Feature................................................................................................ 25 (c) 2019 Microchip Technology Inc. DS20006278A-page 2 AT93C56B/AT93C66B Legal Notice................................................................................................................................................. 25 Trademarks.................................................................................................................................................. 26 Quality Management System....................................................................................................................... 26 Worldwide Sales and Service.......................................................................................................................27 (c) 2019 Microchip Technology Inc. DS20006278A-page 3 AT93C56B/AT93C66B Package Types (not to scale) 1. Package Types (not to scale) 8-lead SOIC/TSSOP (Top View) (c) 2019 Microchip Technology Inc. CS 1 8 Vcc SK 2 7 NC DI 3 6 ORG DO 4 5 GND DS20006278A-page 4 AT93C56B/AT93C66B Pin Descriptions 2. Pin Descriptions The descriptions of the pins are listed below in the Table 2-1. Table 2-1.Pin Function Table 2.1 Name 8Lead SOIC 8Lead TSSOP Function CS 1 1 Chip Select SK 2 2 Serial Data Clock DI 3 3 Serial Data Input DO 4 4 Serial Data Output GND 5 5 Ground ORG 6 6 Internal Organization NC 7 7 No Connect VCC 8 8 Device Power Supply Chip Select (CS) The Chip Select (CS) pin is used to control device selection. The AT93C56B/AT93C66B is selected when the CS pin is high. When the device is not selected, data will not be accepted via the Serial Data Input (DI) pin, and the Serial Output (DO) pin will remain in a high-impedance state. 2.2 Serial Data Clock (SK) The Serial Data Clock (SK) pin is used to synchronize the communication between a master and the AT93C56B/ AT93C66B. Instructions, addresses or data present on the Serial Data Input (DI) pin is latched in on the rising edge of SK, while output on the Serial Data Output (DO) pin is also clocked out on the rising edge of SK. 2.3 Serial Data Input (DI) The Serial Data Input (DI) pin is used to transfer data into the device. It receives instructions, addresses and data. Data is latched on the rising edge of the Serial Data Clock (SK). 2.4 Serial Data Output (DO) The Serial Data Output (DO) pin is used to transfer data out of the AT93C56B/AT93C66B. During a read sequence, data is shifted out on this pin after the rising edge of the Serial Data Clock (SK). This pin also outputs the Ready/Busy status of the part if CS is brought high after being low for a minimum of tcs and an erase or write operation has been initiated. 2.5 Ground (GND) The ground reference for the power supply. The Ground (GND) pin should be connected to the system ground. 2.6 Internal Organization (ORG) The Internal Organization (ORG) pin is used to select between the x16 or x8 memory organizations of the device. When the ORG pin is tied to VCC, the x16 memory organization is selected. When the ORG pin is tied to GND, the x8 memory organization is selected. (c) 2019 Microchip Technology Inc. DS20006278A-page 5 AT93C56B/AT93C66B Pin Descriptions If the ORG pin is left unconnected and the application does not load the input beyond the capability of the internal 1 M pull-up resistor, then the x16 organization is selected. 2.7 Device Power Supply (VCC) The Device Power Supply (VCC) pin is used to supply the source voltage to the device. Operations at invalid VCC voltages may produce spurious results and should not be attempted. (c) 2019 Microchip Technology Inc. DS20006278A-page 6 AT93C56B/AT93C66B Description 3. Description The AT93C56B/AT93C66B provides 2,048/4,096 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 128/256 words of 16 bits each (when the ORG pin is connected to VCC) and 256/512 words of 8 bits each (when the ORG pin is tied to GND). The device is optimized for use in many automotive applications where lowpower and lowvoltage operations are essential. The AT93C56B/AT93C66B is available in space-saving 8-lead SOIC and 8-lead TSSOP packages. All packages operate from 2.5V to 5.5V. The AT93C56B/AT93C66B is enabled through the Chip Select (CS) pin and accessed via a three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Serial Data Clock (SK). Upon receiving a READ instruction at DI, the address is decoded, and the data is clocked out serially on the DO pin. The write cycle is completely self-timed, and no separate erase cycle is required before write. The write cycle is only enabled when the part is in the Erase/ Write Enable state. When CS is brought high following the initiation of a write cycle, the DO pin outputs the Ready/ Busy status of the part. Block Diagram Memory System Control Module CS High Voltage Generation Circuit SK EEPROM Array 256/512 x 8 or 128/256 x 16 DI Column Decoder Data Register Row Decoder 3.1 Power-on Reset Generator VCC Address Register and Counter ORG Clock Generator DO Output Buffer GND Note: When the ORG pin is connected to VCC, the x16 organization is selected. When it is connected to ground, the x8 organization is selected. If the ORG pin is left unconnected, and the application does not load the input beyond the capability of the 10 M pull-up resistor, then the x16 organization is selected. (c) 2019 Microchip Technology Inc. DS20006278A-page 7 AT93C56B/AT93C66B Electrical Characteristics 4. Electrical Characteristics 4.1 Absolute Maximum Ratings Temperature under bias -55C to +125C Storage temperature -65C to +150C VCC 6.25V Voltage on any pin with respect to ground -1.0V to +7.0V DC output current 5.0 mA ESD protection 2 kV Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 4.2 DC and AC Operating Range Table 4-1.DC and AC Operating Range AT93C56B/AT93C66B 4.3 Operating Temperature (Case) Automotive Temperature Range -40C to +125C VCC Power Supply Low-Voltage Grade 2.5V to 5.5V DC Characteristics Table 4-2.DC Characteristics(1) Parameter Symbol Minimum Typical Maximum Units Supply Voltage VCC1 2.5 -- 5.5 V Supply Voltage VCC2 4.5 -- 5.5 V Supply Current ICC1 -- 0.5 2.0 mA VCC = 5.0V, Read at 1 MHz Supply Current ICC2 -- 0.5 2.0 mA VCC = 5.0V, Write at 1 MHz Standby Current (2.5V Option) ISB1 -- 3.0 10.0 A VCC = 2.5V, CS = 0V Standby Current (5.0V Option) ISB2 -- 10.0 15.0 A VCC = 5.0V, CS = 0V Input Leakage Current IIL -- 0.1 3.0 A VIN = 0 to VCC Output Leakage Current ILO -- 0.1 3.0 A VOUT = 0 to VCC Input LowVoltage VIL1 -0.6 -- 0.8 V 2.5V VCC 5.5V (Note 2) Input HighVoltage VIH1 2.0 -- VCC + 1 V 2.5V VCC 5.5V (Note 2) (c) 2019 Microchip Technology Inc. Test Conditions DS20006278A-page 8 AT93C56B/AT93C66B Electrical Characteristics ...........continued Parameter Symbol Minimum Typical Maximum Units Test Conditions Output LowVoltage VOL1 -- -- 0.4 V 2.5V VCC 5.5V, IOL = 2.1 mA Output HighVoltage VOH1 2.4 -- -- V 2.5V VCC 5.5V, IOH = -0.4 mA Note: 1. 2. 4.4 Applicable over recommended operating range from: TA = -40C to +125C, VCC = 2.5V to 5.5V (unless otherwise noted). VIL min and VIH max are reference only and are not tested. AC Characteristics Table 4-3.AC Characteristics(1) Parameter Symbol Minimum Typical Maximum Units fSK 0 -- 2 MHz 4.5V VCC 5.5V 0 -- 1 MHz 2.5V VCC 5.5V Clock Frequency, SK Test Conditions High Time, SK tSKH 250 -- -- ns 2.5V VCC 5.5V Low Time, SK tSKL 250 -- -- ns 2.5V VCC 5.5V Minimum CS Low Time tCS 250 -- -- ns 2.5V VCC 5.5V CS Setup Time tCSS 50 -- -- ns 2.5V VCC 5.5V, Relative to SK DI Setup Time tDIS 100 -- -- ns 2.5V VCC 5.5V, Relative to SK CS Hold Time tCSH 0 -- -- ns Relative to SK DI Hold Time tDIH 100 -- -- ns 2.5V VCC 5.5V, Relative to SK Output Delay to 1 tPD1 -- -- 250 ns 4.5V VCC 5.5V -- -- 500 ns 2.5V VCC 5.5V -- -- 250 ns 4.5V VCC 5.5V -- -- 500 ns 2.5V VCC 5.5V Output Delay to 0 tPD0 CS to Status Valid tSV -- -- 250 ns 2.5V VCC 5.5V CS to DO in Highimpedance tDF -- -- 100 ns 4.5V VCC 5.5V, CS = VIL -- -- 150 ns 2.5V VCC 5.5V, CS = VIL -- -- 5 ms 2.5V VCC 5.5V Write Cycle Time tWP Note: 1. Applicable over recommended operating range from TA = -40C to +125C, VCC = As Specified, CL = 1 TTL Gate and 100 pF (unless otherwise noted). (c) 2019 Microchip Technology Inc. DS20006278A-page 9 AT93C56B/AT93C66B Electrical Characteristics 4.5 Synchronous Data Timing Figure 4-1.Synchronous Data Timing CS SK DI VIH VIL 1s (1) tSKH tCSS tSKL VIH VIL VIH tDIS tDIH VIL tPD0 DO (Read) DO (Program) tCSH tDF tPD1 VOH VOL VOH tDF tSV Status Valid VOL Note: 1. This is the minimum SK period. 4.6 Electrical Specifications 4.6.1 Power-Up Requirements and Reset Behavior During a power-up sequence, the VCC supplied to the AT93C56B/AT93C66B should monotonically rise from GND to the minimum VCC level, as specified in Table 4-1, with a slew rate no faster than 0.1 V/s. 4.6.1.1 Device Reset To prevent inadvertent write operations or any other spurious events from occurring during a power-up sequence, the AT93C56B/AT93C66B includes a Power-on Reset (POR) circuit. Upon power-up, the device will not respond to any commands until the VCC level crosses the internal voltage threshold (VPOR) that brings the device out of Reset and into Standby mode. The system designer must ensure the instructions are not sent to the device until the VCC supply has reached a stable value greater than or equal to the minimum VCC level. Additionally, once the VCC is greater than or equal to the minimum VCC level, the bus master must wait at least tPUP before sending the first command to the device. See Power-up Conditions(1) for the values associated with these power-up parameters. Table 4-4.Power-up Conditions(1) Symbol Parameter tPUP Time required after VCC is stable before the device can accept commands VPOR Power-on Reset Threshold Voltage tPOFF Minimum time at VCC = 0V between power cycles Min. Max. Units 100 s 1.5 V 500 ms Note: 1. These parameters are characterized but they are not 100% tested in production. If an event occurs in the system where the VCC level supplied to the AT93C56B/AT93C66B drops below the maximum VPOR level specified, it is recommended that a full power cycle sequence be performed by first driving the VCC pin to GND, waiting at least the minimum tPOFF time and then performing a new power-up sequence in compliance with the requirements defined in this section. (c) 2019 Microchip Technology Inc. DS20006278A-page 10 AT93C56B/AT93C66B Electrical Characteristics 4.6.2 Pin Capacitance Table 4-5.Pin Capacitance(1) Symbol COUT CIN Test Condition Max. Units Conditions Output Capacitance (DO) 5 pF VOUT = 0V, TA = 25C, F = 1.0 MHz, VCC = +5V Input Capacitance (CS, SK, DI, ORG) 5 pF VIN = 0V, TA = 25C, F = 1.0 MHz, VCC = +5V Note: 1. This parameter is characterized but is not 100% tested in production. 4.6.3 EEPROM Cell Performance Characteristics Table 4-6.EEPROM Cell Performance Characteristics Operation Write Endurance(1) Data Retention(1) Test Condition TA = 25C, VCC = 5.0V TA = 55C Min. Max. Units 1,000,000 -- Write Cycles 100 -- Years Note: 1. Performance is determined through characterization and the qualification process. (c) 2019 Microchip Technology Inc. DS20006278A-page 11 AT93C56B/AT93C66B Device Commands and Addressing 5. Device Commands and Addressing The AT93C56B/AT93C66B is accessed via a simple and versatile three-wire serial communication interface. Device operation is controlled by seven instructions issued by the Host processor. A valid instruction starts with a rising edge of CS and consists of a Start bit (SB), followed by the appropriate opcode, and the desired memory address location. Table 5-1.AT93C56B/AT93C66B Instruction Set Instruction SB Opcode Address Data X8(1) X16(1) X8 Comments X16 READ 1 10 A8A0 A7A0 Reads data stored in memory at specified address. EWEN 1 00 11XXXXXXX 11XXXXXX Write Enable must precede all programming modes. ERASE 1 11 A8A0 A7A0 Erases memory location ANA0. WRITE 1 01 A8A0 A7A0 ERAL 1 00 10XXXXXXX 10XXXXXX WRAL 1 00 01XXXXXXX 01XXXXXX EWDS 1 00 00XXXXXXX 00XXXXXX D7D0 D15D0 Writes memory location ANA0. Erases all memory locations. Valid only at VCC2. See Table 42. D7D0 D15D0 Writes all memory locations. Valid only at VCC2. See Table 42. Disables all programming instructions. Note: 1. The `X' in the address field represents a "don't care" bit and must be sent to the device. Table 5-2.Organization Key for Timing Diagrams I/O AT93C56B (2K) AT93C66B (4K) x8 x16 x8 x16 AN A8(1) A7(2) A8 A7 DN D7 D15 D7 D15 Note: 1. A8 is a "don't care" value, but the extra clock is required. 2. A7 is a "don't care" value, but the extra clock is required. 5.1 READ The READ instruction contains the address code for the memory location to be read. After the instruction and address are decoded, data from the selected memory location is available at the DO pin. Output data changes are synchronized with the rising edges of the SK pin. The AT93C56B/AT93C66B supports sequential read operations. The device will automatically increment the internal Address Pointer and clock out the next memory location as long as Chip Select (CS) is held high. In this case, the dummy bit (Logic `0') will not be clocked out between memory locations, thus allowing for a continuous stream of data to be read. Note: A dummy bit (logic `0') precedes the initial 8-bit or 16-bit data output string. (c) 2019 Microchip Technology Inc. DS20006278A-page 12 AT93C56B/AT93C66B Device Commands and Addressing Figure 5-1.READ Timing tCS CS SK DI DO 5.2 1 1 0 AN A0 High-Impedance 0 DN D0 Erase/Write Enable (EWEN) To ensure data integrity, the part automatically goes into the Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable (EWEN) instruction must be executed first before any programming instructions can be carried out. Note: Once in the write enabled state, programming remains enabled until an EWDS instruction is executed, or VCC power is removed from the part. Figure 5-2.EWEN Timing tCS CS SK DI 5.3 1 0 0 1 1 ... Erase/Write Disable (EWDS) To protect against accidental data disturbance, the Erase/Write Disable (EWDS) instruction disables all programming modes and should be executed after all programming operations. The operation of the READ instruction is independent of both the EWEN and EWDS instructions and can be executed at any time. (c) 2019 Microchip Technology Inc. DS20006278A-page 13 AT93C56B/AT93C66B Device Commands and Addressing Figure 5-3.EWDS Timing tCS CS SK DI 5.4 1 0 0 0 ... 0 ERASE The ERASE instruction programs all bits in the specified memory location to the logic `1' state. The self-timed erase cycle starts once the ERASE instruction and address are decoded. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of tCS. A logic `1' at the DO pin indicates that the selected memory location has been erased, and the part is ready for another instruction. Figure 5-4.ERASE Timing tCS Standby Check Status CS SK DI 1 1 1 AN AN-1 AN-2 ... A0 tDF tSV DO High-Impedance High-impedance Busy Ready tWP 5.5 WRITE The WRITE instruction contains the 8 bits or 16 bits of data to be written into the specified memory location. The selftimed programming cycle, tWP, starts after the last bit of data is received at DI pin . The DO pin outputs the Ready/ Busy status of the part if CS is brought high after being kept low for a minimum of tCS. A logic `0' at DO indicates that programming is still in progress. A logic `1' indicates that the memory location at the specified address has been written with the data pattern contained in the instruction, and the part is ready for further instructions. A Ready/Busy status cannot be obtained if CS is brought high after the end of the self-timed programming cycle, tWP. (c) 2019 Microchip Technology Inc. DS20006278A-page 14 AT93C56B/AT93C66B Device Commands and Addressing Figure 5-5.WRITE Timing tCS Check Status CS Standby SK 1 DI 0 AN 1 A0 ... DN D0 tSV High-Impedance DO tDF Busy Ready tWP 5.6 Write All (WRAL) The Write All (WRAL) instruction programs all memory locations with the data patterns specified in the instruction. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of tCS. Note: The WRAL instruction is valid only at VCC2 (see Table 4-2). Figure 5-6.WRAL Timing tCS Check Status CS Standby SK DI DO 1 0 0 0 1 ... DN ... D0 tDF tSV High-Impedance Busy Ready tWP 5.7 Erase All (ERAL) The Erase All (ERAL) instruction programs every bit in the memory array to the logic `1' state and is primarily used for testing purposes. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of tCS. Note: The ERAL instruction is valid only at VCC2 (see Table 4-2). (c) 2019 Microchip Technology Inc. DS20006278A-page 15 AT93C56B/AT93C66B Device Commands and Addressing Figure 5-7.ERAL Timing tCS Standby Check Status CS SK DI 1 0 0 1 0 tDF tSV DO High-Impedance Busy High-Impedance Ready tWP (c) 2019 Microchip Technology Inc. DS20006278A-page 16 AT93C56B/AT93C66B Packaging Information 6. Packaging Information 6.1 Package Marking Information AT93C56B and AT93C66B Automotive: Package Marking Information 8-lead TSSOP 8-lead SOIC ATMLPYWW ###% CO YYWWNNN Note 1: ATPYWW ###%CO YYWWNNN designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT93C56B Truncation Code ###: 56B AT93C66B Truncation Code ###: 66B Date Codes YY = Year 16: 2016 17: 2017 18: 2018 19: 2019 Voltages 20: 2020 21: 2021 22: 2022 23: 2023 Y = Year 6: 2016 7: 2017 8: 2018 9: 2019 0: 2020 1: 2021 2: 2022 3: 2023 WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Origin Device Grade CO = Country of Origin P: Automotive Grade 1 % = Minimum Voltage D: 2.5V min Atmel Truncation AT: Atmel ATM: Atmel ATML: Atmel Lot Number or Trace Code NNN = Alphanumeric Trace Code (c) 2019 Microchip Technology Inc. DS20006278A-page 17 AT93C56B/AT93C66B Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A-B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NOTE 5 NX b 0.25 C A-B D TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H SEE VIEW C VIEW A-A 0.23 L (L1) VIEW C Microchip Technology Drawing No. C04-057-SN Rev E Sheet 1 of 2 (c) 2017 Microchip Technology Inc. (c) 2019 Microchip Technology Inc. DS20006278A-page 18 AT93C56B/AT93C66B Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L L1 Footprint Foot Angle c Lead Thickness b Lead Width Mold Draft Angle Top Mold Draft Angle Bottom MIN 1.25 0.10 0.25 0.40 0 0.17 0.31 5 5 MILLIMETERS NOM 8 1.27 BSC 6.00 BSC 3.90 BSC 4.90 BSC 1.04 REF - MAX 1.75 0.25 0.50 1.27 8 0.25 0.51 15 15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev E Sheet 2 of 2 (c) 2017 Microchip Technology Inc. (c) 2019 Microchip Technology Inc. DS20006278A-page 19 AT93C56B/AT93C66B Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev E (c) 2017 Microchip Technology Inc. (c) 2019 Microchip Technology Inc. DS20006278A-page 20 M AT93C56B/AT93C66B Packaging Diagrams and Parameters Packaging Information 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 b e c A A2 A1 L L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A - 0.65 BSC - Molded Package Thickness A2 0.80 1.00 1.05 Standoff A1 0.05 - 0.15 1.20 Overall Width E Molded Package Width E1 4.30 6.40 BSC 4.40 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint L1 4.50 1.00 REF Foot Angle 0 - 8 Lead Thickness c 0.09 - 0.20 Lead Width b 0.19 - 0.30 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-086B (c) 2007 Microchip Technology Inc. (c) 2019 Microchip Technology Inc. DS00049AR-page 117 DS20006278A-page 21 M Note: AT93C56B/AT93C66B Packaging Diagrams and Parameters Packaging Information For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS00049BC-page 96 (c) 2019 Microchip Technology Inc. 2009 Microchip Technology Inc. DS20006278A-page 22 AT93C56B/AT93C66B Revision History 7. Revision History Revision A (December 2019) Updated to the Microchip template. Microchip DS20006278 replaces Atmel document 8811. Updated Package Marking Information. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Updated the SOIC and TSSOP package drawings to Microchip format. Atmel 8811C Revision C (February 2016) Updated 8S1 and 8X package drawings and ordering information. Added the ordering code detail. Removed bulk (tube) options. Document reorganization. Atmel 8811B Revision B (August 2012) Removed preliminary status. Updated Atmel logos and disclaimer/copy page. Atmel 8811A Revision A (June 2012) Initial document release. (c) 2019 Microchip Technology Inc. DS20006278A-page 23 AT93C56B/AT93C66B The Microchip Website Microchip provides online support via our website at http://www.microchip.com/. This website is used to make files and information easily available to customers. Some of the content available includes: * * * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software General Technical Support - Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip design partner program member listing Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Product Change Notification Service Microchip's product change notification service helps keep customers current on Microchip products. Subscribers will receive email notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, go to http://www.microchip.com/pcn and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: * * * * Distributor or Representative Local Sales Office Embedded Solutions Engineer (ESE) Technical Support Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in this document. Technical support is available through the website at: http://www.microchip.com/support (c) 2019 Microchip Technology Inc. DS20006278A-page 24 AT93C56B/AT93C66B Product Identification System To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. AT 93C56B-S S PD-T Shipping Carrier Option T = Tape and Reel, Standard Quantity Option Product Family Operating Voltage 93C = Microwire-compatible Three-Wire Serial EEPROM D = 2.5V to 5.5V Package Device Grade or Wafer/Die Thickness Device Density 56 = 2-Kilobit 66 = 4-Kilobit P = Automotive Temperature Range (-40C to +125C) Device Revision Package Option SS X = SOIC = TSSOP Examples Device Package Package Drawing Code Package Option Shipping Carrier Option Device Grade AT93C56BSSPDT SOIC SN SS Tape and Reel AT93C66BSSPDT SOIC SN SS Tape and Reel Automotive Temperature (-40C to 125C) AT93C66BXPDT TSSOP ST X Tape and Reel AT93C56BXPDT TSSOP ST X Tape and Reel Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: * * * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Legal Notice Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with (c) 2019 Microchip Technology Inc. DS20006278A-page 25 AT93C56B/AT93C66B your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2019, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-5355-0 AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro, Vision, Versatile are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. Quality Management System For information regarding Microchip's Quality Management Systems, please visit http://www.microchip.com/quality. (c) 2019 Microchip Technology Inc. DS20006278A-page 26 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/support Web Address: http://www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra'anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-72884388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 (c) 2019 Microchip Technology Inc. DS20006278A-page 27