Storage and Operang Temperature -55°C to +125° C
Solder reow me within 5°C of peak temperature is 20 to 40 seconds(1) 250° C
Forward DC Current 50 mA
Peak Forward Current (1 µs pulse; .03% duty cycle) 1.0 A
Reverse DC Voltage 2.0 V
Power Dissipaon(2) 75 mW
Collector-Emier Voltage 30 V
Emier-Collector Voltage 5.0 V
Collector DC Current 25 mA
Power Dissipaon(2) 75 mW
VF Forward Voltage - - 1.7 V IF = 20 mA
IR Reverse Current - - 100 µA VR = 2.0 V
V(BR)CEO Collector-Emier Breakdown Voltage 30 - - V IC = 100 µA
V(BR)ECO Emier-Collector Breakdown Voltage 5 - - V IE = 100 µA
ICEO Collector Dark Current - - 100 nA VCE = 5.0 V, IF = 0,
Ee = ≤ 0.10 µW/cm2
IC(ON) On-State Collector Current(4) 100 - - µA VCE = 5.0 V, IF = 20 mA,
d = 0.050” (1.27 mm)(3)
VCE(SAT) Collector-Emier Saturaon Voltage(4) - - 0.4 V IF = 20 mA, IC = 100 µa,
d = 0.050” (1.27 mm)(3)
ICX Crosstalk (5) - - 75 µA IF = 20mA, VCE = 5V
Notes:
(1) Solder me less than 5 seconds at temperature extreme.
(2) Derate linearly 0.75 mW/°C above 25°C.
(3) Distance from the assembly face to the reecve surface is “d”.
(4) Measured using Eastman Kodak neutral white test card with 90% white diuse reectance as a reecng surface.
(5) Crosstalk (ICX) is the collector current measured using the indicated current and using a Munsell N2.25 black test card against the face of the
part.