CSH210R - Target Datasheet (Rev 1, 02/01) 1
GaAs MMIC CSH210R
Target Datasheet
• TX-RX and diversity switch for m obile
communications
• GaAs PHEMT Technology
• Low Insertion Loss
• No supply Voltage needed
• Positive Operating voltage
• SOT363 package (2mm x 2mm )
ESD: Electrostatic discharge sensitive device
Observe handling Precautions!
Type Marking Ordering code
(tape and reel) Package
CSH210R TBD TBD SOT363
Maximum Ratings Symbol Value Unit
min max
Control Voltage Range -5 5 V
RF Input Power Pin 3 W
Therm al Resistance Rth tbd °C/W
Junction Temperatur e Tj125 °C
Storag e Temperature Tstg -55 150 °C
CSH210R - Target Datasheet (Rev 1, 02/01) 2
GaAs MMIC CSH210R
Electrical Characteristics
( T=25C, Vcntrl=3.0V, Pin=0dBm)
Parameter Symbol Test
Condition min typ max Unit
Insertion Loss RFC-RF1, RF C-RF2 ILRF DC-0.5GHz
DC-1.0GHz
DC-2.0GHz
DC-3.0GHz
0.25
0.3
0.4
0.55
0.3
0.4
0.5
0.7
dB
Isolation RF1-RF2 ISOL DC-0.5GHz
DC-1.0GHz
DC-2.0GHz
DC-3.0GHz
25
20
16
13
28
24
20
18
dB
VSWR* (all ports) VSWR DC-2.5GHz
DC-3.0GHz 1.3:1
1.5:1
Harmonics Pharm DC-3.0GHz tbd dBc
Gate Leakage IL4.0 14 uA
Trise /Tfall (10% RF to 90%RF) 10 nS
Ton /Toff (50% CNTRL -90%/10%RF) 20 nS
Output Power for 0.1 dB compression P-0.1 DC-3.0GHz 26 dBm
Output Power for 1 dB compression P1 DC-3.0GHz 30 dBm
Intermodulation Intercept Point IP3 Pin=25dBm
Freq.=1.0Ghz 52 56 dBm
*VSWR defined for Insertion Loss State only
CSH210R - Target Datasheet (Rev 1, 02/01) 3
GaAs MMIC CSH210R
PIN Symbol Abbreviation Description
1 RF OU TPUT 1 RF1 RF OU TPUT
2 GND GND Circuit comm on and D C return
3 RF OU TPUT 2 RF2 RF OU TPUT
4 V_CO N TR OL 2 V2 RF O U TPU T 2 control
5 RF C O M MO N RFC Com m on R F port
6 V_CO N TR OL 1 V1 RF O U TPU T 1 control
PIN Assignments & Functional Block Diagram
*external DC blocking capac itor required 100pF 3 pla ces
V1 V2 Through Path
0V 3V RFC – RF1
3V 0V RFC – RF2
Standard Control Logic
1
2
3
6
4
5
V1
V2
RFC
RF1
RF2
GND
CSH210R - Target Datasheet (Rev 1, 02/01) 4
GaAs MMIC CSH210R
Measured Results
(All Ports connect ed to 50ohms, Pin =0 dBm unless otherwise specified)
Input VSWR vs. Frequency
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
0.00 0.50 1.00 1.50 2.00 2.50 3.00
Frequency (GHz)
VSWR
Output VSWR vs. Frequen cy
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
0.00 0.50 1.00 1.50 2.00 2.50 3.00
Frequency (GHz)
VSWR
Insertion Loss vs. Frequency
-1
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.00 0.50 1.00 1.50 2.00 2.50 3.00
Frequency (GHz)
Insertion Loss (dB)
Isolation vs. Frequency
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
0.00 0.50 1.00 1.50 2.00 2.50 3.00
Frequency (GHz)
Isolation (dB)
(RFC - RF1, RFC - RF2) (RF1 - RF2)
(RFC) (RF1 or RF2)
CSH210R - Target Datasheet (Rev 1, 02/01) 5
GaAs MMIC CSH210R
Package Outline - SOT363
Recommended SOT363 Solder Footprint
CSH210R - Target Datasheet (Rev 1, 02/01) 6
GaAs MMIC CSH210R
Evaluation Board Layout
Board Size 0.75” x 1.75 ”
Board Thickness 0.047”, Board Material FR4 Multi-Layer
Infineon Technologies
CSH210 V2.0
V2
V1
CSH210R - Target Datasheet (Rev 1, 02/01) 7
GaAs MMIC CSH210R
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