RN4870/71 Bluetooth(R) 4.2 Low Energy Module Features Fully Qualified Bluetooth(R) Low Energy Module Certified to FCC, IC, CE, KCC, NCC and SRRC On-Board Bluetooth 4.2 Low Energy Stack ASCII Command Interface API over UART Scripting Engine for Hostless Operation Compact Form Factor - The RN4870/71 family comes in four different sizes from 6 mm x 8 mm to 12 mm x 22 mm: - RN4870: 12 mm x 22 mm - RN4871: 9 mm x 11.5 mm - RN4870U: 12 mm x 15 mm - RN4871U: 6 mm x 8 mm * Beacon Private Service for Beacon Services * UART Transparent Service for Serial Data Applications * Remote Configuration Over The Air * * * * * * Operational * Operating Voltage: 1.9V to 3.6V (3.3V typical) * Temperature Range: - -20C to +70C (Normal) - -40C to +85C (Industrial) * Supports UART * Up to Three Pulse Width Modulation (PWM) Outputs RF/Analog Features * * * * * ISM Band 2.402 to 2.480 GHz Operation Channels: 0-39 RX Sensitivity: -90 dBm TX Power: 0 dBm RSSI Monitor Antenna Options * Integrated Chip Antenna (RN487x) - refer to Section 8.0, Antenna Characteristics, Figure 8-1 and Figure 8-2 for antenna performance specifications * External Antenna Connection via RF Pad (RN4870U/RN4871U) MAC/Baseband/Higher Layer Features Applications * Secure AES128 Encryption * GAP, GATT, SM, L2CAP and Integrated Public Profiles * Customer Can Create up to Five Public and Four Private Services * Keyboard I/O Authentication * Software Configurable Role as Peripheral or Central and Client or Server * * * * * * * * 2016-2017 Microchip Technology Inc. Health/Medical Devices Sports Activity/Fitness Meters Beacon Applications Internet of Things (IoT) Sensor Tag Remote Control Wearable Smart Devices and Accessories Smart Energy/Smart Home Industrial Control DS50002489C-page 1 RN4870/71 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 3 2.0 Specifications ............................................................................................................................................................................... 9 3.0 Interface PINs..............................................................................................................................................................................11 4.0 Physical Dimensions And Attributes ........................................................................................................................................... 13 5.0 Application Reference Circuits ................................................................................................................................................... 23 6.0 ASCII Command API.................................................................................................................................................................. 29 7.0 Supported Services .................................................................................................................................................................... 31 8.0 Antenna Characteristics ............................................................................................................................................................. 33 9.0 Timing Characteristics ................................................................................................................................................................ 35 10.0 Regulatory Approval ................................................................................................................................................................... 37 11.0 Ordering Information .................................................................................................................................................................. 43 The Microchip Web Site ....................................................................................................................................................................... 45 Customer Change Notification Service ................................................................................................................................................ 45 Customer Support ................................................................................................................................................................................ 45 Product Identification System............................................................................................................................................................... 46 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS50002489C-page 2 2016-2017 Microchip Technology Inc. RN4870/71 1.0 DEVICE OVERVIEW 1.1 Overview Table 1-1 shows the various options for packaging and features available in the RN4870/71 family. Table 1-2 provides the description of the pin functions for all the modules in the RN4870/71 family. Figure 1-1 through Figure 1-4 show the pinout for the different modules. The RN4870/71 Bluetooth Low Energy (BLE) modules integrate Bluetooth 4.2 baseband controller, on-board Bluetooth stack, digital and analog I/O, and RF power amplifier into one solution. TABLE 1-1: RN4870/71 FAMILY Part Number(1) Antenna On-Board Shielding Number of Pins Yes Yes 33 12 mm x 22 mm -20C to +70C RN4870-V/RMXXX Dimensions Operating Temperature Range RN4870U-V/RMXXX No No 30 12 mm x 15 mm -20C to +70C RN4871-V/RMXXX Yes Yes 16 9 mm x 11.5 mm -20C to +70C RN4871U-V/RMXXX No No 17 6 mm x 8 mm -20C to +70C RN4870-I/RMXXX Yes Yes 33 12 mm x 22 mm -40C to +85C RN4871-I/RMXXX Yes Yes 16 9 mm x 11.5 mm -40C to +85C Note 1: The last three digits in P/N indicate the firmware version. At the time of publication, the latest firmware version is 1.28. Ensure to check product webpage for latest part number and firmware version. TABLE 1-2: PIN DESCRIPTION RN4870U RN4870 RN4871U RN4871 Name Type Description -- 1 -- -- GND Power Ground reference -- 2 -- -- GND Power Ground reference 1 3 12 13 GND Power Ground reference 2 4 11 14 VBAT Power Positive supply input. Range: 1.9V~3.6V -- -- 10 -- BK_IN Power Buck power supply input Can be connected to the VBAT pin Connect to 10 F low ESR ceramic capacitor Voltage range: 1.9V to 3.6V 3 5 -- -- P2_2 D I/O GPIO PWM1 Default: Input; pulled-high 4 6 -- -- VDD_IO Power VDD; power input Same input pin as VBAT Can be connected to the VBAT pin 5 7 -- -- VDD_IO Power VDD; power input Same input pin as VBAT Can be connected to the VBAT pin 6 8 -- -- ULPC_O Power 1.2V ULPC LDO output Used for diagnostic purposes Do not connect to any pin or device For measurement, connect a bypass 1 F capacitor to ground 7 9 -- -- P2_3 D I/O GPIO PWM2 Default: Input; pulled-high 8 10 -- -- BK_O Power 1.55V Buck power supply output for diagnostic purpose Do not connect -- -- 13 6 P1_6 2016-2017 Microchip Technology Inc. D Configurable pin. Refer to Section 1.2 "Module Configuration" for details. DS50002489C-page 3 RN4870/71 TABLE 1-2: PIN DESCRIPTION (CONTINUED) RN4870U RN4870 RN4871U RN4871 Name Type D Description -- -- 14 5 P1_7 Configurable pin. Refer to Section 1.2 "Module Configuration" for details. 9 11 15 15 P2_7 D O/p UART_TX_IND output pin. Provides indication if RN4870 is transmitting to host MCU over UART. Pulled low before UART TX begins and pulled high after UART TX is over. 10 12 -- -- P1_1 D I/O GPIO; default: Input; pulled-high A I/p AD9 Configured as the BLEDK_STATUS1_IND pin by default 11 13 2 3 P1_2 D I/O GPIO; default: Input; pulled-high A I/p AD10; I2C SCL pin 12 14 3 4 P1_3 D I/O GPIO; default: Input; pulled-high AD11; I2C SDA pin 13 15 8 11 P0_0 D I/O GPIO; default: Input; pulled-high AD0 Configured as the UART_CTS pin by default 14 16 -- -- P1_0 D I/O GPIO; default: Input; pulled-high AD8 Configured as the BLEDK_STATUS2_IND pin by default 15 17 6 9 P3_6 D I/O GPIO; default: Input; pulled-high PWM0 Configured as the UART_RTS pin by default 16 18 16 16 P2_0 D I/p D I/O GPIO; default: Input; pulled-high System configuration input; 1: Application mode 0: Test mode/Flash update/EEPROM configuration Default: Input; pulled-high 17 19 -- -- P2_4 18 20 -- -- NC -- 19 21 7 10 RST_N D I/p Module Reset; active-low; Internally pulled-high 20 22 5 7 UART_RX D I/p UART Data input 21 23 4 8 UART_TX D O/p UART Data output 22 24 -- -- P3_1 D I/O GPIO; default: Input; pulled-high Configured as RSSI_IND pin by default; SPI NCS Bus 23 25 -- -- P3_2 D I/p GPIO; default: Input; pulled-high Configured as the LINK_DROP pin by default; SPI MISO pin 24 26 -- -- P3_3 D I/p GPIO; default: Input; pulled-high Configured as the UART RX Indication pin by default; SPI MOSI pin 25 27 -- -- P3_4 D I/p GPIO; default: Input; pulled-high Configured as the PAIRING_KEY pin by default; SPI SCLK pin 26 28 -- -- P3_5 D I/O GPIO; default: Input; pulled-high A I/p LED1; provides indication whether the module is ON/ OFF 27 29 -- -- P0_7 D I/O GPIO; default: Input; pulled-high Configured to the LOW_BATTERY_INDICATOR pin by default DS50002489C-page 4 No Connection 2016-2017 Microchip Technology Inc. RN4870/71 TABLE 1-2: PIN DESCRIPTION (CONTINUED) RN4870U RN4870 RN4871U RN4871 Name Type Description 28 30 9 12 P0_2 D I/O AD2 LED0: Provides indication whether the module is in ON/OFF mode 29 31 17 2 GND Power Ground Reference Power Ground Reference -- 32 -- -- GND 30 -- 1 -- BT_RF -- 33 -- -- GND Legend: Pin Type Abbreviations: FIGURE 1-1: A = Analog A I/O External Antenna connection (50 ohms). Only for RN4870U and RN4871U. No connection for RN4871. Power Ground Reference D = Digital I/O = Input/Output I/p = Input O/p = Output PIN DIAGRAM - RN4870U Top View GND 1 VBAT 2 P2_2 3 VDD_IO 4 VDD_IO 5 ULPC_O 6 P2_3 7 BK_O 8 P2_7/TX_IND 9 P1_1 10 P1_2 11 P1_3 12 Bottom View 30 BT_RF GND P0_2/LED P0_7 P3_5 P3_4 P3_3 P3_2 P3_1 UART_TX UART_RX TP-3 TP-1 TP-2 TP-3 VCC_RF TP-1 VCC_PA TP-2 CLDO_O P0_0/CTS P1_0 P3_6/RTS P2_0/MODE P2_4 NC RST_N 13 14 15 16 17 18 19 29 28 27 26 25 24 23 22 21 20 1 30 FIGURE 1-2: PIN DIAGRAM - RN4870 Top View 1 2 GND VBAT P2_2 VDD_IO VDD_IO ULPC_O P2_3 BK_O P2_7/TX_IND P1_1 P1_2 P1_3 3 4 5 6 7 8 9 10 11 12 13 14 33 GND 32 GND 31 30 29 28 27 26 25 24 23 22 GND P0_2/LED P0_7 P3_5 P3_4 P3_3 P3_2 P3_1 UART_TX UART_RX 33 1 TP-3 TP-1 TP-2 TP-3 VCC_RF TP-1 VCC_PA TP-2 CLDO_O P0_0/CTS P1_0 P3_6/RTS P2_0/MODE P2_4 NC RST_N 15 16 17 18 19 20 21 GND GND Bottom View 2016-2017 Microchip Technology Inc. DS50002489C-page 5 RN4870/71 FIGURE 1-3: PIN DIAGRAM - RN4871U Bottom View 4 3 2 1 UART_TX P1_3 P1_2 BT_RF Top View 5 6 7 8 9 17 GND 17 16 P2_0 15 P2_7 14 P1_7 VCC_RF TP-2 VCC_PA TP-3 TP-1 CLDO_O TP-1 TP-2 TP-4 TP-3 TP-5 TP-4 ULPC_O TP-5 BK_O BK_IN VBAT GND P1_6 10 11 12 13 UART_RX P3_6 RST_N P0_0 P0_2 1 FIGURE 1-4: PIN DIAGRAM - RN4871 7RS9LHZ 1& %RWWRP9LHZ *1' 3B 3B 3B 9%$7 3B *1' 3B 3B TP-3 TP-2 %.B273 TP-1 &/'2B273 TP-4 739&&B3$ 739&&B5) 738/3&B2 TP-5 32B 8$57B7; DS50002489C-page 6 567B1 3B 8$57B5; 3B 16 2016-2017 Microchip Technology Inc. RN4870/71 1.2 Module Configuration The GPIO pins of the RN4870 and RN4871 modules can be configured to different functions using the ASCII command interface. Table 1-3 shows the various pins in the RN4870/71 module that are available for configuration and their default configuration settings. Table 1-4 provides details on each functions available. TABLE 1-3: Table 1-5 shows the status of the module as indicated by the Status 1 and Status 2 indication pins. Table 1-6 shows the details of test pads that are present on the bottom side of the module, used for diagnostic purposes during testing. Figure 1-5 shows all the key elements of the module. CONFIGURABLE PINS AND DEFAULT FUNCTIONS IN THE RN4870 AND RN4871 Pin Name Available in Default Function RN4870 RN4871 P0_7 x -- Low Battery Indication P1_0 x -- Status 2 P1_1 x -- Status 1 P2_2 x -- None P2_4 x -- None P3_1 x -- RSSI Indication P3_2 x -- Link Drop P3_3 x -- UART RX Indication P3_4 x -- Pairing Key P3_5 x -- None P1_2 x x None P1_3 x x None P1_6 -- x UART RX Indication P1_7 -- x None TABLE 1-4: CONFIGURABLE FUNCTIONS AND DESCRIPTIONS Function Name Description Low Battery Indication Pin output goes low when the VDD is below a specified level. To set the threshold level, change the EEPROM settings. Status 1 Use this indication pin along with the Status 2 pin to indicate the current status of the module. Refer to Table 1-5 for details of the status indication. Status 2 Use this indication pin along with the Status 1 pin to indicate the current status of the module. Refer to Table 1-5 for details of the status indication. RSSI Indication Use this indication pin to indicate the quality of the link based on the RSSI level. If the RSSI level is lower than the specified threshold value, then the RSSI indication pin goes low. Set the threshold for the RSSI link quality in EEPROM. Link Drop When the RN4870/71 is connected to a remote device, the host MCU can use the Link Drop pin to force the module to disconnect the link and and enter shutdown state. The pin needs to be pulled low for at least 10 ms. UART RX Indication Use this pin to enable communication with the UART when the module is in LowPower mode. When not in Low-Power mode, the module runs on a 16 MHz clock. If Low-Power mode is enabled on the module by using command SO,1, the module runs on a 32 kHz clock thus reducing power consumption. However, in Low-Power mode, the host MCU cannot communicate with the module via the UART since the UART is not operational. If the user intends to provide data or commands via UART in the Low-Power mode, then the UART RX INDICATION pin must be pulled low and the user needs to wait for at least five milliseconds before sending the data. Pulling the UART RX INDICATION pin low allows the module to operate the 16 MHz clock and to enable UART. 2016-2017 Microchip Technology Inc. DS50002489C-page 7 RN4870/71 TABLE 1-4: CONFIGURABLE FUNCTIONS AND DESCRIPTIONS (CONTINUED) Function Name Description Pairing Key When the RN4870/71 is connected to a remote device, the host MCU can use the Pairing Key pin to force the module to disconnect the link and go back to standby state. The pin must be pulled down for at least 160 ms. RF Active Indication Use this indication pin to indicate that the module is currently performing an active transmission and receiving BLE data. TABLE 1-5: STATUS INDICATION PINS Status 1 Status 2 High High TABLE 1-6: RN4870U State Power On High Low Standby state Low Low Connection established Low High Data session open (Transparent UART) TEST POINTS ON THE BOTTOM SIDE RN4870 RN4871U RN4871 Symbol Description TP-1 TP-1 TP-3 TP-3 VCC_PA 1.55V RF PA LDO TP-2 TP-2 TP-1 TP-5 CLDO_O 1.2V CLDO Output TP-3 TP-3 TP-2 TP-2 VCC_RF 1.2V RF LDO Output -- -- TP-4 TP-4 ULPC_O 1.2V ULPC LDO Output -- -- TP-5 TP-1 BK_O 1.55V Buck Reg Output FIGURE 1-5: BLOCK DIAGRAM OF THE RN4870/71 RN4870/RN4871 DS50002489C-page 8 2016-2017 Microchip Technology Inc. RN4870/71 2.0 SPECIFICATIONS Table 2-1 provides the general specifications for the module. Table 2-2, Table 2-3 and Table 2-4 provide the electrical characteristics and the current consumption of the module. TABLE 2-1: GENERAL SPECIFICATIONS Specification Description Standard Compliance Bluetooth 4.2 Frequency Band 2.402 to 2.480 GHz Modulation Method GFSK Maximum Data Rate (Transparent UART) 10 kbps (iOS(R)9) Antenna Ceramic Interface UART, AIO, PIO Operating Range 1.9V to 3.6V Sensitivity -90 dBm RF TX Power 0 dBm Operating Temperature Range for RN4870-I and RN4871-I modules -40C to +85C Operating Temperature Range for RN4870-V and RN4871-V modules -20C to +70C Storage Temperature Range -40C to +125C Operating Relative Humidity Range 10% to 90% Storage Relative Humidity Range 10% to 90% Moisture Sensitivity Level 2 TABLE 2-2: ELECTRICAL CHARACTERISTICS Parameter Min. Typ. Max. Units 1.9 -- 3.6 V VIL Input Logic Levels Low VSS -- 0.3 VDD V VIH Input Logic Levels High Supply Voltage (VDD) I/O Voltage Levels 0.7 VDD -- VDD V VOL Output Logic Levels Low Vss -- 0.2 VDD V VOH Output Logic Levels High 0.8 VDD -- VDD V 63 -- -- ns Pull-Up Resistance 34 48 74 k Pull-Down Resistance 29 47 86 k Reset Reset Low Duration Input and Tri-State Current with 2016-2017 Microchip Technology Inc. DS50002489C-page 9 RN4870/71 TABLE 2-3: CURRENT CONSUMPTION Parameter Min. Typ. Max. Units TX mode Peak Current at VDD = 3V, TX = 0 dBm, Buck mode -- 10 at +25C 13 at +75C/+85C mA 13 at +75C/+85C mA Supply Current RX mode Peak Current at VDD = 3V, Buck mode -- 10 at +25C Low-Power Mode Current(2) -- 60 at +25C -- A Shutdown Low-Power Mode 1 -- 2.9 A Note 1: 2: The current measurements are characterized across a sample of RN4870/71 modules at room temperature (+25C), unless otherwise noted. For more details on Low-Power mode, refer to the "RN4870/71 Bluetooth(R) Low Energy Module User's Guide" (DS50002466). TABLE 2-4: CURRENT CONSUMPTION DURING APPLICATION MODE Test Mode Advertising(1,2,3) Connected(1,2,4) Note 1: 2: 3: 4: Interval (ms) Average Current Consumption 20 1.061 mA 50 505 A 100 298 A 500 113 A 1000 89 A 18.75 2.23 mA 50 2.13 mA 100 2.10 mA 500 83 A 1000 80 A These measurements are done at an operating temperature of +25C at 3.3V and are characterized across a sample of RN4870/71 modules. Measurements taken with version 1.18 firmware loaded onto the module. The advertising packet data payload is approximately 15 bytes in length. The amount of data being transmitted between two peer devices can affect the average current measured. The average current measurements are done with only the necessary Bluetooth packets being exchanged to keep the connection active at the stated interval. DS50002489C-page 10 2016-2017 Microchip Technology Inc. RN4870/71 3.0 INTERFACE PINS Figure 3-1 shows the power scheme using a 3.3V low-dropout regulator to the RN487x and a host MCU. This scheme ensures that the same voltage is used for both the module and the MCU. FIGURE 3-1: Figure 3-1 also shows the basic UART connections to the host MCU. Figure 3-2 shows the recommended connections for running the RN4870/71 on coin cell battery. POWER SCHEME RN4870/71/70U Reset Reset IC IC Reset System Configurator Note 1: 2: 3: Ensure VDD_IO and MCU VDD voltages are compatible Control and Indication ports are configurable To implement low-power operation, enable the UART_RX_IND pin and connect to ground. Note 1: 2: 3: 4: 5: Ensure VDD_IO and MCU VDD voltages are compatible Control and Indication ports are configurable 10 F (X5R) and 330 ohm resistor are required for RN487x BK_IN connects to VBAT for RN4871U To implement low-power operation, enable the UART_RX_IND pin and connect to ground. RN4871U Reset IC Reset System Configurator 2016-2017 Microchip Technology Inc. DS50002489C-page 11 RN4870/71 FIGURE 3-2: RN4870/71 COIN CELL POWER SCHEME RN4870/71 Reset IC Reset Note 1: Application includes ADC, PWM (RN4870), and I2C bus interface 2: BK_IN connection is needed only for RN4871U. 3: To implement low-power operation, enable the UART_RX_IND pin and connect to ground. The Configuration pins on the RN4870 can also be configured through Windows(R)-based User Interface (UI) Configuration tool, BLEDK3. DS50002489C-page 12 2016-2017 Microchip Technology Inc. RN4870/71 4.0 PHYSICAL DIMENSIONS AND ATTRIBUTES 4.1 RN4870 Module Figure 4-1 shows the physical dimensions of the RN4870 module. Figure 4-2 illustrates the recommended PCB layout, and Figure 4-3 shows the recommended mounting details. Ensure that there is no top copper layer near the test pin area, indicated by the shaded keep out areas, as shown in Figure 4-2. When laying out the host PCB, the FIGURE 4-1: areas under the antenna must not contain any top, inner layer, or bottom copper as shown in Figure 4-3. A low-impedance ground plane ensures the best radio performance (best range; lowest noise). Figure 4-3 also shows a minimum ground plane area to the left and right side of the module for best antenna performance. The ground plane can be extended beyond the minimum recommended as required for host PCB EMC noise reduction. For best range performance, keep all external metal at least 30 mm away from the ceramic chip antenna. RN4870 MODULE DIMENSIONS 2016-2017 Microchip Technology Inc. DS50002489C-page 13 RN4870/71 FIGURE 4-2: RN4870 RECOMMENDED PCB FOOTPRINT FIGURE 4-3: RECOMMENDED MOUNTING DETAILS DS50002489C-page 14 2016-2017 Microchip Technology Inc. RN4870/71 4.2 RN4870U Module Figure 4-4 shows the physical dimensions of the RN4870U module. Figure 4-5 illustrates the recommended PCB layout, and Figure 4-6 shows the recommended mounting details. A low-impedance ground plane ensures the best radio performance (best range; lowest noise). Pin 30 (BT_RF) is a 50 ohm connection that can be connected FIGURE 4-4: to an external antenna such as a PCB trace antenna, a component (chip) antenna, or through a host PCB 50 ohm microstrip trace. This trace can be extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test posts. It is recommended that the microstrip trace to be as short as possible for minimum loss and best impedance matching. If the microstrip trace is longer, a 50 ohm impedance is recommended. RN4870U MODULE DIMENSIONS 2016-2017 Microchip Technology Inc. DS50002489C-page 15 RN4870/71 FIGURE 4-5: RN4870U RECOMMENDED PCB FOOTPRINT FIGURE 4-6: RN4870U RECOMMENDED PCB MOUNTING DS50002489C-page 16 2016-2017 Microchip Technology Inc. RN4870/71 RN4871 Module inner layer, or bottom copper as shown in Figure 4-9. A low-impedance ground plane ensures the best radio performance (best range; lowest noise). Figure 4-9 also shows a space area around antenna section for best antenna performance. The ground plane can be extended beyond the minimum recommended as required for host PCB EMC noise reduction. For best range performance, keep all external metal at least 30 mm away from the ceramic chip antenna. Figure 4-7 shows the physical dimensions of the RN4871 module. Figure 4-8 illustrates the recommended PCB layout, and Figure 4-9 shows the recommended mounting details. Ensure that there is no top copper layer near the test pin area, indicated by the shaded keep out areas, as shown in Figure 4-8. When laying out the host PCB, the areas under the antenna must not contain any top, RN4871 MODULE DIMENSIONS 5.79 5.33 11.5 11.14 Shield mounting hole 9.54 1 7.5 6.7 7.18 16 5.5 6.7 16 TP-3 5.5 Pad Positions 1.5 0.0 2.7 0.6 0.0 9.0 7.5 5.1 6.3 3.9 2.7 1.5 0.0 0.0 2.1 0.70 0.00 1.2 TP-5 5.1 1.9 Shield mounting hole 0.0 3.9 1.9 4.85 4.11 3.68 TP-4 TP-1 6.3 3.1 9.0 4.3 3.1 7.5 4.3 TP-3 6.01 TP-2 TP-2 TP-5 2.38 0.0 Shield mounting hole 4.75 TP-4 TP-1 6.93 11.5 7.5 6.7 0.63 Bottom View Side View 8.31 0.58 Top View 0.0 FIGURE 4-7: 6.0 5.25 4.3 Test Point Positions 1.0 Dimensions are in millimeters Tolerances: PCB Thikness: +/-0.06mm 0.7 0.7 0.5 Pad Detail 2016-2017 Microchip Technology Inc. DS50002489C-page 17 RN4870/71 FIGURE 4-8: RN4871 RECOMMENDED PCB FOOTPRINT 8.0 4.3 3.0 1.0 Top View 11.5 Keep Out Area 0.5 1.5 7.0 7.5 6.7 0.7 5.5 4.6 4.3 3.1 1.2 1.9 1.5 Keep Out Area 9.0 7.5 6.3 5.1 3.9 2.7 1.5 0.0 0.0 Dimensions are in millimeters FIGURE 4-9: DS50002489C-page 18 RN4871 RECOMMENDED PCB MOUNTING SUGGESTION 2016-2017 Microchip Technology Inc. RN4870/71 4.4 RN4871U Module Figure 4-10 shows the physical dimensions of the RN4871U module. Figure 4-11 illustrates the recommended PCB layout. It is highly recommended to layout the host PCB as suggested in Figure 4-12. Figure 4-13 shows the recommended placement for the module on the host PCB board. For optimal transmission and reception sensitivity, place the module at the edge of the board. FIGURE 4-10: A low-impedance ground plane ensures the best radio performance (best range; lowest noise). Pin 1 (BT_RF) is a 50 ohm connection that can be connected to an external antenna such as a PCB trace antenna, a component (chip) antenna, or through a host PCB 50 ohm microstrip trace. This trace can be extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test posts. It is recommended that the microstrip trace to be as short as possible for minimum loss and best impedance matching. If the microstrip trace is longer, a 50 ohm impedance is recommended. RN4871U MODULE DIMENSIONS Top View 2016-2017 Microchip Technology Inc. Side View Bottom View DS50002489C-page 19 RN4870/71 FIGURE 4-11: RN4871U RECOMMENDED PCB FOOTPRINT FIGURE 4-12: RN4871U RECOMMENDED PCB MOUNTING DS50002489C-page 20 2016-2017 Microchip Technology Inc. RN4870/71 FIGURE 4-13: RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST PCB BOARD Best Acceptable Acceptable Lowest performance 4.5 Soldering Recommendations The RN4870/71 Bluetooth modules are assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging the module, the following recommendations are given: * Microchip Technology Application Note, "AN233 Solder Reflow Recommendation" (DS00233) provides solder reflow recommendations * Do not exceed peak temperature (TP) of 250C * Refer to the solder paste data sheet for specific reflow profile recommendations * Use no-clean flux solder paste * Do not wash as moisture can be trapped under the shield * Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. 2016-2017 Microchip Technology Inc. DS50002489C-page 21 RN4870/71 NOTES: DS50002489C-page 22 2016-2017 Microchip Technology Inc. RN4870/71 5.0 5.1 APPLICATION REFERENCE CIRCUITS 5.2 Figure 5-2 through Figure 5-5 show the reference circuits for various modules under the RN4870/71 family. In the circuits, the power input range is 1.9V ~ 3.6V. A battery reverse protection circuit is recommended in case a battery power input is used. Note that the VDD_IO is the same as the power input. In case of a LED connection, the power input must be greater than 3.0V. For the RN4870U, an RF antenna matching circuit must also be included as shown in Figure 5-3. External Configuration and Programming The RN4870/71 modules can be configured and firmware programmed using an external configuration and programming tool. Figure 5-1 shows the mandatory connections required between the module and the external programming header. It is recommended to include these pin connections on the host PCB for development. For accessing the various configuration and indication pins, use Table 1-2, Table 1-3, Table 1-4 and Table 1-5. FIGURE 5-1: Reference Circuit EXTERNAL PROGRAMMING HEADER CONFIGURATIONS RN4870/71 2016-2017 Microchip Technology Inc. 1 P2_0 P2_0 1 VBAT VBAT 1 RXD RXD 1 TXD TXD 1 GND GND DS50002489C-page 23 RN4870 REFERENCE CIRCUIT 1 GND 2 GND VCC 3 GND P2_2 C1 2 GND GND P2_3 GND P2_7 P1_1 P1_2 P1_3 10uF 6.3V X5R Configuration Interface P2_0 2016-2017 Microchip Technology Inc. 1 2 3 4 5 GND VCC GND VBAT P2_2 U1 VDD_IO RN4870 VDD_IO ULPC_O P2_3 BK_O P2_7/TX_IND P1_1 P1_2/SCL P1_3/SDA LED Option GND P0_2 P0_7 P3_5 P3_4 P3_3 P3_2 P3_1 UART_TX UART_RX 31 P0_2 30 29 P0_7 28 P3_5 27 P3_4 26 P3_3 25 P3_2 P3_1 24 UART_TX 23 22 UART_RX UART Interface VCC R2 15 16 17 18 19 20 21 J2 GND 3 4 5 6 7 8 9 10 11 12 13 14 UART_RX UART_TX RST P2_0 MODE Low Test Mode High APP Mode P0_0 P1_0 P3_6 P2_0 P2_4 1 2 1 STS2301 4.7k C2 1uF GND P0_2 R1 LD1 B Q1 J1 33 GND 32 GND P0_0/CTS P1_0 P3_6/RTS P2_0/MODE P2_4 NC RST Reverse Voltage Protection Power Input RN4870/71 DS50002489C-page 24 FIGURE 5-2: 330 Configurable I/O P2_4 P0_0 P2_7 P0_7 P1_0 P3_1 P1_1 P3_2 P1_2 P3_3 P1_3 P3_4 P2_2 P3_5 P2_3 P3_6 VCC RN4870U REFERENCE CIRCUIT ANT1 Antenna Matching Reverse Voltage Protection Power Input VCC P2_2 C1 2 GND GND P2_3 GND 10uF 6.3V X5R P2_7 P1_1 P1_2 P1_3 Configuration Interface P2_0 1 2 3 4 5 BT_RF GND P0_2 P0_7 P3_5 P3_4 P3_3 P3_2 P3_1 UART_TX UART_RX UART_RX UART_TX MODE Low Test Mode High APP Mode 29 P0_2 28 27 P0_7 P3_5 26 P3_4 25 24 P3_3 P3_2 23 P3_1 22 UART_TX 21 UART_RX 20 UART Interface 1nH GND C4 GND LED Option P0_2 R1 LD1 VCC 330 VCC R2 RST P2_0 C3 30 4.7k C2 1uF GND Configurable I/O P2_4 P0_0 P2_7 P0_7 P1_0 P3_1 P1_1 P3_2 P1_2 P3_3 P1_3 P3_4 P2_2 P3_5 P2_3 P3_6 RN4870/71 DS50002489C-page 25 GND VCC GND VBAT P2_2 U1 VDD_IO RN4870U VDD_IO ULPC_O P2_3 BK_O P2_7/TX_IND P1_1 P1_2/SCL P1_3/SDA 13 14 15 16 17 18 19 J2 1 2 3 4 5 6 7 8 9 10 11 12 P0_0 P1_0 P3_6 P2_0 P2_4 1 2 GND 3 STS2301 B J1 L1 P0_0/CTS P1_0 P3_6/RTS P2_0/MODE P2_4 NC RST Q1 1 2016-2017 Microchip Technology Inc. FIGURE 5-3: RN4871 REFERENCE CIRCUIT Configuration Interface P2_0 RN4871 UART Interface P2_0 P2_7 Q1 VCC Power Input C1 P0_2 J1 STS2301 1 2 GND GND P1_6 UART_RX UART_TX P3_6 VCC 2016-2017 Microchip Technology Inc. Configurable I/O P0_0 P1_7 P2_0 P0_2 P1_2 P2_7 P1_3 P3_6 P1_6 16 15 14 13 12 6 7 8 9 10 11 GND P2_0 P2_7 VBAT GND P0_2 1 P1_3 P1_2 P1_7 NC GND P1_2 P1_3 P1_7 2 GND 1 2 3 4 5 R2 4.7k C2 1uF GND LED Option RST Reset Circuit GND GND 10uF 6.3V X5R P0_2 R1 LD1 VCC P2_0 MODE Low Test Mode High APP Mode B UART_RX UART_TX Reverse Voltage Protection 3 VCC P0_0 1 2 3 4 5 U1 P1_6 UART_RX UART_TX P3_6 RST P0_0 J2 RN4870/71 DS50002489C-page 26 FIGURE 5-4: 330 VCC P0_2 R2 4.7k 330 RST Reverse Voltage Protection Power Input GND GND 10 BK_I 11 VBAT 12 GND 13 P1_6 GND 10uF 6.3V X5R Test Mode High APP Mode GND P1_6 U1 RN4871U 4 UART_TX 3 P1_3 2 P1_2 1 BT_RF J2 VCC 1 2 UART_RX 3 UART_TX 4 5 GND P1_3 P1_2 ANT1 Antenna Matching L1 C3 GND GND 1nH C4 GND RN4870/71 DS50002489C-page 27 Configurable I/O P0_0 P1_7 P2_0 P0_2 P1_2 P2_7 P1_3 P3_6 P1_6 Low Configuration Interface P2_0 UART_RX UART_TX UART Interface 9 8 7 6 5 3 1 C1 GND 2 1 2 1uF VCC STS2301 MODE C2 P0_2 P0_0 RST P3_6 UART_RX Q1 J1 P3_6 R1 P2_0 14 P1_7 15 P2_7 16 P2_0 17 GND LD1 P0_2 P0_0 LED Option P1_7 P2_7 P2_0 VCC RN4871U REFERENCE CIRCUIT B 2016-2017 Microchip Technology Inc. FIGURE 5-5: RN4870/71 5.3 Power Drop Protection To prevent any problems that may arise when the power supply goes below 1.9V, a power-supply dropprotection circuit is recommended. Essentially, this circuit consists of a Reset IC which acts as an Open FIGURE 5-6: Drain with a Delay =< 10 ms, and is triggered at 1.8V power supply. Figure 5-6 shows a recommended power drop protection circuit. POWER DROP PROTECTION CIRCUIT VBAT RN4870/71 RST_N DS50002489C-page 28 Reset IC OUT VDD 2016-2017 Microchip Technology Inc. RN4870/71 6.0 ASCII COMMAND API The RN4870/71 command Application Programming Interfaces (APIs) are documented in the "RN4870/71 Bluetooth(R) Low Energy Module User's Guide" (DS50002466). The following are the available command options and their categories: * Connection - Establish connection - Disconnect - Bond/Unbond current connection - Start/Stop scan for other devices - Add/Delete peer devices to white list - Read RSSI values - Stop connection process * I/O - Read/Write I2C - Change settings in the EEPROM - Configure pin functions - Configure GPIO mask - Set/Get GPIO states - Read and write analog data - PWM control * System - Reboot - Factory default - Enter and Exit Command mode - Enter Low-Power mode * Scripting - Enter Script mode - Declare event handler - Execute current script - List current script - Clear script - Define user function 2016-2017 Microchip Technology Inc. * GATT Services - Create/Delete public services/characteristics - Read/Write characteristic values - Set notification for characteristics * GAP Role - Central, Peripheral, Observer and Broadcaster * Advertising - Start/Stop - Set custom advertisement content - Set scan response content - Set beacon content * Private Service - Create/Delete private services/characteristics - Read/Write characteristic values - Set notification for characteristics * Transparent UART - Enable/Disable - Peripheral side configuration - Central side configuration * Remote configuration of the module * Read individual device Information or Profile settings DS50002489C-page 29 RN4870/71 NOTES: DS50002489C-page 30 2016-2017 Microchip Technology Inc. RN4870/71 7.0 SUPPORTED SERVICES The RN4870 supports four built-in GATT services: * Device Information public service * Airpatch private service, which handles Over The Air (OTA) updates * BeaconThings, which handles beacon services control * UART Transparent private service, which handles data streaming function In addition to the above predefined private services, the RN4870 provides the ability to create private services. If the services are supported on both end points of a Bluetooth Low Energy connection, such as Central and Peripheral devices, data can be exchanged. For example, two RN4870 modules can define a custom (private) service with its own unique characteristics. Data can be exchanged easily via Command API. Private services are not registered with the Bluetooth SIG, and therefore not interoperable with other Bluetooth Low Energy devices, unless the device implements the private service. An example of a builtin private service is the Transparent UART. For an example on how to create a custom service using the RN4870, refer to "RN4870/71 Bluetooth(R) Low Energy Module User's Guide" (DS50002466). RN4870 allows custom defined services up to five public and four private services. Each custom defined service allows up to eight custom defined characteristics. All service definitions are saved in on-board Non-Volatile Memory (NVM) where the user must setup the module only once. 2016-2017 Microchip Technology Inc. DS50002489C-page 31 RN4870/71 NOTES: DS50002489C-page 32 2016-2017 Microchip Technology Inc. RN4870/71 8.0 ANTENNA CHARACTERISTICS The RN4870 and RN4871 modules contain an integral ceramic chip antenna. Figure 8-1 and Figure 8-2 show the antenna performance on the modules. FIGURE 8-1: RN4870 ANTENNA PERFORMANCE Parameter Values Frequency 2450 MHz Max Gain 1.63 dBi Efficiency 71.55% Antenna Description ANT ANT3216A063R2400A PIFA 2.4GHz L3 2W1.6 2016-2017 Microchip Technology Inc. Manufacturer Part Number Manufacturer ANT3216A063R2400A Yageo DS50002489C-page 33 RN4870/71 FIGURE 8-2: RN4871 ANTENNA PERFORMANCE Parameter Values Frequency 2442 MHz Max Gain 0.1 dBi Efficiency 42.7% Antenna Description Manufacturer Part Number Manufacturer ANT AANT3216LL00R2400A PIFA 2.4GHz L3 2W1.6 ANT3216LL00R2400A Yageo DS50002489C-page 34 2016-2017 Microchip Technology Inc. RN4870/71 9.0 TIMING CHARACTERISTICS mode, when RN4870/71 is ready to talk to MCU after Reset, the module provides a UART response indicating that the Reset is complete. For more details, refer to the "RN4870/71 Bluetooth(R) Low Energy Module User's Guide" (DS50002466). Figure 9-1 shows the timing diagram for the RN4870/ 71 modules when it is Reset in the Test mode and Application mode. Figure 9-2 shows the timing diagram for the module when it is powered on. In Application FIGURE 9-1: TIMING DIAGRAM OF RN4870/71 UART READY AFTER RESET (IN TEST AND APPLICATION MODE) Ext Reset UART Ready for MCU 1mS Test Mode Process P2_0=0 UART Ready for MCU Application Mode Process Status pin/UART Report Command P2_0=1 25mS 46mS 68mS FIGURE 9-2: TIMING DIAGRAM OF RN4870/71 UART WHEN POWERED ON (IN TEST AND APPLICATION MODE) VBAT Test Mode Process Application Mode Process UART Ready for MCU P2_0=0 25mS UART Ready for MCU Status pin/UART Report Command P2_0=1 46mS 68mS 2016-2017 Microchip Technology Inc. DS50002489C-page 35 RN4870/71 Table 9-1 shows the error rate for various UART baud rates for the RN4870/71 module. The system clock is running at 16 MHz. TABLE 9-1: ERROR RATE FOR VARIOUS BAUD RATES ON THE RN4870/71 Set Baud Rate Measured Baud Rate Error 921600 941176 -2.12% 460800 457143 0.79% 307200 307692 -0.16% 230400 231884 -0.64% 115200 115942 -0.64% 57600 57971 -0.64% 38400 38095 0.79% 19200 19048 0.79% 9600 9524 0.79% DS50002489C-page 36 2016-2017 Microchip Technology Inc. RN4870/71 10.0 REGULATORY APPROVAL This section outlines the regulatory information for the RN4870/71 module for the following countries: * * * * * * * * United States Canada Europe Japan Korea Taiwan China Other Regulatory Jurisdictions 10.1 United States The RN4870/71 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C "Intentional Radiators" singlemodular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product, or host device) by the grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. A host product itself is required to comply with all other applicable FCC equipment authorization regulations, requirements, and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification or Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions). 10.1.1 For the RN4870 module: Contains Transmitter Module FCC ID: A8TBM70ABCDEFGH or Contains FCC ID: A8TBM70ABCDEFGH This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Due to the limited size of the RN4871, the FCC Identifier (FCC ID) is not displayed on the module. Therefore, the FCC ID must be placed on the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: For the RN4871 module: Contains Transmitter Module FCC ID: A8TBM71S2 or Contains FCC ID: A8TBM71S2 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. LABELING AND USER INFORMATION REQUIREMENTS The RN4870 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: 2016-2017 Microchip Technology Inc. DS50002489C-page 37 RN4870/71 A user's manual for the product should include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: * Reorient or relocate the receiving antenna. * Increase the separation between the equipment and receiver. * Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. * Consult the dealer or an experienced radio/TV technician for help. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm. 10.1.2 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB Publication 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm 10.2 Canada The RN4870/71 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen, RSS-210, and RSS247. Modular approval permits the installation of a module in a host device without the need to recertify the device. 10.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements (from RSP-100 - Issue 10, Section 3): The host device shall be properly labeled to identify the module within the host device. Modular Devices (from RSP-100 - Issue 10, Section 7): The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: For the RN4870 module: Contains transmitter module IC: 12246A-BM70BLES1F2 Due to the limited size of the RN4871, the Industry Canada certification number is not displayed on the module. Therefore, the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: Contains transmitter module IC: 12246A-BM71S2 Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. This module is approved for installation into mobile or/and portable host platforms. 10.1.3 HELPFUL WEB SITES Federal Communications Commission (FCC): http://www.fcc.gov DS50002489C-page 38 2016-2017 Microchip Technology Inc. RN4870/71 User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm. Note: This device complies with Industry Canada's licenseexempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage; (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. 10.2.2 RF EXPOSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). 10.2.3 To maintain conformance to the testing listed in Table 10-1, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. 10.3.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the RN4870/71 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ 10.3 Europe The RN4870/71 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The RN4870/71 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table 10-1 and Table 10-2 European Compliance Testing. A Notified Body Opinion has also been issued. All test reports are available on the RN4870/71 product web page at http://www.microchip.com. 2016-2017 Microchip Technology Inc. DS50002489C-page 39 RN4870/71 10.3.2 HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are: * Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm TABLE 10-1: * European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org/ * European Telecommunications Standards Institute (ETSI): http://www.etsi.org * European Radio Communications Office (ERO): http://www.ero.dk/ * The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/ EUROPEAN COMPLIANCE TESTING FOR RN4870 Certification Standards Safety EN60950-1:2006/A11:2009/A1:2010/ A12:2011/A2:2013 Health EN 62479:2010 EMC EN 301 489-1 V1.9.2 Article Laboratory (3.1(a)) (3.1(b)) Report Number 10051261 003 TUV Rheinland 10053580 001 10051137 002 EN 301 489-17 V2.2.1 Radio EN 300 328 V1.9.1 (3.2) 10053580 001 Notified Body Opinion TABLE 10-2: 10048935 001 EUROPEAN COMPLIANCE TESTING FOR RN4871 Certification Standards Safety EN60950-1:2006/A11:2009/A1:2010/ A12:2011/A2:2013 Health EN 62479:2010 EMC EN 301 489-1 V1.9.2 Article Laboratory (3.1(a)) (3.1(b)) Report Number 10053210 001 TUV Rheinland 10053433 001 10052964 001 EN 301 489-17 V2.2.1 Radio EN 300 328 V1.9.1 Notified Body Opinion DS50002489C-page 40 (3.2) 10053433 001 10048936 001 2016-2017 Microchip Technology Inc. RN4870/71 10.4 Japan The RN4870/71 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: * If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. * There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCII: http://www.vcci.jp/vcci_e/index.html 10.4.1 LABELING AND USER INFORMATION REQUIREMENTS 10.4.2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ 10.5 Korea The RN4870/71 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 10.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the RN4870/71 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The RN4870 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: The label on the final product which contains the RN4870/71 module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. The RN4870 module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside: Due to the limited size of the RN4871, the KC mark is not displayed on the module. Therefore, final product requires the KC mark and certificate number of the module: Contains transmitter module with certificate number: 10.5.2 Due to the limited size of the RN4871, the technical conformity mark and certification number is not displayed on the module. Therefore, the final product in which this module is being used must have a label referring to the type certified module inside: HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr. National Radio Research Agency (RRA): http://rra.go.kr. Contains transmitter module with certificate number: 2016-2017 Microchip Technology Inc. DS50002489C-page 41 RN4870/71 10.6 Taiwan The RN4870/71 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. 10.6.2 Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. The RN4870/71 module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. 10.6.1 LABELING AND USER INFORMATION REQUIREMENTS The RN4870 module is labeled with its own NCC ID number, and if the NCC ID is not visible when the module is installed inside another device, then the outside of the device must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Due to the limited size of the RN4871, the NCC ID is not displayed on the module. Therefore, the outside of the device must also display a label referring to the enclosed module. This exterior label can use wording such as the following: National Communications Commission (NCC): http://www.ncc.gov.tw. 10.7 10.7.1 ! DS50002489C-page 42 China LABELING AND USER INFORMATION REQUIREMENTS The RN4870 module is labeled with its own CMIT ID as follows: The RN4871 module is labeled with its own CMIT ID as follows:: 10.8 The user's manual should contain below warning (for RF device) in traditional Chinese: HELPFUL WEB SITES Other Regulatory Jurisdictions Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, a certification utility is available. For further regulatory Certification Utility and documentation, contact your local Microchip Technology sales office. 2016-2017 Microchip Technology Inc. RN4870/71 11.0 ORDERING INFORMATION Table 11-1 provides ordering information for the RN4870/71 module. TABLE 11-1: ORDERING INFORMATION Part Number(1) RN4870-V/RMXXX RN4870U-V/RMXXX Antenna Shielding Number of Pins Operating Temperature Range On-Board Yes 33 -20C to +70C -20C to +70C External No 30 On-Board Yes 16 -20C to +70C External No 17 -20C to +70C RN4870-I/RMXXX On-Board Yes 33 -40C to +85C RN4871-I/RMXXX On-Board Yes 16 -40C to +85C RN4871-V/RMXXX RN4871U-V/RMXXX Note 1: The last three digits in P/N indicate firmware version. At the time of publication, the latest firmware version is 1.28. Ensure to check product webpage for latest part number and firmware version. Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products. 2016-2017 Microchip Technology Inc. DS50002489C-page 43 RN4870/71 APPENDIX A: REVISION HISTORY Revision A (April 2016) This is the initial release of this document. Revision B (October 2017) * Added the new parts, RN4870-I/RMXXX and RN4871-I/RMXXX, released with increased operating temperature range. * Updated Features section and removed Description section on page 1. * Updated Table 1-1, Table 1-2, Table 1-4 and Table 11-1. * Revised Table 2-1 through Table 2-4. * Updated Figure 1-4, Figure 3-1, Figure 3-2, and Figure 4-7. * Added Section 10.7 "China" to Section 10.0 "Regulatory Approval"; * Updated Table 11-1 and Section "Product Identification System". Revision C (December 2017) * Updated Table 2-1 to correct information for the operating temperature range. DS50002489C-page 44 2016-2017 Microchip Technology Inc. RN4870/71 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. 2016-2017 Microchip Technology Inc. DS50002489C-page 45 RN4870/71 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. V PART NO. Temperature Range Device RM XXX Package Firmware Revision Number Device: RN4870: RN4870U: RN4871: RN4871U: Temperature Range: V I = -20C to = -40C to Package: RM = Radio Module DS50002489C-page 46 Example: RN4870-V/RM118: Various temperature RN4870-I/RM128: Industrial temperature Ceramic Chip Antenna External Antenna Ceramic Chip Antenna External Antenna +70C +85C (Various) (Industrial) Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2016-2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2016-2017 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2016-2017, Microchip Technology Incorporated, All Rights Reserved. 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