2016-2017 Microchip Technology Inc. DS50002489C-page 1
RN4870/71
Features
• Fully Qualified Bluetooth® Low Energy Module
• Certified to FCC, IC, CE, KCC, NCC and SRRC
• On-Board Bluetooth 4.2 Low Energy Stack
• ASCII Command Interface API over UART
• Scripting Engine for Hostless Operation
• Compact Form Factor – The RN4870/71 family
comes in four different sizes from 6 mm x 8 mm to
12 mm x 22 mm:
- RN4870: 12 mm x 22 mm
- RN4871: 9 mm x 11.5 mm
- RN4870U: 12 mm x 15 mm
- RN4871U: 6 mm x 8 mm
• Beacon Private Service for Beacon Services
• UART Transparent Service for Serial Data
Applications
• Remote Configuration Over The Air
Operational
• Operating Voltage: 1.9V to 3.6V (3.3V typical)
• Temperature Range:
- -20°C to +70°C (Normal)
- -40°C to +85°C (Industrial)
• Supports UART
• Up to Three Pulse Width Modulation (PWM)
Outputs
RF/Analog Features
• ISM Band 2.402 to 2.480 GHz Operation
• Channels: 0-39
• RX Sensitivity: -90 dBm
• TX Power: 0 dBm
• RSSI Monitor
MAC/Baseband/Higher Layer Features
• Secure AES128 Encryption
• GAP, GATT, SM, L2CAP and Integrated Public
Profiles
• Customer Can Create up to Five Public and Four
Private Services
• Keyboard I/O Authentication
• Software Configurable Role as Peripheral or
Central and Client or Server
Antenna Options
• Integrated Chip Antenna (RN487x) - refer to
Section 8.0, Antenna Characteristics,
Figure 8-1 and Figure 8-2 for antenna
performance specifications
• External Antenna Connection via RF Pad
(RN4870U/RN4871U)
Applications
• Health/Medical Devices
• Sports Activity/Fitness Meters
• Beacon Applications
• Internet of Things (IoT) Sensor Tag
• Remote Control
• Wearable Smart Devices and Accessories
• Smart Energy/Smart Home
• Industrial Control
Bluetooth® 4.2 Low Energy Module
RN4870/71
DS50002489C-page 2 2016-2017 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Specifications ............................................................................................................................................................................... 9
3.0 Interface PINs..............................................................................................................................................................................11
4.0 Physical Dimensions And Attributes ........................................................................................................................................... 13
5.0 Application Reference Circuits ................................................................................................................................................... 23
6.0 ASCII Command API.................................................................................................................................................................. 29
7.0 Supported Services .................................................................................................................................................................... 31
8.0 Antenna Characteristics ............................................................................................................................................................. 33
9.0 Timing Characteristics ................................................................................................................................................................ 35
10.0 Regulatory Approval ................................................................................................................................................................... 37
11.0 Ordering Information .................................................................................................................................................................. 43
The Microchip Web Site ....................................................................................................................................................................... 45
Customer Change Notification Service ................................................................................................................................................ 45
Customer Support ................................................................................................................................................................................ 45
Product Identification System............................................................................................................................................................... 46
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2016-2017 Microchip Technology Inc. DS50002489C-page 3
RN4870/71
1.0 DEVICE OVERVIEW
1.1 Overview
The RN4870/71 Bluetooth Low Energy (BLE) modules
integrate Bluetooth 4.2 baseband controller, on-board
Bluetooth stack, digital and analog I/O, and RF power
amplifier into one solution.
Table 1-1 shows the various options for packaging and
features available in the RN4870/71 family. Table 1-2
provides the description of the pin functions for all the
modules in the RN4870/71 family. Figure 1-1 through
Figure 1-4 show the pinout for the different modules.
TABLE 1-1: RN4870/71 FAMILY
Part Number(1)Antenna
On-Board Shielding Number of
Pins Dimensions Operating
Temperature Range
RN4870-V/RMXXX Yes Yes 33 12 mm x 22 mm -20°C to +70°C
RN4870U-V/RMXXX No No 30 12 mm x 15 mm -20°C to +70°C
RN4871-V/RMXXX Yes Yes 16 9 mm x 11.5 mm -20°C to +70°C
RN4871U-V/RMXXX No No 17 6 mm x 8 mm -20°C to +70°C
RN4870-I/RMXXX Yes Yes 33 12 mm x 22 mm -40°C to +85°C
RN4871-I/RMXXX Yes Yes 16 9 mm x 11.5 mm -40°C to +85°C
Note 1: The last three digits in P/N indicate the firmware version. At the time of publication, the latest firmware
version is 1.28. Ensure to check product webpage for latest part number and firmware version.
TABLE 1-2: PIN DESCRIPTION
RN4870U RN4870 RN4871U RN4871 Name Type Description
— 1 — — GND Power Ground reference
— 2 — — GND Power Ground reference
1 3 12 13 GND Power Ground reference
2 4 11 14 VBAT Power Positive supply input. Range: 1.9V~3.6V
— — 10 — BK_IN Power Buck power supply input
Can be connected to the VBAT pin
Connect to 10 µF low ESR ceramic capacitor
Voltage range: 1.9V to 3.6V
3 5 — — P2_2 D I/O GPIO
PWM1
Default: Input; pulled-high
4 6 — — VDD_IO Power VDD; power input
Same input pin as VBAT
Can be connected to the VBAT pin
5 7 — — VDD_IO Power VDD; power input
Same input pin as VBAT
Can be connected to the VBAT pin
6 8 — — ULPC_O Power 1.2V ULPC LDO output
Used for diagnostic purposes
Do not connect to any pin or device
For measurement, connect a bypass 1 µF
capacitor to ground
7 9 — — P2_3 D I/O GPIO
PWM2
Default: Input; pulled-high
8 10 — — BK_O Power 1.55V Buck power supply output for diagnostic
purpose
Do not connect
— — 13 6 P1_6 D Configurable pin. Refer to Section 1.2 “Module
Configuration” for details.
RN4870/71
DS50002489C-page 4 2016-2017 Microchip Technology Inc.
— — 14 5 P1_7 D Configurable pin. Refer to Section 1.2 “Module
Configuration” for details.
9 11 15 15 P2_7 D O/p UART_TX_IND output pin. Provides indication if
RN4870 is transmitting to host MCU over UART.
Pulled low before UART TX begins and pulled high
after UART TX is over.
10 12 — — P1_1 D I/O
A I/p
GPIO; default: Input; pulled-high
AD9
Configured as the BLEDK_STATUS1_IND pin by
default
11 13 2 3 P1_2 D I/O
A I/p
GPIO; default: Input; pulled-high
AD10; I2C SCL pin
12 14 3 4 P1_3 D I/O GPIO; default: Input; pulled-high
AD11; I2C SDA pin
13 15 8 11 P0_0 D I/O GPIO; default: Input; pulled-high
AD0
Configured as the UART_CTS pin by default
14 16 — — P1_0 D I/O GPIO; default: Input; pulled-high
AD8
Configured as the BLEDK_STATUS2_IND pin by
default
15 17 6 9 P3_6 D I/O GPIO; default: Input; pulled-high
PWM0
Configured as the UART_RTS pin by default
16 18 16 16 P2_0 D I/p System configuration input;
1: Application mode
0: Test mode/Flash update/EEPROM configuration
Default: Input; pulled-high
17 19 — — P2_4 D I/O GPIO; default: Input; pulled-high
18 20 — — NC — No Connection
19 21 7 10 RST_N D I/p Module Reset; active-low; Internally pulled-high
20 22 5 7 UART_RX D I/p UART Data input
21 23 4 8 UART_TX D O/p UART Data output
22 24 — — P3_1 D I/O GPIO; default: Input; pulled-high
Configured as RSSI_IND pin by default; SPI NCS
Bus
23 25 — — P3_2 D I/p GPIO; default: Input; pulled-high
Configured as the LINK_DROP pin by default; SPI
MISO pin
24 26 — — P3_3 D I/p GPIO; default: Input; pulled-high
Configured as the UART RX Indication pin by default;
SPI MOSI pin
25 27 — — P3_4 D I/p GPIO; default: Input; pulled-high
Configured as the PAIRING_KEY pin by default; SPI
SCLK pin
26 28 — — P3_5 D I/O
A I/p
GPIO; default: Input; pulled-high
LED1; provides indication whether the module is ON/
OFF
27 29 — — P0_7 D I/O GPIO; default: Input; pulled-high
Configured to the LOW_BATTERY_INDICATOR pin
by default
TABLE 1-2: PIN DESCRIPTION (CONTINUED)
RN4870U RN4870 RN4871U RN4871 Name Type Description
2016-2017 Microchip Technology Inc. DS50002489C-page 5
RN4870/71
FIGURE 1-1: PIN DIAGRAM - RN4870U
FIGURE 1-2: PIN DIAGRAM - RN4870
28 30 9 12 P0_2 D I/O AD2
LED0: Provides indication whether the module is in
ON/OFF mode
29 31 17 2 GND Power Ground Reference
— 32 — — GND Power Ground Reference
30 — 1 — BT_RF A I/O External Antenna connection (50 ohms). Only for
RN4870U and RN4871U. No connection for RN4871.
— 33 — — GND Power Ground Reference
Legend: Pin Type Abbreviations: A = Analog D = Digital I/O = Input/Output I/p = Input O/p = Output
TABLE 1-2: PIN DESCRIPTION (CONTINUED)
RN4870U RN4870 RN4871U RN4871 Name Type Description
TP-2 TP-2 CLDO_O
TP-1 VCC_PA
TP-3 VCC_RF
TP-1
TP-3
GND
GND
VBAT
P2_2
VDD_IO
VDD_IO
ULPC_O
P2_3
BK_O
P2_7/TX_IND
P1_1
P1_2
P1_3
P0_0/CTS
P1_0
P3_6/RTS
P2_0/MODE
P2_4
NC
RST_N
P0_2/LED
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
UART_TX
UART_RX
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
301BT_RF
2
30 1
Top View Bottom View
TP-2 TP-2 CLDO_O
TP-1 VCC_PA
TP-3 VCC_RF
TP-1
TP-3
GND
GND
GND
GND
GND
GND
VBAT
P2_2
VDD_IO
VDD_IO
ULPC_O
P2_3
BK_O
P2_7/TX_IND
P1_1
P1_2
P1_3
P0_0/CTS
P1_0
P3_6/RTS
P2_0/MODE
P2_4
NC
RST_N
P0_2/LED
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
UART_TX
UART_RX
133
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
Top View Bottom View
RN4870/71
DS50002489C-page 6 2016-2017 Microchip Technology Inc.
FIGURE 1-3: PIN DIAGRAM - RN4871U
FIGURE 1-4: PIN DIAGRAM - RN4871
3
4
1
2
5
6
7
8
9
13
10
11
12
14
15
16
17 17
1
TP-1
TP-2
TP-3
TP-4
TP-5
VBAT
BK_IN
GND
P1_6
P1_7
P2_7
P2_0
GND
BT_RF
P1_2
P1_3
UART_TX
UART_RX
RST_N
P3_6
P0_2
P0_0
TP-1 CLDO_O
VCC_PA TP-3
VCC_RF TP-2 TP-4 ULPC_O
TP-5 BK_O
Top View Bottom View
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2016-2017 Microchip Technology Inc. DS50002489C-page 7
RN4870/71
1.2 Module Configuration
The GPIO pins of the RN4870 and RN4871 modules
can be configured to different functions using the ASCII
command interface. Tab le 1- 3 shows the various pins
in the RN4870/71 module that are available for
configuration and their default configuration settings.
Table 1-4 provides details on each functions available.
Table 1-5 shows the status of the module as indicated
by the Status 1 and Status 2 indication pins. Table 1-6
shows the details of test pads that are present on the
bottom side of the module, used for diagnostic
purposes during testing. Figure 1-5 shows all the key
elements of the module.
TABLE 1-3: CONFIGURABLE PINS AND DEFAULT FUNCTIONS IN THE RN4870 AND RN4871
Pin Name
Available in
Default Function
RN4870 RN4871
P0_7 x — Low Battery Indication
P1_0 x — Status 2
P1_1 x — Status 1
P2_2 x — None
P2_4 x — None
P3_1 x — RSSI Indication
P3_2 x — Link Drop
P3_3 x — UART RX Indication
P3_4 x — Pairing Key
P3_5 x — None
P1_2 x x None
P1_3 x x None
P1_6 — x UART RX Indication
P1_7 — x None
TABLE 1-4: CONFIGURABLE FUNCTIONS AND DESCRIPTIONS
Function Name Description
Low Battery Indication Pin output goes low when the VDD is below a specified level. To set the
threshold level, change the EEPROM settings.
Status 1 Use this indication pin along with the Status 2 pin to indicate the current status of
the module. Refer to Table 1-5 for details of the status indication.
Status 2 Use this indication pin along with the Status 1 pin to indicate the current status of
the module. Refer to Table 1-5 for details of the status indication.
RSSI Indication Use this indication pin to indicate the quality of the link based on the RSSI level.
If the RSSI level is lower than the specified threshold value, then the RSSI
indication pin goes low. Set the threshold for the RSSI link quality in EEPROM.
Link Drop When the RN4870/71 is connected to a remote device, the host MCU can use
the Link Drop pin to force the module to disconnect the link and and enter
shutdown state. The pin needs to be pulled low for at least 10 ms.
UART RX Indication Use this pin to enable communication with the UART when the module is in Low-
Power mode. When not in Low-Power mode, the module runs on a 16 MHz
clock. If Low-Power mode is enabled on the module by using command SO,1,
the module runs on a 32 kHz clock thus reducing power consumption. However,
in Low-Power mode, the host MCU cannot communicate with the module via the
UART since the UART is not operational. If the user intends to provide data or
commands via UART in the Low-Power mode, then the UART RX INDICATION
pin must be pulled low and the user needs to wait for at least five milliseconds
before sending the data. Pulling the UART RX INDICATION pin low allows the
module to operate the 16 MHz clock and to enable UART.
RN4870/71
DS50002489C-page 8 2016-2017 Microchip Technology Inc.
FIGURE 1-5: BLOCK DIAGRAM OF THE RN4870/71
Pairing Key When the RN4870/71 is connected to a remote device, the host MCU can use
the Pairing Key pin to force the module to disconnect the link and go back to
standby state. The pin must be pulled down for at least 160 ms.
RF Active Indication Use this indication pin to indicate that the module is currently performing an
active transmission and receiving BLE data.
TABLE 1-5: STATUS INDICATION PINS
Status 1 Status 2 State
High High Power On
High Low Standby state
Low Low Connection established
Low High Data session open (Transparent UART)
TABLE 1-6: TEST POINTS ON THE BOTTOM SIDE
RN4870U RN4870 RN4871U RN4871 Symbol Description
TP-1 TP-1 TP-3 TP-3 VCC_PA 1.55V RF PA LDO
TP-2 TP-2 TP-1 TP-5 CLDO_O 1.2V CLDO Output
TP-3 TP-3 TP-2 TP-2 VCC_RF 1.2V RF LDO Output
— — TP-4 TP-4 ULPC_O 1.2V ULPC LDO Output
— — TP-5 TP-1 BK_O 1.55V Buck Reg Output
TABLE 1-4: CONFIGURABLE FUNCTIONS AND DESCRIPTIONS (CONTINUED)
Function Name Description
RN4870/RN4871
2016-2017 Microchip Technology Inc. DS50002489C-page 9
RN4870/71
2.0 SPECIFICATIONS
Table 2-1 provides the general specifications for the
module. Table 2-2, Tab le 2 -3 and Ta bl e 2- 4 provide the
electrical characteristics and the current consumption
of the module.
TABLE 2-1: GENERAL SPECIFICATIONS
Specification Description
Standard Compliance Bluetooth 4.2
Frequency Band 2.402 to 2.480 GHz
Modulation Method GFSK
Maximum Data Rate (Transparent UART) 10 kbps (iOS®9)
Antenna Ceramic
Interface UART, AIO, PIO
Operating Range 1.9V to 3.6V
Sensitivity -90 dBm
RF TX Power 0 dBm
Operating Temperature Range for RN4870-I and RN4871-I modules -40°C to +85°C
Operating Temperature Range for RN4870-V and RN4871-V modules -20°C to +70°C
Storage Temperature Range -40°C to +125°C
Operating Relative Humidity Range 10% to 90%
Storage Relative Humidity Range 10% to 90%
Moisture Sensitivity Level 2
TABLE 2-2: ELECTRICAL CHARACTERISTICS
Parameter Min. Typ. Max. Units
Supply Voltage (VDD) 1.9 — 3.6 V
I/O Voltage Levels
VIL Input Logic Levels Low VSS — 0.3 VDD V
VIH Input Logic Levels High 0.7 VDD —VDD V
VOL Output Logic Levels Low Vss — 0.2 VDD V
VOH Output Logic Levels High 0.8 VDD —VDD V
Reset
Reset Low Duration 63 — — ns
Input and Tri-State Current with
Pull-Up Resistance 34 48 74 k
Pull-Down Resistance 29 47 86 k
RN4870/71
DS50002489C-page 10 2016-2017 Microchip Technology Inc.
TABLE 2-3: CURRENT CONSUMPTION
Parameter Min. Typ. Max. Units
Supply Current
TX mode Peak Current at VDD = 3V, TX = 0 dBm, Buck mode — 10 at +25°C 13 at +75°C/+85°C mA
RX mode Peak Current at VDD = 3V, Buck mode — 10 at +25°C 13 at +75°C/+85°C mA
Low-Power Mode Current(2)— 60 at +25°C — µA
Shutdown Low-Power Mode 1 — 2.9 µA
Note 1: The current measurements are characterized across a sample of RN4870/71 modules at room tempera-
ture (+25°C), unless otherwise noted.
2: For more details on Low-Power mode, refer to the “RN4870/71 Bluetooth® Low Energy Module User’s
Guide” (DS50002466).
TABLE 2-4: CURRENT CONSUMPTION DURING APPLICATION MODE
Test Mode Interval
(ms) Average Current Consumption
Advertising(1,2,3)
20 1.061 mA
50 505 µA
100 298 µA
500 113 µA
1000 89 µA
Connected(1,2,4)
18.75 2.23 mA
50 2.13 mA
100 2.10 mA
500 83 µA
1000 80 µA
Note 1: These measurements are done at an operating temperature of +25°C at 3.3V and are characterized
across a sample of RN4870/71 modules.
2: Measurements taken with version 1.18 firmware loaded onto the module.
3: The advertising packet data payload is approximately 15 bytes in length.
4: The amount of data being transmitted between two peer devices can affect the average current measured.
The average current measurements are done with only the necessary Bluetooth packets being exchanged
to keep the connection active at the stated interval.
2016-2017 Microchip Technology Inc. DS50002489C-page 11
RN4870/71
3.0 INTERFACE PINS
Figure 3-1 shows the power scheme using a 3.3V
low-dropout regulator to the RN487x and a host MCU.
This scheme ensures that the same voltage is used for
both the module and the MCU.
Figure 3-1 also shows the basic UART connections to
the host MCU.
Figure 3-2 shows the recommended connections for
running the RN4870/71 on coin cell battery.
FIGURE 3-1: POWER SCHEME
System Configurator
System Configurator
Note 1: Ensure VDD_IO and MCU VDD voltages are compatible
2: Control and Indication ports are configurable
3: To implement low-power operation, enable the UART_RX_IND
pin and connect to ground.
Note 1: Ensure VDD_IO and MCU VDD voltages are compatible
2: Control and Indication ports are configurable
3: 10 µF (X5R) and 330 ohm resistor are required for RN487x
4: BK_IN connects to VBAT for RN4871U
5: To implement low-power operation, enable the UART_RX_IND
pin and connect to ground.
RN4870/71/70U
RN4871U
Reset IC Reset
System Configurator
System Configurator
Note 1: Ensure VDD_IO and MCU VDD voltages are compatible
2: Control and Indication ports are configurable
3: To implement low-power operation, enable the UART_RX_IND
pin and connect to ground.
Note 1: Ensure VDD_IO and MCU VDD voltages are compatible
2: Control and Indication ports are configurable
3: 10 µF (X5R) and 330 ohm resistor are required for RN487x
4: BK_IN connects to VBAT for RN4871U
5: To implement low-power operation, enable the UART_RX_IND
pin and connect to ground.
RN4870/71/70U
RN4871U
Reset IC Reset
Reset IC Reset
RN4870/71
DS50002489C-page 12 2016-2017 Microchip Technology Inc.
FIGURE 3-2: RN4870/71 COIN CELL POWER SCHEME
The Configuration pins on the RN4870 can also be
configured through Windows®-based User Interface
(UI) Configuration tool, BLEDK3.
RN4870/71
Note 1: Application includes ADC, PWM (RN4870), and
I2C bus interface
2: BK_IN connection is needed only for RN4871U.
3: To implement low-power operation, enable the
UART_RX_IND pin and connect to ground.
Reset IC Reset
2016-2017 Microchip Technology Inc. DS50002489C-page 13
RN4870/71
4.0 PHYSICAL DIMENSIONS AND
ATTRIBUTES
4.1 RN4870 Module
Figure 4-1 shows the physical dimensions of the
RN4870 module. Figure 4-2 illustrates the recom-
mended PCB layout, and Figure 4-3 shows the recom-
mended mounting details.
Ensure that there is no top copper layer near the test
pin area, indicated by the shaded keep out areas, as
shown in Figure 4-2. When laying out the host PCB, the
areas under the antenna must not contain any top,
inner layer, or bottom copper as shown in Figure 4-3. A
low-impedance ground plane ensures the best radio
performance (best range; lowest noise). Figure 4-3
also shows a minimum ground plane area to the left
and right side of the module for best antenna
performance. The ground plane can be extended
beyond the minimum recommended as required for
host PCB EMC noise reduction. For best range
performance, keep all external metal at least 30 mm
away from the ceramic chip antenna.
FIGURE 4-1: RN4870 MODULE DIMENSIONS
RN4870/71
DS50002489C-page 14 2016-2017 Microchip Technology Inc.
FIGURE 4-2: RN4870 RECOMMENDED PCB FOOTPRINT
FIGURE 4-3: RECOMMENDED MOUNTING DETAILS
2016-2017 Microchip Technology Inc. DS50002489C-page 15
RN4870/71
4.2 RN4870U Module
Figure 4-4 shows the physical dimensions of the
RN4870U module. Figure 4-5 illustrates the recom-
mended PCB layout, and Figure 4-6 shows the recom-
mended mounting details.
A low-impedance ground plane ensures the best radio
performance (best range; lowest noise). Pin 30
(BT_RF) is a 50 ohm connection that can be connected
to an external antenna such as a PCB trace antenna, a
component (chip) antenna, or through a host PCB 50
ohm microstrip trace. This trace can be extended to
include passive parts for antenna attenuation padding,
impedance matching, or to provide test posts. It is
recommended that the microstrip trace to be as short
as possible for minimum loss and best impedance
matching. If the microstrip trace is longer, a 50 ohm
impedance is recommended.
FIGURE 4-4: RN4870U MODULE DIMENSIONS
RN4870/71
DS50002489C-page 16 2016-2017 Microchip Technology Inc.
FIGURE 4-5: RN4870U RECOMMENDED PCB FOOTPRINT
FIGURE 4-6: RN4870U RECOMMENDED PCB MOUNTING
2016-2017 Microchip Technology Inc. DS50002489C-page 17
RN4870/71
4.3 RN4871 Module
Figure 4-7 shows the physical dimensions of the
RN4871 module. Figure 4-8 illustrates the recom-
mended PCB layout, and Figure 4-9 shows the recom-
mended mounting details.
Ensure that there is no top copper layer near the test
pin area, indicated by the shaded keep out areas, as
shown in Figure 4-8. When laying out the host PCB, the
areas under the antenna must not contain any top,
inner layer, or bottom copper as shown in Figure 4-9. A
low-impedance ground plane ensures the best radio
performance (best range; lowest noise). Figure 4-9
also shows a space area around antenna section for
best antenna performance. The ground plane can be
extended beyond the minimum recommended as
required for host PCB EMC noise reduction. For best
range performance, keep all external metal at least
30 mm away from the ceramic chip antenna.
FIGURE 4-7: RN4871 MODULE DIMENSIONS
1.5
1
2.7
5.1
7.5
6.3
9.0
2.1
0.6
0.0
9.0
7.5
16
6.3
5.1
1.0
3.9
1.5
0.0
0.0
4.11
0.58
8.31
6.93
5.25 5.33
5.79
0.63
0.0
0.0
3.1
1.9
4.3
6.7
3.9
16
0.70
0.00
7.18
11.14
0.7
0.0
3.1
1.9
4.3
6.7
0.5
2.7
TP-5
TP-2
TP-3
1.2 2.38
4.85
6.01
0.7
TP-5
TP-2
TP-3
4.75
6.7
7.5
5.5
11.5
9.54
7.5
5.5
11.5
TP-4 3.68
6.0
0.0
TP-4
Shield
mounting
hole
Shield
mounting hole
Pad Positions Test Point Positions
Bottom View
Pad Detail
TP-1TP-1
Shield
mounting hole
Dimensions are in millimeters
Tolerances:
PCB Thikness: +/-0.06mm
Top View Side View
RN4870/71
DS50002489C-page 18 2016-2017 Microchip Technology Inc.
FIGURE 4-8: RN4871 RECOMMENDED PCB FOOTPRINT
FIGURE 4-9: RN4871 RECOMMENDED PCB MOUNTING SUGGESTION
1.2
0.5
1.5 1.0
2.7 3.0
5.1
4.3
7.5
6.3
9.0
1.5
0.7
0.0
1.9
3.1
4.3
4.6
6.7
Keep Out Area
1.5
Keep Out Area
7.0
0.0
5.5
7.5
11.5
3.9
8.0
Dimensions are in millimeters
Top View
2016-2017 Microchip Technology Inc. DS50002489C-page 19
RN4870/71
4.4 RN4871U Module
Figure 4-10 shows the physical dimensions of the
RN4871U module. Figure 4-11 illustrates the recom-
mended PCB layout. It is highly recommended to
layout the host PCB as suggested in Figure 4-12.
Figure 4-13 shows the recommended placement for
the module on the host PCB board. For optimal
transmission and reception sensitivity, place the
module at the edge of the board.
A low-impedance ground plane ensures the best radio
performance (best range; lowest noise). Pin 1 (BT_RF)
is a 50 ohm connection that can be connected to an
external antenna such as a PCB trace antenna, a
component (chip) antenna, or through a host PCB
50 ohm microstrip trace. This trace can be extended to
include passive parts for antenna attenuation padding,
impedance matching, or to provide test posts. It is
recommended that the microstrip trace to be as short
as possible for minimum loss and best impedance
matching. If the microstrip trace is longer, a 50 ohm
impedance is recommended.
FIGURE 4-10: RN4871U MODULE DIMENSIONS
Top View Bottom View
Side View
RN4870/71
DS50002489C-page 20 2016-2017 Microchip Technology Inc.
FIGURE 4-11: RN4871U RECOMMENDED PCB FOOTPRINT
FIGURE 4-12: RN4871U RECOMMENDED PCB MOUNTING
2016-2017 Microchip Technology Inc. DS50002489C-page 21
RN4870/71
FIGURE 4-13: RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST
PCB BOARD
4.5 Soldering Recommendations
The RN4870/71 Bluetooth modules are assembled
using standard lead-free reflow profile IPC/JEDEC
J-STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recom-
mendations are given:
• Microchip Technology Application Note, “AN233
Solder Reflow Recommendation” (DS00233)
provides solder reflow recommendations
•Do not exceed peak temperature (TP) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
•Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
Acceptable
Best
Acceptable
Lowest
performance
RN4870/71
DS50002489C-page 22 2016-2017 Microchip Technology Inc.
NOTES:
2016-2017 Microchip Technology Inc. DS50002489C-page 23
RN4870/71
5.0 APPLICATION REFERENCE
CIRCUITS
5.1 External Configuration and
Programming
The RN4870/71 modules can be configured and firm-
ware programmed using an external configuration and
programming tool. Figure 5-1 shows the mandatory
connections required between the module and the
external programming header. It is recommended to
include these pin connections on the host PCB for
development. For accessing the various configuration
and indication pins, use Ta bl e 1-2 , Tab le 1- 3, Table 1-4
and Tabl e 1- 5.
5.2 Reference Circuit
Figure 5-2 through Figure 5-5 show the reference
circuits for various modules under the RN4870/71 fam-
ily. In the circuits, the power input range is 1.9V ~ 3.6V.
A battery reverse protection circuit is recommended in
case a battery power input is used. Note that the
VDD_IO is the same as the power input. In case of a
LED connection, the power input must be greater than
3.0V. For the RN4870U, an RF antenna matching
circuit must also be included as shown in Figure 5-3.
FIGURE 5-1: EXTERNAL PROGRAMMING HEADER CONFIGURATIONS
RN4870/71
DS50002489C-page 24 2016-2017 Microchip Technology Inc.
FIGURE 5-2: RN4870 REFERENCE CIRCUIT
RN4870
GND
1
GND
2
GND
3
VBAT
4
P2_2
5
VDD_IO
6
VDD_IO
7
ULPC_O
8
P2_3
9
BK_O
10
P2_7/TX_IND
11
P1_1
12
P1_2/SCL
13
P1_3/SDA
14
P0_0/CTS
15
P1_0
16
P3_6/RTS
17
P2_0/MODE
18
P2_4
19
NC
20
RST
21
UART_RX 22
UART_TX 23
P3_1 24
P3_2 25
P3_3 26
P3_4 27
P3_5 28
P0_7 29
P0_2 30
GND 31
GND 32
GND 33
RN4
8
7
0
G
N
D
G
N
D
G
N
D
V
B
A
T
P
2
_
2
VDD_
IO
V
DD
_
IO
U
LPC
_
O
P
2
_
3
BK_
O
P
2
_
7
/
TX_
IND
P1
_
1
P
1
_
2
/
SCL
P1
_
3
/S
D
A
P
0
_
0
/
C
T
S
P
1
_
0
P
3
_
6
/
R
T
S
P
2
_
0
/
M
O
D
E
P
2
_
4
N
C
R
S
T
UART
_
R
X
UA
RT_
TX
P
3
_
1
P
3
_
2
P
3
_
3
P
3
_
4
P
3
_
5
P
0
_
7
P
0
_
2
G
N
D
G
N
D
G
N
D
U1
B
LD1
GND
GND
330
R1
GND
VCC
VCC
UART_TX
UART_RX
P0_2
P0_0
P1_0
P1_1
P1_2
P1_3
P0_7
P2_0
P2_2
P2_3
P2_4
P2_7
P3_1
P3_2
P3_3
P3_4
P3_5
P3_6
4.7k
R2
VCC
P0_7
P3_1
P3_2
P3_3
P3_4
P3_5
3
2
1
STS2301
Q1
P0_0
P1_0
P2_0
P2_4
P3_6
P1_1
P1_2
P1_3
P2_3
P2_7
P2_2
Configurable I/O
P2_0 MODE
Low
High
Test Mode
APP Mode
P
2
_
0
L
o
w
Hi
g
h
M
O
DE
T
e
s
t
M
o
de
APP
M
o
de
1
2
J1
GND
1
2
3
4
5
J2
GND
Power Input
Reverse Voltage Protection
Configuration Interface
VCC
UART_TX
UART_RX
UART Interface
LED Option
P0_2
10uF 6.3V X5R
C1
GND
1uF
C2
GND
RST
2016-2017 Microchip Technology Inc. DS50002489C-page 25
RN4870/71
FIGURE 5-3: RN4870U REFERENCE CIRCUIT
GND
1
VBAT
2
P2_2
3
VDD_IO
4
VDD_IO
5
ULPC_O
6
P2_3
7
BK_O
8
P2_7/TX_IND
9
P1_1
10
P1_2/SCL
11
P1_3/SDA
12
P0_0/CTS
13
P1_0
14
P3_6/RTS
15
P2_0/MODE
16
P2_4
17
NC
18
RST
19
UART_RX 20
UART_TX 21
P3_1 22
P3_2 23
P3_3 24
P3_4 25
P3_5 26
P0_7 27
P0_2 28
GND 29
BT_RF 30
G
N
D
V
B
AT
P
2
_
2
VDD_
I
O
VDD_
I
O
U
LPC
_
O
P2
_
3
BK
_
O
P
2
_
7
/
TX_
IND
P
1
_
1
P
1
_
2
/
SC
L
P
1
_
3
/S
D
A
P
0
_
0
/
C
T
S
P
1
_
0
P
3
_
6
/
R
T
S
P
2
_
0
/
M
O
D
E
P
2
_
4
N
C
R
S
T
U
ART
_
R
X
UA
RT
_
TX
P3
_
1
P3
_
2
P3
_
3
P3
_
4
P3
_
5
P0
_
7
P0
_
2
G
ND
BT_
RF
RN4870U
U1
B
LD1
GND
GND
330
R1
GND
VCC
VCC
UART_TX
UART_RX
P0_2
P0_0
P1_0
P1_1
P1_2
P1_3
P0_7
P2_0
P2_2
P2_3
P2_4
P2_7
P3_1
P3_2
P3_3
P3_4
P3_5
P3_6
4.7k
R2
VCC
P0_7
P3_1
P3_2
P3_3
P3_4
P3_5
3
2
1
STS2301
Q1
P0_0
P1_0
P2_0
P2_4
P3_6
P1_1
P1_2
P1_3
P2_3
P2_7
P2_2
Configurable I/O
P2_0 MODE
Low
High
Test Mode
APP Mode
P2
_
0
L
o
w
Hi
g
h
M
O
DE
T
e
s
t
M
o
de
APP
M
o
de
1
2
J1
GND
1
2
3
4
5
J2
GND
Power Input
Reverse Voltage Protection
Configuration Interface
VCC
UART_TX
UART_RX
UART Interface
LED Option
P0_2
C3 C4
ANT1
1nH
L1
10uF 6.3V X5R
C1
GND
1uF
C2
GND
GND
Antenna Matching
RST
RN4870/71
DS50002489C-page 26 2016-2017 Microchip Technology Inc.
FIGURE 5-4: RN4871 REFERENCE CIRCUIT
RN4871
RN4
8
7
1
VBAT 14
P2_7 15
P1_6
6
P1_2
3
P1_3
4
P0_0
11
P3_6
9
P2_0 16
RST
10
UART_RX
7
UART_TX
8
P0_2 12
GND 13
NC
1
P1_7
5
GND
2
U1
B
LD1
GND
330
R1
GND
VCC
VCC
UART_TX
UART_RX
P0_2
P1_2
P1_3
P1_7
P2_7
4.7k
R2
VCC
P0_2
3
2
1
STS2301
Q1
P0_0
P2_0
P1_6
P3_6
P1_2
P1_3
P2_7
P2_0
Configurable I/O
P2_0 MODE
Low
High
Test Mode
APP Mode
P2
_
0
Low
Hi
gh
MO
D
E
T
es
t M
ode
A
PP M
ode
1
2
J1
GND
1
2
3
4
5
J2
GND
Power Input
Reverse Voltage Protection
Configuration Interface
VCC
UART_TX
UART_RX
UART Interface
LED Option
P0_2
10uF 6.3V X5R
C1
GND
GND
P0_0
P2_0
P3_6
P1_6
P1_7
1uF
C2
GND
RST
Reset Circuit
2016-2017 Microchip Technology Inc. DS50002489C-page 27
RN4870/71
FIGURE 5-5: RN4871U REFERENCE CIRCUIT
VBAT
11 BK_I
10
P2_7
15
P1_6
13 P1_2 2
P1_3 3
P0_0 8
P3_6 6
P2_0
16 RST 7
UART_RX 5
UART_TX 4
P0_2 9
GND
17
BT_RF 1
P1_7
14
GND
12 RN4871U
U1
B
LD1
GND
330
R1
GND
VCC
VCC
UART_TX
UART_RX
P0_2
P1_2
P1_3
P1_7
P2_7
4.7k
R2
VCC
P0_2
3
2
1
STS2301
Q1
P0_0
P2_0
P1_6
P3_6
P1_2
P1_3
P2_7
P2_0
Configurable I/O
P2_0 MODE
Low
High
Test Mode
APP Mode
P2_0
Low
Hi
gh
MO
DE
Tes
t
Mode
A
PP M
ode
1
2
J1
GND
1
2
3
4
5
J2
GND
Power Input
Reverse Voltage Protection
Configuration Interface
VCC
UART_TX
UART_RX
UART Interface
LED Option
P0_2
10uF 6.3V X5R
C1
GND
P0_0
P2_0 P3_6
P1_6
P1_7
GND
1uF
C2
GND
GND
C3 C4
ANT1
1nH
L1
GND
Antenna Matching
RST
RN4870/71
DS50002489C-page 28 2016-2017 Microchip Technology Inc.
5.3 Power Drop Protection
To prevent any problems that may arise when the
power supply goes below 1.9V, a power-supply drop-
protection circuit is recommended. Essentially, this
circuit consists of a Reset IC which acts as an Open
Drain with a Delay =< 10 ms, and is triggered at 1.8V
power supply. Figure 5-6 shows a recommended
power drop protection circuit.
FIGURE 5-6: POWER DROP PROTECTION CIRCUIT
RN4870/71
VBAT
RST_N
Reset IC
OUT VDD
2016-2017 Microchip Technology Inc. DS50002489C-page 29
RN4870/71
6.0 ASCII COMMAND API
The RN4870/71 command Application Programming
Interfaces (APIs) are documented in the “RN4870/71
Bluetooth® Low Energy Module User's Guide”
(DS50002466).
The following are the available command options and
their categories:
• Connection
- Establish connection
- Disconnect
- Bond/Unbond current connection
- Start/Stop scan for other devices
- Add/Delete peer devices to white list
- Read RSSI values
- Stop connection process
•I/O
- Read/Write I2C
- Change settings in the EEPROM
- Configure pin functions
- Configure GPIO mask
- Set/Get GPIO states
- Read and write analog data
-PWM control
• System
- Reboot
- Factory default
- Enter and Exit Command mode
- Enter Low-Power mode
•Scripting
- Enter Script mode
- Declare event handler
- Execute current script
- List current script
- Clear script
- Define user function
•GATT Services
- Create/Delete public services/characteristics
- Read/Write characteristic values
- Set notification for characteristics
• GAP Role
- Central, Peripheral, Observer and
Broadcaster
• Advertising
- Start/Stop
- Set custom advertisement content
- Set scan response content
- Set beacon content
• Private Service
- Create/Delete private services/characteristics
- Read/Write characteristic values
- Set notification for characteristics
• Transparent UART
- Enable/Disable
- Peripheral side configuration
- Central side configuration
• Remote configuration of the module
• Read individual device Information or Profile
settings
RN4870/71
DS50002489C-page 30 2016-2017 Microchip Technology Inc.
NOTES:
2016-2017 Microchip Technology Inc. DS50002489C-page 31
RN4870/71
7.0 SUPPORTED SERVICES
The RN4870 supports four built-in GATT services:
• Device Information public service
• Airpatch private service, which handles Over The
Air (OTA) updates
• BeaconThings, which handles beacon services
control
• UART Transparent private service, which handles
data streaming function
In addition to the above predefined private services, the
RN4870 provides the ability to create private services.
If the services are supported on both end points of a
Bluetooth Low Energy connection, such as Central and
Peripheral devices, data can be exchanged. For
example, two RN4870 modules can define a custom
(private) service with its own unique characteristics.
Data can be exchanged easily via Command API.
Private services are not registered with the Bluetooth
SIG, and therefore not interoperable with other
Bluetooth Low Energy devices, unless the device
implements the private service. An example of a built-
in private service is the Transparent UART. For an
example on how to create a custom service using the
RN4870, refer to “RN4870/71 Bluetooth® Low Energy
Module User's Guide” (DS50002466).
RN4870 allows custom defined services up to five
public and four private services. Each custom defined
service allows up to eight custom defined
characteristics. All service definitions are saved in
on-board Non-Volatile Memory (NVM) where the user
must setup the module only once.
RN4870/71
DS50002489C-page 32 2016-2017 Microchip Technology Inc.
NOTES:
2016-2017 Microchip Technology Inc. DS50002489C-page 33
RN4870/71
8.0 ANTENNA CHARACTERISTICS
The RN4870 and RN4871 modules contain an integral
ceramic chip antenna. Figure 8-1 and Figure 8-2 show
the antenna performance on the modules.
FIGURE 8-1: RN4870 ANTENNA PERFORMANCE
Parameter Values
Frequency 2450 MHz
Max Gain 1.63 dBi
Efficiency 71.55%
Antenna Description Manufacturer Part Number Manufacturer
ANT ANT3216A063R2400A
PIFA 2.4GHz L3 2W1.6 ANT3216A063R2400A Yageo
RN4870/71
DS50002489C-page 34 2016-2017 Microchip Technology Inc.
FIGURE 8-2: RN4871 ANTENNA PERFORMANCE
Parameter Values
Frequency 2442 MHz
Max Gain 0.1 dBi
Efficiency 42.7%
Antenna Description Manufacturer Part Number Manufacturer
ANT AANT3216LL00R2400A
PIFA 2.4GHz L3 2W1.6 ANT3216LL00R2400A Yageo
2016-2017 Microchip Technology Inc. DS50002489C-page 35
RN4870/71
9.0 TIMING CHARACTERISTICS
Figure 9-1 shows the timing diagram for the RN4870/
71 modules when it is Reset in the Test mode and
Application mode. Figure 9-2 shows the timing diagram
for the module when it is powered on. In Application
mode, when RN4870/71 is ready to talk to MCU after
Reset, the module provides a UART response
indicating that the Reset is complete. For more details,
refer to the “RN4870/71 Bluetooth® Low Energy Mod-
ule User's Guide” (DS50002466).
FIGURE 9-1: TIMING DIAGRAM OF RN4870/71 UART READY AFTER RESET (IN TEST AND
APPLICATION MODE)
FIGURE 9-2: TIMING DIAGRAM OF RN4870/71 UART WHEN POWERED ON (IN TEST AND
APPLICATION MODE)
Ext
Reset
1mS
P2_0=0
P2_0=1
25mS
Test Mode
Process
Application
Mode
Process
46mS
68mS
UART Ready
for MCU
UART Ready
for MCU
Status pin/UART
Report Command
VBAT
P2_0=0
P2_0=1
25mS
Test Mode
Process
Application
Mode
Process
46mS
68mS
UART Ready
for MCU
UART Ready
for MCU
Status pin/UART
Report Command
RN4870/71
DS50002489C-page 36 2016-2017 Microchip Technology Inc.
Table 9-1 shows the error rate for various UART baud
rates for the RN4870/71 module. The system clock is
running at 16 MHz.
TABLE 9-1: ERROR RATE FOR VARIOUS BAUD RATES ON THE RN4870/71
Set Baud Rate Measured Baud Rate Error
921600 941176 -2.12%
460800 457143 0.79%
307200 307692 -0.16%
230400 231884 -0.64%
115200 115942 -0.64%
57600 57971 -0.64%
38400 38095 0.79%
19200 19048 0.79%
9600 9524 0.79%
2016-2017 Microchip Technology Inc. DS50002489C-page 37
RN4870/71
10.0 REGULATORY APPROVAL
This section outlines the regulatory information for the
RN4870/71 module for the following countries:
• United States
• Canada
• Europe
• Japan
• Korea
• Taiwan
• China
• Other Regulatory Jurisdictions
10.1 United States
The RN4870/71 module has received Federal Commu-
nications Commission (FCC) CFR47 Telecommunica-
tions, Part 15 Subpart C “Intentional Radiators” single-
modular approval in accordance with Part 15.212 Mod-
ular Transmitter approval. Single-modular transmitter
approval is defined as a complete RF transmission
sub-assembly, designed to be incorporated into
another device, that must demonstrate compliance
with FCC rules and policies independent of any host. A
transmitter with a modular grant can be installed in dif-
ferent end-use products (referred to as a host, host
product, or host device) by the grantee or other equip-
ment manufacturer, then the host product may not
require additional testing or equipment authorization
for the transmitter function provided by that specific
module or limited module device.
A host product itself is required to comply with all other
applicable FCC equipment authorization regulations,
requirements, and equipment functions that are not
associated with the transmitter module portion. For
example, compliance must be demonstrated: to regula-
tions for other transmitter components within a host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification or
Declaration of Conformity) as appropriate (e.g., Blue-
tooth and Wi-Fi transmitter modules may also contain
digital logic functions).
10.1.1 LABELING AND USER
INFORMATION REQUIREMENTS
The RN4870 module has been labeled with its own
FCC ID number, and if the FCC ID is not visible when
the module is installed inside another device, then the
outside of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label can use wording
as follows:
For the RN4870 module:
Due to the limited size of the RN4871, the FCC Identi-
fier (FCC ID) is not displayed on the module. Therefore,
the FCC ID must be placed on the outside of the fin-
ished product into which the module is installed must
also display a label referring to the enclosed module.
This exterior label can use wording as follows:
For the RN4871 module:
Contains Transmitter Module
FCC ID: A8TBM70ABCDEFGH
or
Contains FCC ID: A8TBM70ABCDEFGH
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
Contains Transmitter Module
FCC ID: A8TBM71S2
or
Contains FCC ID: A8TBM71S2
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
RN4870/71
DS50002489C-page 38 2016-2017 Microchip Technology Inc.
A user’s manual for the product should include the fol-
lowing statement:
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engi-
neering and Technology (OET) Laboratory Division
Knowledge Database (KDB)
http://apps.fcc.gov/oetcf/kdb/index.cfm.
10.1.2 RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB Publication 447498 Gen-
eral RF Exposure Guidance provides guidance in
determining whether proposed or existing transmitting
facilities, operations or devices comply with limits for
human exposure to Radio Frequency (RF) fields
adopted by the Federal Communications Commission
(FCC).
Output power listed is conducted. This grant is valid
only when the module is sold to OEM integrators and
must be installed by the OEM or OEM integrators. This
transmitter is restricted for use with the specific
antenna(s) tested in this application for Certification
and must not be co-located or operating in conjunction
with any other antenna or transmitters within a host
device, except in accordance with FCC multi-transmit-
ter product procedures. This module is approved for
installation into mobile or/and portable host platforms.
10.1.3 HELPFUL WEB SITES
Federal Communications Commission (FCC):
http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Lab-
oratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
10.2 Canada
The RN4870/71 module has been certified for use in
Canada under Industry Canada (IC) Radio Standards
Procedure (RSP) RSP-100, Radio Standards
Specification (RSS) RSS-Gen, RSS-210, and RSS-
247. Modular approval permits the installation of a
module in a host device without the need to recertify
the device.
10.2.1 LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements (from RSP-100 - Issue 10,
Section 3): The host device shall be properly labeled to
identify the module within the host device.
Modular Devices (from RSP-100 - Issue 10, Section 7):
The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words “Contains transmit-
ter module”, or the word “Contains”, or similar wording
expressing the same meaning, as follows:
For the RN4870 module:
Due to the limited size of the RN4871, the Industry
Canada certification number is not displayed on the
module. Therefore, the host device must be labeled to
display the Industry Canada certification number of the
module, preceded by the words “Contains transmitter
module”, or the word “Contains”, or similar wording
expressing the same meaning, as follows:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio fre-
quency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the follow-
ing measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is con-
nected.
• Consult the dealer or an experienced radio/TV
technician for help.
Contains transmitter module
IC: 12246A-BM70BLES1F2
Contains transmitter module
IC: 12246A-BM71S2
2016-2017 Microchip Technology Inc. DS50002489C-page 39
RN4870/71
User Manual Notice for License-Exempt Radio Appara-
tus (from Section 8.4, RSS-Gen, Issue 4, November
2014): User manuals for license-exempt radio appara-
tus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alterna-
tively on the device or both:
10.2.2 RF EXPOSURE
All transmitters regulated by IC must comply with RF
exposure requirements listed in RSS-102 - Radio Fre-
quency (RF) Exposure Compliance of Radiocommuni-
cation Apparatus (All Frequency Bands).
10.2.3 HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
10.3 Europe
The RN4870/71 module is an R&TTE Directive
assessed radio module that is CE marked and has
been manufactured and tested with the intention of
being integrated into a final product.
The RN4870/71 module has been tested to R&TTE
Directive 1999/5/EC Essential Requirements for Health
and Safety (Article (3.1(a)), Electromagnetic Compati-
bility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and
are summarized in Table 10-1 and Ta b l e 1 0 - 2 Euro-
pean Compliance Testing. A Notified Body Opinion has
also been issued. All test reports are available on the
RN4870/71 product web page at http://www.micro-
chip.com.
The R&TTE Compliance Association provides guid-
ance on modular devices in document Technical
Guidance Note 01 available at
http://www.rtteca.com/html/download_area.htm.
10.3.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4870/71 module must follow CE marking require-
ments. The R&TTE Compliance Association Techni-
cal Guidance Note 01 provides guidance on final
product CE marking.
This device complies with Industry Canada's license-
exempt RSSs. Operation is subject to the following
two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, includ-
ing interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d'Indus-
trie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux con-
ditions suivantes:
(1) l'appareil ne doit pas produire de brouillage;
(2) l'utilisateur de l'appareil doit accepter tout brouil-
lage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
Note: To maintain conformance to the testing
listed in Table 10-1, the module shall be
installed in accordance with the installa-
tion instructions in this data sheet and
shall not be modified.
When integrating a radio module into a
completed product the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements of
the R&TTE Directive.
RN4870/71
DS50002489C-page 40 2016-2017 Microchip Technology Inc.
10.3.2 HELPFUL WEB SITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Radio Commu-
nications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
• Radio and Telecommunications Terminal Equip-
ment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
• European Conference of Postal and Telecommu-
nications Administrations (CEPT):
http://www.cept.org/
• European Telecommunications Standards Insti-
tute (ETSI):
http://www.etsi.org
• European Radio Communications Office (ERO):
http://www.ero.dk/
• The Radio and Telecommunications Terminal
Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com/
TABLE 10-1: EUROPEAN COMPLIANCE TESTING FOR RN4870
TABLE 10-2: EUROPEAN COMPLIANCE TESTING FOR RN4871
Certification Standards Article Laboratory Report Number
Safety EN60950-1:2006/A11:2009/A1:2010/
A12:2011/A2:2013
(3.1(a))
TUV
Rheinland
10051261 003
Health EN 62479:2010 10053580 001
EMC EN 301 489-1 V1.9.2 (3.1(b)) 10051137 002
EN 301 489-17 V2.2.1
Radio EN 300 328 V1.9.1 (3.2) 10053580 001
Notified Body
Opinion
10048935 001
Certification Standards Article Laboratory Report Number
Safety EN60950-1:2006/A11:2009/A1:2010/
A12:2011/A2:2013
(3.1(a))
TUV
Rheinland
10053210 001
Health EN 62479:2010 10053433 001
EMC EN 301 489-1 V1.9.2 (3.1(b)) 10052964 001
EN 301 489-17 V2.2.1
Radio EN 300 328 V1.9.1 (3.2) 10053433 001
Notified Body
Opinion
10048936 001
2016-2017 Microchip Technology Inc. DS50002489C-page 41
RN4870/71
10.4 Japan
The RN4870/71 module has received type certification
and is labeled with its own technical conformity mark
and certification number as required to conform to the
technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If the host product is subject to electrical appli-
ance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their confor-
mance laboratory to determine if this testing is
required.
• There is a voluntary Electromagnetic Compatibil-
ity (EMC) test for the host product administered
by VCCII: http://www.vcci.jp/vcci_e/index.html
10.4.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4870/71 module must follow Japan marking
requirements. The integrator of the module should refer
to the labeling requirements for Japan available at the
Ministry of Internal Affairs and Communications (MIC)
website.
The RN4870 module is labeled with its own technical
conformity mark and certification number. The final
product in which this module is being used must have
a label referring to the type certified module inside:
Due to the limited size of the RN4871, the technical
conformity mark and certification number is not dis-
played on the module. Therefore, the final product in
which this module is being used must have a label
referring to the type certified module inside:
10.4.2 HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
10.5 Korea
The RN4870/71 module has received certification of
conformity in accordance with the Radio Waves Act.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed.
10.5.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4870/71 module must follow KC marking require-
ments. The integrator of the module should refer to the
labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.
The RN4870 module is labeled with its own KC mark.
The final product requires the KC mark and certificate
number of the module:
Due to the limited size of the RN4871, the KC mark is
not displayed on the module. Therefore, final product
requires the KC mark and certificate number of the
module:
10.5.2 HELPFUL WEB SITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr.
National Radio Research Agency (RRA):
http://rra.go.kr.
Contains transmitter module with certificate number:
Contains transmitter module with certificate number:
RN4870/71
DS50002489C-page 42 2016-2017 Microchip Technology Inc.
10.6 Taiwan
The RN4870/71 module has received compliance
approval in accordance with the Telecommunications
Act. Customers seeking to use the compliance
approval in their product should contact Microchip
Technology sales or distribution partners to obtain a
Letter of Authority.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed.
10.6.1 LABELING AND USER
INFORMATION REQUIREMENTS
The RN4870 module is labeled with its own NCC ID
number, and if the NCC ID is not visible when the mod-
ule is installed inside another device, then the outside
of the device must also display a label referring to the
enclosed module. This exterior label can use wording
such as the following:
Due to the limited size of the RN4871, the NCC ID is
not displayed on the module. Therefore, the outside of
the device must also display a label referring to the
enclosed module. This exterior label can use wording
such as the following:
The user's manual should contain below warning (for
RF device) in traditional Chinese:
注意!
依據低功率電波輻射性電機管理辦法
第十二條經型式認證合格之低功率射頻電機，
非經許可，
公司、商號或使用者均不得擅自變更頻率、加大
功率或變更原設計
之特性及功能。
第十四條低功率射頻電機之使用不得影響飛航安
全及干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無
干擾時方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及
醫療用電波輻射性
電機設備之干擾。
10.6.2 HELPFUL WEB SITES
National Communications Commission (NCC):
http://www.ncc.gov.tw.
10.7 China
The RN4870/71 module has received certification of
conformity in accordance with the China MIIT Notice
2014-01 of State Radio Regulation Committee (SRRC)
certification scheme. Integration of this module into a
final product does not require additional radio
certification, provided installation instructions are
followed and no modifications of the module are
allowed.
10.7.1 LABELING AND USER
INFORMATION REQUIREMENTS
The RN4870 module is labeled with its own CMIT ID as
follows:
The RN4871 module is labeled with its own CMIT ID as
follows::
10.8 Other Regulatory Jurisdictions
Should other regulatory jurisdiction certification be
required by the customer, or the customer need to
recertify the module for other reasons, a certification
utility is available. For further regulatory Certification
Utility and documentation, contact your local Microchip
Technology sales office.
2016-2017 Microchip Technology Inc. DS50002489C-page 43
RN4870/71
11.0 ORDERING INFORMATION
Table 11-1 provides ordering information for the RN4870/71 module.
Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products.
TABLE 11-1: ORDERING INFORMATION
Part Number(1) Antenna Shielding Number of Pins Operating Temperature
Range
RN4870-V/RMXXX On-Board Yes 33 -20°C to +70°C
RN4870U-V/RMXXX External No 30 -20°C to +70°C
RN4871-V/RMXXX On-Board Yes 16 -20°C to +70°C
RN4871U-V/RMXXX External No 17 -20°C to +70°C
RN4870-I/RMXXX On-Board Yes 33 -40°C to +85°C
RN4871-I/RMXXX On-Board Yes 16 -40°C to +85°C
Note 1: The last three digits in P/N indicate firmware version. At the time of publication, the latest firmware version
is 1.28. Ensure to check product webpage for latest part number and firmware version.
RN4870/71
DS50002489C-page 44 2016-2017 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision A (April 2016)
This is the initial release of this document.
Revision B (October 2017)
• Added the new parts, RN4870-I/RMXXX and
RN4871-I/RMXXX, released with increased
operating temperature range.
• Updated Features section and removed
Description section on page 1.
• Updated Table 1-1, Ta ble 1 -2 , Tab le 1- 4 and
Table 11-1.
•Revised Ta b l e 2 - 1 through Table 2-4.
• Updated Figure 1-4, Figure 3-1, Figure 3-2, and
Figure 4-7.
• Added Section 10.7 “China” to Section 10.0
“Regulatory Approval”;
• Updated Table 11-1 and Section “Product
Identification System”.
Revision C (December 2017)
• Updated Table 2-1 to correct information for the
operating temperature range.
2016-2017 Microchip Technology Inc. DS50002489C-page 45
RN4870/71
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
RN4870/71
DS50002489C-page 46 2016-2017 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
Device: RN4870: Ceramic Chip Antenna
RN4870U: External Antenna
RN4871: Ceramic Chip Antenna
RN4871U: External Antenna
Temperature
Range:
V=-20C to +70C (Various)
I=-40C to +85C (Industrial)
Package: RM =
Radio Module
Example:
RN4870-V/RM118: Various temperature
RN4870-I/RM128: Industrial temperature
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
PART NO.
Device
V
Temperature
Range
RM
Package
XXX
Firmware
Revision
Number
2016-2017 Microchip Technology Inc. DS50002489C-page 47
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016-2017, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-2506-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS50002489C-page 48 2016-2017 Microchip Technology Inc.
Worldwide Sales and Service
10/25/17
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Tel: 63-2-634-9065
Singapore
Tel: 65-6334-8870
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Thailand - Bangkok
Tel: 66-2-694-1351
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820