1. General description
The HEF4043B is a quad R/S latch with 3-state outputs with a common output ena ble
input (OE). Each latch has an active HIGH se t input (1S to 4S), an active HIGH reset input
(1R to 4R) and an active HIGH 3-state output (1Q to 4Q).
When OE is HIGH, the latch outpu t (nQ) is d etermine d by the nR and n S input s as shown
in Table 3. When OE is LOW, the latch outputs are in the high impedance OFF-state. OE
does not affect the state of the latch. The high impedance of f-state fea ture allows common
bussing of the outputs.
It operates over a recommended VDD power supply r ange of 3 V to 15 V r eferenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input. It is
also suita ble for use over the industrial (40 °C to +85 °C) temperature range.
2. Features
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Operates across the full industrial temperature range 40 °C to +85 °C
Complies with JEDEC standard JESD 13-B
3. Applications
Four-bit storage with outpu t enable
4. Ordering information
HEF4043B
Quad R/S latch with 3-state outputs
Rev. 09 — 16 December 2009 Product data sheet
Table 1. Ordering information
All types operate from
40
°
C to +85
°
C.
Type number Package
Name Description Version
HEF4043BP DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
HEF4043BT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 2 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
5. Functional diagram
6. Pinning information
6.1 Pinning
Fig 1. Functional diagram Fig 2. Logic diagram for one latch
001aae616
1S
3-STATE
OUTPUTS
4
3
2
1R
1Q
2S6
7
9
2R
2Q
3S12
11
10
3R
3Q
4S14
15
1
4R
4Q
5OE
001aae618
nR
OE
nS nQ
to other latches
Fig 3. Pin configuration
HEF4043B
4Q V
DD
1Q 4R
1R 4S
1S n.c.
OE 3S
2S 3R
2R 3Q
V
SS
2Q
001aae617
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 3 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
6.2 Pin description
7. Functional description
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high impedance state.
8. Limiting values
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 °C.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C.
Table 2. Pin description
Symbol Pin Description
1Q to 4Q 2, 9, 10, 1 3-state buffered latch output
1R to 4R 3, 7, 11, 15 reset input (active HIGH)
1S to 4S 4, 6, 12, 14 set input (active HIGH)
OE 5 common output enable input
VSS 8 ground supply voltage
n.c. 13 not connected
VDD 16 supply voltage
Table 3. Function table[1]
Inputs Output
OE nS nR nQ
LXXZ
HLHL
HHXH
HLLlatched
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 +18 V
IIK input clam pi n g cu rre nt VI<0.5 V or VI>V
DD + 0.5 V - ±10 mA
VIinput voltage 0.5 VDD + 0.5 V
IOK output clamping current VO<0.5 V or VO>V
DD + 0.5 V - ±10 mA
II/O input/out pu t cu rren t - ±10 mA
IDD supply current - 50 mA
Tstg storage temperature 65 +150 °C
Tamb ambient temp erature 40 +85 °C
Ptot total power dissipation Tamb 40 °C to +85 °C
DIP16 package [1] -750mW
SO16 package [2] -500mW
P power dissipation per output - 100 mW
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 4 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
9. Recommended operating conditions
10. Static characteristics
Table 5. Recommended operating con ditions
Symbol Parameter Conditions Min Typ Max Unit
VDD supply voltage 3 - 15 V
VIinput voltage 0 - V DD V
Tamb ambient temperature in free air 40 - +85 °C
Δt/ΔV input transition rise and fall rate VDD = 5 V - - 3.75 μs/V
VDD = 10 V - - 0.5 μs/V
VDD = 15 V - - 0.08 μs/V
Table 6. Static characteristics
VSS = 0 V; VI = VSS or VDD unless otherwise specified.
Symbol Parameter Conditions VDD Tamb = 40 °C Tamb = 25 °C Tamb = 85 °CUnit
Min Max Min Max Min Max
VIH HIGH-level input voltage |IO| < 1 μA 5 V 3.5 - 3.5 - 3.5 - V
10 V 7.0 - 7.0 - 7.0 - V
15 V 11.0 - 11.0 - 11.0 - V
VIL LOW-level input voltage |IO| < 1 μA 5 V - 1.5 - 1.5 - 1.5 V
10 V - 3.0 - 3.0 - 3.0 V
15 V - 4.0 - 4.0 - 4.0 V
VOH HIGH-level output voltage |IO| < 1 μA 5 V 4.95 - 4.95 - 4.95 - V
10 V 9.95 - 9.95 - 9.95 - V
15 V 14.95 - 14.95 - 14.95 - V
VOL LOW- l e vel output voltage |IO| < 1 μA 5 V - 0.05 - 0.05 - 0.05 V
10 V - 0.05 - 0.05 - 0.05 V
15 V - 0.05 - 0.05 - 0.05 V
IOH HIGH-level output current VO = 2.5 V 5 V 1.7 - 1.4 - 1.1 - mA
VO = 4.6 V 5 V 0.52 - 0.44 - 0.36 - mA
VO = 9.5 V 10 V 1.3 - 1.1 - 0.9 - mA
VO = 13.5 V 15 V 3.6 - 3.0 - 2.4 - mA
IOL LOW - l e vel output cur r en t VO = 0.4 V 5 V 0.52 - 0.44 - 0.36 - mA
VO = 0.5 V 10 V 1.3 - 1.1 - 0.9 - mA
VO = 1.5 V 15 V 3.6 - 3.0 - 2.4 - mA
IIinput leakage current 15 V - ±0.3 - ±0.3 - ±1.0 μA
IOZ OFF-state output current nQ output HIGH;
returned to VDD
15 V - 1.6 - 1.6 - 12.0 μA
nQ output LOW;
returned to VSS
15 V - 1.6 - 1.6 - 12.0 μA
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 5 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
11. Dynamic characteristics
[1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).
[2] tt is the same as tTHL and tTLH.
IDD supply current IO = 0 A 5 V - 20 - 20 - 150 μA
10 V - 40 - 40 - 300 μA
15 V - 80 - 80 - 600 μA
CIinput capacitance - - - 7.5 - - pF
Table 6. Static characteristicscontinued
VSS = 0 V; VI = VSS or VDD unless otherwise specified.
Symbol Parameter Conditions VDD Tamb = 40 °C Tamb = 25 °C Tamb = 85 °CUnit
Min Max Min Max Min Max
Table 7. Dynamic characteristics
VSS = 0 V; Tamb = 25
°
C; For waveforms and test circuit see Section 12; unless otherwise specified.
Symbol Parameter Conditions VDD Extrapolation formula Min Typ Max Unit
tPHL HIGH to LOW
propagation delay nR nQ;
see Figure 4 5 V [1] 63 ns + (0.55 ns/pF)CL-90180ns
10 V 24 ns + (0.23 ns/pF)CL-3570ns
15 V 17 ns + (0.16 ns/pF)CL-2550ns
tPLH LOW to HIGH
propagation delay nS nQ;
see Figure 4 5 V [1] 38 ns + (0.55 ns/pF)CL-65135ns
10 V 14 ns + (0.23 ns/pF)CL-2550ns
15 V 7 ns + (0.16 ns/pF)CL-1535ns
tttransition time nQ output;
see Figure 4 5 V [1] [2] 10 ns + (1.00 ns/pF)CL-60120ns
10 V 9 ns + (0.42 ns/pF)CL-3060ns
15 V 6 ns + (0.28 ns/pF)CL-2040ns
tPHZ HIGH to OFF-state
propagation delay OE nQ;
see Figure 5 5 V - 45 90 ns
10 V - 20 35 ns
15 V - 10 25 ns
tPLZ LOW to OFF-state
propagation delay OE nQ;
see Figure 5 5 V - 50 100 ns
10 V - 20 40 ns
15 V - 10 25 ns
tPZH OFF-state to HIGH
propagation delay OE nQ;
see Figure 5 5 V - 25 50 ns
10 V - 15 30 ns
15 V - 10 25 ns
tPZL OFF-state to LOW
propagation delay OE nQ;
see Figure 5 5 V - 40 80 ns
10 V - 20 45 ns
15 V - 15 35 ns
tWpulse width nS input HIGH;
minimum width;
see Figure 4
5 V 30 15 - ns
10 V 20 10 - ns
15 V 16 8 - ns
nR input HIGH;
minimum width;
see Figure 4
5 V 30 15 - ns
10 V 20 10 - ns
15 V 16 8 - ns
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 6 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
12. Waveforms
Table 8. Dynamic power dissipation PD
PD can be calculated from the formulas shown. VSS = 0 V; tr = tf
20 ns; Tamb = 25
°
C.
Symbol Parameter VDD Typical formula for PD (μW) where:
PDdynamic power
dissipation 5 V PD = 1100 × fi + Σ(fo × CL) × VDD2fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VDD = supply voltage in V;
Σ(fo × CL) = sum of the outputs.
10 V PD = 4400 × fi + Σ(fo × CL) × VDD2
15 V PD = 11400 × fi + Σ(fo × CL) × VDD2
tr and tf are the input rise and fall times.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Transition times: transition time (tt) = HIGH LOW (tTHL) or LOW HIGH (tTLH) transition times.
Measurement points are given in Table 9 and test data is given in Table 10.
Fig 4. Input minimum set (nS) and reset (nR) pulse widths, inputs nS or nR to latch output (nQ) propagation
delay and nQ transition time
001aai28
6
input nR
output nQ
tPHL
tPLH
0 V
VI
VM
VOH
VOL
tTHL
tTLH
input nS
0 V
VI
VM
VM
tW
tW
10 %
10 %
90 %
90 %
trtf
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 7 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
Measurement points are given in Table 9.
Fig 5. Output enable (OE) to latch output (nQ) enable time (tPZL and tPZH) and disable time (tPLZ and tPHZ)
001aag35
5
tPLZ
tPHZ
outputs off outputs onoutputs on
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
OE input
VDD
VDD
VSS
VSS
VDD
VSS
tPZL
tPZH
VY
VY
VX
VX
Table 9. Measurement points
Supply voltage Input Output
VDD VIVMVMVXVY
5 V to 15 V VDD or 0 V 0.5V DD 0.5VDD 0.1VDD 0.9VDD
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 8 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
a. Input waveform
b. Test circuit
Test and measurement data is given in Table 10.
Definitions test circuit:
DUT = Device Under Test.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
Fig 6. Test circuit for measuring switching times
V
M
V
M
t
W
t
W
10 %
90 %
0 V
V
I
V
I
negative
pulse
positive
pulse
0 V
V
M
V
M
90 %
10 %
t
f
t
r
t
r
t
f
001aaj78
1
001aaj91
5
V
EXT
V
DD
V
I
V
O
DUT
CL
RT
RL
G
Table 10. Test data
Supply voltage Input Load VEXT
VItr, tfCLRLtPLH, tPHL tPLZ, tPZL tPHZ, tPZH
5 V to 15 V VDD 20 ns 50 pF 1 kΩopen VDD GND
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 9 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
13. Package outline
Fig 7. Package outline SOT38-4 (DIP16)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT38-4 95-01-14
03-02-13
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.30
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05 0.2542.54 7.62 8.25
7.80
10.0
8.3 0.764.2 0.51 3.2
inches 0.068
0.051
0.021
0.015
0.014
0.009
1.25
0.85
0.049
0.033
0.77
0.73
0.26
0.24
0.14
0.12 0.010.1 0.3 0.32
0.31
0.39
0.33 0.030.17 0.02 0.13
D
IP16: plastic dual in-line package; 16 leads (300 mil) SOT38
-4
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 10 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
Fig 8. Package outline SOT109-1 (SO16)
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10
1.45
1.25 0.25 0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8 1.27 6.2
5.8
0.7
0.6
0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1 99-12-27
03-02-19
076E07 MS-012
0.069 0.010
0.004
0.057
0.049 0.01 0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15 0.05
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
S
O16: plastic small outline package; 16 leads; body width 3.9 mm SOT109
-1
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 11 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
14. Revision history
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
HEF4043B_9 20091216 Product data sheet - HEF4043B_8
Modifications: Section 12 “Waveforms Table 10 “Test data tPLZ and tPZL value updated.
HEF4043B_8 20091127 Product data sheet - HEF4043B_7
HEF4043B_7 20090710 Product data sheet - HEF4043B_6
HEF4043B_6 20081111 Product data sheet - HEF4043B_5
HEF4043B_5 20080729 Product data sheet - HEF4043B_4
HEF4043B_4 20080710 Product data sheet - HEF4043B_CNV_3
HEF4043B_CNV_3 19950101 Product specification - HEF4043B_CNV_2
HEF4043B_CNV_2 19950101 Product specification - -
HEF4043B_9 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 09 — 16 December 2009 12 of 13
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warrant ies as to t he accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre va il.
15.3 Disclaimers
General — In formation in this document is believed to be accurate and
reliable. However, NXP Semiconduct ors does not give any repr esentatio ns or
warranties, expressed or impli ed, as to the accuracy or completeness of such
information and shall have no liability for th e co nsequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descripti ons, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are no t designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or application s and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ra tings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other co nditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may af fect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sal e, as published
at http://www.nxp.com/profile/terms, i ncluding those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between inf ormation in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Not hing in this document may be interpret ed or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
15.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respective ow ners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development .
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.
Product [short] data sheet Production This document contain s the product specification.
NXP Semiconductors HEF4043B
Quad R/S latch with 3-state outputs
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 December 2009
Document identifier: HEF4043B_9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Functional description . . . . . . . . . . . . . . . . . . . 3
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
9 Recommended operating conditions. . . . . . . . 4
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
15 Legal information . . . . . . . . . . . . . . . . . . . . . . . 12
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
16 Contact information. . . . . . . . . . . . . . . . . . . . . 12
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13