CPC2014N 60V Dual Normally-Open Single-Pole 8-Pin SOIC OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 60 400 2 2 Units VP mArms / mADC mA Features * Designed for use in Security Systems Complying with EN50130-4 * 1500Vrms Input/Output Isolation * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Immune to Radiated EM Fields * Tape & Reel Version Available * Small 8-Pin SOIC Package * Flammability Rating UL 94 V-0 Description The CPC2014N is a miniature device with two independent normally-open (1-Form-A) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient infrared LED. The CPC2014N uses IXYS Integrated Circuits' state of the art, double-molded vertical construction packaging to produce one of the world's smallest relays. The CPC2014N offers substantial board space savings over the competitor's larger 8-pin SOIC relay. Approvals Applications * Security * Passive Infrared Detectors (PIR) * Data Signalling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Medical Equipment--Patient/Equipment Isolation * Aerospace * Industrial Controls * UL Recognized Component: File E76270 * CSA Approval Pending * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # CPC2014N CPC2014NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 8 1 + Control Load 7 2 - Control Load 6 3 + Control Load 4 5 - Control Load Switching Characteristics of Normally-Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-CPC2014N-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC2014N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 60 5 50 1 70 600 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Capacitance, Input to Output Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current 1 2 3 2 Conditions Symbol Min Typ Max Units IF=2mA t <10ms IL=400mA VL=60VP IL ILPK RON ILEAK - - 400 1 2 1 mArms / mADC AP IF=0mA, VL=50V, f=1MHz VIO=0V, f=1MHz ton toff COUT CIO - 0.47 0.22 25 1 2 1 - IL=400mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.25 0.2 1.2 - 2 1.5 10 IF=5mA, VL=10V A ms pF pF mA mA V A Load current derates linearly from 400mA @ 25oC to 200mA @80oC, and must be derated for both poles operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC2014N PERFORMANCE DATA* 15 10 5 10 1.275 Typical On-Resistance Distribution (N=50, IF=1mA, IL=400mA) 20 15 10 5 0.18 0.20 0.22 0.24 LED Current (mA) 0.26 10 5 0.16 0.18 0.20 0.22 0.24 LED Current (mA) 0.26 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 30 25 20 15 10 5 20 15 10 5 0 0 0.35 0.505 0.510 0.515 0.520 0.525 0.530 0.535 On-Resistance (:) 15 0.28 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 25 0 20 0 0.16 Device Count (N) 1.255 1.260 1.265 1.270 LED Forward Voltage (V) Device Count (N) Device Count (N) 15 0 1.250 25 20 5 0 Typical IF for Switch Dropout (N=50, IL=400mA) 25 Device Count (N) 20 Typical IF for Switch Operation (N=50, IL=400mA) 25 Device Count (N) Device Count (N) 25 Typical LED Forward Voltage Drop (N=50, IF=5mA) 0.40 0.45 0.50 0.55 0.60 Turn-On Time (ms) 0.65 0.55 0.65 0.75 0.85 0.95 Turn-Off Time (ms) 1.05 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 63.5 Typical LED Forward Voltage Drop vs. Temperature 0.36 IF=20mA 1.4 1.3 1.1 1.0 -40 66.5 Typical IF for Switch Operation vs. Temperature (IL=200mA) Typical IF for Switch Dropout vs. Temperature (IL=200mA) 0.36 IF=10mA IF=5mA IF=2mA -20 0 20 40 60 Temperature (C) 80 100 0.32 LED Current (mA) 1.5 1.2 64.5 65.0 65.5 66.0 Blocking Voltage (VP) IF=50mA LED Current (mA) LED Forward Voltage (V) 1.6 64.0 0.28 0.24 0.20 0.16 -40 0.32 0.28 0.24 0.20 0.16 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2014N PERFORMANCE DATA* -0.2 -0.1 0.0 0.1 0.3 0.7 Turn-Off Time (ms) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 Typical Turn-On Time vs. Temperature (IL=80mA) Typical Turn-Off Time vs. Temperature (IL=80mA) IF=10mA 0.7 Steady State 0.6 0.5 0.4 -40 -20 0 20 40 60 80 100 15 20 25 30 35 40 45 IF=5mA IF=10mA -40 -20 0 20 40 60 80 100 5 50 Typical On-Resistance vs. Temperature (IL=200mA) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 10 0 10 15 20 25 30 35 40 LED Forward Current (mA) IF=5mA 5 50 LED Forward Current (mA) 0.3 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 -40 45 IF=5mA IF=10mA -20 0 20 40 60 80 100 Temperature (C) Temperature (C) Temperature (C) Maximum Load Current vs. Temperature with One Pole Operating (IF=2mA) Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 5&6 and 7&8 (VL=60V) 400 300 200 100 72 0.016 70 0.014 68 Leakage (A) Blocking Voltage (VP) 500 Load Current (mA) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=80mA) Load Voltage (V) 0.8 On-Resistance (:) 0.2 Typical Turn-On Time vs. LED Forward Current (IL=80mA) Turn-Off Time (ms) 0.9 Turn-On Time (ms) 500 400 300 200 100 0 -100 -200 -300 -400 -500 -0.3 Turn-On Time (ms) Load Current (mA) Typical Load Current vs. Load Voltage with One Pole Operating (IF=2mA) 66 64 62 -20 0 20 40 60 Temperature (C) Output Capacitance (pF) 200 80 100 0.008 0.006 0.002 -40 -20 0 20 40 60 80 100 0 -40 -20 Temperature (C) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 175 0 20 40 60 Temperature (C) 80 100 Energy Rating Curve (IF=2mA) 1100 1000 900 800 700 600 500 400 300 200 100 0 10Ps 100Ps 1ms 10ms 100ms Time Load Current (mA) -40 0.010 0.004 60 58 0 0.012 150 125 100 75 50 25 0 0 10 20 30 Load Voltage (V) 40 50 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC2014N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC2014N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC2014N 260C 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2014N MECHANICAL DIMENSIONS CPC2014N 1.016 0.025 (0.040 0.001) 9.347 0.203 (0.368 0.008) Pin 1 2.184 MAX (0.086 MAX) 0.432 0.127 (0.017 0.005) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 0.102 (0.033 0.004) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 0.102 (0.240 0.004) 3.810 0.051 (0.150 0.002) 2.540 TYP (0.100 TYP) 0.203 0.025 (0.008 0.001) 2.54 (0.100) 0.55 (0.022) Dimensions mm (inches) 0.381 0.051 (0.015 0.002) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC2014NTR Tape & Reel 1.75 0.10 330.2 DIA. (13.00 DIA.) 4.00 0.10 P1=8.00 0.10 2.00 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 0.10 O1.50 +0.1, -0 6.50 9.65 0.10 16.00 0.30 Embossed Carrier Direction of feed 3.50 Embossment 6.55 0.10 2.35 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance 0.20. 3. Carrier camber is within 1mm in 250mm. O1.50 MIN 2.85 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 0.05mm. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC2014N-R05 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits 6/4/2018