INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC2014N-R05 1
CPC2014N
60V Dual Normally-Open Single-Pole
8-Pin SOIC OptoMOS® Relay
Part # Description
CPC2014N 8-Pin SOIC (50/tube)
CPC2014NTR 8-Pin SOIC (2000/reel)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 400 mArms / mADC
On-Resistance (max) 2
LED Current to operate 2 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• Designed for use in Security Systems Complying
with EN50130-4
• 1500Vrms Input/Output Isolation
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• Tape & Reel Version Available
• Small 8-Pin SOIC Package
• Flammability Rating UL 94 V-0
The CPC2014N is a miniature device with two
independent normally-open (1-Form-A) solid state
relays in an 8-pin SOIC package that employs
optically coupled MOSFET technology to provide
1500Vrms of input to output isolation.
Optically coupled outputs that use the patented
OptoMOS architecture are controlled by a highly
efficient infrared LED.
The CPC2014N uses IXYS Integrated Circuits'
state of the art, double-molded vertical construction
packaging to produce one of the world’s smallest
relays. The CPC2014N offers substantial board space
savings over the competitor’s larger 8-pin SOIC relay.
Switching Characteristics
of Normally-Open (Form A) Devices
Approvals
• UL Recognized Component: File E76270
• CSA Approval Pending
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
Form-A
IF
ILOAD
10%
90%
ton toff
+ Control
– Control
Load
Load
1
2
3
4
7
8
5
6
+ Control
– Control
Load
Load
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R05
CPC2014N
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 70 mW
Total Power Dissipation 1600 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 5mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1IF=2mA IL- - 400 mArms / mADC
Peak t <10ms ILPK - - ±1 AP
On-Resistance 2IL=400mA RON --2
Off-State Leakage Current VL=60VPILEAK --1 µA
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 0.47 2 ms
Turn-Off toff - 0.22 1
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -25 - pF
Capacitance, Input to Output VIO=0V, f=1MHz CIO -1 - pF
Input Characteristics
Input Control Current to Activate 3IL=400mA IF- 0.25 2 mA
Input Control Current to Deactivate - IF0.1 0.2 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR- - 10 µA
1 Load current derates linearly from 400mA @ 25oC to 200mA @80oC, and must be derated for both poles operating simultaneously.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended.
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25ºC, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
INTEGRATED CIRCUITS DIVISION
CPC2014N
www.ixysic.com 3
R05
PERFORMANCE DATA*
LED Forward Voltage (V)
1.250 1.255 1.260 1.265 1.270 1.275
Device Count (N)
0
5
10
15
20
25
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
LED Current (mA)
0.16 0.18 0.20 0.22 0.24 0.26 0.28
Device Count (N)
0
5
10
15
20
25
Typical IF for Switch Operation
(N=50, IL=400mA)
LED Current (mA)
0.16 0.18 0.20 0.22 0.24 0.26
Device Count (N)
0
5
10
15
20
25
Typical IF for Switch Dropout
(N=50, IL=400mA)
Turn-On Time (ms)
0.35 0.40 0.45 0.50 0.55 0.60 0.65
Device Count (N)
0
5
10
15
20
25
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
Turn-Off Time (ms)
0.55 0.65 0.75 0.85 0.95 1.05
Device Count (N)
0
5
10
15
20
25
30
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
On-Resistance (:)
0.505 0.510 0.515 0.520 0.525 0.530 0.535
Device Count (N)
0
5
10
15
20
25
Typical On-Resistance Distribution
(N=50, IF=1mA, IL=400mA)
Blocking Voltage (VP)
63.5 64.0 64.5 65.0 65.5 66.0 66.5
Device Count (N)
0
5
10
15
20
25
30
35
Typical Blocking Voltage Distribution
(N=50)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.16
0.20
0.24
0.28
0.32
0.36
Typical IF for Switch Operation
vs. Temperature
(IL=200mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.28
Typical IF for Switch Dropout
vs. Temperature
(IL=200mA)
0.36
0.24
0.20
0.16
0.32
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R05
CPC2014N
PERFORMANCE DATA*
Turn-On Time (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-20 0 20 40 60 80 100
Temperature (ºC)
IF=5mA
IF=10mA
Typical Turn-On Time vs. Temperature
(IL=80mA)
Turn-Off Time (ms)
-40
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
-20 0 20 40 60 80 100
Typical Turn-Off Time vs. Temperature
(IL=80mA)
Temperature (ºC)
IF=5mA
IF=10mA
-40
0.9
0.8
0.7
0.6
0.5
0.4
0.3
-20 0 20 40 60 80 100
Steady State
On-Resistance (:)
Temperature (ºC)
IF=5mA
IF=10mA
Typical On-Resistance vs. Temperature
(IL=200mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
0
100
200
300
400
500
Maximum Load Current vs. Temperature
with One Pole Operating
(IF=2mA)
Blocking Voltage (VP)
-40
72
70
68
66
64
62
60
58
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Leakage (µA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 5&6 and 7&8
(VL=60V)
Temperature (ºC)
Load Voltage (V)
0 1020304050
Output Capacitance (pF)
0
25
50
75
100
125
150
175
200
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (mA)
0
100
200
300
400
500
600
700
800
900
1000
1100
Energy Rating Curve
(IF=2mA)
Load Voltage (V)
-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3
Load Current (mA)
-500
-400
-300
-200
-100
0
100
200
300
400
500
Typical Load Current vs. Load Voltage
with One Pole Operating
(IF=2mA)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=80mA)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=80mA)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
CPC2014N
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R05
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in
the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC2014N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC2014N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC2014N-R05
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
6/4/2018
For additional information please visit our website at: www.ixysic.com
6
CPC2014N
MECHANICAL DIMENSIONS
CPC2014N
CPC2014NTR Tape & Reel
Dimensions
mm
(inches)
PCB Land Pattern
2.184 MAX
(0.086 MAX)
0.838 ± 0.102
(0.033 ± 0.004) 0.381 ± 0.051
(0.015 ± 0.002)
Pin to Package Standoff
MIN 0.0254 (0.001)
(MAX 0.102 (0.004)
0.432 ± 0.127
(0.017 ± 0.005)
0.203 ± 0.025
(0.008 ± 0.001)
1.016 ± 0.025
(0.040 ± 0.001)
5.60
(0.22)
1.30
(0.051)
0.55
(0.022)
2.54
(0.100)
9.347 ± 0.203
(0.368 ± 0.008)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.051
(0.150 ± 0.002)
2.540 TYP
(0.100 TYP)
Pin 1
Note:
1. Lead dimensions do not include plating: 1000 microinches max.
NOTES:
1. All dimensions in millimeters
2. 10 sprocket hole pitch cumulative tolerance ± 0.20.
3. Carrier camber is within 1mm in 250mm.
4. Tape material : Black Conductive Polystyrene Alloy.
5. All dimensions meet EIA-481-C requirements.
6. Thickness : 0.30 ± 0.05mm.
7.50 ± 0.10
16.00 ± 0.30
1.75 ± 0.10 P1=8.00 ± 0.104.00 ± 0.10
2.00 ± 0.10
9.65 ± 0.106.50
1.20
2.85 ± 0.10
2.35 ± 0.10
6.55 ± 0.10
3.50
Ø1.50
+0.1, -0
Ø1.50 MIN
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
Direction of feed
