UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
for merly General Semiconductor
Document Number 88758 www.vishay.com
30-Jul-02 1
New Product
Ultrafast Rectifiers Rever se V oltage 500 to 600V
Forward Current 12A
Reverse Recovery Time 30ns
0.08
(2.032)
0.24
(6.096)
0.42
(10.66)
0.63
(17.02)
0.12
(3.05)
0.33
(8.38)
Mounting Pad Layout TO-263AB
0.380 (9.65)
0.411 (10.45)
0.320 (8.13)
0.360 (9.14)
0.591 (15.00)
0.624 (15.85)
12
0.245 (6.22)
MIN
K
0.027 (0.686)
0.037 (0.940)
0.105 (2.67)
0.095 (2.41) 0.205 (5.20)
0.195 (4.95)
K
0.160 (4.06)
0.190 (4.83)
0.045 (1.14)
0.055 (1.40)
0.021 (0.53)
0.014 (0.36)
0.110 (2.79)
0.140 (3.56)
0.090 (2.29)
0.110 (2.79)
0.047 (1.19)
0.055 (1.40)
PIN 1
PIN 2 K - HEATSINK
0-0.01 (0-0.254)
0.060 (1.52)
0.405 (10.27)
0.383 (9.72)
0.191 (4.85)
0.171 (4.35)
0.600 (15.5)
0.580 (14.5)
0.560 (14.22)
0.530 (13.46)
0.037 (0.94)
0.027 (0.69)
0.140 (3.56)
0.130 (3.30)
0.350 (8.89)
0.330 (8.38)
0.188 (4.77)
0.172 (4.36)
0.110 (2.80)
0.100 (2.54)
0.131 (3.39)
0.122 (3.08)
0.110 (2.80)
0.100 (2.54)
0.022 (0.55)
0.014 (0.36)
0.205 (5.20)
0.195 (4.95)
12
PIN
DIA.
DIA.
PIN 1
PIN 2
0.676 (17.2)
0.646 (16.4)
ITO-220AC (UGF12 Series)
TO-220AC (UG12 Series)
Dimensions in inches
and (millimeters)
TO-263AB (UGB12 Series)
0.154 (3.91)
0.148 (3.74) DIA.
0.113 (2.87)
0.103 (2.62)
0.185 (4.70)
0.175 (4.44)
0.055 (1.39)
0.045 (1.14)
0.145 (3.68)
0.135 (3.43)
0.350 (8.89)
0.330 (8.38)
0.160 (4.06)
0.140 (3.56)
0.037 (0.94)
0.027 (0.68)
0.205 (5.20)
0.195 (4.95)
0.560 (14.22)
0.530 (13.46)
0.022 (0.56)
0.014 (0.36)
0.110 (2.79)
0.100 (2.54)
12 1.148 (29.16)
1.118 (28.40)
0.105 (2.67)
0.095 (2.41)
0.410 (10.41)
0.390 (9.91) 0.635 (16.13)
0.625 (15.87)
0.603 (15.32)
0.573 (14.55)
PIN
0.415 (10.54) MAX.
PIN 1
PIN 2 CASE
0.370 (9.40)
0.360 (9.14)
Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• Ideally suited for freewheeling diode and power factor
correction applications
• Soft recover y characteristics
• Excellent high temperature switching
• Optimized to reduce switching losses
• Glass passivated chip junction
Mechanical Data
Case: JEDEC T O-220A C, IT O-220A C & T O-263AB
molded plastic body
Terminals: Plated leads, solderable per
MIL-STD-750, Method 2026
High temperature soldering in accordance with CECC
802 / Reflow guaranteed
Polarity: As marked
Mounting Position: Any
Mounting T orque: 10 in-lbs maximum
Weight: 0.08 oz., 2.24 g
UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
for merly General Semiconductor
www.vishay.com Document Number 88758
230-Jul-02
Maximum Ratings (TC= 25°C unless otherwise noted)
Parameter Symbol
UG12HT UG12JT
Unit
Maximum repetitive peak reverse voltage VRRM 500 600 V
Maximum working reverse voltage VRWM 400 480 V
Maximum RMS voltage VRMS 350 420 V
Maximum DC blocking voltage VDC 500 600 V
Maximum average forward rectified current IF(AV) 12 A
Peak forward surge current 8.3ms single half sine-wave IFSM 135 A
superimposed on rated load (JEDEC Method)
Operating junction and storage temperature range TJ, TSTG –55 to +150 °C
RMS Isolation voltage (UGF types only) 4500(1)
from terminals to heatsink with t = 1.0 second, RH ≤30% VISOL 3500(2) V
1500(3)
Electrical Characteristics(TC= 25°C unless otherwise noted)
Parameter Symbol UG12HT
UG12JT
Unit
Maximum instantaneous IF= 12A, TJ = 25°C VF1.75 V
forward voltage(4) IF= 12A, TJ = 125°C 1.50
TJ = 25°C 30 µA
Maximum DC reverse current at VRWM TJ = 100°C IR800 µA
TJ = 125°C 4.0 mA
Maximum reverse recovery time at
IF = 0.5A, IR= 1.0A, Irr = 0.25A trr 30 ns
Maximum reverse recovery time at trr 50 ns
IF = 1.0A, di/dt = 50A/µs, VR = 30V, Irr = 0.1 IRM
Typical softness factor (tb/ta)S 0.9 —
IF = 12A, di/dt = 240A/µs, VR = 400V, Irr = 0.1 IRM
Maximum reverse recovery current at IRM 7.5 A
IF = 12A, di/dt = 96A/µs, VR = 400V, TC= 125°C
Peak forward recovery time at tfr 500 ns
IF = 12A, di/dt = 96A/µs, VF = 1.1V
Thermal Characteristics(TC= 25°C unless otherwise noted)
Parameter Symbol UG12 UGF12 UGB12 Unit
Typical ther mal resistance from junction to case RθJC 1.73 3.04 1.73 °C/W
Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110” offset
(2) Clip mounting (on case), where leads do overlap heatsink
(3) Screw mounting with 4-40 screw, where washer diameter is ≤ 4.9 mm (0.19”)
(4) Pulse test: 300µs pulse width, 1% duty cycle
Ordering Information
Product Case Package Code Package Option
UG12HT & UG12JT TO-220AC 45 Anti-Static tube, 50/tube, 2K/carton
UGF12HT & UGF12JT ITO-220AC 45 Anti-Static tube, 50/tube, 2K/car ton
31 13” reel, 800/reel, 4.8K/carton
UGB12HT & UGB12JT TO-263AB 45 Anti-Static tube, 50/tube, 2K/car ton
81 Anti-Static 13” reel, 800/reel, 4.8K/carton
025 50 75 100 125 150 175
0
2
4
6
8
10
12
14
16
110
0
25
50
75
100
125
150
175
200
100
0.01
0.1
1
10
100
110 100
1
10
100
25 50
50
75 100
100
150
200
250
300
350
400
125
0
020 40 60 80 100
1
10
100
1,000
10,000
Fig. 2 – Maximum Non-Repetitive Peak
Forward Surge Current
Peak Forward Surge Current (A)
Number of Cycles at 60 HZ
Fig. 1 – Forward Current
Derating Curve
Average Forward Current (A)
Case Temperature (¡C)
Instantaneous Forward Voltage (V)
Fig. 3 – Typical Instantaneous
Forward Characteristics Per Leg Fig. 4 – Typical Reverse Leakage
Characteristics Per Leg
Instantaneous Reverse Leakage
Current (µA)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Forward Current (A)
Junction Temperature (°C)
Stored Charge / Reverse Recovery Time
(nC/ns)
Fig. 6 – Rever se Switc hing Characteristics
P er Leg
Reverse Voltage (V)
Junction Capacitance (pF)
Fig. 5 – Typical Junction Capacitance
P er Leg
TJ = 25°C
TJ = 25°C
TJ = 125°C
TJ = 125°CTJ = 100°C
TJ = 100°C
trr
Qrr
UG12HT, UG12JT,
UGB12HT, UGB12JT
UGF12HT, UGF12JT
0.1 0.3 0.5 0.7 0.9 1.0 1.3 1.5 1.7 1.9 2.1
12A, 240A/µs, 400V
1A, 50A/µs, 30V
12A, 240A/µs, 400V
1A, 50A/µs, 30V
UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
for merly General Semiconductor
Document Number 88758 www.vishay.com
30-Jul-02 3
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
