© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice 1Doc. No. 5002, Rev. K
CAT3200, CAT3200-5
Low Noise Regulated Charge Pump DC-DC Converter
DESCRIPTION
The CAT3200 and CAT3200-5 are switched capacitor
boost converters that deliver a low noise, regulated
output voltage. The CAT3200-5 gives a fixed regulated
5V output. The CAT3200 has an adjustable output
using external resistors. The constant frequency 2MHz
charge pump allows small 1µF ceramic capacitors to
be used.
Maximum output loads of up to 100mA can be
supported over a wide range of input supply voltages
(2.7V to 4.5V) making the device ideal for battery-
powered applications.
FEATURES
Constant high frequency (2MHz) operation
100mA output current
Regulated output voltage (5V fixed CAT3200-5,
Adjustable CAT3200)
Low quiescent current (1.7mA typ.)
Input voltage operation down to 2.7V
Soft start, slew rate control
Thermal overload shutdown protection
Low value external capacitors (1µF)
Foldback current overload protection
Shutdown current less than 1µA
CAT3200-5 in low profile (1mm thin) 6-lead
SOT23 package
CAT3200 in MSOP-8 package
APPLICATIONS
3V to 5V boost conversion
White LED driver
USB On-The-Go 5V supply
A shutdown control input allows the device to be
placed in power-down mode, reducing the supply
current to less than 1µA.
In the event of short circuit or overload conditions, the
device is fully protected by both foldback current
limiting and thermal overload detection. In addition, a
soft start, slew rate control circuit limits inrush current
during power-up.
The CAT3200-5 is available in a 6-lead, 1mm max
thin SOT23 package. The CAT3200 is available in an
8-lead MSOP package.
Local 5V supply from lower rail
Battery backup systems
Handheld portable devices
TYPICAL APPLICATION
CAT3200-5
CNEG CPOS
IN OUT
ON OFF SHDN
GND
+
-
5V Output
3.3V
CAT3200
CNEG CPOS
IN OUT
ON OFF SHDN
GND
+
-
3.3V
VIN
5V
100mA
VOUT
Adjustable Output
VIN
FB
R1
R2
100m
A
VOUT
VOUT = 1.27 V 1+
(
(
R1
R2
CAT3200/3200-5
2
Doc. No. 5002, Rev. K © 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
PIN CONFIGURATION
ORDERING INFORMATION
6-lead Thin SOT23
CAT3200-5
1
2
3
6
5
4
OUT
GND
SHDN
CPOS
IN
CNEG
8-pin MSOP
1
2
3
4
8
7
6
5
CPOS
IN
CNEG
PGND
OUT
FB
SHDN
SGND
CAT3200
PIN DESCRIPTIONS
Designation Description
OUT Regulated output voltage.
GND Ground reference for all voltages.
SHDN Shutdown control logic input (Active LOW)
CNEG Negative connection for the flying capacitor.
IN Input power supply.
CPOS Positive connection for the flying capacitor.
FB Feedback to set the output voltage.
PGND Power ground.
SGND Signal ground.
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CAT3200/3200-5
3Doc No. 5002, Rev. K
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
Note 1: ROL = (2VIN - VOUT)/IOUT
Note 2: In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor
feedback network. This will cause a small level of reverse current to flow back into the device to ground.
ELECTRICAL SPECIFICATIONS
Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1µF ceramic capacitors and VIN
is set to 3.6V.
ABSOLUTE MAXIMUM RATINGS
VIN, VOUT, SHDN, CNEG, CPOS Voltage .. -0.6V to 6.0V
VOUT Short Circuit Duration......................... Indefinite
Output Current ................................................ 200mA
ESD Protection (HBM) ..................................... 2000V
Junction Temperature ...................................... 150°C
Storage Temperature Range ............. -65°C to 160°C
Lead Soldering Temperature (10 sec) ............. 300°C
Power Dissipation (SOT23-6) ............................ 0.3W
Power Dissipation (8-MSOP) ............................. 0.5W
RECOMMENDED OPERATING CONDITIONS
VIN ................................................................................... 2.7V to 4.5V
CIN, COUT, CFLY .......................................................................... 1µF
ILOAD ................................................................................. 0 to 100mA
Ambient Temperature Range ................... -40°C to 85°C
Symbol Parameter Conditions Min Typ Max Units
VOUT Regulated Output ILOAD 40mA, VIN 2.7 V 4.8 5.0 5.2 V
ILOAD 100mA, VIN 3.1 V
VLINE Line Regulation 3.1V VIN 4.5V, ILOAD = 50mA 6 mV
VLOAD Load Regulation ILOAD = 10mA to 100mA, VIN = 3.6V 20 mV
FOSC Switching Frequency 1.3 2.0 2.6 MHz
VROutput Ripple ILOAD = 100mA 30 mVp-p
Voltage CAT3200-5 Only
ηEfficiency ILOAD = 50mA, VIN = 3V, CAT3200-5 80 %
IGND Ground Current ILOAD = 0mA, SHDN = VIN 1.6 4 mA
ISHDN Shutdown Input ILOAD = 0mA, SHDN = 0V to VIN 1µA
Current
VFB FB Voltage CAT3200 Only 1.22 1.27 1.32 V
IFB FB Input Current CAT3200 Only -50 50 nA
ROL Open-Loop ILOAD = 100mA, VIN = 3V (Note 1) 10
Resistance
TON VOUT Turn-on time ILOAD = 0mA, VIN = 3V 0.5 ms
(10% to 90%)
VIHSHDN High Detect 0.8 1.3 V
Shutdown Threshold
VILSHDN Low Detect 0.4 V
Shutdown Threshold
IROUT Reverse Leakage VOUT = 5V, Shutdown mode (Note 2) 15 30 µA
into OUT pin
ISC Short-circuit Output VOUT = 0V 80 mA
TSD Thermal Shutdown 160 °°
°°
°C
THYST Thermal Hysteresis 20 °°
°°
°C
CAT3200/3200-5
4
Doc. No. 5002, Rev. K © 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5)
Shutdown Input Threshold vs. Supply Voltage
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
2.7 3.0 3.3 3.6 3.9 4.2 4.5
INPUT VOLTAGE [V]
SHUTDOWN THRESHOLD [V] .
Ground Current vs. Supply Voltage (No Load)
1.2
1.4
1.6
1.8
2.0
2.2
2.73.03.33.63.94.24.5
INPUT VOLTAGE [V]
GROUND CURRENT [mA]
Line Regulation
4.8
4.9
5.0
5.1
5.2
2.73.03.33.63.94.24.5
INPUT VOLTAGE [V]
OUTPUT VOLTAGE [V] .
20mA Load
100mA Load
Load Regulation
4.8
4.9
5.0
5.1
5.2
050100150
LOAD CURRENT [mA]
OUTPUT VOLTAGE [V] .
VIN = 2.7V
VIN = 3V
VIN = 3.2V
Oscillator Frequency vs. Supply Voltage
1.6
1.8
2.0
2.2
2.4
2.6
2.73.03.33.63.94.24.5
INPUT VOLTAGE [V]
OSCILLATOR FREQUENCY [MHz]
Efficiency
vs. Load Current
30
40
50
60
70
80
90
100
110 100
LOAD CURRENT [mA]
VIN=
2.7V
VIN= 3.7V
VIN= 4.5V
VIN= 3.2V
EFFICIENCY [%]
TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise.
CAT3200/3200-5
5Doc No. 5002, Rev. K
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5)
TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise.
Soft Start Power Up (90mA Load, 3.3V Input) Load Step Response (3.3V Input)
Output Ripple (100mA Load, 3.3V Input)
Short Circuit Current vs Supply Voltage
0
50
100
150
200
250
2.7 3.0 3.3 3.6 3.9 4.2 4.5
INPUT VOLTAGE [V]
CURRENT LIMIT [mA]
.
Output Voltage Change vs. Temperature
-2
-1
0
1
2
-40 -20 0 20 40 60 80 100
TEMPERATURE [
C]
OUTPUT VOLTAGE CHANGE [%]
.
10mA Load
Oscillator Frequency Change vs. Temperature
-4
-2
0
2
4
-40-20 0 20406080100
TEMPERATURE [ C]
FREQUENCY CHANGE [%] .
CAT3200/3200-5
6
Doc. No. 5002, Rev. K © 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
resistor network (400k). The feedback network will
result in a reverse current of 10µA to 20µA to flow back
through the device to ground.
Whenever the device is taken out of shutdown mode, the
output voltage will experience a slew rate controlled
power-up. Full operating voltage is typically achieved in
less than 0.5 msec.
GND is the ground reference for all voltages on CAT3200-
5 devices.
FB (CAT3200 Only) is the feedback input pin. An output
divider should be connected from OUT to FB to program
the output voltage.
PGND (CAT3200 Only). Is the same as GND for the
CAT3200-5 except for the internal reference connection
to SGND.
SGND (CAT3200 Only) Ground pin for the internal
reference. The CNEG connection is switched to this pin
during the normal charge pump operation.
PIN FUNCTIONS
IN is the power supply. During normal operation the
device draws a supply current which is almost constant.
A very brief interval of non-conduction will occur at the
switching frequency. The duration of the non-conduction
interval is set by the internal non-overlapping
“break-before-make” timing. IN should be bypassed
with a 1µF to 4.7µF low ESR (Equivalent Series
Resistance) ceramic capacitor.
For filtering, a low ESR ceramic bypass capacitor (1µF)
in close proximity to the IN pin prevents noise from being
injected back into the power supply.
SHDNSHDN
SHDNSHDN
SHDN is the logic control input (Active LOW) that places
the device into shutdown mode. The internal logic is
CMOS and the pin does not use an internal pull-down
resistor. The SHDNSHDN
SHDNSHDN
SHDN pin should not be allowed to float.
CPOS, CNEG are the positive and negative connections
respectively for the charge pump flying capacitor. A low
ESR ceramic capacitor (1µF) should be connected
between these pins. During initial power-up it may be
possible for the capacitor to experience a voltage reversal
and for this reason, avoid using a polarized (tantalum or
aluminum) flying capacitor.
OUT is the regulated output voltage to power the load.
During normal operation, the device will deliver a train of
current pulses to the pin at a frequency of 2MHz.
Adequate filtering on the pin can typically be achieved
through the use a low ESR ceramic bypass capacitor
(1µF to 4.7µF) in close proximity to the OUT pin. The
ESR of the output capacitor will directly influence the
output ripple voltage.
When the shutdown mode is entered, the output is
immediately isolated from the input supply, however, the
output will remain connected to the internal feedback
CAT3200 Adjustable Output CAT3200-5 5V Fixed Output
BLOCK DIAGRAM
+
EN
2MHz
Voltage
Doubler
1.25V
SGND
SHDN
IN
CNEG CPOS
2VIN
5V/100mA
OUT
PGND
FB
+
EN
2MHz
Voltage
Doubler
300k
100k
1.25V
GND
SHDN
IN
CNEG CPOS
2VIN
5V
100mA OUT
CAT3200/3200-5
7Doc No. 5002, Rev. K
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
Figure 1: Programming the Adjustable CAT3200
Typical values for total voltage divider resistance can
range from several ks up to 1M.
OUT
FB
PGND
SGND
VOUT
1.27V
COUT
R1
R2
( )
1 + R1
R2
8
7
4
5
CPOS CNEG
IN
SHDN
3
2
6
1
DEVICE OPERATION
The CAT3200/CAT3200-5 use a switched capacitor
charge pump to boost the voltage at IN to a regulated
output voltage. Regulation is achieved by sensing the
output voltage through an internal resistor divider
(CAT3200-5) and modulating the charge pump output
current based on the error signal. A 2-phase non-
overlapping clock activates the charge pump switches.
The flying capacitor is charged from the IN voltage on the
first phase of the clock. On the second phase of the clock
it is stacked in series with the input voltage and connected
to OUT. The charging and discharging the flying capacitor
continues at a free running frequency of typically 2MHz.
In shutdown mode all circuitry is turned off and the
CAT3200/CAT3200-5 draw only leakage current from
the VIN supply. OUT is disconnected from IN. The SHDN
pin is a CMOS input with a threshold voltage of
approximately 0.8V. The CAT3200/CAT3200-5 is in
shutdown when a logic LOW is applied to the SHDN pin.
The SHDN pin is a high impedance CMOS input. SHDN
does not have an internal pull-down resistor and should
not be allowed to float and. It must always be driven with
a valid logic level.
Short-Circuit and Thermal Protection
The CAT3200 and CAT3200-5 have built-in short-circuit
current limiting and over temperature protection. During
overload conditions, output current is limited to
approximately 225mA. At higher temperatures, or if the
input voltage is high enough to cause excessive chip self
heating, the thermal shutdown circuit shuts down the
charge pump as the junction temperature exceeds
approximately 160°C. Once the junction temperature
drops back to approximately 140°C, the charge pump is
enabled. The CAT3200and CAT3200-5 will cycle in and
out of thermal shutdown indefinitely without latch-up or
damage until a short-circuit on OUT is removed.
Programming the CAT3200 Output Voltage (FB Pin)
The CAT3200-5 version has an internal resistive divider
to program the output voltage. The programmable
CAT3200 may be set to an arbitrary voltage via an
external resistive divider. Since it employs a voltage
doubling charge pump, it is not possible to achieve
output voltages greater than twice the available input
voltage. Figure 1 shows the required voltage divider
connection. The voltage divider ratio is given by the
formula:
R
R
V
V
OUT1
2127 1=−
.
CAT3200/3200-5
8
Doc. No. 5002, Rev. K © 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
APPLICATION INFORMATION
Ceramic Capacitors
Ceramic capacitors of different dielectric materials lose
their capacitance with higher temperature and voltage at
different rates. For example, a capacitor made of X5R or
X7R material will retain most of its capacitance from
40°C to 85°C whereas a Z5U or Y5V style capacitor will
lose considerable capacitance over that range.
Z5U and Y5V capacitors may also have voltage coefficient
causing them to lose 60% or more of their capacitance
when the rated voltage is applied. When comparing
different capacitors it is often useful consider the amount
of achievable capacitance for a given case size rather
than discussing the specified capacitance value. For
example, over rated voltage and temperature conditions,
a 1µF, 10V, Y5V ceramic capacitor in an 0603 case may
not provide any more capacitance than a 0.22µF, 10V,
X7R available in the same 0603 case. For many
CAT3200/CAT3200-5 applications these capacitors can
be considered roughly equivalent.
The capacitor manufacturers data sheet should be
consulted to determine what value of capacitor is needed
to ensure the desired capacitance at all temperatures
and voltages. Below is a list of ceramic capacitor
manufacturers and how to contact them:
Capacitor
Manufacturer Web Phone
Murata www.murata.com 814.237.1431
AVX/Kemet www.avxcorp.com 843.448.9411
Vishay www.vishay.com
Kemet www.kemet.com 408.986.0424
Taiyo Yuden www.t-yuden.com 408.573.4150
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the
CAT3200/CAT3200-5. If the junction temperature
increases to 160°C, the thermal shutdown circuitry will
automatically turn off the output.
A good thermal connection to the PC board is
recommended to reduce the chip temperature.
Connecting the GND pin (Pins 4/5 for CAT3200, Pin 2 for
CAT3200-5) to a ground plane, and maintaining a solid
ground plane under the device reduces the overall
thermal resistance.
The overall junction to ambient thermal resistance (θJA)
for device power dissipation (PD) consists primarily of
two paths in series. The first path is the junction to the
case (θJC) which is defined by the package style, and the
second path is case to ambient (θCA) thermal resistance
which is dependent on board layout. The final operating
junction temperature for any set of conditions can be
estimated by the following thermal equation:
TTP P
JUNC AMB D JC DCA
=+ +() ()ΘΘ
=+TP
AMB D JA
()Θ
The CAT3200 in SOT23 package, when mounted on
printed circuit board with two square inches of copper
allocated for heat spreading, will result with an overall
θJA of less than 150°C/W.
For a typical application operating from a 3.8V input
supply, the maximum power dissipation is 260mW
(100mA x 3V). This would result if a maximum junction
temperature of :
T = T + P ()
= 85 C + 0.26W (150 C/W)
= 85 C + 39 C = 124 C
JUNC AMB D JA
θ
°°
°° °
The use of multi-layer board construction with power
planes will further enhance the overall thermal
performance. In the event of no dedicated copper area
being used for heat spreading, a multi-layer board will
typically provide the CAT3200 with an overall θJA of
200°C/W. This level of thermal conduction would allow
up to 200mW be safely dissipated within the device.
CAT3200/3200-5
9Doc No. 5002, Rev. K
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
ON OFF
13
2
6
8
7
5
4
C+C-
IN OUT
FB
SGND
PGND
SHDN
8282828282
CAT3200
VSHDN
Apply PWM Waveform for
Adjustable Brightness Control
3V to 4.4V
Li-ion
Battery
t
Up to 6 LEDs
+
ON OFF
46
5
3
1
2
C-C+
IN OUT
SGND
SHDN
100100100100
CAT3200-5
VSHDN
Apply PWM Waveform for
Adjustable Brightness Control
3V to 4.4V
Li-ion
Battery
t
Drive up to 5 LEDs
100
+
CAT3200-5
46
5
3
1
2
VOUT
5V + 4%
100mA
3.3 V + 10%
CAT3200-5
46
5
3
1
2
VOUT
5V + 4%
IN OUT
SHDN
GND
IN OUT
SHDN
GND
TYPICAL APPLICATIONS
White or Blue LED Driver with LED Current Control
Lithium-Ion Battery to 5V White or Blue LED Driver
3.3 V Supply to 5 V USB Port to Regulated 5V Power Supply
CAT3200/3200-5
10
Doc. No. 5002, Rev. K © 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
Notes:
1. Dimensions and tolerancing per ASME Y14.5M - 1994
2. Dimension are in mm.
3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15mm per side. D and E1 dimensions are determined at Datum H.
Tolerances of Form and Position Notes
aaa 0.15 1,2
bbb 0.25 1,2
ccc 0.10 1,2
Variations
AA 6 AB BA
Min Nom Max Min Nom Max Min Nom Max Notes
b 0.30 0.45 0.30 0.45 0.22 0.36 7,8
b1 0.31 0.35 0.39 0.31 0.35 0.39 0.22 0.26 0.30
e 0.95BSC 0.95BSC 0.65BSC
e1 1.90BSC 1.90BSC 1.95BSC
N6 5 8
Tolerances of Form and Position
ddd 0.20 0.20 0.13 1,2
4. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, the bar
burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. D and E1 dimensions are determined at Datum H.
5. Datums A & B to be determined at Datum H.
6. Package varation "AB" is a 5 lead version of the 6 lead variation "AA" where lead #5 has been removed from the 6 lead "AA" variation.
7. These dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip.
8. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition. The dambar
cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm.
aaa C 2X
aaa C D
2X
34
3 4
5
bbb C
2X N/2 TIPS
NX b
5
12 N/2
N/2
+1
N
ddd C
MA B D
D
e1
A
B
e
E1
E1/2
E/2
E
D
ccc C
C
SEATING
PLANE
A2
ANX
A
A
A1
H
B
B
SEE VIEW C
VIEW A-A
L2
R
R1
GAUGE
PLANE
L
C
SEATING
PLANE
VIEW C
BASE METAL
SECTION B - B
c1
WITH METAL
b1
(b)
c
7
b5 8
X
X=A &/or B
ODD LEAD SIDES
TOP VIEW
5
X
X=A &/or B
EVEN LEAD SIDES
TOP VIEW
e/2
(L1)
MECHANICAL PACKAGE DRAWINGS
6-LEAD THIN
SOT-23
All Dimensions are in Millimeters
Min Nom Max Notes
A——1.00
A1 0.01 0.05 0.10
A2 0.84 0.87 0.90
c 0.12 0.15 0.20 7
c1 0.08 0.13 0.16 7
D 2.80 2.90 3.00 3,4
E 2.60 2.80 3.00 3,4
E1 1.50 1.60 1.75 3,4
L 0.30 0.40 0.50
L1 0.60REF
L2 0.25BSC
R 0.10 ——
R1 0.10 0.25
θ0°4°8°
θ14°10°12°
CAT3200/3200-5
11 Doc No. 5002, Rev. K
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
Notes:
(1) All dimensions are in mm Angles in degrees.
2 Does not include Mold Flash, Protrusion or Gate Burrs. Mold Flash, Protrusions or Gate Burrs shall not exceed 0.15 mm. per side.
3 Does not include Interlead Flash orProtrusion. Interlead Flash or Protrusion shall not exceed 0.25 mm per side.
4 Does not include Dambar Protrusion, allowable Dambar Protrusion shall be 0.08 mm.
(5) This part is compliant with JEDEC Specification MO-187 Variations AA.
(6) Lead span/stand off height/coplanarity are considered as special characteristics. (S)
(7) Controlling dimensions in inches. [mm]
MECHANICAL PACKAGE DRAWINGS
8-LEAD MSOP
0.0150
0.0110
0.38
0.28
0.1970
0.1890
5.00
4.80 S
0.0256 [0.65] BSC
0.1220
0.1142
3.10
2.90
0.0433 [1.10] MAX.
0.039 [0.10] MAX. S 0.0059
0.0020
0.15
0.05 S
0.0374
0.0295
0.95
0.75
0.0276
0.0157
0.70
0.40
0.1220
0.1142
3.10
2.90 0˚ - 6˚
0.0091
0.0051
0.23
0.13
0.0118 [0.30] REF.
BASE METAL
0.0050 [0.127]
0.0150
0.0110
0.38
0.28
WITH PLATING
SECTION A - A
WITH PLATING
Catalyst Semiconductor, Inc.
Corporate Headquarters
2975 Stender Way
Santa Clara, CA 95054
Phone: 408.542.1000
Fax: 408.542.1200
www.catsemi.com
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Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:
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Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents
issued to Catalyst Semiconductor contact the Company’s corporate office at 408.542.1000.
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a
situation where personal injury or death may occur.
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate
typical semiconductor applications and may not be complete.
Publication #: 5002
Revison: K
Issue date: 08/01/06
REVISION HISTORY
Date Rev. Reason
06/17/2004 A Initial Release
09/3/2004 B Update Ordering Information
09/23/2004 C Minor change
10/26/2004 D Removed TDFN package, minor changes
10/29/2004 E Added Green Packages
02/1/2005 F Update 6-lead SOT-23 mechanical package drawing
02/28/2005 G Update Ordering Information
03/18/2005 H Update Ordering Information
09/22/2005 I Update Ordering Information
01/11/2006 J Update Ordering Information
08/01/2006 K Change MSOP Tape&Reel