AT25010A-10PN-2.7 - Atmel Corporation

Features

•Serial Peripheral Interface (SPI) Compatible

•Supports SPI Modes 0 (0,0) and 3 (1,1)

– Data Sheet Describes Mode 0 Operation

•Medium-voltage and Standard-voltage Operation

–2.7 (V

CC = 2.7V to 5.5V)

•Extended Temperature Range −40°C to +125°C

•5.0 MHz Clock Rate

•8-byte Page Mode

•Block Write Protection

– Protect 1/4, 1/2, or Entire Array

•Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software

Data Protection

•Self-timed Write Cycle (10 ms max)

•High Reliability

– Endurance: One Million Write Cycles

– Data Retention: 100 Years

•8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP Packages

Description

The AT25010A/020A/040A provides 1024/2048/4096 bits of serial electrically-eras-

able programmable read-only memory (EEPROM) organized as 128/256/512 words of

8 bits each. The device is optimized for use in many automotive applications where

low-power and low-voltage operation are essential. The AT25010A/020A/040A is

available in space-saving 8-pin PDIP, 8-lead JEDEC SOIC and 8-lead TSSOP

packages.

The AT25010A/020A/040A is enabled through the Chip Select pin (CS) and accessed

via a three-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO),

and Serial Clock (SCK). All programming cycles are completely self-timed, and no

separate erase cycle is required before write.

Block write protection is enabled by programming the status register with one of four

blocks of write protection. Separate program enable and program disable instructions

are provided for additional data protection. Hardware data protection is provided via

the WP pin to protect against inadvertent write attempts. The HOLD pin may be used

to suspend any serial communication without resetting the serial sequence.

Table 1. Pin Configurations

Pin Name Function

CS Chip Select

SCK Serial Data Clock

SI Serial Data Input

SO Serial Data Output

GND Ground

VCC Power Supply

WP Write Protect

HOLD Suspends Serial Input

SPI Serial

Extended

Temperature

EEPROMs

1K (128 x 8)

2K (256 x 8)

4K (512 x 8)

AT25010A

AT25020A

AT25040A

5087B–SEEPR–1/05

GND

VCC

HOLD

SCK

GND

VCC

HOLD

SCK

8-lead PDIP

8-lead SOIC

GND

VCC

HOLD

SCK

8-lead TSSOP

2AT25010A/020A/040A

5087B–SEEPR–1/05

Figure 1. Block Diagram

Absolute Maximum Ratings*

Operating Temperature......................................−55°C to +125°C*NOTICE: Stresses beyond those listed under “Absolute

Maximum Ratings” may cause permanent dam-

age to the device. This is a stress rating only and

functional operation of the device at these or any

other conditions beyond those indicated in the

operational sections of this specification is not

implied. Exposure to absolute maximum rating

conditions for extended periods may affect device

reliability.

Storage Temperature .........................................−65°C to +150°C

Voltage on Any Pin

with Respect to Ground ........................................ −1.0V to +7.0V

Maximum Operating Voltage .......................................... 6.25V

DC Output Current........................................................ 5.0 mA

128/256/

512 x 8

AT25010A/020A/040A

5087B–SEEPR–1/05

Table 2. Pin Capacitance(1)

Note: 1. This parameter is characterized and is not 100% tested.

Table 3. DC Characteristics

Applicable over recommended operating range from: TAE = −40°C to +125°C. VCC = +2.7V to +5.5V

Note: 1. Worst case measured at 125°C

2. VIL min and VIH max are reference only and are not tested.

Applicable over recommended operating range from TAE = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted)

Symbol Test Conditions Max Units Conditions

COUT Output Capacitance (SO) 8 pF VOUT = 0V

CIN Input Capacitance (CS, SCK, SI, WP, HOLD)6pFV

IN = 0V

Symbol Parameter Test Condition Min Max Units

VCC1 Supply Voltage 2.7 5.5 V

ICC1 Supply Current VCC = 5.0V at 1 MHz, SO = Open, Read 3.0 mA

ICC2 Supply Current VCC = 5.0V at 2 MHz, SO = Open,

Read, Write 6.0 mA

ICC3Supply Current VCC = 5.0V at 5 MHz, SO = Open,

Read, Write 6.0 mA

ISB1(1) Standby Current VCC = 2.7V CS = VCC 3.0 µA

ISB2(1) Standby Current VCC = 5.0V CS = VCC 5.0 µA

IIL Input Leakage VIN = 0V to VCC −0.6 3.0 µA

IOL Output Leakage VIN = 0V to VCC −0.6 3.0 µA

VIL

(2) Input Low Voltage −0.6 VCC x 0.3V

VIH(2) Input High Voltage VCC x 0.7 VCC + 0.5 V

VOL1 Output Low Voltage 3.6V ≤ VCC ≤ 5.5V IOL = 2.0 mA 0.4 V

VOH1 Output High Voltage IOH = −1.0 mA VCC – 0.8 V

VOL2 Output Low Voltage 2.7V ≤ VCC ≤ 3.6V IOL = 0.15 mA 0.2 V

VOH2 Output High Voltage IOH = −100 µA VCC – 0.2 V

4AT25010A/020A/040A

5087B–SEEPR–1/05

Note: 1. This parameter is characterized and is not 100% tested.

Table 4. AC Characteristics

Applicable over recommended operating range from TAE = −40°C to +125°C, VCC = As Specified,

CL = 1 TTL Gate and 100 pF (unless otherwise noted).

Symbol Parameter Voltage Min Max Units

fSCK SCK Clock Frequency 2.7–5.5 0 5.0 MHz

tRI Input Rise Time 2.7–5.5 2 µs

tFI Input Fall Time 2.7–5.5 2 µs

tWH SCK High Time 2.7–5.5 40 ns

tWL SCK Low Time 2.7–5.5 40 ns

tCS CS High Time 2.7–5.5 80 ns

tCSS CS Setup Time 2.7–5.5 80 ns

tCSH CS Hold Time 2.7–5.5 80 ns

tSU Data In Setup Time 2.7–5.5 5 ns

tHData In Hold Time 2.7–5.5 20 ns

tHD Hold Setup Time 2.7–5.5 40

tCD Hold Hold Time 2.7–5.5 40 ns

tVOutput Valid 2.7–5.5 0 40 ns

tHO Output Hold Time 2.7–5.5 0 ns

tLZ Hold to Output Low Z 2.7–5.5 0 40 ns

tHZ Hold to Output High Z 2.7–5.5 80 ns

tDIS Output Disable Time 2.7–5.5 80 ns

tWC Write Cycle Time 2.7–5.5 5 ms

Endurance(1) 5.0V, 25°C, Page Mode 1M Write Cycles

AT25010A/020A/040A

5087B–SEEPR–1/05

Serial Interface

Description

MASTER: The device that generates the serial clock.

SLAVE: Because the serial clock pin (SCK) is always an input, the

AT25010A/020A/040A always operates as a slave.

TRANSMITTER/RECEIVER: The AT25010A/020A/040A has separate pins designated

for data transmission (SO) and reception (SI).

MSB: The Most Significant Bit (MSB) is the first bit transmitted and received.

SERIAL OP-CODE: After the device is selected with CS going low, the first byte will be

received. This byte contains the op-code that defines the operations to be performed.

The op-code also contains address bit A8 in both the Read and Write instructions.

INVALID OP-CODE: If an invalid op-code is received, no data will be shifted into the

AT25010A/020A/040A, and the serial output pin (SO) will remain in a high impedance

state until the falling edge of CS is detected again. This will reinitialize the serial

communication.

CHIP SELECT: The AT25010A/020A/040A is selected when the CS pin is low. When

the device is not selected, data will not be accepted via the SI pin, and the serial output

pin (SO) will remain in a high impedance state.

HOLD: The HOLD pin is used in conjunction with the CS pin to select the

AT25010A/020A/040A. When the device is selected and a serial sequence is underway,

HOLD can be used to pause the serial communication with the master device without

resetting the serial sequence. To pause, the HOLD pin must be brought low while the

SCK pin is low. To resume serial communication, the HOLD pin is brought high while the

SCK pin is low (SCK may still toggle during HOLD). Inputs to the SI pin will be ignored

while the SO pin is in the high impedance state.

WRITE PROTECT: The write protect pin (WP) will allow normal read/write operations

when held high. When the WP pin is brought low, all write operations are inhibited. WP

going low while CS is still low will interrupt a write to the AT25010A/020A/040A. If the

internal write cycle has already been initiated, WP going low will have no effect on any

write operation.

6AT25010A/020A/040A

5087B–SEEPR–1/05

Figure 2. SPI Serial Interface

AT25010A/020A/040A

5087B–SEEPR–1/05

Functional

Description

The AT25010A/020A/040A is designed to interface directly with the synchronous serial

peripheral interface (SPI) of the 6805 and 68HC11 series of microcontrollers.

The AT25010A/020A/040A utilizes an 8-bit instruction register. The list of instructions

and their operation codes are contained in Table 5. All instructions, addresses, and data

are transferred with the MSB first and start with a high-to-low CS transition.

Note: “A” represents MSB address bit A8.

WRITE ENABLE (WREN): The device will power up in the write disable state when VCC

is applied. All programming instructions must therefore be preceded by a Write Enable

instruction. The WP pin must be held high during a WREN instruction.

WRITE DISABLE (WRDI): To protect the device against inadvertent writes, the Write

Disable instruction disables all programming modes. The WRDI instruction is indepen-

dent of the status of the WP pin.

READ STATUS REGISTER (RDSR): The Read Status Register instruction provides

access to the status register. The READY/BUSY and Write Enable status of the device

can be determined by the RDSR instruction. Similarly, the block write protection bits

indicate the extent of protection employed. These bits are set by using the WRSR

instruction.

WRITE STATUS REGISTER (WRSR): The WRSR instruction allows the user to select

one of four levels of protection. The AT25010A/020A/040A is divided into four array seg-

ments. One-quarter, one-half, or all of the memory segments can be protected. Any of

Table 5. Instruction Set for the AT25010A/020A/040A

Instruction Name Instruction Format Operation

WREN 0000 X110 Set Write Enable Latch

WRDI 0000 X100 Reset Write Enable Latch

RDSR 0000 X101 Read Status Register

WRSR 0000 X001 Write Status Register

READ 0000 A011 Read Data from Memory Array

WRITE 0000 A010 Write Data to Memory Array

Table 6. Status Register Format

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

X X X X BP1 BP0 WEN RDY

Table 7. Read Status Register Bit Definition

Bit Definition

Bit 0 (RDY) Bit 0 = “0” (RDY) indicates the device is ready. Bit 0 = “1” indicates the write

cycle is in progress.

Bit 1 (WEN) Bit 1= “0” indicates the device is not write-enabled. Bit 1 = “1” indicates the

device is write-enabled.

Bit 2 (BP0) See Table 8 on page 8.

Bit 3 (BP1) See Table 8 on page 8.

Bits 4 − 6 are “0”s when device is not in an internal write cycle.

Bits 0 − 7 are “1”s during an internal write cycle.

8AT25010A/020A/040A

5087B–SEEPR–1/05

the data within any selected segment will therefore be read only. The block write protec-

tion levels and corresponding status register control bits are shown in Table 8.

Bits BP0 and BP1 are nonvolatile cells that have the same properties and functions as

the regular memory cells (e.g., WREN, tWC, RDSR).

READ SEQUENCE (READ): Reading the AT25010A/020A/040A via the serial output

(SO) pin requires the following sequence. After the CS line is pulled low to select a

device, the read op-code (including A8) is transmitted via the SI line followed by the byte

address to be read (A7–A0). Upon completion, any data on the SI line will be ignored.

The data (D7−D0) at the specified address is then shifted out onto the SO line. If only

one byte is to be read, the CS line should be driven high after the data comes out. The

read sequence can be continued since the byte address is automatically incremented

and data will continue to be shifted out. When the highest address is reached, the

address counter will roll over to the lowest address, allowing the entire memory to be

read in one continuous read cycle.

WRITE SEQUENCE (WRITE): In order to program the AT25010A/020A/040A, the Write

Protect (WP) pin must be held high and two separate instructions must be executed.

First, the device

must be write enabled

via the WREN instruction. Then a write (WRITE)

instruction may be executed. Also, the address of the memory location(s) to be pro-

grammed must be outside the protected address field location selected by the block

write protection level. During an internal write cycle, all commands will be ignored

except the RDSR instruction.

A write instruction requires the following sequence. After the CS line is pulled low to

select the device, the WRITE op-code (including A8) is transmitted via the SI line fol-

lowed by the byte address (A7−A0) and the data (D7–D0) to be programmed.

Programming will start after the CS pin is brought high. The low-to-high transition of the

CS pin must occur during the SCK low-time immediately after clocking in the D0 (LSB)

data bit.

The READY/BUSY status of the device can be determined by initiating a read status

the write cycle has ended. Only the RDSR instruction is enabled during the write pro-

gramming cycle.

The AT25010A/020A/040A is capable of an 8-byte page write operation. After each byte

of data is received, the three low-order address bits are internally incremented by one;

the six high-order bits of the address will remain constant. If more than eight bytes of

data are transmitted, the address counter will roll over and the previously written data

will be overwritten. The AT25010A/020A/040A is automatically returned to the write dis-

able state at the completion of a write cycle.

NOTE: If the WP pin is brought low or if the device is not write enabled (WREN), the

device will ignore the Write instruction and will return to the standby state when CS is

brought high. A new CS falling edge is required to reinitiate the serial communication.

Table 8. Block Write Protect Bits

Level

Status Register Bits Array Addresses Protected

BP1 BP0 AT25010A AT25020A AT25040A

0 0 0 None None None

1 (1/4) 0 1 60-7F C0-FF 180-1FF

2 (1/2) 1 0 40-7F 80-FF 100-1FF

3 (All) 1 1 00-7F 00-FF 000-1FF

AT25010A/020A/040A

5087B–SEEPR–1/05

Timing Diagrams

Figure 3. Synchronous Data Timing (for Mode 0)

Figure 4. WREN Timing

Figure 5. WRDI Timing

VOH

VOL

HI-Z HI-Z

VALID IN

VIH

VIL

tSU

tDIS

SCK

VIH

VIL

tWH

tCSH

VIH

VIL

tCSS

tCS

tWL

tHO

10 AT25010A/020A/040A

5087B–SEEPR–1/05

Figure 6. RDSR Timing

Figure 7. WRSR Timing

SCK

01234567891011121314

INSTRUCTION

SO 76543210

DATA OUT

MSB

HIGH IMPEDANCE

SCK

0123456789 1011121314

INSTRUCTION

76543210

DATA IN

HIGH IMPEDANCE

AT25010A/020A/040A

5087B–SEEPR–1/05

Figure 8. READ Timing

Figure 9. WRITE Timing

HOLD Timing

SCK

0123456789 1011121314

INSTRUCTION

76543210

DATA IN

HIGH IMPEDANCE

15 16 17 1819 20 21 22

801234567

9TH BIT OF ADDRESS

BYTE ADDRESS

SCK

HOLD

tCD

tHD

tHZ

tHD

tCD

tLZ

12 AT25010A/020A/040A

5087B–SEEPR–1/05

AT25010A Ordering Information

Ordering Code Package Operation Range

AT25010A-10PE-2.7

AT25010AN-10SE-2.7

8P3

8S1

Extended Temperature

(−40°C to 125°C)

AT25010A-10PQ-2.7

AT25010A-10TQ-2.7

AT25010AN-10SQ-2.7

8P3

8A2

8S1

Lead-free/Halogen-free

Extended Temperature

(−40°C to 125°C)

Package Type

8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2 8-lead, 0.170” Wide, Thin Shrink Small Outline Package (TSSOP)

Options

−2.7 Low Voltage (2.7V to 5.5V)

AT25010A/020A/040A

5087B–SEEPR–1/05

AT25020A Ordering Information

Ordering Code Package Operation Range

AT25020A-10PE-2.7

AT25020AN-10SE-2.7

8P3

8S1

Extended Temperature

(−40°C to 125°C)

AT25020A-10PQ-2.7

AT25020A-10TQ-2.7

AT25020AN-10SQ-2.7

8P3

8A2

8S1

Lead-free/Halogen-free

Extended Temperature

(−40°C to 125°C)

Package Type

8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

Options

−2.7 Low Voltage (2.7V to 5.5V)

14 AT25010A/020A/040A

5087B–SEEPR–1/05

AT25040A Ordering Information

Ordering Code Package Operation Range

AT25040A-10PE-2.7

AT25040AN-10SE-2.7

8P3

8S1

Extended Temperature

(−40°C to 125°C)

AT25040A-10PQ-2.7

AT25040A-10TQ-2.7

AT25040AN-10SQ-2.7

8P3

8A2

8S1

Lead-free/Halogen-free

Extended Temperature

(−40°C to 125°C)

Package Type

8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

Options

−2.7 Low Voltage (2.7V to 5.5V)

AT25010A/020A/040A

5087B–SEEPR–1/05

Packaging Information

8P3 – PDIP

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

8P3, 8-lead, 0.300" Wide Body, Plastic Dual

In-line Package (PDIP)

01/09/02

8P3 B

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.

2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.

3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.

4. E and eA measured with the leads constrained to be perpendicular to datum.

5. Pointed or rounded lead tips are preferred to ease insertion.

6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).

COMMON DIMENSIONS

(Unit of Measure = inches)

SYMBOL MIN NOM MAX NOTE

A2 A

4 PLCS

–

0.210 2

A2 0.115 0.130 0.195

b 0.014 0.018 0.022 5

b2 0.045 0.060 0.070 6

b3 0.030 0.039 0.045 6

c 0.008 0.010 0.014

D 0.355 0.365 0.400 3

D1 0.005

–

E 0.300 0.310 0.325 4

E1 0.240 0.250 0.280 3

e 0.100 BSC

eA 0.300 BSC 4

L 0.115 0.130 0.150 2

Top View

Side View

End View

16 AT25010A/020A/040A

5087B–SEEPR–1/05

8S1 – JEDEC SOIC

1150 E. Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906

TITLE DRAWING NO.

REV.

Note:

10/7/03

8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing

Small Outline (JEDEC SOIC) 8S1 B

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A1 0.10 – 0.25

These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.

A 1.35 – 1.75

b 0.31 – 0.51

C 0.17 – 0.25

D 4.80 – 5.00

E1 3.81 – 3.99

E 5.79 – 6.20

e 1.27 BSC

L 0.40 – 1.27

∅ 0˚ – 8˚

∅

Top View

End View

Side View

AT25010A/020A/040A

5087B–SEEPR–1/05

8A2 – TSSOP

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

5/30/02

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

D 2.90 3.00 3.10 2, 5

E 6.40 BSC

E1 4.30 4.40 4.50 3, 5

A – – 1.20

A2 0.80 1.00 1.05

b 0.19 – 0.30 4

e 0.65 BSC

L 0.45 0.60 0.75

L1 1.00 REF

8A2, 8-lead, 4.4 mm Body, Plastic

Thin Shrink Small Outline Package (TSSOP)

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,

datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed

0.15 mm (0.006 in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm

(0.010 in) per side.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the

b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between

protrusion and adjacent lead is 0.07 mm.

5. Dimension D and E1 to be determined at Datum Plane H.

8A2 B

Side View

End View

Top View

123

Pin 1 indicator

this corner

Printed on recycled paper.

5087B–SEEPR–1/05

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