fr4 AND COMPOSITE PRE-SENSITISED PCB LAMINATES High quality dip coated positive working photoresist. This high resolution photoresist contains a dye which gives a good contrast against the copper, allowing boards to be easily inspected at the developing stage. Panels are protected by a specially designed light-proof blue film which allows them to be guillotined without the risk of fracturing the Photoresist. Low tack blue plastic film Photosensitive coating Electrodeposited Copper FR4 Epoxy resin impregnated glass fibre matt (FR4) Compositive material has epoxy resin and paper base. Thickness Copper foil Dissipation factor Dielectric Constant Solderbath resistance (260) Resist thickness Spectral response U.V. light energy required approx. Shelf life Developer Etchant FR4 Laminate 1.6mm 35 microns 35 5.4 20 secs. 5 microns 350 - 450 nm 50ml / cm 1 year at 15 - 20C 3204996 Ferric Chloride Pellets or liquid and Fine Etch Crystals. U.V. EXPOSURE Use a good quality artwork and purpose made U.V. exposure unit. The exact exposure time will vary, depending on the quality of the artwork used and the size of the U.V. unit. As a guide: Exposure times between 90 seconds and 120 seconds are normally sufficient. DEVELOPING THE RESIST Use 3204996 Developer concentrate. Mix as instructed and use between 18C - 24C, preferably in a heated Processing Tank (157363). Developing time will depend on artwork, exposure and developer temperature, 30 seconds to 180 seconds is typical. Ready to use 141-310 Developer can also be used with this board, but the above mentioned 3204996 is recommended as the preferred developer. FARNELL ELECTRONIC COMPONENTS LIMITED. CANAL ROAD, LEEDS, WEST YORKSHIRE ,LS12 2TU Telephone Number: 0113263 6311 Fax Number: 0113263 3411