Low tack blue plastic film
Electrodeposited
Copper
Epoxy resin impregnated glass fibre matt (FR4)
Compositive material has epoxy resin and paper base.
fr4 AND COMPOSITE PRE-SENSITISED PCB
LAMINATES
High quality dip coated positive working photoresist. This high resolution photoresist
contains a dye which gives a good contrast against the copper, allowing boards to be easily
inspected at the developing stage. Panels are protected by a specially designed light-proof
blue film which allows them to be guillotined without the risk of fracturing the Photoresist.
FR4 Laminate
Thickness 1.6mm
Copper foil 35 microns
Dissipation factor 35
Dielectric Constant 5.4
Solderbath resistance (260º) 20 secs.
Resist thickness 5 microns
Spectral response 350 – 450 nm
U.V. light energy required approx. 50ml / cm
Shelf life 1 year at 15 – 20ºC
Developer 3204996
Etchant Ferric Chloride Pellets or liquid and Fine Etch Crystals.
U.V. EXPOSURE
Use a good quality artwork and purpose made U.V. exposure unit. The exact exposure time
will vary, depending on the quality of the artwork used and the size of the U.V. unit.
As a guide: Exposure times between 90 seconds and 120 seconds are normally sufficient.
DEVELOPING THE RESIST
Use 3204996 Developer concentrate. Mix as instructed and use between 18ºC – 24ºC,
preferably in a heated Processing Tank (157363). Developing time will depend on artwork,
exposure and developer temperature, 30 seconds to 180 seconds is typical.
Ready to use 141-310 Developer can also be used with this board, but the above mentioned
3204996 is recommended as the preferred developer.
FARNELL ELECTRONIC COMPONENTS LIMITED.
CANAL ROAD, LEEDS, WEST YORKSHIRE ,LS12 2TU
Telephone Number: 0113263 6311
Fax Number: 0113263 3411
Photosensitive coating
FR4
