DATA SHEET • SKY65047-360LF LOW NOISE AMPLIFIER
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6 April 8, 2011 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201084D
Evaluation Board Description
The SKY65047-360LF Evaluation Board is used to test the
performance of the SKY65047-360LF LNA. Three different boards
are available, depending on the desired performance frequency:
915 MHz, 1575 MHz, and 2450 MHz.
Evaluation Board schematic diagrams are provided in Figures 9,
11, and 13. Assembly drawings for the Evaluation Board are
shown in Figures 10, 12, and 14.
Evaluation Board layer detail drawings for the 915 MHz,
1575 MHz, and 2450 MHz boards are shown in Figures 15, 16,
and 17, respectively. Layer detail physical characteristics are
noted in Figure 18.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65047-360LF has special electrical
and thermal grounding requirements. This pad is the main
thermal conduit for heat dissipation. Since the circuit board
acts as the heat sink, it must shunt as much heat as possible
from the device. Therefore, design the connection to the
ground pad to dissipate the maximum wattage produced by
the circuit board. Multiple vias to the grounding layer are
required.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Evaluation Board Test Procedure
Step 1: Connect RF test equipment to amplifier input/output SMA
connectors.
Step 2: Connect DC ground.
Step 3: Connect VCC to a +3.3 V supply. Verify that the board
draws approximately 6.7 mA.
Step 4: Connect pin 8 (EN) to a +3.3 V supply to enable the LNA.
Set EN to 0 V to disable the LNA.
Step 5: Apply an RF input signal of –40 dBm and observe the
output signal level. This level should be approximately
–23.5 dBm with a gain equal to approximately 16.5 dB.
Application Circuit Notes
Center Ground. It is extremely important to sufficiently ground the
bottom ground pad of the device for both thermal and stability
reasons. Multiple small vias are acceptable and will work well
under the device if solder migration is an issue.
GND (pins 1, 3, and 4). Attach all ground pins to the RF ground
plane with the largest diameter and lowest inductance via that the
layout allows. Multiple small vias are acceptable and will work
well under the device if solder migration is an issue. Pin 3 can
also be connected to ground with a small inductance of emitter
degeneration.
RF_IN (pin 2). The LNA requires a DC blocking capacitor as part
of the external RF matching.
VBIAS (pin 5). The bias supply voltage for the LNA is typically set
to +3.3 V using a bias resistor.
BIAS_R (pin 6). This pin is typically connected to ground through
a bias resistor.
RF_OUT/BIAS (pin 7). The LNA collector supply voltage is
supplied through an RF choke (component L3 on the 915 MHz and
2450 MHz Evaluation Boards, and component L2 on the 1575 MHz
Evaluation Board) to the output at pin 7. The LNA requires a DC
blocking capacitor as part of the external RF matching.
EN (pin 8). A logic low voltage level disables the internal PA; a
logic high voltage level enables the internal PA.
Package Dimensions
The PCB layout footprint for the SKY65047-360LF is shown in
Figure 19. Typical case markings are shown in Figure 20.
Package dimensions for the 8-pin DFN are shown in Figure 21,
and tape and reel dimensions are provided in Figure 22.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
THE SKY65047-360LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 °C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.