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1994, 2000
BIPOLAR ANALOG INTEGRATED CIRCUIT
μ
PC1943,1944
ADJUSTABLE PRECISION SHUNT REGULATORS
DATA SHEET
Document No. G10239EJ4V0DS00 (4th edition)
Date Published November 2006 NS CP (N)
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
DESCRIPTION
The
μ
PC1943, 1944 are adjustable high precision shunt regulators. The output voltage can be set to any value between
reference voltage (1.26 V) and 24 V by two external resistors.
These ICs can apply to error amplifier of switching regulators.
FEATURES
• Low voltage operation. VREF ≤ VOUT ≤ 24 V
• High accuracy. VREF = 1.26 V ± 2.4%
• Adjustable output voltage by two external resistors.
• Pin compatible with
μ
PC1093. (
μ
PC1944)
ORDERING INFORMATION
Part Number Marking Marking
μ
PC1943T POWER MINI MOLD (SOT-89) (SC-62) 9B
μ
PC1943T-AZ Note1 POWER MINI MOLD (SOT-89) (SC-62) 9B
μ
PC1944T
POWER MINI MOLD (SOT-89) (SC-62) 9C
μ
PC1944T-AZ Note1
POWER MINI MOLD (SOT-89) (SC-62) 9C
μ
PC1944J
3PIN PLASTIC SIP (TO-92) 1944
μ
PC1944J-A Note2
3PIN PLASTIC SIP (TO-92) 1944
μ
PC1944GR
8PIN PLASTIC SOP (5.72 mm (225)) 1944
μ
PC1944GR-A Note2
8PIN PLASTIC SOP (5.72 mm (225)) 1944
Notes 1. Pb-free (This product does not contain Pb in the external electrode.)
2. Pb-free (This product does not contain Pb in the external electrode and other parts.)
PIN CONFIGURATIONS (Marking Side)
K
K
K: Cathode
NC
NC
NC
AREF
K
A
AREF
REF
REF: Reference
NC
A
A: Anode
NC
NC: No Connection
μ
PC1944J
μ
PC1944GR
μ
PC1943T
μ
PC1944T
1
1
2
2
3
345
6
7
8
K
A
A REF
1
123
2 3
BLOCK DIAGRAM
K
A
REF
<R>
<R>
Data Sheet G10239EJ4V0DS
2
μ
PC1943,1944
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified.)
Parameter Symbol Ratings Unit
Cathode Voltage VKA 25 V
Cathode Current IK 50 mA
Cathode to Anode Reverse Current − IK −30 mA
Reference Voltage VREF 7 V
Reference Input Current IREF 50
μ
A
Reference to Anode Reverse Current − IREF −10 mA
Total Power Dissipation
μ
PC1943T
PT 320/1600 Note mW
μ
PC1944T
320/1600 Note mW
μ
PC1944J
560 mW
μ
PC1944GR
385 mW
Operating Ambient Temperature TA −30 to +85 °C
Operating Junction Temperature TJ −30 to +125 °C
Storage Temperature Tstg −65 to +125 °C
Note with 16 cm2 × 0.7 mm ceramic substrate.
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is the absolute maximum ratings are rated values at which the product is on the verge
of suffering physical damage, and therefore the product must be used under conditions that ensure
that the absolute maximum ratings are not exceeded.
TYPICAL CONNECTION
K
A
REF
V
IN
R
0
R
1
R
2
V
OUT
G
ND
V
OUT
(1 + ) · V
RE
F
R
2
R
1
∼
APPLICATION CIRCUIT
<R>
Data Sheet G10239EJ4V0DS
3
μ
PC1943,1944
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Cathode Voltage VKA VREF 24 V
Cathode Current IK 1 10 30 mA
Total Power Dissipation
μ
PC1943T
PT 45/240 Note mW
μ
PC1944T
45/240 Note mW
μ
PC1944J
83 mW
μ
PC1944GR
57 mW
Operating Ambient Temperature TA −30 +85 °C
Operating Junction Temperature TJ −30 +100 °C
Note with 16 cm2 × 0.7 mm ceramic substrate.
ELECTRICAL CHARACTERISTICS (IK = 10 mA, TA = 25°C, unless otherwise specified.)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Reference Voltage VREF VKA = VREF 1.23 1.26 1.29 V
Reference Voltage Change
Over Temperature
Δ
VREF VKA = VREF, 0°C ≤ TA ≤ 70°C
±5 ±30 mV
Reference Voltage Change
Δ
VREF/
Δ
VKA | VREF | ≤ VKA ≤ 5 V 2.7 mV/V
Over Cathode Voltage 5 V ≤ VKA ≤ 24 V 2.0 mV/V
Reference Input Current IREF VKA = VREF, R1 = 10 kΩ, R2 = ∞ 2.0 4.0
μ
A
Reference Input Current Change
Over Temperature
Δ
IREF VKA = VREF, 0°C ≤ TA ≤ 70°C,
R1 = 10 kΩ, R2 = ∞ 0.3 1.2
μ
A
Minimum Cathode Current IKmin VKA = VREF,
Δ
VREF = 2% 0.16 1.0 mA
Off-state Cathode Current IKoff VKA = 24 V, VREF = 0 V 0.01 1.0
μ
A
Dynamic Impedance | ZKA | VKA = VREF, f ≤ 1 kHz,
1 mA ≤ IK ≤ 30 mA
0.12 0.5 Ω
Data Sheet G10239EJ4V0DS
4
μ
PC1943,1944
TYPICAL CHARACTERISTIC (TA = 25°C, unless otherwise specified. Nominal)
P
T
vs
T
A
( I )
Note1
0
100
200
300
400
500
600
25 50 75 100 125 150
PC1944J
μ
PC1944GR
μ
PC1943T,
μ
1944T
260 °C/W
180 °C/W
315 °C/W
P
T
- Total Power Dissipation - mW
T
A
- Operating Ambient Temperature - °C
P
T
vs
T
A
( II )
Note1
0
0.5
1.0
1.5
2.0
25 50 75 100 125 150
PC1943T, 1944T
μ
62.5 °C/W
with 16 cm
2
× 0.7 mm
ceramic substrate
P
T
- Total Power Dissipation - W
T
A
- Operating Ambient Temperature - °C
0 20 40 60 80 100 120
−20
−20
−40
−10
0
10
20
I
K
= 10 mA
V
KA
= V
REF
T
A
- Operating Ambient Temperature - °C
V
REF
vs
T
A
Note2
Δ
V
REF
- Reference Voltage Change - mV
Δ
0.2 0.4 0.6 0.8 1.0 1.2 1.40
1.0
2.0 V
KA
= V
REF
V
KA
- Cathode Voltage - V
I
K
vs
V
KA
( I )
I
K
- Cathode Current - mA
0.5 1.0 1.50
20
30
40
10
50 V
KA
= V
REF
V
KA
- Cathode Voltage - V
I
K
vs
V
KA
(II)
I
K
- Cathode Current - mA
0
−10
−20
−30
−1.0 −0.8 −0.6 −0.4 −0.2
0
V
KA
= V
REF
V
KA
- Cathode Voltage - V
I
K
vs
V
KA
(III)
(Reverse Characteristic)
I
K
- Cathode Current - mA
Data Sheet G10239EJ4V0DS
5
μ
PC1943,1944
0 20 40 60 80 100 120
1.0
−20
0
2.0
3.0
4.0 V
KA
= V
REF
, I
K
= 10 mA,
R
1
= 10 kΩ, R
2
=
∞
T
A
- Operating Ambient Temperature - °C
I
REF
vs
T
A Note2
I
REF
- Reference Input Current - A
μ
0 20406080100120−20
0
0.1
0.2 V
KA
= 24 V
V
REF
= 0 V
T
A
- Operating Ambient Temperature - °C
I
Koff
vs
T
A Note2
1k 10k 100k 1M 10M
0
−20
20
40
60
−90
−180
−270
0
+90
f - Frequency - Hz
A
v
, vs
f
A
v
- Voltage Gain - dB
φ
220 Ω
10 kΩ
I
K
10 kΩ
(I
K
= 10 mA)
υ
o
υ
in
A
v
φ
- Phase - °
φ
1k 10k 100k 1M 10M
1.0
0.1
10
50
f - Frequency - Hz
| Z
KA
| vs
f
| Z
KA
| - Dynamic Impedance - Ω
V
KA
= V
REF
1 mA ≤ I
K
≤ 30 mA
I
Koff
- Off State Cathode Current - A
μ
0.001 0.01 0.1 1 10
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0
CKA - Lode Capacitance - F
Stability Area Test Circuit
a:
b, c:
CKA: Monolithic Ceramic Capacitor
IKA - Cathode Current - mA
a
b
c
a: VKA = VREF
b: VKA = 3 V
c: VKA = 5 V
Unstable
Stable
Stable
μ
150 Ω
IKA
CKA
CKA
150 Ω
10 kΩ
R
IKA
Notes 1. This graph shows the absolute maximum rating, while the other graphs show standard characteristics.
Be sure to use the devices within the ranges delimited by the solid lines shown for each device.
2. In this temperature characteristics graph, the ratings for the operating ambient temperatures are indicated
by a solid line, and the ratings for the operating junction temperatures are indicated by a dashed line.
Caution of Stability Area
If the Aluminum electrolytic capacitor is used, it should be kept CKA ≥ 6.8
μ
F. Please note Temperature characteristic
and Electrical characteristic by capacitor type etc.
<R>
Data Sheet G10239EJ4V0DS
6
μ
PC1943,1944
PACKAGE DRAWINGS (Unit : mm)
POWER MINI MOLD (SOT-89) (SC-62)
4.5±0.1
1.6±0.2
0.41
+0.03
−0.05
1.5±0.1
2.5±0.1
4.0±0.25
3.0
1.5
0.42±0.06
0.42±0.06
0.8 MIN.
0.47
±0.06
Data Sheet G10239EJ4V0DS
7
μ
PC1943,1944
ITEM
B
C
I
8-PIN PLASTIC SOP (5.72 mm (225))
D
E
F
G
H
J
P
MILLIMETERS
1.27 (T.P.)
0.78 MAX.
4.4±0.15
0.1±0.1
0.42
1.59±0.21
6.5±0.3
1.49
+0.08
−0.07
1.1±0.2
3°+7°
−3°
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition. A5.2 +0.17
−0.20
K
L
M
N
0.6±0.2
0.17
0.12
0.10
+0.08
−0.07
S8GM-50-225B-6
85
14
S
M
C
detail of lead end
A
M
SN
FG
B
E
D
P
H
IJ
K
L
Data Sheet G10239EJ4V0DS
8
μ
PC1943,1944
GM
13
JU
V
F
3-PIN PLASTIC SIP (TO-92)
A
M
Y
H
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
P3J-127B-3
ITEM MILLIMETERS
A
F
G
H
J
M
N
U
5.0±0.2
0.12
5.0±0.5
4.0±0.2
0.50
V
Y 15.0±0.7
2.8 MAX.
0.50±0.10
1.27
1.33 MAX.
+0.30
−0.10
N
Data Sheet G10239EJ4V0DS
9
μ
PC1943,1944
RECOMMENDED SOLDERING CONDITIONS
The
μ
PC1943, 1944 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
μ
PC1943T, 1944T : POWER MINI MOLD (SOT-89) (SC-62)
Process Conditions Symbol
Infrared ray reflow Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times.
IR35-00-3
VPS Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 2 times.
VP15-00-2
Partial Heating Method
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device).
P350
μ
PC1943T-AZ, 1944T-AZ : POWER MINI MOLD (SOT-89) (SC-62)
Process Conditions Symbol
Infrared ray reflow Peak temperature: 260°C or below (Package surface temperature),
Reflow time: 60 seconds or less (at 220°C or higher),
Maximum number of reflow processes: 3 times.
IR60-00-3
Partial Heating Method Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device).
P350
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
<R>
<R>
Data Sheet G10239EJ4V0DS
10
μ
PC1943,1944
μ
PC1944GR : 8PIN PLASTIC SOP (5.72 mm (225))
Process Conditions Symbol
Infrared ray reflow Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 time.
IR35-00-3
VPS Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
Wave soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time.
WS60-00-1
Partial Heating Method Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device).
P350
μ
PC1944GR-A : 8PIN PLASTIC SOP (5.72 mm (225))
Process Conditions Symbol
Infrared ray reflow Peak temperature: 260°C or below (Package surface temperature),
Reflow time: 60 seconds or less (at 220°C or higher),
Maximum number of reflow processes: 3 time.
IR60-00-3
Wave soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time.
WS60-00-1
Partial Heating Method Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device).
P350
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
Type of Through-hole Device
μ
PC1944J, 1944J-A : 3PIN PLASTIC SIP (TO-92)
Process Conditions Symbol
Wave soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less.
Maximum number of flow processes: 1 time,
WS60-00-1
Partial Heating Method
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each pin).
P350
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
REFERENCE DOCUMENTS
Review of Quality and Reliability Handbook Information C12769E
Semiconductor Device Mount Manual http://www.necel.com/pkg/en/mount/index.html
<R>
<R>
μ
PC1943,1944
The information in this document is current as of November, 2006. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
•
•
•
•
•
•
M8E 02. 11-1
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
