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Lead (Pb)-bearing Thick Film, Rectangular
Precision Chip Resistor Vishay
Document Number: 20009 For technical questions, contact: filmresistors.thickfilmchip@vishay.com www.vishay.com
Revision: 13-Oct-08 139
0402 0603 0805 1206 1210
2010
2512
80
70
60
50
40
30
20
10
0 0 0.1 0.2 0.3 0.4 0.5
Power in W
Temperature Rise in °C
Temperature Rise
- 55 - 25 0 25 50 75 100 125 155 175
120
100
80
60
40
20
0
70
DeratingAmbient Temperature in °C
Rated Power in %
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
TEST (clause) CONDITIONS OF TEST
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR/R)
STABILITY CLASS 1 OR BETTER
Stability for product types: 10R to 10M
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Resistance (4.5) - ± 1 %; ± 0.5 %; ± 0.25 %
Temperature coefficient (4.8.4.2) 20/- 55/20 °C and
20/125/20 °C ± 100 ppm/K; ± 50 ppm/K; ± 100 ppm/K
Overload (4.13)
U = 2.5 x (P70 x R)1/2
≤ 2 x Umax.;
Duration: according the style
± (0.25 % R + 0.05 Ω)
Solderability (4.17.5)
Aging 4 h at 155 °C, dryheat
solder bath method; 235 °C; 2 s
visual examination
Good tinning
(≥ 95 % covered)
no visible damage
Resistance to soldering heat
(4.18.2)
Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 Ω)
Rapid change of temperature (4.19) 30 min at LCT = - 55 °C;
30 min at UCT = 125 °C; 5 cycles ± (0.25 % R + 0.05 Ω)
Damp heat, steady state (4.24) (40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (1 % R + 0.05 Ω)
Climatic sequence (4.23)
16 h at UCT = 125 °C; 1 cycle at 55 °C;
2 h at LCT = - 55 °C;
1 h/1 kPa at 15 °C to 35 °C;
5 cycles at 55 °C
U = (P70 × R)1/2
U = Umax.; whichever is less severe
± (1 % R + 0.05 Ω)
Endurance at 70 °C (4.25.1)
U = (P70 × R)1/2
U = Umax.; whichever is less severe
1.5 h ON; 0.5 h OFF;
70 °C; 1000 h
± (1 % R + 0.05 Ω)
Extended endurance (4.25.1.8) Duration extended to 8000 h ± (2 % R + 0.1 Ω)
Endurance at upper category
temperature (4.25.3) UCT = 125 °C; 1000 h ± (1 % R + 0.05 Ω)
APPLICABLE SPECIFICATIONS
• EN 60115-1 Generic Specifications
• EN 140400 Sectional Specification
• EN 140401-802 Detail Specifications
• IEC 60068-2-x Variety of environmental test procedures
• IEC 60286-3 Packaging of SMD components