AP9564GM RoHS-compliant Product Advanced Power Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET Simple Drive Requirement D D Low On-resistance D D Fast Switching Characteristic G SO-8 S BVDSS -40V RDS(ON) 28m ID -7.3A S S Description D Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SO-8 package is widely preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. G S Absolute Maximum Ratings Parameter Symbol VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25 ID@TA=70 Rating Units -40 V +25 V 3 -7.3 A 3 -5.9 A Continuous Drain Current Continuous Drain Current 1 IDM Pulsed Drain Current -30 A PD@TA=25 Total Power Dissipation 2.5 W Linear Derating Factor 0.02 W/ TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Rthj-a Parameter Value Unit Maximum Thermal Resistance, Junction-ambient 3 50 /W Data and specifications subject to change without notice 1 201009302 AP9564GM Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. -40 - - V - -0.03 - V/ VGS=-10V, ID=-7A - - 28 m VGS=-4.5V, ID=-5A - - 40 m BVDSS Drain-Source Breakdown Voltage BVDSS/Tj Breakdown Voltage Temperature Coefficient Reference to 25, ID=-1mA RDS(ON) Static Drain-Source On-Resistance VGS=0V, ID=-250uA 2 Max. Units VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -3 V gfs Forward Transconductance VDS=-10V, ID=-7A - 13 - S IDSS Drain-Source Leakage Current VDS=-40V, VGS=0V - - -1 uA Drain-Source Leakage Current (Tj=70 C) VDS=-32V, VGS=0V - - -25 uA Gate-Source Leakage VGS=+25V, VDS=0V - - +100 nA ID=-7A - 27 43 nC o IGSS 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=-32V - 6 - nC Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 14 - nC VDS=-20V - 14 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=-1A - 8 - ns td(off) Turn-off Delay Time RG=3.3,VGS=-10V - 46 - ns tf Fall Time RD=20 - 17 - ns Ciss Input Capacitance VGS=0V - 2240 3600 pF Coss Output Capacitance VDS=-25V - 300 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 250 - pF Min. Typ. IS=-2A, VGS=0V - - -1.2 V Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 Test Conditions Max. Units trr Reverse Recovery Time IS=-7A, VGS=0V, - 37 - ns Qrr Reverse Recovery Charge dI/dt=100A/s - 57 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 125 /W when mounted on Min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP9564GM 50 50 -10V -7.0V -5.0V -4.5V -ID , Drain Current (A) 40 40 30 20 V G = -3.0 V 30 20 V G = -3.0 V 10 10 0 0 0 1 2 3 4 5 0 1 2 3 4 5 -V DS , Drain-to-Source Voltage (V) -V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 1.8 36 ID=-5A T A =25 ID=-7A V G =-10V Normalized RDS(ON) 32 RDS(ON) (m) -10V -7.0V -5.0V -4.5V o T A = 150 C -ID , Drain Current (A) o T A =25 C 28 1.5 1.2 0.9 24 0.6 20 2 4 6 8 -50 10 0 50 100 150 o -V GS , Gate-to-Source Voltage (V) T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 7 1.7 Normalized -VGS(th) (V) 6 -IS(A) 5 T j =150 o C 4 T j =25 o C 3 2 1.2 0.7 1 0.2 0 0 0.2 0.4 0.6 0.8 1 -V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP9564GM f=1.0MHz 10000 I D = -7A V DS = -32V 10 8 C iss C (pF) -VGS , Gate to Source Voltage (V) 12 6 1000 4 C oss C rss 2 0 100 0 10 20 30 40 50 1 60 5 9 Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics 17 21 25 29 Fig 8. Typical Capacitance Characteristics 1 100us Operation in this area limited by RDS(ON) 10 1ms 10ms 1 100ms 1s 0.1 T A =25 o C Single Pulse DC Normalized Thermal Response (Rthja) 100 -ID (A) 13 -V DS , Drain-to-Source Voltage (V) Duty factor=0.5 0.2 0.1 0.1 0.05 0.02 0.01 PDM t 0.01 T Single Pulse Duty factor = t/T Peak Tj = PDM x Rthja + T a Rthja=125 oC/W 0.001 0.01 0.01 0.1 1 10 100 0.0001 0.001 0.01 -V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.1 1 10 100 1000 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG -4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4