SML05SC06D3A.GCDM - Semelab Plc.

SiC SCHOTTKY DIODE

Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.

Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However

Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to

verify that datasheets are current before placing an order.

Semelab ltd

Semelab ltdSemelab ltd

Semelab ltd

Coventry Road, Lutterworth, Leicestershire, LE17 4JB

Document Number 9166

Telephone +44 (0) 1455 556565

Fax +44 (0) 1455 552612

Issue 2

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Page 1 of 6

SML05SC06D3A / SML05SC06D3B

• VR(max) = 600V

• IF(avg) = 5A

• VF(typ) = 1.5V

• DLCC3 Hermetic Ceramic Surface Mount Package Designed as a

Drop In Replacement for “D-5B”/ “E-MELF” Package

†

• No Reverse Recovery

• No Forward Recovery

• High Reliability Screening Options Available

ABSOLUTE MAXIMUM RATINGS

(TA = 25°C unless otherwise stated)

VRRM Peak Repetitive Reverse Voltage 600V

VRSM Surge Peak Reverse Voltage 600V

IF(AVG) Average Forward Current

(1)

IFSM Non-Repetitive Peak Forward Surge Current

(3,4)

60A

PD Total Power Dissipation at TA = 25°C 2.96

(2)

Derate Above TA = 25°C 14.8mW/°C

(2)

TJ Junction Temperature Range -55 to +225°C

Tstg Storage Temperature Range -55 to +225°C

THERMAL PROPERTIES

Symbols Parameters Max. Units

RθJSP(IN) Thermal Resistance, Junction To Solder Pads TSP = 25°C 29 °C/W

RθJA(PCB)

(2)

Thermal Resistance, Junction To Ambient, On PCB 67.5 °C/W

RθJA(PCB)

(3)

Thermal Resistance, Junction To Ambient, On PCB 123 °C/W

Notes

NotesNotes

Notes

(1) IO1

is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where

TJ(Max) does not exceed 175°C; This equates to RθJA(PCB) ≤ 68°C/W.

(2) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air.

(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.

IO1

is rated at 1.0A @ TA = 25°C for PC boards where RθJA(PCB) ≤ 125°C/W. Derate at 7.33mA/°C above TA = 25°C in this case.

(4) MIL-STD-750 Method 4066.4 Condition A1. I

= 1A, V

RWM

= 600V, V

RSM

= 600V, ten surges of 8.3mS each at 1 minute intervals, TA = 25°C.

‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.

SiC SCHOTTKY DIODE

SML05SC06D3A / SML05SC06D3B

Semelab ltd

Semelab ltdSemelab ltd

Semelab ltd

Coventry Road, Lutterworth, Leicestershire, LE17 4JB

Document Number 9166

Telephone +44 (0) 1455 556565

Fax +44 (0) 1455 552612

Issue 2

Email: sales@semelab-tt.com

Website: http://www.semelab-tt.com

Page 2 of 6

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise stated)

Symbol Parameters Test Conditions Min.

Typ. Max.

Unit

IF = 5A TJ = 25°C 1.5 1.8

(1)

Diode Forward Voltage IF = 5A TJ = 175°C 2.0 2.4

VR = 600V TJ = 25°C 50 200

IR Leakage Current VR = 600V TJ = 175°C 100 1000

µA

DYNAMIC CHARACTERISTICS

VR = 600V IF = 5A

QC Total Capacitive Charge di/dt = 500A/µs TJ = 25°C 28 nC

VR = 0V TJ = 25°C 550

VR = 200V TJ = 25°C 65

CT Junction Capacitance

(f = 1.0MHz)

VR = 400V TJ = 25°C 50

Notes

NotesNotes

Notes

(1) Pulse Width ≤ 300us, δ ≤ 2%

SiC SCHOTTKY DIODE

SML05SC06D3A / SML05SC06D3B

Semelab ltd

Semelab ltdSemelab ltd

Semelab ltd

Coventry Road, Lutterworth, Leicestershire, LE17 4JB

Document Number 9166

Telephone +44 (0) 1455 556565

Fax +44 (0) 1455 552612

Issue 2

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Page 3 of 6

Typical Performance Over Temperature Range

The Forward Characteristics of 600V D3A Diodes

0.0

2.0

4.0

6.0

8.0

10.0

12.0

0 0.5 1 1.5 2 2.5

Vf - For war d Vol tage ( V)

If - Forward Current (A)

-55 25 100 125 150 175 225

Reverse Leakage characteristics of 600V D3A Diodes

000.0E+0

2.0E-6

4.0E-6

6.0E-6

8.0E-6

10.0E-6

12.0E-6

14.0E-6

16.0E-6

18.0E-6

0 100 200 300 400 500 600 700 800

VR Rever se V ol tage ( Vol t s)

Reverse Current (A)

-55 25 100 125 150 175 225

SiC SCHOTTKY DIODE

SML05SC06D3A / SML05SC06D3B

Semelab ltd

Semelab ltdSemelab ltd

Semelab ltd

Coventry Road, Lutterworth, Leicestershire, LE17 4JB

Document Number 9166

Telephone +44 (0) 1455 556565

Fax +44 (0) 1455 552612

Issue 2

Email: sales@semelab-tt.com

Website: http://www.semelab-tt.com

Page 4 of 6

SML05SC06D3

Equivalent

Reverse Recovery Time Device

=500mA, I

= 1A, I

=250mA

-1.500

-1.000

-0.500

0.000

0.500

1.000

-18

-16

-14

-12

-10

-8

-6

-4

-2

Time (nS)

C urrent(A )

-55°C 0°C 25°C 50°C 100°C 150°C 200°C 225°C

SiC Schottky Diode, no minority

carrier recombination thus zero

reverse recovery. Recovery time

shown is due to a small junction

capacitance charge and is

independent of junction

temperature

SiC SCHOTTKY DIODE

SML05SC06D3A / SML05SC06D3B

Semelab ltd

Semelab ltdSemelab ltd

Semelab ltd

Coventry Road, Lutterworth, Leicestershire, LE17 4JB

Document Number 9166

Telephone +44 (0) 1455 556565

Fax +44 (0) 1455 552612

Issue 2

Email: sales@semelab-tt.com

Website: http://www.semelab-tt.com

Page 5 of 6

MECHANICAL DATA

C C

1 2

SML

D3A

C C

1 2

SML

D3B

* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep

dielectric discharge in space applications; see the Space Weather link www.semelab.co.uk/dlcc3.html on the Semelab web site. Package variant

to be specified at order.

† The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology,

which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture

and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.

SOLDER PAD LAYOUT

Soldering temperature should be 260°C for a

maximum of 10 seconds.

The physical dimensions for the DLCC3 ceramic package are designed

to be different from the published dimensions for the “D-5B” and “E-

MELF” outlines. The DLCC3 design fully utilises the recommended

solder footprint for the “D-5B” / “E-MELF” Package, and as such

presents a drop in replacement for existing board designs.

PACKAGE MASS

Gold Plated Solder Pad Finish = 150mg

mm Inches

A 7.32 0.288

B 1.78 0.070

C 3.94 0.155

DLCC3 Variant

(D3

)

PAD 1 ANODE

PAD 2 CATHODE

PAD 3 LID CONTACT TO CATHODE*

DIMENSION mm Inches

A 7.00 ±0.10 0.275 ±0.004

B 3.75 ±0.10 0.143 ±0.004

C 1.60 ±0.10 0.063 ±0.004

D 1.76 ±0.10 0.069 ±0.004

DLCC3 Variant A (D3A)

PAD 1 ANODE

PAD 2 CATHODE

DIMENSION mm Inches

A 7.00 ±0.10 0.275 ±0.004

B 3.75 ±0.10 0.143 ±0.004

C 1.60 ±0.10 0.063 ±0.004

D 1.76 ±0.10 0.069 ±0.004

SiC SCHOTTKY DIODE

SML05SC06D3A / SML05SC06D3B

Semelab Limited

Semelab LimitedSemelab Limited

Semelab Limited

Coventry Road, Lutterworth, Leicestershire, LE17 4JB

Telephone +44 (0) 1455 556565 Fax +44 (0) 1455 552612 Email: sales@semelab-tt.com Website: http://www.semelab-tt.com

Document Number 9166

Issue 2

Page 6 of 6

SCREENING OPTIONS

Space Level (JQRS/ESA) and High Reliability options are

available in accordance with the High Reliability and

Screening Options Handbook available for download from

the from the TT electronics Semelab web site.

ESA Quality Level Products are based on the testing

procedures specified in the generic ESCC 5000 and in the

corresponding part detail specifications.

Semelab’s QR216 and QR217 processing specifications

(JQRS), in conjunction with the companies ISO 9001:2000

approval present a viable alternative to the American MIL-

PRF-19500 space level processing.

QR217 (Space Level Quality Conformance) is based on the

quality conformance inspection requirements of MIL-PRF-

19500 groups A (table V), B (table VIa), C (table VII) and

also ESA / ESCC 5000 (chart F4) lot validation tests.

QR216 (Space Level Screening) is based on the screening

requirements of MIL-PRF-19500 (table IV) and also ESA

/ESCC 5000 (chart F3).

JQRS parts are processed to the device data sheet and

screened to QR216 with conformance testing to Q217

groups A and B in accordance with MIL-STD-750 methods

and procedures.

Additional conformance options are available, for example

Pre-Cap Visual Inspection, Buy-Off Visit or Data Packs.

These are chargeable and must be specified at the order

stage (See Ordering Information). Minimum order

quantities may apply.

Alternative or additional customer specific conformance or

screening requirements would be considered. Contact

Semelab sales with enquires.

MARKING DETAILS

Parts can be laser marked with approximately 7 characters

on two lines and always includes cathode identification.

Typical marking would include part or specification number,

week of seal or serial number subject to available space and

legibility.

Customer specific marking requirements can be arranged at

the time of order.

Example Marking:

ORDERING INFORMATION

Part numbers are built up from Type, Package Variant, and

screening level. The part numbers are extended to include

the additional options as shown below.

Type – See Electrical Stability Characteristics Table

Package Variant – See Mechanical Data

Screening Level – See Screening Options (ESA / JQRS)

Additional Options:

Customer Pre-Cap Visual Inspection .CVP

Customer Buy-Off visit .CVB

Data Pack .DA

Solderability Samples .SS

Scanning Electron Microscopy .SEM

Radiography (X-ray) .XRAY

Total Dose Radiation Test .RAD

MIL-PRF-19500 (QR217)

Group B charge .GRPB

Group B destructive mechanical samples .GBDM (12 pieces)

Group C charge .GRPC

Group C destructive electrical samples .GCDE (12 pieces)

Group C destructive mechanical samples .GCDM (6 pieces)

ESA/ESCC

Lot Validation Testing (subgroup 1) charge .LVT1

LVT1 destructive samples (environmental) .L1DE (15 pieces)

LVT1 destructive samples (mechanical) .L1DM (15 pieces)

Lot Validation Testing (subgroup 2) charge .LVT2

LVT2 endurance samples (electrical) .L2D (15 pieces)

Lot Validation Testing (subgroup 3) charge .LVT3

LVT3 destructive samples (mechanical) .L3D (5 pieces)

Additional Option Notes:

1) All ‘Additional Options’ are chargeable and must be

specified at order stage.

2) When Group B,C or LVT is required, additional electrical

and mechanical destructive samples must be ordered

3) All destructive samples are marked the same as other

production parts unless otherwise requested.

Example ordering information:

The following example is for the SML05SC06D3A /

SML05SC06D3B part with package variant B, JQRS

screening, additional Group C conformance testing and a

Data pack.

Part Numbers:

SML05SC06D3B-JQRS

(Include quantity for flight parts)

SML05SC06D3B.GRPC

(chargeable conformance option)

SML05SC06D3B.GCDE

(charge for destructive parts)

SML05SC06D3B.GCDM

(charge for destructive parts)

SML05SC06D3B.DA

(charge for Data pack)

Customers with any specific requirements (e.g. marking or

screening) may be supplied with a similar alternative part

number (there is maximum 20 character limit to part

numbers). Contact Semelab sales with enquiries.

High Reliability and Screening Options Handbook link:

http://www.semelab.co.uk/pdf/misc/documents/hirel_and_screening_options.pdf