APTGT75TDU120PG
APTGT75TDU120PG – Rev 1 July, 2006
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Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
E5/ E6
G5
E5
E3/ E 4
C5
G3
C6
E6
G6
C2
E2
G2
C4
E4
G4
E1
C1
G1
E1/E2
C3
E3
E5
G5
C 5C 3
G3
E5/E6
E3
E6
G6
C 4 C 6
E4
G4
E1
E1/E2 E3 /E4
C 1
G1
G2
E2
C 2
S
ymbol Parameter Ma
x
ratings Unit
VCES Collector - Emitter Breakdown Voltage 1200 V
TC = 25°C 100
IC Continuous Collector Current TC = 80°C 75
ICM Pulsed Collector Current TC = 25°C 175
A
VGE Gate – Emitter Voltage ±20 V
PD Maximum Power Dissipation TC = 25°C 350 W
RBSOA Reverse Bias Safe Operating Area Tj = 125°C 150A@1150V
VCES = 1200V
IC = 75A @ Tc = 80°C
Applicatio
n
AC Switches
Switched Mode Power Supplies
Uninterruptible Power Supplies
Features
Fast Trench + Field Stop IGBT® Technology
- Low voltage drop
- Low tail current
- Switching freque nc y up to 20 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- Avalanche energy rated
- RBSOA and SCSOA rated
Kelvin emitter for easy drive
Very low stray inductance
- Symmetrical design
- Lead frames for power connections
High level of integration
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Easy paralleling due to positive TC of VCEsat
Very low (12mm) profile
Each leg can be easily paralleled to achieve a dual
common source configuration of three times the
current capability
RoHS Compliant
Triple Dual Common Source
Fast Trench + Field Stop IGBT®
Power Module
APTGT75TDU120PG
APTGT75TDU120PG – Rev 1 July, 2006
www.microsemi
.
com 2 - 5
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
ICES Zero Gate Voltage Collector Current VGE = 0V, VCE = 1200V 250 µA
Tj = 25°C 1.4 1.7 2.1
VCE(sat) Collector Emitter saturation Voltage VGE =15V
IC = 75A Tj = 125°C 2.0 V
VGE(th) Gate Threshold Voltage VGE = VCE , IC = 3 mA 5.0 6.5 V
IGES Gate – Emitter Leakage Current VGE = 20V, VCE = 0V 400 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Cies Input Capacitance 5340
Coes Output Capacitance 280
Cres Reverse Transfer Capacitance
VGE = 0V
VCE = 25V
f = 1MHz 240
pF
Td(on) Turn-on Delay Time 260
Tr Rise Time 30
Td(off) Turn-off Delay Time 420
Tf Fall Time
Inductive Switching (25°C)
VGE = ±15V
VBus = 600V
IC = 75A
RG = 4.7 70
ns
Td(on) Turn-on Delay Time 285
Tr Rise Time 50
Td(off) Turn-off Delay Time 520
Tf Fall Time
Inductive Switching (125°C)
VGE = ±15V
VBus = 600V
IC = 75A
RG = 4.7 90
ns
Eon Tur n-on Switchi ng Energy Tj = 125°C 7
Eoff Turn-off Switching Energy
VGE = ±15V
VBus = 600V
IC = 75A
RG = 4.7 Tj = 125°C 8.1
mJ
Reverse diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
VRRM Maximum Peak Repetitive Reverse Voltage 1200 V
Tj = 25°C 250
IRM Maximum Reverse Leakage Current VR=1200V Tj = 125°C 500 µA
IF DC Forward Current Tc = 80°C 75 A
Tj = 25°C 1.6 2.1
VF Diode Forward Voltage IF = 75A
VGE = 0V Tj = 125°C 1.6 V
Tj = 25°C 170
trr Reverse Recovery Time Tj = 125°C 280 ns
Tj = 25°C 7
Qrr Reverse Recovery Charge Tj = 125°C 14 µC
Tj = 25°C 3
Er Reverse Recovery Energy
IF = 75A
VR = 600V
di/dt =2000A/µs
Tj = 125°C 5.5 mJ
APTGT75TDU120PG
APTGT75TDU120PG – Rev 1 July, 2006
www.microsemi
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com 3 - 5
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
IGBT 0.35
RthJC Junction to Case Thermal Resistance Diode 0.58
°C/W
VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V
TJ Operating junction temperature range -40 150
TSTG Storage Temperature Range -40 125
TC Operating Case Temperature -40 100
°C
Torque Mounting torque To heatsink M6 3 5 N.m
Wt Package Weight 250 g
SP6-P Package outline (dimensions in mm)
5 places (3:1)
See application note 1902 - Mounting Instructions for SP6-P (12mm) Power Modules on www.microsemi.com
APTGT75TDU120PG
APTGT75TDU120PG – Rev 1 July, 2006
www.microsemi
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com 4 - 5
Typical Performance Curve
Output Characteristics (VGE=15V)
TJ=25°C
TJ=125°C
0
25
50
75
100
125
150
01234
VCE (V)
IC (A)
Output Characteristics
VGE
=15V
VGE=13V
VGE=17V
VGE=9V
0
25
50
75
100
125
150
01234
VCE (V)
IC (A)
TJ = 125°C
Transfert Characteristics
TJ=25°C
TJ=125°C
0
25
50
75
100
125
150
56789101112
VGE (V)
IC (A)
Energy losses vs Collector Current
Eon
Eoff
Er
0
2.5
5
7.5
10
12.5
15
17.5
0 25 50 75 100 125 150
IC (A)
E (mJ)
VCE = 600V
VGE = 15V
RG = 4.7
TJ = 125°C
Eon
Eoff
Er
0
2
4
6
8
10
12
14
16
0 4 8 12 16 20 24 28 32
Gate Resistance (ohms)
E (mJ)
VCE = 600V
VGE
=15V
IC = 75A
TJ = 125°C
Switching Energy Losses vs Gate Resistance Reverse Bias Safe Operating Area
0
25
50
75
100
125
150
175
0 400 800 1200 1600
VCE (V)
IC (A)
VGE=15V
TJ=125°C
RG=4.7
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.9
0.7
0.5
0.3
0.1
0.05 Single Pulse
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
IGBT
APTGT75TDU120PG
APTGT75TDU120PG – Rev 1 July, 2006
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com 5 - 5
Forward Characteristic of diode
TJ=25°C
TJ=12C
TJ=125°C
0
25
50
75
100
125
150
0 0.4 0.8 1.2 1.6 2 2.4
VF (V)
IF (A)
Hard
switching
ZCS ZVS
0
10
20
30
40
50
60
0 20406080100120
IC (A)
Fmax, Operating Frequency (kHz)
VCE=600V
D=50%
RG=4.7
TJ=125°C
Tc=75°C
Operating Frequency vs Collector Current
maximum Effective Transient Therm al Imped ance, Junction to Case vs P ulse Duration
0.9
0.7
0.5
0.3
0.1
0.05 Single Pulse
0
0.1
0.2
0.3
0.4
0.5
0.6
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Diode
M icros emi rese rve s the rig ht to c ha nge , witho ut notice , t he spe cificatio ns and i nfo rmatio n co nta ine d he rein
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