Microwave Ceramics and Modules 2-Pol Filter for WLL Filter B69842N3487A185 Data Sheet Features z SMD filter consisting of coupled resonators with stepped impedances z MgTiO3-CaTiO3 (r = 21 / TCf =010 ppm/K) with a coating of copper (10m) and tin (>5m) z Excellent reflow solderability, no migration effect due to copper/tin metallization z ESD insensitivity and ESD protecting due to filter characteristics Index Page 2 * Component drawing * Recommended footprint Page 3 * Characteristics * Maximum ratings * Typical passband characteristic Page 4 * Processing information * Soldering requirements * Delivery mode ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 2-Pol Filter for WLL Filter B69842N3487A185 Data Sheet Component drawing View from below onto the solder terminals and view from Recommended footprint solder pads ground area below solder resist with vias to second ground layer connected to lines with an impedance of 50 Ohm FR4 material permitivity : 4.4 preferred thickness : 0.3 Vias: O0.3mm / mm For other thickness correlation might be necessary ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 2-Pol Filter for WLL Filter B69842N3487A185 Data Sheet Characteristics min. Center frequency fc IL Insertion loss Passband typ. max. 3487.5 - MHz 0.8 1.6 dB B 185 MHz 0.4 1.0 SWR 1.7 2.0 Impedance Z 50 Attenuation 33 14 10 dB dB dB Amplitude ripple (peak - peak) Standing wave ratio at 3100 MHz at 3242 MHz at 3875 MHz 27 10 9 dB Maximum ratings IEC climatic category (IEC 68-1) - 40/+ 90/56 Operating temperature Top -30 / +85 C Typical passband characteristic 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 4400 0 attenuation [dB] -10 -20 S11 -30 S21 -40 -50 -60 frequency [MHz] ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 2-Pol Filter for WLL Filter B69842N3487A185 Data Sheet Processing information z Wettability acc. to IEC 68-2-58: 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Profile for leadfree solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) reflow 260 (max. 2 sec.) C 250 (max. 10 sec.) C Recommended soldering conditions (infrared): within 10 sec. Temp. [C] within 10 sec. Temp. [C] 245C5C 215C10C 20-40 sec. 30 sec. Time [sec.] 2.5 C/s 40-80 sec. 2-3 min. Time [sec.] > - 5 C/s Delivery mode z Blister tape acc. to IEC 286-3, polyester, grey z Pieces/tape: 3000 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 4/4