TQM7M5050
Quad-Band GSM/EDGE 5x3.5 PAM
Data Sheet: Rev E - 1 of 16 - Disclaimer: Subject to change without notice
© 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network®
Applications
Functional Block Diagram
CMOS
Controller
LB Output Match
HB Output Match
GSM/EDGE/WEDGE Handsets
GSM/EDGE/WEDGE Wireless Cards
Product Features
Small 14-pin 5.0x3.5x0.9mm2 module
Input power controlled – GMSK and 8PSK (predistortion
required in EDGE mode)
Low-Band has 2 modes – HBM and LBM
High-Band has 2 modes – HBM and LBM
TriQuint’s GaAs HBT / CuFlip® PA Technology
Built-in CMOS controller
Optimized for 50Ω system
MSL3 260°C / RoHS / Halogen-free
General Description
Pin Configuration
Pin # Symbol
1 RFIN_HB
2, 9, 10, 12, 13, 15 GND
3 RFIN_LB
4 LB_EN
5 HB_EN
6 VMODE0
7 VBATT
8 RFOUT_LB
11 RFOUT_HB
14 VCC
Ordering Information
Part No. Description
TQM7M5050
Standard T/R size = 2,500 pieces on a 13” reel.
The TQM7M5050 is fully matched input power controlled, multi-
bias state, Quad-Band GSM/EDGE PAM desi
g
ned for use with
the Qualcomm multi-mode solutions supporting Linear EDGE.
The PA output power is controlled b
y
the input power comin
g
from the transceiver in both GMSK and 8PSK modes and thus
does not require a Vramp input. Additionall
y
, the small 5mm x
3.5mm package requires minimum board space and allows fo
r
high levels of phone integration.
The TQM7M5050 is desi
g
ned on TriQuint’s advanced InGaP
HBT GaAs technolo
gy
with CuFlip® assembl
y
offerin
g
state o
f
the art reliability, temperature stability and ruggedness.
