SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 Copyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type JM38510/08003BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/08003BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/08003BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/31004B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/31004B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/31004BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/31004BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/31004BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/31004BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/31004SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/31004SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/31004SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/31004SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN54LS08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7408N OBSOLETE PDIP N 14 TBD Call TI Call TI Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN7408N OBSOLETE PDIP N 14 TBD Call TI Call TI SN7408N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN7408N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS08DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08J OBSOLETE CDIP J 14 TBD Call TI Call TI SN74LS08J OBSOLETE CDIP J 14 TBD Call TI Call TI SN74LS08N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS08N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS08NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS08NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS08NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08J OBSOLETE CDIP J 14 TBD Call TI Call TI SN74S08J OBSOLETE CDIP J 14 TBD Call TI Call TI SN74S08N ACTIVE PDIP N 14 Pb-Free CU NIPDAU Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 25 Addendum-Page 2 N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S08N ACTIVE PDIP N 14 SN74S08N3 OBSOLETE PDIP N SN74S08N3 OBSOLETE PDIP N SN74S08NE4 ACTIVE PDIP N 14 SN74S08NE4 ACTIVE PDIP N SNJ54LS08FK ACTIVE LCCC SNJ54LS08FK ACTIVE LCCC SNJ54LS08J ACTIVE CDIP Lead/Ball Finish MSL Peak Temp (3) (RoHS) 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 14 TBD Call TI Call TI 14 TBD Call TI Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type FK 20 1 TBD POST-PLATE N / A for Pkg Type FK 20 1 TBD POST-PLATE N / A for Pkg Type J 14 1 TBD A42 N / A for Pkg Type SNJ54LS08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS08DBR SSOP SN74LS08DR SN74LS08NSR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 DB 14 2000 330.0 16.4 8.2 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS08DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS08DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS08NSR SO NS 14 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type JM38510/08003BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/08003BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/08003BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/31004B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/31004B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/31004BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/31004BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/31004BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/31004BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/31004SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/31004SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/31004SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/31004SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN54LS08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7408N OBSOLETE PDIP N 14 TBD Call TI Call TI Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN7408N OBSOLETE PDIP N 14 TBD Call TI Call TI SN7408N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN7408N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS08DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08J OBSOLETE CDIP J 14 TBD Call TI Call TI SN74LS08J OBSOLETE CDIP J 14 TBD Call TI Call TI SN74LS08N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS08N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS08NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS08NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS08NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S08J OBSOLETE CDIP J 14 TBD Call TI Call TI SN74S08J OBSOLETE CDIP J 14 TBD Call TI Call TI SN74S08N ACTIVE PDIP N 14 Pb-Free CU NIPDAU Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 25 Addendum-Page 2 N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S08N ACTIVE PDIP N 14 SN74S08N3 OBSOLETE PDIP N SN74S08N3 OBSOLETE PDIP N SN74S08NE4 ACTIVE PDIP N 14 SN74S08NE4 ACTIVE PDIP N SNJ54LS08FK ACTIVE LCCC SNJ54LS08FK ACTIVE LCCC SNJ54LS08J ACTIVE CDIP Lead/Ball Finish MSL Peak Temp (3) (RoHS) 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 14 TBD Call TI Call TI 14 TBD Call TI Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type FK 20 1 TBD POST-PLATE N / A for Pkg Type FK 20 1 TBD POST-PLATE N / A for Pkg Type J 14 1 TBD A42 N / A for Pkg Type SNJ54LS08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS08DBR SSOP SN74LS08DR SN74LS08NSR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 DB 14 2000 330.0 16.4 8.2 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS08DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS08DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS08NSR SO NS 14 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP(R) Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee(R) Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2010, Texas Instruments Incorporated