HSMS-281x Surface Mount RF Schottky Barrier Diodes Data Sheet Description/Applications Features These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS281x series of diodes features very low flicker (1/f ) noise. * Surface Mount Packages Note that Avago's manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. * Single, Dual and Quad Versions * Low Flicker Noise * Low FIT (Failure in Time) Rate* * Six-sigma Quality Level * Tape and Reel Options Available * Lead-free * For more information see the Surface Mount Schottky Reliability Data Sheet. Pin Connections and Package Marking GUx 1 2 3 6 Package Lead Code Identification, SOT-23/SOT-143 (Top View) SINGLE 3 SERIES 3 1 1 COMMON ANODE 3 5 4 Notes: 1. Package marking provides orientation and identification. 2. See "Electrical Specifications" for appropriate package marking. 2 #0 UNCONNECTED PAIR 3 4 1 1 RING QUAD 3 4 2 #5 2 #2 1 #7 #3 2 BRIDGE QUAD 3 4 2 1 #8 2 Package Lead Code Identification, SOT-323 Package Lead Code Identification, SOT-363 (Top View) (Top View) SINGLE B COMMON ANODE E COMMON CATHODE 3 SERIES C COMMON CATHODE HIGH ISOLATION UNCONNECTED PAIR 6 5 1 2 4 K 3 COMMON CATHODE QUAD 6 5 1 2 4 UNCONNECTED TRIO 6 5 1 2 4 L 3 COMMON ANODE QUAD 6 5 1 2 4 F 6 1 M 3 BRIDGE QUAD 5 4 6 2 3 1 N 3 RING QUAD 5 4 2 3 1 #4 2 Absolute Maximum Ratings[1] TC = 25C Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363 If Forward Current (1 s Pulse) Amp 1 1 PIV Peak Inverse Voltage V Same as VBR Same as VBR Tj Junction Temperature C 150 150 Tstg Storage Temperature C -65 to 150 -65 to 150 jc Thermal Resistance[2] C/W 500 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. Electrical Specifications TC = 25C, Single Diode[3] Minimum Maximum Part Package Breakdown Forward Number Marking Lead Voltage Voltage HSMS[4] Code Code Configuration VBR (V) VF (mV) Maximum Forward Voltage VF (V) @ IF (mA) Maximum Reverse Leakage Maximum IR (nA) @ Capacitance VR (V) CT (pF) 2810 B0 0 2812 B2 2 2813 B3 3 2814 B4 4 2815 B5 5 2817 B7 7 2818 B8 8 281B B0 B 281C B2 C 281E B3 E 281F B4 F 281K BK K 281L BL L 1.0 200 Single Series Common Anode Common Cathode Unconnected Pair Ring Quad[4] Bridge Quad[4] Single Series Common Anode Common Cathode High Isolation Unconnected Pair Unconnected Trio 20 410 35 15 Test Conditions IR = 10 mA IF = 1 mA Notes: 1. VF for diodes in pairs and quads in 15 mV maximum at 1 mA. 2. C TO for diodes in pairs and quads is 0.2 pF maximum. 3. Effective Carrier Lifetime () for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA. 4. See section titled "Quad Capacitance." 5. RD = RS + 5.2 at 25C and I f = 5 mA. Typical Dynamic Resistance RD ()[5] 1.2 15 VF = 0 V f = 1 MHz IF = 5 mA Quad Capacitance Linear Equivalent Circuit Model Diode Chip Capacitance of Schottky diode quads is measured using an HP4271 LCR meter. This instrument effectively isolates individual diode branches from the others, allowing ac curate capacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S. voltage at 1 MHz. Avago defines this measurement as "CM", and it is equiva lent to the capacitance of the diode by itself. The equiva lent diagonal and adjacent capaci-tances can then be cal culated by the formulas given below. In a quad, the diagonal capacitance is the capacitance be tween points A and B as shown in the figure below. The diagonal capacitance is calculated using the following formula C DIAGONAL C3 x C 4 C1 x C 2 = _______ + _______ C1 + C 2 C3 + C4 The equivalent adjacent C 13 x C 4 is the capacitance C 1 x C 2 capacitance C DIAGONAL _______ Cand ADJACENT 1 + ____________ between points==A_______ C in+the figure below. This capaci 1 following C13 + C 14 formula 1 + C 2the tance is calculatedCusing -- + -- + -- C 2 C 3 C4 1 C ADJACENT = C 1 + ____________ 1 1 8.33 X 101 -5 nT Rj= I b + -- I s + -- + -- C 2 C 3 C4 This information does not apply to cross-over quad di 8.33 X 10 -5 nT odes. Rj= I b+ Is Rj RS Cj RS = series resistance (see Table of SPICE parameters) C j = junction capacitance (see Table of SPICE parameters) Rj = 8.33 X 10-5 nT Ib + Is where Ib = externally applied bias current in amps Is = saturation current (see table of SPICE parameters) T = temperature, K n = ideality factor (see table of SPICE parameters) Note: To effectively model the packaged HSMS-281x product, please refer to Application Note AN1124. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. SPICE Parameters Parameter Units BV V 25 CJ0 pF 1.1 EG eV 0.69 IBV A E-5 IS A 4.8E-9 N HSMS-281x 1.08 RS 10 PB V 0.65 PT 2 M 0.5 Typical Performance, TC = 25C (unless otherwise noted), Single Diode 100,000 10,000 10 1 TA = +125C TA = +75C TA = +25C TA = -25C 0 1000 100 TA = +125C TA = +75C TA = +25C 10 1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 Figure 1. Forward Current vs. Forward Voltage at Temperatures. 30 IF - FORWARD CURRENT (mA) CT - CAPACITANCE (pF) 1 0.75 0.50 0.25 0 2 4 6 8 10 12 14 16 VR - REVERSE VOLTAGE (V) Figure 4. Total Capacitance vs. Reverse Voltage. IF (Left Scale) 10 VF (Right Scale) 1 0.3 0.2 1 0.4 0.6 0.8 1.0 1.2 VF - FORWARD VOLTAGE (V) Figure 5. Typical Vf Match, Pairs and Quads. 10 1 10 IF - FORWARD CURRENT (mA) 30 10 100 1 0.1 15 Figure 2. Reverse Current vs. Reverse Voltage at Temperatures. 1.25 10 VR - REVERSE VOLTAGE (V) VF - FORWARD VOLTAGE (V) 0 5 0.3 1.4 Figure 3. Dynamic Resistance vs. Forward Current. VF - FORWARD VOLTAGE DIFFERENCE (mV) 0.1 0.01 1000 RD - DYNAMIC RESISTANCE () IR - REVERSE CURRENT (nA) IF - FORWARD CURRENT (mA) 100 100 Applications Information Assembly Instructions Introduction -- Product Selection SOT-323 PCB Footprint Avago's family of Schottky products provides unique solu tions to many design problems. A recommended PCB pad layout for the miniature SOT323 (SC-70) package is shown in Figure 6 (dimensions are in inches). This layout provides ample allowance for pack age placement by automated assembly equipment with out adding parasitics that could impair the performance. The first step in choosing the right product is to select the diode type. All of the products in the HSMS282x fam ily use the same diode chip, and the same is true of the HSMS-281x and HSMS-280x families. Each family has a dif ferent set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1. A review of these data shows that the HSMS-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (Rs). In applications which do not require high voltage the HSMS-282x family, with a lower value of series resistance, will offer higher current carrying capacity and better performance. The HSMS-281x family is a hybrid Schottky (as is the HSMS-280x), offering lower 1/f or flicker noise than the HSMS-282x family. In general, the HSMS-282x family should be the designer's first choice, with the -280x family reserved for high volt age applications and the HSMS-281x family for low flicker noise applications. Table 1. Typical SPICE Parameters. Parameter Units HSMS-280x HSMS-281x HSMS-282x BV V 75 25 15 CJ0 pF 1.6 1.1 0.7 EG eV 0.69 0.69 0.69 IBV A 1 E-5 1 E-5 1 E-4 IS A 3 E-8 4.8 E-9 2.2 E-8 1.08 1.08 1.08 N RS 30 10 6.0 PB (VJ) V 0.65 0.65 0.65 PT (XTI) 2 2 2 M 0.5 0.5 0.5 0.026 0.079 0.039 0.022 Dimensions in inches Figure 6. Recommended PCB Pad Layout for Avago's SC70 3L/SOT323 Products. Assembly Instructions SOT-363 PCB Footprint A recommended PCB pad layout for the miniature SOT363 (SC-70, 6 lead) package is shown in Figure 7 (dimen sions are in inches). This layout provides ample allowance for package placement by automated assembly equip ment without adding parasitics that could impair the per formance. 0.026 0.079 0.039 0.018 Dimensions in inches Figure 7. Recommended PCB Pad Layout for Avago's SC70 6L/SOT363 Products. SMT Assembly Reliable assembly of surface mount components is a com plex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass. Avago's SOT diodes have been qualified to the time-tem perature profile shown in Figure 8. This profile is repre sentative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to pro duce a reflow of the solder. The rates of change of temperature for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to compo nents due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 260C. These parameters are typical for a surface mount assem bly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. tp Tp Critical Zone T L to Tp Ramp-up Temperature TL Ts Ts tL max min Ramp-down ts Preheat 25 t 25 C to Peak Time Figure 8. Surface Mount Assembly Profile. Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C) Reflow Parameter Lead-Free Assembly Average ramp-up rate (Liquidus Temperature (TS(max) to Peak) 3C/ second max Preheat Temperature Min (TS(min)) 150C Temperature Max (TS(max)) 200C Time (min to max) (tS) 60-180 seconds Ts(max) to TL Ramp-up Rate Time maintained above: 3C/second max Temperature (TL) 217C Time (tL) 60-150 seconds Peak Temperature (TP) 260 +0/-5C Time within 5 C of actual Peak temperature (tP) 20-40 seconds Ramp-down Rate 6C/second max Time 25 C to Peak Temperature 8 minutes max Note 1: All temperatures refer to topside of the package, measured on the package body surface Part Number Ordering Information Part Number No. of Devices Container HSMS-281x-TR2G 10000 13" Reel HSMS-281x-TR1G 3000 7" Reel HSMS-281x-BLKG 100 antistatic bag x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L Package Dimensions Outline 23 (SOT-23) Outline SOT-323 (SC-70 3 Lead) e1 e2 e1 XXX E XXX E E1 e e DIMENSIONS (mm) C DIMENSIONS (mm) D A C D B Notes: XXX-package marking Drawings are not to scale L B L A1 E1 SYMBOL A A1 B C D E1 e e1 e2 E L MIN. 0.79 0.000 0.30 0.08 2.73 1.15 0.89 1.78 0.45 2.10 0.45 MAX. 1.20 0.100 0.54 0.20 3.13 1.50 1.02 2.04 0.60 2.70 0.69 A A1 Notes: XXX-package marking Drawings are not to scale SYMBOL A A1 B C D E1 e e1 E L MIN. MAX. 0.80 1.00 0.00 0.10 0.15 0.40 0.08 0.25 1.80 2.25 1.10 1.40 0.65 typical 1.30 typical 1.80 2.40 0.26 0.46 Outline 143 (SOT-143) Outline SOT-363 (SC-70 6 Lead) e2 e1 HE B1 XXX E E E1 L e c D DIMENSIONS (mm) L B e C A1 A2 DIMENSIONS (mm) D A A1 Notes: XXX-package marking Drawings are not to scale SYMBOL A A1 B B1 C D E1 e e1 e2 E L MIN. 0.79 0.013 0.36 0.76 0.086 2.80 1.20 0.89 1.78 0.45 2.10 0.45 Device Orientation MAX. 1.097 0.10 0.54 0.92 0.152 3.06 1.40 1.02 2.04 0.60 2.65 0.69 A b SYMBOL E D HE A A2 A1 e b c L MIN. MAX. 1.15 1.35 1.80 2.25 1.80 2.40 0.80 1.10 0.80 1.00 0.00 0.10 0.650 BCS 0.15 0.30 0.08 0.25 0.10 0.46 For Outlines SOT-23, -323 REEL TOP VIEW END VIEW 4 mm 8 mm CARRIER TAPE USER FEED DIRECTION ABC For Outline SOT-143 ABC For Outline SOT-363 END VIEW TOP VIEW TOP VIEW 4 mm END VIEW 4 mm ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. ABC Note: "AB" represents package marking code. "C" represents date code. COVER TAPE 8 mm ABC 8 mm ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. Tape Dimensions and Product Orientation For Outline SOT-23 P P2 D E P0 F W D1 t1 Ko 9 MAX 13.5 MAX 8 MAX B0 A0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.15 0.10 2.77 0.10 1.22 0.10 4.00 0.10 1.00 + 0.05 0.124 0.004 0.109 0.004 0.048 0.004 0.157 0.004 0.039 0.002 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 0.10 1.75 0.10 0.059 + 0.004 0.157 0.004 0.069 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 + 0.30 - 0.10 0.229 0.013 0.315 +0.012 - 0.004 0.009 0.0005 DISTANCE BETWEEN CENTERLINE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 0.05 0.138 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 0.05 0.079 0.002 For Outline SOT-143 P D P2 P0 E F W D1 t1 9 M A X 9 MAX K0 A0 B0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.19 0.10 2.80 0.10 1.31 0.10 4.00 0.10 1.00 + 0.25 0.126 0.004 0.110 0.004 0.052 0.004 0.157 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 0.10 1.75 0.10 0.059 + 0.004 0.157 0.004 0.069 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 - 0.10 0.254 0.013 0.315+0.012 - 0.004 0.0100 0.0005 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 0.05 0.138 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 0.05 0.079 0.002 Tape Dimensions and Product Orientation For Outlines SOT-323, -363 P P2 D P0 E F W C D1 t 1 (CARRIER TAPE THICKNESS) K0 An A0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 0.30 0.254 0.02 0.315 0.012 0.0100 0.0008 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 0.05 0.138 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 0.05 0.079 0.002 FOR SOT-323 (SC70-3 LEAD) An FOR SOT-363 (SC70-6 LEAD) An B0 CAVITY ANGLE Tt (COVER TAPE THICKNESS) 8 C MAX 10 C MAX For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4021EN AV02-1367EN - May 29, 2009