AP01N40J RoHS-compliant Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET Lower Gate Charge D 100% Avalanche Rated Fast Switching Performance BVDSS 400V RDS(ON) 16 ID 0.5A G Simple Drive Requirement S Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low onresistance and cost-effectiveness. G D TO-251(J) S The TO-251 package is widely preferred for commercial-industrial through-hole applications. Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage 400 V VGS Gate-Source Voltage 20 V ID@TC=25 Continuous Drain Current, V GS @ 10V 0.5 A ID@TC=100 Continuous Drain Current, V GS @ 10V 0.4 A 2 A 17.4 W 0.14 W/ 0.5 mJ 1 IDM Pulsed Drain Current PD@TC=25 Total Power Dissipation Linear Derating Factor 2 EAS Single Pulse Avalanche Energy TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Parameter Value Units Rthj-c Maximum Thermal Resistance, Junction-case 7.2 /W Rthj-a Maximum Thermal Resistance, Junction-ambient 110 /W Data & specifications subject to change without notice 201018072-1/4 AP01N40J o Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol BVDSS Parameter Test Conditions Min. Typ. VGS=0V, ID=1mA 400 - - V VGS=10V, ID=0.5A - - 16 VDS=VGS, ID=250uA 1 - 3 V VDS=10V, ID=0.5A - 0.5 - S VDS=400V, VGS=0V - - 10 uA Drain-Source Leakage Current (Tj=150 C) VDS=320V, VGS=0V - - 100 uA Gate-Source Leakage VGS=20V - - 100 nA ID=1A - 2.9 4.6 nC Drain-Source Breakdown Voltage RDS(ON) Static Drain-Source On-Resistance VGS(th) Gate Threshold Voltage gfs Forward Transconductance o IDSS Drain-Source Leakage Current (Tj=25 C) o IGSS 3 3 Max. Units Qg Total Gate Charge Qgs Gate-Source Charge VDS=320V - 0.6 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 0.6 - nC 3 td(on) Turn-on Delay Time VDD=200V - 7.7 - ns tr Rise Time ID=1A - 12 - ns td(off) Turn-off Delay Time RG=3.3,VGS=10V - 23 - ns tf Fall Time RD=200 - 73 - ns Ciss Input Capacitance VGS=0V - 76 125 pF Coss Output Capacitance VDS=25V - 11 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 4 - pF Min. Typ. IS=2A, VGS=0V - - 1.5 V Source-Drain Diode Symbol Parameter 3 Test Conditions Max. Units VSD Forward On Voltage trr Reverse Recovery Time IS=1A, VGS=0V - 260 - ns Qrr Reverse Recovery Charge dI/dt=100A/s - 460 - nC Notes: 1.Pulse width limited by Max. junction temperature. o 2.Starting Tj=25 C , VDD=50V , L=1mH , RG=25 3.Pulse test THIS PRODUCT IS AN ELECTROSTATIC SENSITIVE, PLEASE HANDLE WITH CAUTION. THIS PRODUCT HAS BEEN QUALIFIED FOR CONSUMER MARKET. APPLICATIONS OR USES AS CRITERIAL COMPONENT IN LIFE SUPPORT DEVICE OR SYSTEM ARE NOT AUTHORIZED. 2/4 AP01N40J 0.6 1.2 0.8 V G = 6.0 V o ID , Drain Current (A) T C =25 C 0.6 0.4 0.4 V G = 6.0 V 0.3 0.2 0.1 0.2 0 0 0 4 8 12 16 20 0 24 4 8 12 16 20 24 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 3 1.2 I D =0.5A V G =10V Normalized RDS(ON) 1.1 Normalized BVDSS (V) 10V 9.0V 8.0V 7.0V T C =150 o C 0.5 ID , Drain Current (A) 1 10V 9.0V 8.0V 7.0V 1 2 1 0.9 0 0.8 -50 0 50 100 -50 150 0 50 100 150 T j , Junction Temperature ( o C ) o T j , Junction Temperature ( C) Fig 3. Normalized BVDSS v.s. Junction Fig 4. Normalized On-Resistance Temperature v.s. Junction Temperature 2.4 10 T j = 150 o C VGS(th) (V) IS (A) 2 T j = 25 o C 1 1.6 1.2 0.8 0.1 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 T j , Junction Temperature ( o C ) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3/4 AP01N40J I D =1A V DS =320V C iss 12 C (pF) VGS , Gate to Source Voltage (V) f=1.0MHz 100 16 8 C oss 10 C rss 4 1 0 0 1 2 3 1 4 5 Q G , Total Gate Charge (nC) 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 10 ID (A) 1 100us 1ms 0.1 T c =25 o C Single Pulse 10ms 100ms DC 0.01 Normalized Thermal Response (Rthjc) 1 Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 1 10 100 1000 0.00001 0.0001 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.001 0.01 0.1 1 10 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4/4