MT9M034 MT9M034 1/3-Inch CMOS Digital Image Sensor Table 1. KEY PARAMETERS Parameter www.onsemi.com Value Optical Format 1/3-inch (6 mm) Active Pixels 1280 x 960 = 1.2 Mp Pixel Size 3.75 m Color Filter Array RGB Bayer or Monochrome Shutter Type Electronic Rolling Shutter Input Clock Range 6-50 MHz Output Clock Maximum 74.25 MHz Output Parallel 12-bit Frame Rate Full Resolution 45 fps 720p 60 fps Responsivity 5.48 V/lux-sec SNRMAX 43.9 dB Maximum Dynamic Range >115 dB Supply Voltage I/O 1.8 V* or 2.8 V Digital 1.8 V Analog 2.8 V ILCC48 10x10 CASE 847AD ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Applications * Video Surveillance * 720p60 Video Applications * High Dynamic Range Imaging Power Consumption 270 mW (1280 x 720 60 fps Parallel Output Linear Mode) 460 mW (1280 x 720 60 fps Parallel Output HDR Mode) Operating Temperature (ambient) -TA -30C to + 70C (Surveillance) Package Options 10x10 mm 48-pin iLCC Bare Die *1.8 V VDD_IO is recommended due to better row noise performance Features * * * * * * * * * Superior Low-light performance HD Video (720p60) Linear or High Dynamic Range Capture Video/Single Frame Modes On-chip AE and Statistics Engine Parallel and Serial Output Auto Black Level Calibration Context Switching Temperature Sensor (c) Semiconductor Components Industries, LLC, 2010 May, 2017 - Rev. 9 1 Publication Order Number: MT9M034/D MT9M034 ORDERING INFORMATION Table 2. AVAILABLE PART NUMBERS Part Number Product Description Orderable Product Attribute Description MT9M034I12STC-DPBR1 1.2 MP 1/3" CIS Dry Pack with Protective Film, Double Side BBAR Glass MT9M034I12STC-DRBR1 1.2 MP 1/3" CIS Dry Pack without Protective Film, Double Side BBAR Glass MT9M034I12STM-DPBR1 1.2 MP 1/3" CIS Dry Pack with Protective Film, Double Side BBAR Glass MT9M034I12STM-DRBR 1.2 MP 1/3" CIS Dry Pack without Protective Film, Double Side BBAR Glass GENERAL DESCRIPTION The ON Semiconductor MT9M034 is a 1/3-inch CMOS digital image sensor with an active-pixel array of 1280 (H) x 960 (V). It captures images in either linear or high dynamic range modes, with a rolling-shutter readout. It includes sophisticated camera functions such as auto exposure control, windowing, and both video and single frame modes. It is designed for both low light and high dynamic range scene performance. It is programmable through a simple two-wire serial interface. The MT9M034 produces extraordinarily clear, sharp digital pictures, and its ability to capture both continuous video and single frames makes it the perfect choice for a wide range of applications, including surveillance and HD video. The ON Semiconductor MT9M034 can be operated in its default mode or programmed for frame size, exposure, gain, and other parameters. The default mode output is a 960p-resolution image at 45 frames per second (fps). In linear mode, it outputs 12-bit raw data. In high dynamic range mode, it outputs 12-bit compressed data using parallel output. The device may be operated in video (master) mode or in single frame trigger mode. FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a synchronized pixel clock in parallel mode. The MT9M034 includes additional features to allow application-specific tuning: windowing and offset, adjustable auto-exposure control, auto black level correction, and on-board temperature sensor. Optional register information and histogram statistic information can be embedded in first and last 2 lines of the image frame. The sensor is designed to operate in a wide temperature range (-30C to +70C). FUNCTIONAL OVERVIEW The MT9M034 is a progressive-scan sensor that generates a stream of pixel data at a constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally enabled to generate all internal clocks from a single master input clock running between 6 and 50 MHz The maximum output pixel rate is 74.25 Mp/s, corresponding to a clock rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor. OTPM Memory Active Pixel Sensor PLL External Clock (APS) Array Power Timing and Control (Sequencer) Auto Exposure and Stats Engine Pixel Data Path (Signal Processing) Analog Processing and A/D Conversion Trigger Two-Wire Serial Interface Control Registers Figure 1. Block Diagram www.onsemi.com 2 Parallel Output MT9M034 analog-to-digital converter (ADC). The output from the ADC is a 12-bit value for each pixel in the array. The ADC output passes through a digital processing signal chain (which provides further data path corrections and applies digital gain). The sensor also offers a high dynamic range mode of operation where multiple images are combined on-chip to produce a single image at 20-bit per pixel value. A compressing mode is further offered to allow this 20-bit pixel value to be transmitted to the host system as a 12-bit value with close to zero loss in image quality. The pixel data are output at a rate of up to 74.25 Mp/s, in parallel to frame and line synchronization signals. User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the sensor is a 1.2 Mp Active- Pixel Sensor array. The timing and control circuitry sequences through the rows of the array, resetting and then reading each row in turn. In the time interval between resetting a row and reading that row, the pixels in the row integrate incident light. The exposure is controlled by varying the time interval between reset and readout. Once a row has been read, the data from the columns is sequenced through an analog signal chain (providing offset correction and gain), and then through an Master clock (6-50 MHz) PLL Analog Analog Power1 Power1 Power1 VDD_PLL VAA VAA_PIX VDD_IO VDD 1.5k2,3 1.5k2 Digital Digital I/0 Core Power1 Power1 DOUT [11:0] EXTCLK PIXCLK LINE_VALID FRAME_VALID SADDR SDATA SCLK TRIGGER OE_BAR STANDBY RESET_BAR From Controller To Controller TEST DGND VDD_IO VDD VDD_PLL VAA VAA_PIX Digital ground Notes: AGND Analog ground 1. 2. 3. 4. All power supplies should be adequately decoupled. ON Semiconductor recommends a resistor value of 1.5 k, but a greater value may be used for slower two-wire speed. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used. ON Semiconductor recommends that 0.1 F and 10 F decoupling capacitors for each power supply are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Check the demo headboard schematics for circuit recommendations. 5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized. 6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents. 7. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used. Figure 2. Typical Configuration: Parallel Pixel Data Interface www.onsemi.com 3 5 4 3 2 1 48 47 46 45 44 EXTCLK VDD_PLL DOUT6 DOUT5 DOUT4 DOUT3 DOUT2 DOUT1 DOUT0 DGND 43 NC 6 DGND MT9M034 10 DOUT10 AGND 39 11 DOUT11 VAA_PIX 38 12 VDD_IO VAA_PIX 37 13 PIXCLK VAA 36 14 VDD AGND 35 15 SCLK VAA 34 16 SDATA Reserved 33 17 RESET_BAR Reserved 32 18 VDD_IO Reserved 31 DGND 40 LINE_VALID VAA FRAME_VALID DOUT9 TRIGGER 9 FLASH 41 TEST NC SADDR DOUT8 OE_BAR 8 STANDBY 42 NC NC NC DOUT7 VDD 7 19 20 21 22 23 24 25 26 27 28 29 30 Figure 3. 48 iLCC Package, Parallel Output www.onsemi.com 4 MT9M034 Table 3. PIN DESCRIPTION Pin Number Name Type 1 DOUT4 Output Parallel pixel data output Description 2 DOUT5 Output Parallel pixel data output 3 DOUT6 Output Parallel pixel data output 4 VDD_PLL Power PLL power 5 EXTCLK Input 6 DGND Power External input clock Digital ground 7 DOUT7 Output Parallel pixel data output 8 DOUT8 Output Parallel pixel data output 9 DOUT9 Output Parallel pixel data output 10 DOUT10 Output Parallel pixel data output 11 DOUT11 Output Parallel pixel data output (MSB) 12 VDD_IO Power I/O supply power 13 PIXCLK Output Pixel clock out. DOUT is valid on rising edge of this clock 14 VDD Power Digital power 15 SCLK Input 16 SDATA I/O 17 RESET_BAR Input 18 VDD_IO Power I/O supply power 19 VDD Power Digital power 20 NC 21 NC 22 STANDBY Input Standby-mode enable pin (active HIGH) 23 OE_BAR Input Output enable (active LOW) 24 SADDR Input Two-Wire Serial address select 25 TEST Input Manufacturing test enable pin (connect to DGND) 26 FLASH Output 27 TRIGGER Input 28 FRAME_VALID Output Asserted when DOUT frame data is valid 29 LINE_VALID Output Asserted when DOUT line data is valid 30 DGND Power Digital ground 31 Reserved NC 32 Reserved NC 33 Reserved NC 34 VAA Power Analog power 35 AGND Power Analog ground 36 VAA Power Analog power 37 VAA_PIX Power Pixel power 38 VAA_PIX Power Pixel power 39 AGND Power Analog ground Two-Wire Serial clock input Two-Wire Serial data I/O Asynchronous reset (active LOW). All settings are restored to factory default Flash output control Exposure synchronization input www.onsemi.com 5 MT9M034 Table 3. PIN DESCRIPTION (continued) Pin Number Name Type Description 40 VAA Power Analog power 41 NC 42 NC 43 NC 44 DGND Power Digital ground 45 DOUT0 Output Parallel pixel data output (LSB) 46 DOUT1 Output Parallel pixel data output 47 DOUT2 Output Parallel pixel data output 48 DOUT3 Output Parallel pixel data output www.onsemi.com 6 MT9M034 PIXEL DATA FORMAT Pixel Array Structure active rows are included for use when horizontal or vertical mirrored readout is enabled, to allow readout to start on the same pixel. The pixel adjustment is always performed for monochrome or color versions. The active area is surrounded with optically transparent dummy pixels to improve image uniformity within the active area. Not all dummy pixels or barrier pixels can be read out. The MT9M034 pixel array is configured as 1412 columns by 1028 rows, (see Figure 4). The dark pixels are optically black and are used internally to monitor black level. Of the right 100 columns, 64 are dark pixels used for row noise correction. Of the top 24 rows of pixels, 12 of the dark rows are used for black level correction. There are 1296 columns by 976 rows of optically active pixels. While the sensor's format is 1280 x 960, the additional active columns and 1412 2 light dummy + 4 barrier + 24 dark + 4 barrier + 6 dark dummy 1028 1296 x 976 (1288 x 968 active) 4.86 x 3.66 mm2 (4.83 x 3.63 mm2) 2 light dummy + 4 barrier + 100 dark + 4 barrier 2 light dummy + 4 barrier 2 light dummy + 4 barrier + 6 dark dummy Dark pixel Light dummy Barrier pixel pixel Figure 4. Pixel Array Description www.onsemi.com 7 Active pixel MT9M034 Column Readout Direction Row Readout Direction Active Pixel (0, 0) Physical Pixel (122, 44) R G R G R G R G G B G B G B G B R G R G R G R G G B G B G B G B R G R G R G R G G B G B G B G B Figure 5. Pixel Color Pattern Detail (Top Right Corner) Default Readout Order When the sensor is imaging, the active surface of the sensor faces the scene as shown in Figure 6. When the image is read out of the sensor, it is read one row at a time, with the rows and columns sequenced as shown in Figure 6. By convention, the sensor core pixel array is shown with pixel (0,0) in the top right corner (see Figure 5). This reflects the actual layout of the array on the die. Also, the first pixel data read out of the sensor in default condition is that of pixel (112, 44). Lens Scene Sensor (rear view) Row Readout Order Column Readout Order Pixel (0,0) Figure 6. Imaging a Scene Digital Gain Control gain control of the MT9M034 is dependent on the configuration of the x_addr_start register. Table 4 illustrates how the digital gains are applied when x_addr_start is even or odd number. MT9M034 supports four digital gains for the color channels: Red, Green1 (green pixels on the red rows), Green2 (green pixels on the blue rows), and Blue. Digital Table 4. DIGITAL GAIN CONTROL FOR ODD AND EVEN X_ADDR_START (R0X3004) Pixels x_addr_start Gain Register Red Even red_gain R0x305A Odd green1_gain R0x3056 Green1 (on Red rows) Even green1_gain R0x3056 Odd red_gain R0x305A Even green2_gain R0x305C Odd blue_gain R0x3058 Even blue_gain R0x3058 Odd green2_gain R0x305C Green2 (on Blue rows) Blue www.onsemi.com 8 MT9M034 OUTPUT DATA FORMAT The MT9M034 image data is read out in a progressive scan. Valid image data is surrounded by horizontal and vertical blanking (see Figure 7). The amount of horizontal row time (in clocks) is programmable through R0x300C. The amount of vertical frame time (in rows) is programmable through R0x300A. Line_Valid (LV) is HIGH during the shaded region of Figure 7. Optional Embedded Register setup information and Histogram statistic information are available in first 2 and last row of image data. P 0,0 P 0,1 P 0,2 .....................................P 0,n-1 P0,n P 1,0 P 1,1 P 1,2 .....................................P 1,n-1 P1,n 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 HORIZONTAL VALID IMAGE BLANKING Pm-1,0 Pm-1,1 .....................................Pm-1,n-1 Pm-1,n Pm,0 Pm,1 .....................................P P m,n-1 m,n 00 00 00 ..................................... 00 00 00 00 00 00 ..................................... 00 00 00 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 VERTICAL/HORIZONTAL VERTICAL BLANKING BLANKING 00 00 00 ..................................... 00 00 00 00 00 00 ..................................... 00 00 00 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 Figure 7. Spatial Illustration of Image Readout Readout Sequence dark regions of the array, but if this is done, consideration must be given to how the sensor reads the dark regions for its own purposes. Typically, the readout window is set to a region including only active pixels. The user has the option of reading out www.onsemi.com 9 MT9M034 Parallel Output Data Timing data. For each PIXCLK cycle, with respect to the falling edge, one 12-bit pixel datum outputs on the DOUT pins. When both FV and LV are asserted, the pixel is valid. PIXCLK cycles that occur when FV is de-asserted are called vertical blanking. PIXCLK cycles that occur when only LV is de-asserted are called horizontal blanking. The output images are divided into frames, which are further divided into lines. By default, the sensor produces 968 rows of 1284 columns each. The FV and LV signals indicate the boundaries between frames and lines, respectively. PIXCLK can be used as a clock to latch the PIXCLK FV EEEEEEEEEEEEEEEEEEEEEEEEEEEEE EEEEEEEEEEEEEEEEEEEEEEEEEEEEE LV D OUT [11:0] P0 Vertical Blanking Horiz Blanking P1 P2 P3 P4 Valid Image Data Pn Horiz Blanking Vertical Blanking Figure 8. Default Pixel Output Timing LV and FV of FV by 6 PIXCLKs. Normally, LV will only be asserted if FV is asserted; this is configurable as described below. The timing of the FV and LV outputs is closely related to the row time and the frame time. FV will be asserted for an integral number of row times, which will normally be equal to the height of the output image. LV will be asserted during the valid pixels of each row. The leading edge of LV will be offset from the leading edge LV Format Options The default situation is for LV to be de-asserted when FV is de-asserted. By configuring R0x306E[1:0], the LV signal can take two different output formats. The formats for reading out four lines and two vertical blanking lines are shown in Figure 9. FV Default LV FV Continuous LV LV FV XOR LV LV Figure 9. LV Format Options The timing of an entire frame is shown in Figure 10: "Line Timing and FRAME_VALID/LINE_VALID Signals". www.onsemi.com 10 MT9M034 (tROW) is the period from the first pixel output in a row to the first pixel output in the next row. The row time and frame time are defined by equations in Table 5. Frame Time The pixel clock (PIXCLK) represents the time needed to sample 1 pixel from the array. The sensor outputs data at the maximum rate of 1 pixel per PIXCLK. One row time ... FRAME_VALID ... LINE_VALID ... Number of master clocks P1 A Q A Q A P2 Figure 10. Line Timing and FRAME_VALID/LINE_VALID Signals Table 5. FRAME TIME (EXAMPLE BASED ON 1280 X 960, 45 FRAMES PER SECOND) Parameters Name Equation Default Timing at 74.25 MHz A Active Data Time Context A: R0x3008 - R0x3004 + 1 Context B: R0x308E - R0x308A + 1 1280 pixel clocks = 17.23 s P1 Frame Start Blanking 6 (fixed) 6 pixel clocks = 0.08 s P2 Frame End Blanking 6 (fixed) 6 pixel clocks = 0.08 s Q Horizontal Blanking R0x300C - A 370 pixel clocks = 4.98 s A + Q (tROW) Line (Row) Time R0x300C 1650 pixel clocks = 22.22 s V Vertical Blanking Context A: (R0x300A-(R0x3006-R0x3002+1)) x (A + Q) Context B: ((R0x30AA-(R0x3090-R0x308C+1)) x (A + Q) 49,500 pixel clocks = 666.66 s Nrows x (A + Q) Frame Valid Time Context A: ((R0x3006-R0x3002+1) x (A+Q))-Q+P1+P2 Context B: ((R0x3090-R0x308C+1) x (A+Q))-Q+P1+P2 1,584,000 pixel clocks = 21.33 ms F Total Frame Time V + (Nrows x (A + Q)) 1,633,500 pixel clocks = 22.22 ms control is programmed with 2000 rows and the fine shutter width total is zero. For Master mode, if the integration time registers exceed the total readout time, then the vertical blanking time is internally extended automatically to adjust for the additional integration time required. This extended value is not written back to the frame_length_lines register. The frame_length_lines register can be used to adjust frame-to-frame readout time. This register does not affect the exposure time but it may extend the readout time. Sensor timing is shown in terms of pixel clock cycles (see Figure 7). The recommended pixel clock frequency is 74.25 MHz. The vertical blanking and the total frame time equations assume that the integration time (coarse integration time plus fine integration time) is less than the number of active lines plus the blanking lines: Window Height ) Vertical Blanking (eq. 1) If this is not the case, the number of integration lines must be used instead to determine the frame time, (see Table 6). In this example, it is assumed that the coarse integration time www.onsemi.com 11 MT9M034 Table 6. FRAME TIME: LONG INTEGRATION TIME Parameters Name Equation (Number of Pixel Clock Cycles) F' Total Frame Time (Long Integration Time) Context A: (R0x3012 x (A + Q)) + R0x3014 + P1 + P2 Context B: (R0x3016 x (A + Q)) + V R0x3018 + P1 + P2 Default Timing at 74.25 MHz 3,300,012 pixel clocks = 44.44 ms 1. The MT9M034 uses column parallel analog-digital converters; thus short line timing is not possible. The minimum total line time is 1650 columns (horizontal width + horizontal blanking) for HDR mode and 1400 for linear mode. The minimum horizontal blanking is 370. Exposure Total integration time is the result of Coarse_Integration_Time and Fine_Integration_Time registers, and depends also on whether manual or automatic exposure is selected. The actual total integration time, tINT is defined as: t INT + t INTCoarse * 410 * t INTFine - - (eq. 2) Context A: the number of pixels of integration equals the value in R0x3014 Context B: the number of pixels of integration equals the value in R0x3018. Maximum value for tINTFine is line length pixel clocks - 611 Typically, the value of the Coarse_Integration_Time register is limited to the number of lines per frame (which includes vertical blanking lines), such that the frame rate is not affected by the integration time. For more information on coarse and fine integration time settings limits, please refer to the Register Reference document. NOTE: In HDR mode, there are specific limitations on coarse_integration_time due to the number of line buffers available. Please refer to the section called "HDR Specific Exposure Settings". = (number of lines of integration x line time) - (410 pixel clocks of conversion time overhead) - (number of pixels of integration x pixel time) where: Number of Lines of Integration (Auto Exposure Control: Enabled) When automatic exposure control (AEC) is enabled, the number of lines of integration may vary from frame to frame, with the limits controlled by R0x311E (minimum auto exposure time) and R0x311C (maximum auto exposure time) Number of Lines of Integration (Auto Exposure Control: Disabled) If AEC is disabled, the number of lines of integration equals the value in R0x3012 (context A) or R0x3016 (context B) Number of Pixels of Integration The number of fine shutter width pixels is independent of AEC mode (enabled or disabled): For best image quality, it is recommended that the integration time be set to two rows or greater for the shortest exposure, particularly for monochrome sensors. For linear mode, this would be the coarse integration time (R0x3012). For HDR mode, the integration time should be set such that the T3 exposure is 2 rows or greater. Setting the exposure time to 1 row may result in non-uniformity between rows. www.onsemi.com 12 MT9M034 HIGH DYNAMIC RANGE MODE By default, the sensor powers up in Linear Mode, however, the MT9M034 can be configured to run in HDR mode. The HDR scheme used is multi-exposure HDR. This allows the sensor to handle 120 dB of dynamic range. The sensor also features a linear mode. In HDR mode, the sensor sequentially captures three exposures by maintaining 3 separate read and reset pointers that are interleaved within the rolling shutter readout. The intermediate pixel values are stored in line buffers while waiting for the 3 exposures values to be present. As soon as a pixel's 3 exposure values are available, they are combined to create a linearized 20-bit value for each pixel's response. This 20-bit value is then optionally compressed back to a 12- or 14-bit value for output. For 14-bit mode, the compressing is lossless. In 12-bit mode, there is minimal data loss. Figure 11 shows the HDR data compression: Digital output code Decompressed linear output ADC max code K2 = knee point 2 K1 = knee point 1 Piece-wise Compressed Signal Output From Sensor Pout = P Signal Response to Light Intensity Figure 11. HDR Data Compression knee-points (Figure 11). Aligning the capture knee-points on top of the compression knee-points, can avoid code losses (SNR loss) in the compression. Table 7 and Table 8 below show the knee points for the different modes. Alternatively, the sensor automatically reports the knee points and can be read directly from registers R0x319A and R0x319C. The HDR mode is selected when Operation_Mode_Ctrl, R0x3082[1:0] = 0. Further controls on exposure time limits and compressing are controlled by R0x3082[5:2], and R0x31D0. More details can be found in the MT9M034 Register Reference. In HDR mode, when compression is used, there are two types of knee-points: (i) T1/T2 and T2/T3 capture knee-points and (ii) POUT and POUT2 compression www.onsemi.com 13 MT9M034 Table 7. KNEE POINTS FOR COMPRESSION TO 14 BITS T1/T2 Exposure Ratio (R1) R0x3082[3:2] P1 4x 212 8x 16x 212 212 POUT1 = P1 P2 POUT2 = (P2 - P1) / R1 + POUT1 4096 214 7168 4096 4096 215 T2/T3 Exposure Ratio (R2) R0x3082[5:4] PMAX POUTMAX = (PMAX - P2) / (R1 R2) + POUT2 4x 216 10240 8x 217 10752 16x 218 11008 4x 217 10752 8x 218 11264 16x 219 11520 4x 218 11008 8x 219 11520 16x 220 11776 T2/T3 Exposure Ratio (R2) R0x3082[5:4] PMAX POUTMAX = (PMAX - P2) / (R1 R2) + POUT2 8x 217 3840 16x 218 3904 4x 217 3776 8x 218 3904 16x 219 3968 4x 218 3808 8x 219 3936 16x 220 4000 7680 216 7936 Table 8. KNEE POINTS FOR COMPRESSION TO 12 BITS T1/T2 Exposure Ratio (R1) R0x3082[3:2] P1 POUT1 = P1 P2 POUT2 = (P2 - P1) / R1 + POUT1 4x 211 2048 214 2944 8x 16x 211 211 2048 2048 215 3008 216 3040 HDR Specific Exposure Settings follow the programmed ratio. For example if the T1 / T2 ratio was programmed to 16x but coarse integration was increased beyond 672 than one would still use the 16x relinearization formulas. An additional limitation is the maximum number of exposure lines in relation to the frame_length_lines register. In Linear mode, maximum coarse_integration_time = frame_length_lines - 1. However in HDR mode, since the coarse integration time register controls T1, the max coarse_integration time is frame_length_lines - 45. Putting the two criteria listed above together, it can be summarized as follows: In HDR mode, pixel values are stored in line buffers while waiting for all 3 exposures to be available for final pixel data combination. There are 42 line buffers used to store intermediate T1 data. Due to this limitation, the maximum coarse integration time possible is equal to 42 x T1 / T2 lines. For example, if R0x3082[3:2] = 2, the sensor is set to have T1/T2 ratio = 16x. Therefore the maximum number of integration lines is 42 x 16 = 672 lines. If coarse integration time is greater than this, the T2 integration time will stay at 42. The sensor will calculate the ratio internally,enabling the linearization to be performed. If companding is being than relinearization would still maximum coarse_integration_time + minimum(42 In HDR mode, subline integration is not utilized. As such, fine integration time register changes will have no effect on the image. T1T2, frame_length_lines * 45) (eq. 3) There is also a limitation of the minimum number of exposure lines that can be used. This is summarized in the following formula: minimumcoarse_integration_time + (0.5) www.onsemi.com 14 (T1T2) (T2T3) (eq. 4) MT9M034 Due to limitation on the internal floating point calculation, the exact ratio specified by the RATIO_T2_T3 (R0x3082[5:4]) may not be achievable. When using companded output in combination with certain exposure ratios (other than T1 / T2 = 16x and T2 / T3 = 16x), digital gain needs to be set to a fixed value. Table below provides the proper digital gain settings for each T1 / T2 and T2 / T3 ratio. Table 9. DIGITAL GAIN SETTING FOR EACH T1 / T2 AND T2 / T3 RATIO T1 / T2 Ratio T2 / T3 Ratio Setting for Digital Gain Register (0x305E Context A or 0x30C4 Context B) 4 4 0x02h 4 8 0x04h 4 16 0x08h 8 4 0x04h 8 8 0x08h 8 16 0x10h 16 4 0x08h 16 8 0x10h 16 16 Any Legal Value Motion Compensation R0x318C[14] = 1. Additional parameters are available to control the extent of motion detection and correction as per the requirements of the specific application. These can be set in R0x318C-R0x3190. The other is using the DLO method of HDR combination. When using DLO, R0x318C[14] is ignored. DLO is enabled by setting R0x3190[13] = 1. Noise filtering is enabled by setting R0x3190[14] = 1. For more information, please refer to the MT9M034 Register Reference document. In typical multi-exposure HDR systems, motion artifacts can be created when objects move during the T1, T2 or T3 integration time. When this happens, edge artifacts can potentially be visible and might look like a ghosting effect. To correct this feature, the MT9M034 has special 2D motion compensation circuitry that detects motion artifacts and corrects the image accordingly. There are two motion compensation options available. One using the default HDR motion compensation by setting www.onsemi.com 15 MT9M034 REAL-TIME CONTEXT SWITCHING In the MT9M034, the user may switch between two full register sets (listed in Table 10) by writing to a context switch change bit in R0x30B0[13]. This context switch will change all registers (no shadowing) at the frame start time and have the new values apply to the immediate next exposure and readout time. Table 10. REAL-TIME CONTEXT-SWITCH REGISTERS Register Number Context A Context B Y_Addr_Start R0x3002 R0x308C X_Addr_Start R0x3004 R0x308A Y_Addr_End R0x3006 R0x3090 X_Addr_End R0x3008 R0x308E Coarse_Integration_Time R0x3012 R0x3016 Fine_Integration_Time R0x3014 R0x3018 Y_Odd_Inc R0x30A6 R0x30A8 R0x30B0[5:4] R0x30B0[9:8] Green1_Gain (GreenR) R0x3056 R0x30BC Blue_Gain R0x3058 R0x30BE Red_Gain R0x305A R0x30C0 Green2_Gain (GreenB) R0x305C R0x30C2 Global_Gain R0x305E R0x30C4 Frame_Length_Lines R0x300A R0x30AA R0x3032[1:0] R0x3032[5:4] 0x3082 0x3084 Register Description Column Gain Digital_Binning Operation_Mode_Ctrl www.onsemi.com 16 MT9M034 FEATURES See the MT9M034 Register Reference for additional details. new frame. This bit is a self-resetting bit and also returns to "0" during two-wire serial interface reads. Reset Clocks The MT9M034 may be reset by using RESET_BAR (active LOW) or the reset register. The MT9M034 requires one clock input (EXTCLK). PLL-Generated Master Clock The PLL contains a prescaler to divide the input clock applied on EXTCLK, a VCO to multiply the prescaler output, and two divider stages to generate the output clock. The clocking structure is shown in Figure 12. PLL control registers can be programmed to generate desired master clock frequency. NOTE: The PLL control registers must be programmed while the sensor is in the software Standby state. The effect of programming the PLL divisors while the sensor is in the streaming state is undefined. Hard Reset of Logic The RESET_BAR pin can be connected to an external RC circuit for simplicity. The recommended RC circuit uses a 10 k resistor and a 0.1 F capacitor. The rise time for the RC circuit is 1 s maximum. Soft Reset of Logic Soft reset of logic is controlled by the R0x301A Reset register. Bit 0 is used to reset the digital logic of the sensor while preserving the existing two-wire serial interface configuration. Furthermore, by asserting the soft reset, the sensor aborts the current frame it is processing and starts a PLL Input Clock EXTCLK PLL Output Clock Pre PLL Div (PFD) PLL Multiplier (VCO) Pre_pll_clk_div pll_multiplier SYSCLK PLL Output Div1 vt_sys_clk_div PLL Output Div2 PIXCLK vt_pix_clk_div Figure 12. PLL-Generated Master Clock PLL Setup NOTES: 1. The PLL can be bypassed at any time (sensor will run directly off EXTCLK) by setting R0x30B0[14] = 1. The PLL is always bypassed in software standby mode. To disable the PLL, the sensor must be in standby mode (R0x301A[2] = 0) 2. The following restrictions apply to the PLL tuning parameters: 32 M 255 1 N 63 1 P1 16(P1 = 1, 2, 3, 4, 6, 8, 10, 12, 14, 16) 4 P2 16 3. The VCO frequency, defined as fVCO = fEXTCLK x M / N must be within 384-768 MHz. 4. When PLL_Multiplier is odd, 2 MHz <= fEXTCLK / N <= 24 MHz The PLL is enabled by default on the MT9M034. To configure and use the PLL: 1. Bring the MT9M034 up as normal; make sure that fEXTCLK is between 6 and 50 MHz and ensure the sensor is in software standby (R0x301A-B[2] = 0). PLL control registers must be set in software standby. 2. Set pll_multiplier, pre_pll_clk_div, vt_sys_clk_siv, and vt_pix_clk_div based on the desired input (fEXTCLK) and output (fPIXCLK ) frequencies. Determine the M, N, P1, and P2 values to achieve the desired fPIXCLK using this formula: fPIXCLK= (fEXTCLK x M) / (N x P1 x P2) where M = PLL_Multiplier N = Pre_PLL_Clk_Div P1 = Vt_Sys_Clk_Div P2 = Vt_PIX_Clk_Div 3. Wait 1 ms to ensure that the VCO has locked. 4. Set R0x301A[2] = 1 to enable streaming and to switch from EXTCLK to the PLL-generated clock. The user can utilize the Register Wizard tool accompanying DevWare to generate PLL settings given a supplied input clock and desired output frequency. www.onsemi.com 17 MT9M034 Window Control Spread-Spectrum Clocking To facilitate improved EMI performance, the external clock input allows for spread spectrum sources, with no impact on image quality. Limits of the spread spectrum input clock are: * 5% maximum clock modulation * 35 KHz maximum modulation frequency * Accepts triangle wave modulation, as well as sine or modified triangle modulations. Registers x_addr_start, x_addr_end, y_addr_start, and y_addr_end control the size and starting coordinates of the image window. The exact window height and width out of the sensor is determined by the difference between the Y address start and end registers or the X address start and end registers, respectively. The MT9M034 allows different window sizes for context A and context B. Stream/Standby Control Blanking Control The sensor supports two standby modes: Hard Standby and Soft Standby. In both modes, external clock can be optionally disabled to further minimize power consumption. If this is done, then the "Power-Up Sequence" must be followed. Horizontal blank and vertical blank times are controlled by the line_length_pck and frame_length_lines registers, respectively. * Horizontal blanking is specified in terms of pixel clocks. It is calculated by subtracting the X window size from the line_length_pck register. The minimum horizontal blanking is 370 pixel clocks. * Vertical blanking is specified in terms of numbers of lines. It is calculated by subtracting the Y window size from the frame_length_lines register. The minimum vertical blanking is 26 lines. Soft Standby Soft Standby is a low power state that is controlled through register R0x301A[2]. Depending on the value of R0x301A[4], the sensor will go to standby after completion of the current frame readout (default behavior) or after the completion of the current row readout. When the sensor comes back from Soft Standby, previously written register settings are still maintained. Soft standby will not occur if the TRIGGER pin is held high. A specific sequence needs to be followed to enter and exit from Soft Standby. Entering Soft Standby: 1. Set R0x301A[2] = 0 and drive the TRIGGER pin LOW 2. External clock can be turned off to further minimize power consumption (Optional) The actual imager timing can be calculated using Table 5 and Table 6, which describe the Line Timing and FV/LV signals. When in HDR mode, the maximum size is 1280 x 960. Readout Modes Digital Binning By default, the resolution of the output image is the full width and height of the FOV as defined above. The output resolution can be reduced by digital binning. For RGB and monochrome mode, this is set by the register R0x3032. For Context A, use bits [1:0], for Context B, use bits [5:4]. Available settings are: 00 = No binning 01 = Horizontal binning 10 = Horizontal and vertical binning Exiting Soft Standby: 1. Enable external clock if it was turned off 2. R0x301A[2] = 1 or drive the TRIGGER pin HIGH Hard Standby Hard Standby puts the sensor in lower power state; previously written register settings are still maintained. A specific sequence needs to be followed to enter and exit from Hard Standby. Binning gives the advantage of reducing noise at the cost of reduced resolution. When both horizontal and vertical binning are used, a 2x improvement in SNR is achieved, therefore improving low light performance. Binning results in a smaller resolution image, but the FOVs between the binned and unbinned images are the same. Entering Hard Standby: 1. R0x301A[8] = 1 2. Assert STANDBY pin 3. External clock can be turned off to further minimize power consumption (Optional) Bayer Space Resampling All of the pixels in the FOV contribute to the output image in digital binning mode. This can result in a more pleasing output image with reduced subsampling artifacts. It also improves low-light performance. For RGB mode, resampling can be enabled by setting of register 0x306E[4] = 1. Exiting Hard Standby: 1. Enable external clock if it was turned off 2. De-assert STANDBY pin 3. Set R0x301A[8] = 0 www.onsemi.com 18 MT9M034 Mirror When using horizontal mirror mode, the user must retrigger column correction. Please refer to the column correction section to see the procedure for column correction retriggering. Bayer resampling must be enabled, by setting bit 4 of register 0x306E[4] = 1. Column Mirror Image By setting R0x3040[14] = 1, the readout order of the columns is reversed, as shown in Figure 13. The starting Bayer color pixel is maintained in this mode by a 1-pixel shift in the imaging array. LV Normal readout DOUT [11:0] G0[11:0] R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0] G3[11:0] R3[11:0] Reverse readout DOUT [11:0] G3[11:0] R3[11:0] G2[11:0] R2[11:0] G1[11:0] R1[11:0] G0[11:0] R0[11:0] Figure 13. Eight Pixels in Normal and Column Mirror Readout Modes imaging array. When using horizontal mirror mode, the user must retrigger column correction. Please refer to the column correction section to see the procedure for column correction retriggering. Row Mirror Image By setting R0x3040[15] = 1, the readout order of the rows is reversed as shown in Figure 14. The starting Bayer color pixel is maintained in this mode by a 1-pixel shift in the FV Normal readout Row0[11:0] Row1[11:0] Row2[11:0] Row3[11:0] Row4[11:0] Row5[11:0] D OUT [11:0] Reverse readout D OUT [11:0] Row5[11:0] Row4[11:0] Row3[11:0] Row2[11:0] Row1[11:0] Row0[11:0] Figure 14. Six Rows in Normal and Row Mirror Readout Modes * * * * * Maintaining a Constant Frame Rate Maintaining a constant frame rate while continuing to have the ability to adjust certain parameters is the desired scenario. This is not always possible, however, because register updates are synchronized to the read pointer, and the shutter pointer for a frame is usually active during the readout of the previous frame. Therefore, any register changes that could affect the row time or the set of rows sampled causes the shutter pointer to start over at the beginning of the next frame. By default, the following register fields cause a "bubble" in the output rate (that is, the vertical blank increases for one frame) if they are written in video mode, even if the new value would not change the resulting frame rate. The following list shows only a few examples of such registers; a full listing can be seen in the MT9M034 Register Reference. * x_addr_start * x_addr_end * y_addr_start * y_addr_end frame_length_lines line_length_pclk coarse_integration_time fine_integration_time read_mode The size of this bubble is (Integration_Time x tROW), calculating the row time according to the new settings. The Coarse_Integration_Time and Fine_Integration _Time fields may be written to without causing a bubble in the output rate under certain circumstances. Because the shutter sequence for the next frame often is active during the output of the current frame, this would not be possible without special provisions in the hardware. Writes to these registers take effect two frames after the frame they are written, which allows the integration time to increase without interrupting the output or producing a corrupt frame (as long as the change in integration time does not affect the frame time). www.onsemi.com 19 MT9M034 Synchronizing Register Writes to Frame Boundaries cycles. If the trigger signal is applied to multiple sensors at the same time, the single frame output of the sensors will be synchronized to within 1 PIXCLK if is PLL disabled or 2 PIXCLKs if PLL is enabled. During integration time of single-frame mode and video mode, the FLASH output pin is at high. Changes to most register fields that affect the size or brightness of an image take effect on two frames after the one during which they are written. These fields are noted as "synchronized to frame boundaries" in the MT9M034 Register Reference. To ensure that a register update takes effect on the next frame, the write operation must be completed after the leading edge of FV and before the trailing edge of FV. Fields not identified as being frame-synchronized are updated immediately after the register write is completed. The effect of these registers on the next frame can be difficult to predict if they affect the shutter pointer. Continuous Trigger In certain applications, multiple sensors need to have their video streams synchronized (E.g. surround view or panorama view applications). The TRIGGER pin can also be used to synchronize output of multiple image sensors together and still get a video stream. This is called continuous trigger mode. Continuous trigger is enabled by holding the TRIGGER pin high. Alternatively, the TRIGGER pin can be held high until the stream bit is enabled (R0x301A[2] = 1) then can be released for continuous synchronized video streaming. If the TRIGGER pins for all connected MT9M034 sensors are connected to the same control signal, all sensors will receive the trigger pulse at the same time. If they are configured to have the same frame timing, then the usage of the TRIGGER pin guarantees that all sensors will be synchronized within 1 PIXCLK cycle if PLL is disabled, or 2 PIXCLK cycles if PLL is enabled. With continuous trigger mode, the application can now make use of the video streaming mode while guaranteeing that all sensor outputs are synchronized. As long as the initial trigger for the sensors takes place at the same time, all subsequent video streams will be synchronous. Restart To restart the MT9M034 at any time during the operation of the sensor, write a "1" to the Restart register (R0x301A[1] = 1). This has two effects: first, the current frame is interrupted immediately. Second, any writes to frame-synchronized registers and the shutter width registers take effect immediately, and a new frame starts (in video mode). The current row completes before the new frame is started, so the time between issuing the Restart and the beginning of the next frame can vary by about tROW. Image Acquisition Modes The MT9M034 supports two image acquisition modes: video(master) and single frame. Video The video mode takes pictures by scanning the rows of the sensor twice. On the first scan, each row is released from reset, starting the exposure. On the second scan, the row is sampled, processed, and returned to the reset state. The exposure for any row is therefore the time between the first and second scans. Each row is exposed for the same duration, but at slightly different point in time, which can cause a shear in moving subjects as is typical with electronic rolling shutter sensors. Temperature Sensor The MT9M034 sensor has a built-in PTAT-based temperature sensor, accessible through registers, that is capable of measuring die junction temperature. The temperature sensor can be enabled by writing R0x30B4[0] = 1 and R0x30B4[4] = 1. After this, the temperature sensor output value can be read from R0x30B2[10:0]. The value read out from the temperature sensor register is an ADC output value that needs to be converted downstream to a final temperature value in degrees Celsius. Since the PTAT device characteristic response is quite linear in the temperature range of operation required, a simple linear function in the format of listed in the equation below can be used to convert the ADC output value to the final temperature in degrees Celsius. Single Frame The single-frame mode operates similar to the video mode. It also scans the rows of the sensor twice, first to reset the rows and second to read the rows. Unlike video mode where a continuous stream of images are output from the image sensor, the single-frame mode outputs a single frame in response to a high state placed on the TRIGGER input pin. As long as the TRIGGER pin is held in a high state, new images will be read out. After the TRIGGER pin is returned to a low state, the image sensor will not output any new images and will wait for the next high state on the TRIGGER pin. The TRIGGER pin state is detected during the vertical blanking period (i.e. the FV signal is low). The pin is level sensitive rather than edge sensitive. As such, image integration will only begin when the sensor detects that the TRIGGER pin has been held high for 3 consecutive clock Temperature + slope R0x30B2[10 : 0] ) T 0 (eq. 5) For this conversion, a minimum of 2 known points are needed to construct the line formula by identifying the slope and y-intercept "T0". These calibration values can be read from registers R0x30C6 and R0x30C8 which correspond to value read at 70C and 55C respectively. Once read, the slope and y-intercept values can be calculated and used in the above equation. www.onsemi.com 20 MT9M034 pixels are used, regardless of color or mono mode. In HDR mode, the coarse and fine integration time is the longest integration time of the three integration, the other two shorter integration are generated automatically base on the pre-defined exposure ratios. When using non-default HDR exposure ratios, auto_dg_en should not be enabled (R0x3100[4] = 0) due to required digital gains as documented in Table 9, "Digital Gain Setting for Each T1 / T2 and T2 / T3 Ratio". For more information on the temperature sensor registers, refer to the MT9M034 Register Reference. Automatic Exposure Control The integrated automatic exposure control (AEC) is responsible for ensuring that optimal settings of exposure and gain are computed and updated every other frame. AEC can be enabled or disabled by R0x3100[0]. When AEC is disabled (R0x3100[0] = 0), the sensor uses the manual exposure value in coarse and fine shutter width registers and the manual gain value in the gain registers. When AEC is enabled (R0x3100[0] = 1), the target luma value in linear mode is set by R0x3102. For the MT9M034 this target luma has a default value of 0x0800 or about half scale. For HDR mode, the luma target maximum auto exposure value is limited by R0x311C; the minimum auto exposure is limited by R0x311E. These values are in units of line-times. The exposure control measures current scene luminosity by accumulating a histogram of pixel values while reading out a frame. It then compares the current luminosity to the desired output luminosity. Finally, the appropriate adjustments are made to the exposure time and gain. All Embedded Data and Statistics The MT9M034 has the capability to output image data and statistics embedded within the frame timing. There are 2 types of information embedded within the frame readout: 1. Embedded Data: If enabled, these are displayed on the 2 rows immediately before the first active pixel row is displayed 2. Embedded Statistics: If enabled, these are displayed on the 2 rows immediately after the last active pixel row is displayed NOTE: Embedded data and embedded statistics must be enabled or disabled together. Register Data HBlank Image Status & Statistics Data VBlank Figure 15. Frame Format with Embedded Data Lines Enabled In parallel mode, since the pixel word depth is 12-bits/pixel, the sensor 16-bit register data will be transferred over 2 pixels where the register data will be broken up into 8msb and 8lsb. The alignment of the 8bit data will be on the 8MSB bits of the 12-bit pixel word. For example, if a register value of 0x1234 is to be transmitted, it will be transmitted over 2, 12-bit pixels as follows: 0x120, 0x340. The first pixel of each line in the embedded data is a tag value of 0x0A0. This signifies that all subsequent data is 8 bit data aligned to the MSB of the 12-bit pixel. The figure below summarizes how the embedded data transmission looks like. It should be noted that data, as shown in Figure 16, is aligned to the MSB of each word: Embedded Data The embedded data contains the configuration of the image being displayed. This includes all register settings used to capture the current frame. The registers embedded in these rows are as follows: Line 1: Registers R0x3000 to R0x312F Line 2: Registers R0x3136 to R0x31BF, R0x31D0 to R0x31FF NOTE: All non-defined registers will have a value of 0. www.onsemi.com 21 MT9M034 data_format_ code =8'h0A 8'hAA {register_ address_MSB} 8'hA5 {register_ value_LSB} 8'h5A {register_ address_LSB} 8'h5A {register_ value_MSB} 8'h5A Data line 1 data_format_ code =8'h0A 8'hAA {register_ address_MSB} 8'hA5 {register_ value_LSB} 8'h5A {register_ address_LSB} 8'h5A {register_ value_MSB} 8'h5A Data line 2 Figure 16. Format of Embedded Data Output within a Frame * * * * * * * * * * * * * * * The data embedded in these rows are as follows: 0x0A0 - identifier 0xAA0 Register Address MSB of the first register 0xA50 Register Address LSB of the first register 0x5A0 Register Value MSB of the first register addressed 0x5A0 Register Value LSB of the first register addressed 0x5A0 Register Value MSB of the register at first address + 2 0x5A0 Register Value LSB of the register at first address + 2 0x5A0 etc. Embedded Statistics The embedded statistics contain frame identifiers and histogram information of the image in the frame. This can be used by downstream auto-exposure algorithm blocks to make decisions about exposure adjustment. This histogram is divided into 244 bins with a bin spacing of 64 evenly spaced bins for digital code values 0 to 212, 120 evenly spaced bins for values 212 to 216, 60 evenly spaced bins for values 216 to 220. In HDR with a 16x exposure ratio, this approximately corresponds to the T1, T2, T3 exposures respectively. The first pixel of each line in the embedded statistics is a tag value of 0x0B0. This signifies that all subsequent statistics data is 10 bit data aligned to the MSB of the 12-bit pixel. The figure below summarizes how the embedded statistics transmission looks like. It should be noted that data, as shown in Figure 17, is aligned to the msb of each word: statsline1 data_format_ code=8'h0B #words= 10'h1EC {2'b00,frame {2'b00,frame {2'b00,frame _countLSB} _IDMSB} _IDLSB} histogram bin0[19:10] histogram bin0[9:0] histogram bin243 [19:0] histogram bin243 [9:0] 8'h07 histBegin [9:0] histEnd [19:10] histEnd [9:0] histogram bin1 [19:0] histogram bin1[9:0] mean [19:10] mean [9:0] 8'h07 statsline2 data_format_ code=8'h0B #words= 10'h00C histBegin [19:10] lowEndMean lowEndMean perc_lowEnd perc_lowEnd norm_abs_ [19:10] [9:0] [19:10] [9:0] dev[19:10] norm_abs_ dev[9:0] Figure 17. Format of Embedded Statistics Output within a Frame www.onsemi.com 22 8'h07 MT9M034 threshold. If the average is lower than the minimum acceptable level, the offset correction value is increased by a predetermined amount. If it is above the maximum level, the offset correction value is decreased by a predetermined amount. The high and low thresholds have been calculated to avoid oscillation of the black level from below to above the targeted black level. The statistics embedded in these rows are as follows: Line 1: 0x0B0 - (identifier) Register 0x303A - frame_count Register 0x31D2 - frame ID Histogram data - histogram bins 0-243 * * * * Row-wise Noise Correction Line 2: * 0x0B0 (identifier) * Mean * Histogram Begin * Histogram End * Low End Histogram Mean * Percentage of Pixels Below Low End Mean * Normal Absolute Deviation Row (Line)-wise Noise Correction is handled automatically by the image sensor. No adjustments are provided except to enable or disable this feature. Clearing R0x3044[10] disables the row noise correction. Default setting is for row noise correction to be enabled. Row-wise noise correction is performed by calculating an average from a set of optically black pixels at the start of each line and then applying each average to all the active pixels of the line. Gain Column Correction The MT9M034 uses column parallel readout architecture to achieve fast frame rate. Without any corrections, the consequence of this architecture is that different column signal paths have slightly different offsets that might show up on the final image as structured fixed pattern noise. MT9M034 has column correction circuitry that measures this offset and removes it from the image before output. This is done by sampling dark rows containing tied pixels and measuring an offset coefficient per column to be corrected later in the signal path. Column correction can be enabled/disabled via R0x30D4[15]. Additionally, the number of rows used for this offset coefficient measurement is set in R0x30D4[3:0]. By default this register is set to 0x7, which means that 8 rows are used. This is the recommended value. Other control features regarding column correction can be viewed in the MT9M034 Register reference. Any changes to column correction settings need to be done when the sensor streaming is disabled and the appropriate triggering sequence must be followed as described below. Digital Gain Digital gain can be controlled globally by R0x305E (Context A) or R0x30C4 (Context B). There are also registers that allow individual control over each Bayer color (GreenR, GreenB, Red, Blue). The format for digital gain setting is xxx.yyyyy where 0b00100000 represents a 1x gain setting and 0b00110000 represents a 1.5x gain setting. The step size for yyyyy is 0.03125 while the step size for xxx is 1. Therefore to set a gain of 2.09375 one would set digital gain to 01000011. Analog Gain The MT9M034 has a column parallel architecture and therefore has an Analog gain stage per column. There are 2 stages of analog gain, the first stage can be set to 1x, 2x, 4x or 8x. This can be set in R0x30B0[5:4] (Context A) or R0x30B0[9:8] (Context B). The second stage is capable of setting an additional 1x or 1.25x gain which can be set in R0x3EE4[9:8]. This allows the maximum possible analog gain to be set to 10x. Column Correction Triggering Column correction requires a special procedure to trigger depending on which state the sensor is in. Black Level Correction Black level correction is handled automatically by the image sensor. No adjustments are provided except to enable or disable this feature. Setting R0x30EA[15] disables the automatic black level correction. Default setting is for automatic black level calibration to be enabled. The automatic black level correction measures the average value of pixels from a set of optically black lines in the image sensor. The pixels are averaged as if they were light-sensitive and passed through the appropriate gain. This line average is then digitally low-pass filtered over many frames to remove temporal noise and random instabilities associated with this measurement. The new filtered average is then compared to a minimum acceptable level, low threshold, and a maximum acceptable level, high Column Triggering on Startup When streaming the sensor for the first time after powerup, a special sequence needs to be followed to make sure that the column correction coefficients are internally calculated properly. 1. Follow proper power up sequence for power supplies and clocks 2. Apply sequencer settings if needed (Linear or HDR mode) 3. Apply frame timing and PLL settings as required by application www.onsemi.com 23 MT9M034 Defective Pixel Correction 4. Set analog gain to 1x and low conversion gain (R0x30B0 = 0x1300) 5. Enable column correction and settings (R0x30D4 = 0xE007) 6. Disable auto re-trigger for change in conversion gain or col_gain, and enable column correction always (R0x30BA = 0x0008) 7. Enable streaming (R0x301A[2] = 1) or drive the TRIGGER pin HIGH 8. Wait 9 frames to settle (First frame after coming up from standby is internally column correction disabled) 9. Disable streaming (R0x301A[2] = 0) Defective Pixel Correction is intended to compensate for defective pixels by replacing their value with a value based on the surrounding pixels, making the defect less noticeable to the human eye. The defect pixel correction feature supports up to 200 defects. The locations of defective pixels are stored in a table on chip during the manufacturing process; this table is accessible through the two-wire serial interface. There is no provision for later augmenting the defect table entries. The DPC algorithm is one-dimensional, calculating the resulting averaged pixel value based on nearby pixels within a row. The algorithm distinguishes between color and monochrome parts; for color parts, the algorithm uses nearest neighbor in the same color plane. At high gain, long exposure, and high temperature conditions, the performance of this function can degrade. After this, the sensor has calculated the proper column correction coefficients and the sensor is ready for streaming. Any other settings (including gain, integration time and conversion gain etc.) can be done afterwards without affecting column correction. Test Patterns The MT9M034 has the capability of injecting a number of test patterns into the top of the datapath to debug the digital logic. With one of the test patterns activated, any of the datapath functions can be enabled to exercise it in a deterministic fashion. Test patterns are selected by Test_Pattern_Mode register (R0x3070). Only one of the test patterns can be enabled at a given point in time by setting the Test_Pattern_Mode register according to Table 11. When test patterns are enabled the active area will receive the value specified by the selected test pattern and the dark pixels will receive the value in Test_Pattern_Green (R0x3074 and R0x3078) for green pixels, Test_Pattern_Blue (R0x3076) for blue pixels, and Test_Pattern_Red (R0x3072) for red pixels. NOTE: Turn off black level calibration (BLC) when Test Pattern is enabled. Column Correction Retriggering Due to Mode Change Since column offsets is sensitive to changes in the analog signal path, such changes require column correction circuitry to be retriggered for the new path. Examples of such mode changes include: horizontal mirror, vertical mirror, changes to column correction settings. When such changes take place, the following sequence needs to take place: 1. Disable streaming (R0x301A[2] = 0) or drive the TRIGGER pin LOW 2. Enable streaming (R0x301A[2] = 1) or drive the TRIGGER pin HIGH 3. Wait 9 frames to settle NOTE: The above steps are not needed if the sensor is being reset (soft or hard reset) upon the mode change. Table 11. TEST PATTERN MODES Test_Pattern_Mode Test Pattern Output 0 No test pattern (normal operation) 1 Solid color test pattern 2 100% color bar test pattern 3 Fade-to-gray color bar test pattern 256 Walking 1s test pattern (12-bit) Vertical Color Bars When the vertical color bars mode is selected, a typical color bar pattern will be sent through the digital pipeline. Color Field When the color field mode is selected, the value for each pixel is determined by its color. Green pixels will receive the value in Test_Pattern_Green, red pixels will receive the value in Test_Pattern_Red, and blue pixels will receive the value in Test_Pattern_Blue. Walking 1s When the walking 1s mode is selected, a walking 1s pattern will be sent through the digital pipeline. The first value in each row is 1. www.onsemi.com 24 MT9M034 TWO-WIRE SERIAL REGISTER INTERFACE The two-wire serial interface bus enables read/write access to control and status registers within the MT9M034. The interface protocol uses a master/slave model in which a master controls one or more slave devices. The sensor acts as a slave device. The master generates a clock (SCLK) that is an input to the sensor and is used to synchronize transfers. Data is transferred between the master and the slave on a bidirectional signal (SDATA). SDATA is pulled up to VDD_IO off-chip by a 1.5 k resistor. Either the slave or master device can drive SDATA LOW-the interface protocol determines which device is allowed to drive SDATA at any given time. The protocols described in the two-wire serial interface specification allow the slave device to drive SCLKLOW; the MT9M034 uses SCLK as an input only and therefore never drives it LOW. (write address) and 0x21 (read address) in accordance with the specification. Alternate slave addresses of 0x30 (write address) and 0x31 (read address) can be selected by enabling and asserting the SADDR input. An alternate slave address can also be programmed through R0x31FC. Message Byte Message bytes are used for sending register addresses and register write data to the slave device and for retrieving register read data. Acknowledge Bit Each 8-bit data transfer is followed by an acknowledge bit or a no-acknowledge bit in the SCLK clock period following the data transfer. The transmitter (which is the master when writing, or the slave when reading) releases SDATA. The receiver indicates an acknowledge bit by driving SDATA LOW. As for data transfers, SDATA can change when SCLK is LOW and must be stable while SCLK is HIGH. Protocol Data transfers on the two-wire serial interface bus are performed by a sequence of low-level protocol elements: 1. a (repeated) start condition 2. a slave address/data direction byte 3. an (a no) acknowledge bit 4. a message byte 5. a stop condition No-Acknowledge Bit The no-acknowledge bit is generated when the receiver does not drive SDATA LOW during the SCLK clock period following a data transfer. A no-acknowledge bit is used to terminate a read sequence. The bus is idle when both SCLK and SDATA are HIGH. Control of the bus is initiated with a start condition, and the bus is released with a stop condition. Only the master can generate the start and stop conditions. Typical Sequence A typical READ or WRITE sequence begins by the master generating a start condition on the bus. After the start condition, the master sends the 8-bit slave address/data direction byte. The last bit indicates whether the request is for a read or a write, where a "0" indicates a write and a "1" indicates a read. If the address matches the address of the slave device, the slave device acknowledges receipt of the address by generating an acknowledge bit on the bus. If the request was a WRITE, the master then transfers the 16-bit register address to which the WRITE should take place. This transfer takes place as two 8-bit sequences and the slave sends an acknowledge bit after each sequence to indicate that the byte has been received. The master then transfers the data as an 8-bit sequence; the slave sends an acknowledge bit at the end of the sequence. The master stops writing by generating a (re)start or stop condition. If the request was a READ, the master sends the 8-bit write slave address/data direction byte and 16-bit register address, the same way as with a WRITE request. The master then generates a (re)start condition and the 8-bit read slave address/data direction byte, and clocks out the register data, eight bits at a time. The master generates an acknowledge bit after each 8-bit transfer. The slave's internal register address is automatically incremented after every 8 bits are transferred. The data transfer is stopped when the master sends a no-acknowledge bit. Start Condition A start condition is defined as a HIGH-to-LOW transition on SDATA while SCLK is HIGH. At the end of a transfer, the master can generate a start condition without previously generating a stop condition; this is known as a "repeated start" or "restart" condition. Stop Condition A stop condition is defined as a LOW-to-HIGH transition on SDATA while SCLK is HIGH. Data Transfer Data is transferred serially, 8 bits at a time, with the MSB transmitted first. Each byte of data is followed by an acknowledge bit or a no-acknowledge bit. This data transfer mechanism is used for the slave address/data direction byte and for message bytes. One data bit is transferred during each SCLK clock period. SDATA can change when SCLK is LOW and must be stable while SCLK is HIGH. Slave Address/Data Direction Byte Bits [7:1] of this byte represent the device slave address and bit [0] indicates the data transfer direction. A "0" in bit [0] indicates a WRITE, and a "1" indicates a READ. The default slave addresses used by the MT9M034 are 0x20 www.onsemi.com 25 MT9M034 Single READ from Random Location register data. The master terminates the READ by generating a no-acknowledge bit followed by a stop condition. Figure 18 shows how the internal register address maintained by the MT9M034 is loaded and incremented as the sequence proceeds. This sequence (Figure 18) starts with a dummy WRITE to the 16-bit address that is to be used for the READ. The master terminates the WRITE by generating a restart condition. The master then sends the 8-bit read slave address/data direction byte and clocks out one byte of Previous Reg Address, N Slave Address S 0 A Reg Address[15:8] S = Start Condition P = Stop Condition Sr = Restart Condition A = Acknowledge A = No-acknowledge Reg Address, M Reg Address[7:0] A A Sr Slave Address 1 A M+1 Read Data A P Slave to Master Master to Slave Figure 18. Single READ from Random Location Single READ From Current Location master terminates the READ by generating a no-acknowledge bit followed by a stop condition. The figure shows two independent READ sequences. This sequence (Figure 19) performs a read using the current value of the MT9M034 internal register address. The Previous Reg Address, N S 1 A Slave Address Reg Address, N + 1 Read Data A P S N+2 1 A Read Data Slave Address A P Figure 19. Single READ from Current Location Sequential READ, Start From Random Location has been transferred, the master generates an acknowledge bit and continues to perform byte READs until "L" bytes have been read. This sequence (Figure 20) starts in the same way as the single READ from random location (Figure 18). Instead of generating a no-acknowledge bit after the first byte of data Previous Reg Address, N S Slave Address 0 A Reg Address[15:8] M+1 Read Data A Reg Address[7:0] M+2 A Read Data Reg Address, M M+3 A Sr Slave Address M+L-2 A Read Data 1 A M+L-1 A Read Data Figure 20. Sequential READ, Start from Random Location www.onsemi.com 26 M+1 Read Data M+L A P A MT9M034 Sequential READ, Start From Current Location has been transferred, the master generates an acknowledge bit and continues to perform byte READs until "L" bytes have been read. This sequence (Figure 21) starts in the same way as the single READ from current location (Figure 19). Instead of generating a no-acknowledge bit after the first byte of data Previous Reg Address, N S Slave Address 1 A N+1 Read Data A N+2 Read Data A N+L-1 Read Data A Read Data N+L A P Figure 21. Sequential READ, Start from Current Location Single WRITE to Random Location then LOW bytes of the register address that is to be written. The master follows this with the byte of write data. The WRITE is terminated by the master generating a stop condition. This sequence (Figure 22) begins with the master generating a start condition. The slave address/data direction byte signals a WRITE and is followed by the HIGH Previous Reg Address, N S Slave Address 0 A Reg Address[15:8] A Reg Address, M Reg Address[7:0] A Write Data M+1 A P A Figure 22. Single WRITE to Random Location Sequential WRITE, Start at Random Location has been transferred, the master generates an acknowledge bit and continues to perform byte WRITEs until "L" bytes have been written. The WRITE is terminated by the master generating a stop condition. This sequence (Figure 23) starts in the same way as the single WRITE to random location (Figure 22). Instead of generating a no-acknowledge bit after the first byte of data Previous Reg Address, N S Slave Address 0 A M+1 Write Data Reg Address[15:8] A M+2 A Write Data Reg Address, M Reg Address[7:0] M+3 A Write Data M+L-2 A Write Data 27 A M+L-1 A Figure 23. Sequential WRITE, Start at Random Location www.onsemi.com M+1 Write Data M+L A A P MT9M034 SPECTRAL CHARACTERISTICS 70 60 red green blue Quantum Efficiency (%) 50 40 30 20 10 0 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050 Wavelength (nm) Figure 24. Quantum Efficiency - Color Sensor Figure 25. Estimated Quantum Efficiency - Monochrome Sensor www.onsemi.com 28 MT9M034 Electrical Specifications Unless otherwise stated, the following specifications apply to the following conditions: VDD = 1.8 V - 0.10 / +0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8 V 0.3V ; TA = -30C to +70C; output load = 10 pF; frequency = 74.25 MHz. Two-Wire Serial Register Interface The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are shown in Figure 26 and Table 12. SDATA tLOW tf tSU;DAT tr tf tHD;STA tr tBUF SCLK S tHD;STA tHD;DAT tHIGH tSU;STA tSU;STO Sr P S Note: Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register address are issued. Figure 26. Two-Wire Serial Bus Timing Parameters Table 12. TWO-WIRE SERIAL BUS CHARACTERISTICS fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; VDD_DAC = 2.8 V; TA = 25C Standard-Mode Fast-Mode Symbol Min Max Min Max Unit fSCL 0 100 0 400 KHz tHD;STA 4.0 - 0.6 - S LOW Period of the SCLK Clock tLOW 4.7 - 1.3 - S HIGH Period of the SCLK Clock tHIGH 4.0 - 0.6 - S tSU;STA 4.7 - 0.6 - S tHD;DAT 0 (Note 4) 3.45 (Note 5) 0 (Note 6) 0.9 (Note 5) S tSU;DAT 250 - 1006 - nS tr - 1000 20 + 0.1Cb (Note 7) 300 nS tf - 300 20 + 0.1Cb (Note 7) 300 nS tSU;STO 4.0 - 0.6 - S tBUF 4.7 - 1.3 - S Cb - 400 - 400 pF CIN_SI - 3.3 - 3.3 pF Parameter SCLK Clock Frequency Hold Time (Repeated) START Condition After this Period, the First Clock Pulse is Generated Set-up Time for a Repeated START Condition Data Hold Time Data Set-up Time Rise Time of Both SDATA and SCLK Signals Fall Time of Both SDATA and SCLK Signals Set-up Time for STOP Condition Bus Free Time between a STOP and START Condition Capacitive Load for Each Bus Line Serial Interface Input pin Capacitance SDATA Max Load Capacitance SDATA Pull-up Resistor CLOAD_SD - 30 - 30 pF RSD 1.5 4.7 1.5 4.7 K This table is based on I2C standard (v2.1 January 2000). On Semiconductor. Two-wire control is I2C-compatible. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1 VDD levels. Sensor EXCLK = 27 MHz. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCLK line is released. 7. Cb = total capacitance of one bus line in pF. 1. 2. 3. 4. 5. 6. www.onsemi.com 29 MT9M034 I/O Timing See Figure 27 and Table 13 for I/O timing (AC) characteristics. By default, the MT9M034 launches pixel data, FV, and LV with the falling edge of PIXCLK. The expectation is that the user captures DOUT[11:0], FV, and LV using the rising edge of PIXCLK. This can be changed using register R0x3028. tR t RP tF t FP 90 % 10 % 90 % 10 % t EXTCLK EXTCLK PIXCLK t PD Pxl _ 0 Data[11:0] FRAME_VALID/ LINE_VALID Pxl _ 1 Pxl _ 2 Pxl _ n t PFH t PLH t PFL t PLL FRAME_VALID leads LINE_VALID by 6 PIXCLKs. FRAME_VALID trails LINE_VALID by 6 PIXCLKs. Figure 27. I/O Timing Diagram Table 13. I/O TIMING CHARACTERISTICS (2.8 V VDD_IO) (Note 1) Symbol Min Typ Input Clock Frequency 6 Input Clock Period 20 tR Input Clock Rise Time tF Input Clock Fall Time tJITTER Input Clock Jitter tRP Pixclk Rise Time PCLK slew rate = 6 tFP Pixclk Fall Time PCLK slew rate = 6 fEXTCLK tEXTCLK Definition Condition Max Unit - 50 MHz - 166 ns - 3 - ns - 3 - ns - - 600 ps 1.2 - 2.9 ns 1.2 - 2.9 ns Pixclk Duty Cycle 45 50 55 % fPIXCLK PIXCLK Frequency (Note 2) 6 - 74.25 MHz tPD PIXCLK to Data Valid PCLK slew rate = 6, Parallel slew rate = 7 -2 - 2.5 ns tPFH PIXCLK to FV HIGH PCLK slew rate = 6, Parallel slew rate = 7 -2 - 2.5 ns tPLH PIXCLK to LV HIGH PCLK slew rate = 6, Parallel slew rate = 7 -2 - 2.5 ns tPFL PIXCLK to FV LOW PCLK slew rate = 6, Parallel slew rate = 7 -2 - 2.5 ns tPLL PIXCLK to LV LOW PCLK slew rate = 6, Parallel slew rate = 7 -2 - 2.5 ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70C at 2.5 V, and -30C at 3.1 V. All values are taken at the 50% transition point. The loading used is 10 pF. 2. Jitter from PIXCLK is already taken into account as the data of all the output parameters. Table 14. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO) (Note 1) Symbol Definition Condition Min Typ Max Unit fEXTCLK Input Clock Frequency 6 - 50 MHz tEXTCLK Input Clock Period 20 - 166 ns tR Input Clock Rise Time - 3 - ns www.onsemi.com 30 MT9M034 Table 14. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO) (Note 1) (continued) Symbol Definition Condition Min Typ Max Unit tF Input Clock Fall Time - 3 - ns tJITTER Input Clock Jitter - - 600 ps tRP Pixel Rise Time PCLK slew rate = 6 1.8 - 4.8 ns tFP Pixel Fall Time PCLK slew rate = 6 1.7 - 4.5 ns 50 Pixel Duty Cycle 45 fPIXCLK PIXCLK Frequency (Note 2) 6 55 % 74.25 MHz tPD PIXCLK to Data Valid PCLK slew rate = 6, Parallel slew rate = 7 -2.5 - 2 ns tPFH PIXCLK to FV HIGH PCLK slew rate = 6, Parallel slew rate = 7 -2.5 - 2 ns tPLH PIXCLK to LV HIGH PCLK slew rate = 6, Parallel slew rate = 7 -2.5 - 2 ns tPFL PIXCLK to FV LOW PCLK slew rate = 6, Parallel slew rate = 7 -2.5 - 2 ns tPLL PIXCLK to LV LOW PCLK slew rate = 6, Parallel slew rate = 7 -2.5 - 2 ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70C at 1.7 V, and -30C at 1.95 V. All values are taken at the 50% transition point. The loading used is 10 pF. 2. Jitter from PIXCLK is already taken into account as the data of all the output parameters. Table 15. I/O RISE SLEW RATE (2.8 V VDD_IO) (Note 1) Parallel Slew Rate (R0x306E[15:13]) Conditions Min Typ Max Units 7 Default 1.08 1.77 2.72 V/ns 6 Default 0.77 1.26 1.94 V/ns 5 Default 0.58 0.95 1.46 V/ns 4 Default 0.44 0.70 1.08 V/ns 3 Default 0.32 0.51 0.78 V/ns 2 Default 0.23 0.37 0.56 V/ns 1 Default 0.16 0.25 0.38 V/ns 0 Default 0.10 0.15 0.22 V/ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70C at 2.5 V, and -30C at 3.1 V. The loading used is 10 pF. Table 16. I/O FALL SLEW RATE (2.8 V VDD_IO) (Note 1) Parallel Slew Rate (R0x306E[15:13]) Conditions Min Typ Max Units 7 Default 1.00 1.62 2.41 V/ns 6 Default 0.76 1.24 1.88 V/ns 5 Default 0.60 0.98 1.50 V/ns 4 Default 0.46 0.75 1.16 V/ns 3 Default 0.35 0.56 0.86 V/ns 2 Default 0.25 0.40 0.61 V/ns 1 Default 0.17 0.27 0.41 V/ns 0 Default 0.11 0.16 0.24 V/ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70C at 2.5 V, and -30C at 3.1 V. The loading used is 10 pF. www.onsemi.com 31 MT9M034 Table 17. I/O RISE SLEW RATE (1.8 V VDD_IO) (Note 1) Parallel Slew Rate (R0x306E[15:13]) Conditions Min Typ Max Units 7 Default 0.41 0.65 1.10 V/ns 6 Default 0.30 0.47 0.79 V/ns 5 Default 0.24 0.37 0.61 V/ns 4 Default 0.19 0.28 0.46 V/ns 3 Default 0.14 0.21 0.34 V/ns 2 Default 0.10 0.15 0.24 V/ns 1 Default 0.07 0.10 0.16 V/ns 0 Default 0.04 0.06 0.10 V/ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70C at 1.7 V, and -30C at 1.95 V. The loading used is 10 pF. Table 18. I/O FALL SLEW RATE (1.8 V VDD_IO) (Note 1) Parallel Slew Rate (R0x306E[15:13]) Conditions Min Typ 7 Default 0.42 6 Default 0.32 5 Default 4 3 Max Units 0.68 1.11 V/ns 0.51 0.84 V/ns 0.26 0.41 0.67 V/ns Default 0.20 0.32 0.52 V/ns Default 0.16 0.24 0.39 V/ns 2 Default 0.12 0.18 0.28 V/ns 1 Default 0.08 0.12 0.19 V/ns 0 Default 0.05 0.07 0.11 V/ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70C at 1.7 V, and -30C at 1.95 V. The loading used is 10 pF. www.onsemi.com 32 MT9M034 DC ELECTRICAL CHARACTERISTICS The DC electrical characteristics are shown in the tables below. Table 19. DC ELECTRICAL CHARACTERISTICS Definition Min Typ Max 1.7 1.8 1.95 1.7 / 2.5 1.8 / 2.8 1.9 / 3.1 2.5 2.8 3.1 Pixel Supply Voltage 2.5 2.8 3.1 VDD_PLL PLL Supply Voltage 2.5 2.8 3.1 VDD_SLVS HiSPi Supply Voltage for SLVS Mode 0.3 0.4 0.6 VDD_SLVS HiSPi Supply Voltage for HiVcm Mode 1.7 1.8 1.95 VIH Input HIGH Voltage VDD_IO x 0.7 - - VIL Input LOW Voltage - - VDD_IO x 0.3 IIN Input Leakage Current - - 20 VOH Output HIGH Voltage VDD_IO - 0.3 - - VOL Output LOW Voltage - - 0.4 IOH Output HIGH Current At specified VOH -22 - - IOL Output LOW Current At specified VOL - - 22 Symbol VDD Core Digital Voltage VDD_IO I/O Digital Voltage VAA Analog Voltage VAA_PIX Condition No pull-up resistor; VIN = VDD_IO or DGND Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. CAUTION: Stresses greater than those listed in Table 14 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Table 20. ABSOLUTE MAXIMUM RATINGS Symbol Definition Condition Min Max Unit -0.3 4.5 V VSUPPLY VSUPPLY Power Supply Voltage (All Supplies) ISUPPLY Total Power Supply Current - 200 mA ISUPPLY IGND Total Ground Current - 200 mA IGND VIN DC Input Voltage -0.3 VDD_IO + 0.3 V VIN VOUT DC Output Voltage -0.3 VDD_IO + 0.3 V VOUT TSTG (Note 1) Storage Temperature -40 +150 C TSTG (Note 1) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. To keep dark current and shot noise artifacts from impacting image quality, keep operating temperature at a minimum. Table 21. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND LINEAR MODE Symbol Min Typ Max Unit Digital Operating Current Definition Streaming, 1280x960 45 fps Condition IDD1 - 63 90 mA I/O Digital Operating Current Streaming, 1280x960 45 fps IDD_IO - 35 40 mA Analog Operating Current Streaming, 1280x960 45 fps IAA - 30 45 mA 10 15 mA Pixel Supply Current Streaming, 1280x960 45 fps IAA_PIX - PLL Supply Current Streaming, 1280x960 45 fps IDD_PLL - 7 15 mA Digital Operating Current Streaming, 720p 60 fps IDD1 - 63 90 mA www.onsemi.com 33 MT9M034 Table 21. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND LINEAR MODE (continued) Definition Condition Symbol Min Typ Max Unit I/O Digital Operating Current Streaming, 720p 60 fps IDD_IO - 35 40 mA Analog Operating Current Streaming, 720p 60 fps IAA - 30 45 mA Pixel Supply Current Streaming, 720p 60 fps IAA_PIX - 10 15 mA PLL Supply Current Streaming, 720p 60f ps IDD_PLL - 7 15 mA 1. Operating currents are measured at the following conditions: - VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V - VDD =1.8 V - PLL Enabled and PIXCLK = 74.25 MHz - TA = 25C - CLOAD = 10 pF Measured in dark Table 22. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND HDR MODE Definition Condition Symbol Min Typ Max Unit Digital Operating Current Streaming, 1280x960 45 fps IDD1 - 63 90 mA Digital Operating Current Streaming, 1280x960 45 fps IDD - 95 115 mA I/O Digital Operating Current Streaming, 1280x960 45 fps IDD_IO - 35 40 mA Analog Operating Current Streaming, 1280x960 45 fps IAA - 65 75 mA Pixel Supply Current Streaming, 1280x960 45 fps IAA_PIX - 15 20 mA PLL Supply Current Streaming, 1280x960 45 fps IDD_PLL - 7 15 mA Digital Operating Current Streaming, 720p 60 fps IDD - 95 115 mA I/O Digital Operating Current Streaming, 720p 60 fps IDD_IO - 35 40 mA Analog Operating Current Streaming, 720p 60 fps IAA - 61 75 mA Pixel Supply Current Streaming, 720p 60 fps IAA_PIX - 15 20 mA PLL Supply Current Streaming, 720p 60 fps IDD_PLL - 7 15 mA Condition Symbol Min Typ Max Unit Hard Standby (Clock Off) Analog, 2.8 V - - 30 100 A Digital, 1.8 V - - 85 2500 A Hard Standby (Clock On) Analog, 2.8 V - - 30 100 A Digital, 1.8 V - - 1.55 4 mA Soft Standby (Clock Off) Analog, 2.8 V - - 85 100 A Digital, 1.8 V - - 85 2500 A Analog, 2.8 V - - 30 100 A Digital, 1.8 V - - 1.55 4 mA 1. Operating currents are measured at the following conditions: - VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V - VDD =1.8 V - PLL Enabled and PIXCLK = 74.25 MHz - TA = 25C - CLOAD = 10 pF Measured in dark Table 23. STANDBY CURRENT CONSUMPTION Definition Soft Standby (Clock On) 1. Analog - VAA + VAA_PIX + VDD_PLL 2. Digital - VDD + VDD_IO www.onsemi.com 34 MT9M034 Power Supply Rejection Ratio 70 PSRR (dB) 60 50 40 30 20 10 0 1000 10000 100000 Frequency (Hz) Figure 28. Power Supply Rejection Ratio www.onsemi.com 35 1000000 MT9M034 POWER-ON RESET AND STANDBY TIMING Power-Up Sequence 5. Assert RESET_BAR for at least 1 ms 6. Wait 850000 EXTCLKs (for internal initialization into software standby) 7. Configure PLL, output, and image settings to desired values 8. Wait 1ms for the PLL to lock 9. Set streaming mode (R0x301A[2] = 1) The recommended power-up sequence for the MT9M034 is shown in Figure 29. The available power supplies (VDD_IO, VDD, VDD_PLL, VAA, VAA_PIX) must have the separation specified below. 1. Turn on VDD_PLL power supply 2. After 0-10 s, turn on VAA and VAA_PIX power supply 3. After 0-10 s, turn on VDD_IO power supply 4. After the last power supply is stable, enable EXTCLK V DD _PLL (2.8) t0 V AA _PIX V AA (2.8) t1 V DD _IO (1.8/2.8) t2 V DD(1.8) t3 EXTCLK t4 RESET_BAR tx t5 Hard Reset t6 Internal Initialization Software Standby PLL Lock Streaming Figure 29. Power Up Table 24. POWER-UP SEQUENCE Definition Symbol Minimum Typical Maximum Unit VDD_PLL to VAA/VAA_PIX (Note 3) t0 0 10 - s VAA/VAA_PIX to VDD_IO t1 0 10 - s VDD_IO to VDD t2 0 10 - s Xtal Settle Time tx - 30 (Note 1) - ms Hard Reset t4 1 (Note 2) - - ms Internal Initialization t5 850000 - - EXTCLKS PLL Lock Time t6 1 - - ms 1. Xtal settling time is component-dependent, usually taking about 10-100 ms. 2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard reset is held down by RC circuit, then the RC time must include the all power rail settle time and Xtal settle time. 3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the others. If the case happens that VDD_PLL is powered after other supplies then sensor may have functionality issues and will experience high current draw on this supply. www.onsemi.com 36 MT9M034 Power-Down Sequence 3. Turn off VDD 4. Turn off VDD_IO 5. Turn off VAA/VAA_PIX 6. Turn off VDD_PLL The recommended power-down sequence for the MT9M034 is shown in Figure 30. The available power supplies (VDD_IO, VDD, VDD_PLL, VAA, VAA_PIX) must have the separation specified below. Power may be removed from all supplies simultaneously, and a sudden loss of power on all rails does not cause damage or affect the lifetime of the device. 1. Disable streaming if output is active by setting standby R0x301A[2] = 0 2. The soft standby state is reached after the current row or frame, depending on configuration, has ended t0 VDD (1.8) t1 VDD_IO (1.8/2.8) t2 VAA _PIX VAA(2.8) t3 VDD _PLL (2.8) EXTCLK t4 Power Down until next Power up cycle Figure 30. Power Down Table 25. POWER-DOWN SEQUENCE Definition Symbol Minimum Typical Maximum Unit VDD to VDD_IO t1 0 - - s VDD_IO to VAA/VAA_PIX t2 0 - - s VAA/VAA_PIX to VDD_PLL t3 0 - - s PwrDn until Next PwrUp Time t4 100 - - ms 1. t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged. www.onsemi.com 37 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ILCC48 10x10 CASE 847AD ISSUE O DOCUMENT NUMBER: 98AON93695F DESCRIPTION: ILCC48 10X10 DATE 30 DEC 2014 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. 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