TLP2451 Photocouplers GaAAs Infrared LED & Photo IC TLP2451 1. Applications * Transistor Inverters * MOSFET Gate Drivers * IGBT Gate Drivers * Induction Cooktop and Home Appliances 2. General The TLP2451 is a photocoupler in a SO8 package that consists of a GaAAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperatures up to 125. The TLP2451 has an internal Faraday shield that provides a guaranteed Common-mode transient immunity of 15 kV/s. It has a totem-pole output that can both sink and source current. The TLP2451 is ideal for IBGT and power MOSFET gate drive. 3. Features (1) Output peak current: 0.6 A (max) (2) Operating temperature: -40 to 125 (3) Supply current: 2 mA (max) (4) Supply voltage: 10 to 30 V (5) Threshold input current: 5 mA (max) (6) Propagation delay time: tpHL/tpLH = 700 ns (max) (7) Common-mode transient immunity: 15 kV/s (min) (8) Isolation voltage: 3750 Vrms (min) (9) Safety standards UL-approved: UL1577 (approval pending) File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A (approval pending), File No.E67349 Note: VDE-approved: Option (V4) EN60747-5-2 (approval pending) (Note) When an EN60747-5-2 approved type is needed, please designate the Option (V4) (V4). 4. Packaging and Pin Configuration 1: N.C 2: Anode 3: Cathode 4: N.C 5: GND 6: Output 7: N.C 8: VCC 11-5K1S 1 2011-06-14 Rev.1.0 TLP2451 5. Internal Circuit (Note) Fig. 5.1 Internal Circuit Note: A 0.1F bypass capacitor must be connected between pin 8 and pin 5. 6. Principle of Operation 6.1. Truth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6.2. Mechanical Parameters Characteristics Min Unit Creepage distances 4.2 mm Clearance distances 4.2 Internal isolation thickness 2 2011-06-14 Rev.1.0 TLP2451 ) 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 25 Characteristics LED Symbol Input forward current Input forward current derating IF 25 mA -0.67 mA/ 1 A (Ta 110) IFP/Ta -25 mA/ VR 5 V IFP Input power dissipation Detector Peak high-level output current Peak low-level output current (Note 1) PD 40 mW (Ta 110) PD/Ta -1.0 mW/ (Ta = -40 to 125) IOPH (Note 2) -0.6 A (Ta = -40 to 125) IOPL (Note 2) +0.6 Output voltage VO 35 Supply voltage VCC 35 Output power dissipation Output power dissipation derating (Ta 110) PO 160 mW -4.0 mW/ Topr -40 to 125 Storage temperature Isolation voltage V PO/Ta Common Operating temperature Lead soldering temperature Unit IF/Ta Input reverse voltage Input power dissipation derating Rating (Ta 110) Input forward current (pulsed) Input forward current derating (pulsed) Note Tstg -55 to 150 (10 s) Tsol (Note 3) 260 AC, 1 min, R.H. 60%, Ta = 25 BVS (Note 4) 3750 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) 1 s, 300 pps Note 2: Exponential waveform. Pulse width 2 s, f 10 kHz Note 3: 2 mm below seating plane. Note 4: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit Input on-state current IF(ON) (Note 1) 7.5 15 mA Input off-state voltage VF(OFF) 0 0.8 V (Note 2) 10 30 Supply voltage VCC Peak high-level output current IOPH -0.2 Peak low-level output current IOPL +0.2 25 Operating frequency f (Note 3) A kHz Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. Note: A ceramic capacitor (0.1 F) should be connected between pin 8 and pin 5 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 s. Note 2: Denotes the operating range, not the recommended operating condition. Note 3: Exponential waveform. IOPH -0.3 A ( 2.0 s), IOPL 0.3 A ( 2.0 s), Ta = 125 3 2011-06-14 Rev.1.0 TLP2451 9. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 ) 125 Characteristics Input forward voltage Input forward voltage temperature coefficient Input reverse current Input capacitance Peak high-level output current Peak low-level output current Symbol Note Test Circuit VF VF/Ta IR Ct IOPH IOPL (Note 1) (Note 1) Fig. 12.1.1 Fig. 12.1.2 Test Condition Min Typ. Max IF = 10 mA, Ta = 25 Unit 1.45 1.55 1.7 V IF = 10 mA -2.0 mV/ VR = 5 V, Ta = 25 10 A V = 0 V, f = 1 MHz, Ta = 25 60 pF IF = 5 mA, VCC = 15 V, V8-6 = 4 V -0.4 -0.2 A IF = 5 mA, VCC = 15 V, V8-6 = 10 V -0.4 IF = 0 mA, VCC = 15 V, V6-5 = 2 V 0.2 0.5 IF = 0 mA, VCC = 15 V, V6-5 = 10 V 0.4 High-level output voltage VOH Fig. 12.1.3 IF = 5 mA, VCC = 10 V, IO = -100 mA 6.0 8.5 Low-level output voltage VOL Fig. 12.1.4 VF = 0.8 V, VCC = 10 V, IO = 100 mA 0.35 1.0 High-level supply current ICCH Fig. 12.1.5 IF = 10 mA, VCC = 10 to 30 V, VO = Open 1.1 2.0 Low-level supply current ICCL Fig. 12.1.6 IF = 0 mA, VCC = 10 to 30 V, VO = Open 1.1 2.0 Threshold input current (L/H) IFLH VCC = 15 V, VO > 1 V 1.2 5 Threshold input voltage (H/L) VFHL VCC = 15 V, VO < 1 V 0.8 Supply voltage VCC 10 30 V mA V Note: Note: All typical values are at Ta = 25. This device is designed for low power consumption, making it more sensitive to ESD than its predecessors. Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems. Note 1: IO application time 50 s, single pulse. ) 25 10. Isolation Characteristics (Unless otherwise specified, Ta = 25 Characteristics Symbol Note Test Conditions Min Typ. Max Unit 0.8 pF 1x1012 1014 3750 Vrms AC, 1 s, in oil 10000 DC, 1 min, in oil 10000 Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz Isolation resistance RS (Note 1) VS = 500 V, R.H. 60% Isolation voltage BVS AC, 1 min Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 4 2011-06-14 Rev.1.0 TLP2451 11. Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 ) 125 Characteristics Symbol Note Propagation delay time (L/H) tpLH (Note 1) Propagation delay time (H/L) tpHL Rise time Fall time Test Circuit Test Condition Min Typ. Max Unit Fig. IF = 0 5 mA, VCC = 30 V, 12.1.7 Rg = 47 , Cg = 3 nF 30 700 ns (Note 1) IF = 5 0 mA, VCC = 30 V, Rg = 47 , Cg = 3 nF 30 700 tr (Note 1) IF = 0 5 mA, VCC = 30 V, Rg = 47 , Cg = 3 nF 50 tf (Note 1) IF = 5 0 mA, VCC = 30 V, Rg = 47 , Cg = 3 nF 50 Pulse width distortion |tpHLtpLH| (Note 1) IF = 0 5 mA, VCC = 30 V, Rg = 47 , Cg = 3 nF 500 Common-mode transient immunity at output high CMH (Note 2) Fig. VCM = 1000 Vp-p, IF = 5 mA, 12.1.8 VCC = 30 V, Ta = 25, VO(min) = 26 V 15 20 Common-mode transient immunity at output low CML (Note 3) 15 20 VCM = 1000 Vp-p, IF = 0 mA, VCC = 30 V, Ta = 25, VO(min) = 1 V kV/s Note: All typical values are at Ta = 25. Note 1: f = 25 kHz, duty = 50%, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 26 V). Note 3: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 1 V). 5 2011-06-14 Rev.1.0 TLP2451 12. Test Circuits and Characteristics Curves 12.1. Test Circuits Fig. 12.1.1 IOPH Test Circuit Fig. 12.1.2 IOPL Test Circuit Fig. 12.1.3 VOH Test Circuit Fig. 12.1.4 VOL Test Circuit Fig. 12.1.5 ICCH Test Circuit Fig. 12.1.6 ICCL Test Circuit Fig. 12.1.7 Switching Time Test Circuit Fig. 12.1.8 Common-Mode Transient Immunity 6 2011-06-14 Rev.1.0 TLP2451 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow (See Fig. 13.1.1 and 13.1.2) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 13.1.1 An example of a temperature profile when Sn-Pb eutectic solder is used * Fig. 13.1.2 An example of a temperature profile when lead(Pb)-free solder is used When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Apply preheating of 150 for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 7 2011-06-14 Rev.1.0 TLP2451 14. Land Pattern Dimensions for Reference Only Fig. 14.1 Land Pattern Dimensions for Reference Only (unit: mm) 15. Marking Fig. 15.1 Marking 8 2011-06-14 Rev.1.0 TLP2451 16. EN60747-5-2 Option (V4) Specification * Part number: TLP2451 (Note) * The following part naming conventions are used for the devices that have been qualified according to option (V4) of EN60747. Example: TLP2451(V4-TP,F) V4: EN60747 option TP: Tape type F: [[G]]/RoHS COMPATIBLE (Note 1) Note: Use TOSHIBA standard type number for safety standard application. e.g., TLP2451(V4-TP,F) TLP2451 Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. Fig. 16.1 EN60747 Insulation Characteristics 9 2011-06-14 Rev.1.0 TLP2451 Fig. 16.2 Insulation Related Specifications (Note) Note: Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall take suitable measures. This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 16.3 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747. 10 2011-06-14 Rev.1.0 TLP2451 Fig. 16.4 Measurement Procedure 11 2011-06-14 Rev.1.0 TLP2451 Package Dimensions Unit: mm Weight: 0.11 g (typ.) Package Name(s) TOSHIBA: 11-5K1S 12 2011-06-14 Rev.1.0 TLP2451 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 13 2011-06-14 Rev.1.0