Microwave Ceramics and Modules 2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band Filter B69842N5257D200 Preliminary Data Sheet Features z SMD filter consisting of coupled resonators with stepped impedances z MgTiO3 - CaTiO3 (r = 21 / TCf =010 ppm/K) with a coating of copper (10m) and tin (>5m) z Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 z Component drawing z Recommended footprint Page 3 z Characteristics z Maximum ratings z Typical passband characteristic Page 4 z Processing information z Soldering requirements z Delivery mode ISSUE DATE 18.03.04 ISSUE P3 PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band Filter B69842N5257D200 Preliminary Data Sheet Component drawing View from below onto the solder terminals and view from beside Recommended footprint I/O ISSUE DATE 18.03.04 I/O ISSUE P3 PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band Filter B69842N5257D200 Preliminary Data Sheet Characteristics min. typ. max. 5250 - MHz 0.7 0.9 dB Passband IL B 200 Amplitude ripple (peak - peak) 0.3 0.8 SWR 1.5 2.0 Impedance Z 50 Power P Center frequency fc - Insertion loss Standing wave ratio Attenuation at DC to 1990 MHz at 1990 to 2170 MHz at 2400 to 2500 MHz at 6.5 to 10 GHz MHz dB 1.0 W 48 46 44 10 dB dB dB dB Maximum ratings IEC climatic category (IEC 68-1) - 40/+ 90/56 Operating temperature Top -40 / + 85 C Typical passband characteristic 0 -5 -10 -15 Att [dB] -20 S11 [dB] -25 S21 [dB] -30 -35 -40 -45 6,00 5,90 5,80 5,70 5,60 5,50 5,40 5,30 5,20 5,10 5,00 4,90 4,80 4,70 4,60 4,50 4,40 4,30 4,20 4,10 4,00 -50 freq [GHz] Processing information ISSUE DATE 18.03.04 ISSUE P3 PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band Filter B69842N5257D200 Preliminary Data Sheet z Wettability acc. to IEC 68-2-58: 75% (after aging) Soldering requirements Profile for eutectic SnPb solder paste Profile for leadfree solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) reflow 260 (max. 2 sec.) C 250 (max. 10 sec.) C Recommended soldering conditions (infrared): within 10 sec. Temp. [C] within 10 sec. Temp. [C] 245C5C 215C10C 20-40 sec. 30 sec. Time [sec.] 2.5 C/s 40-80 sec. eutectic SnPb solder paste profile 2-3 min. Time [sec.] > - 5 C/s leadfree solder paste profile Delivery mode z Blister tape acc. to IEC 286-3, PS, grey z Pieces/tape: 4000 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 18.03.04 ISSUE P3 PUBLISHER SAW MWC PD PAGE 4/4