AW9961DNR - Awinic Technology

TL1WK-DW1,L

1

LED Lamps InGaN and Phosphor

TL1WK-DW1,L

Start of commercial production

2014-08

1.

1. Applications

Applications

• General Lighting

2.

2. Features

Features

(1) Size: 0.65 (L) mm × 0.65 (W) mm × 0.36 (H) mm

(2) High luminous flux LED: 21.8 lm (typ.) @IF = 60 mA

(3) Color: White (color temperature: 6500 K (typ.))

(4) Operating temperature range: Topr = -40 to 120 

(5) Reflow-soldering is available.

3.

3. Packaging and Pin Assignment

Packaging and Pin Assignment

4-1K1

1: Anode

2: Cathode

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Rev.1.0

TL1WK-DW1,L

2

4.

4. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Forward current (DC)

Power dissipation

Operating temperature

Storage temperature

Junction temperature A

Junction temperature B

See Fig. 4.1.

(Note1)

Symbol

IF

PD

Topr

Tstg

Tj

Rating

180

0.61

-40 to 120

125

150

Unit

mA

W



Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Fig.

Fig. 4.1

4.1

4.1 I

I

IF

F

F - T

- T

- Ta

a

a (Note 1), (Note 2)

(Note 1), (Note 2)

Note 1: The junction-to-ambient thermal resistance, Rth(j-a), should be kept below 70 /W so that this product is not

exposed to a condition beyond the absolute maximum ratings.

Junction temperature A: For general lighting applications, the current rating should be limited within the range

shown by the dotted line (A) (Tj ≤ 125 ) and derated for temperature. Heat dissipation performance should

also be considered when selecting a printed circuit board.

Junction temperature B: The device temperature is between lines A and B shown in Figure 4.1 (125  < Tj ≤

150 ). Because the device becomes so hot, it could be damaged in a short period of time. Therefore, in this

temperature range, the device must not be used for any applications other than camera flashlights and similar

applications (with a short lifetime on-time).

Rth(j-a): Thermal resistance from the LED junction to ambient temperature

Note 2: This LED has a relatively large (mid-range) operating power. When it is mounted in a narrow space or together

with other components, they have mutual effects on their thermal characteristics; most notably, Rth(j-a) affects

their junction temperatures. Therefore, care should be exercised to thermal management and PCB

selection.

If this LED operates at high temperatures, be sure to provide adequate heat dissipation by using an MCP,

thermally enhanced PCB and the like, and perform thorough evaluation.

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3

5.

5. Handling Precautions

Handling Precautions

• This product is sensitive to electrostatic and care must be fully taken when handling products. Particularly

in the case that an overvoltage shall be applied, the overflowed energy may cause damage to or possibly

result in destruction of the product. Users shall take absolutely secure countermeasures against

electrostatic and surge when handling the product.

• A damage to the device might create a tiny leakage path, which causes the LED lamp not to light up in the

low-current region or causes a drop in the VF rise voltage.

Failure criterion: IF ≥ 0.5 mA @ VF = 2 V

• If multiple LEDs are connected in parallel, they will experience variations in the forward current due to

the characteristics differences in forward voltage. Ensure that the forward current of all the LEDs fall

within the intended range of the system design, for example, by inserting current-limiting resistors to each

LED string.

Circuit Example

• Since this product is intended to be used for display lighting, the measurement standard is based on the

spectral sensitivity of the human eye. It is not intended to be used for any applications other than display

lighting (e.g., sensors and light communications systems.)

• Generally, GaN-based LEDs exhibit instability or significant device-to-device variations in the relative

luminous flux in the low-current region. To avoid these problems, an application system should be

designed in such a manner that the GaN-based LEDs are driven with a forward current of 2 mA or higher.

• This device should not be reverse-biased.

• When the device is used in places that are likely to be exposed to condensation, salt or corrosive gas, the

effect on its performance and reliability must be thoroughly verified.

• Please note the handling of products during evaluation.

(1) Please do not handle apply pressure to the product with finger, tweezers, and others.

Failure of product to light up may occur due to package deformation disconnection.

(2) Please do not drop the product. There is a possibility for package transformation etc. to occur when the

product is dropped.

(3) Please do not stack the printed circuit boards on which the product is mounted to prevent damages to

product surface. Also, please note not to damage the surface of the product with cushioning material

etc. Surface damage to the product may influence their optical characteristics.

(4) Solder, flux, paper or heat-sensitive materials that might be deformed or discolored at high

temperatures should not be left on the surface of an LED lamp.

2014-09-04

Rev.1.0

TL1WK-DW1,L

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6.

6. Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Forward voltage

Thermal resistance

(junction-to-soldering point)

See Table 6.1.

Symbol

VF

Rth(j-s)

Note

(Note 1)

Test Condition

IF = 60 mA

Min

2.7



Typ.

2.8

17

Max

3.1



Unit

V

/W

Note 1: Rth(j-s): Thermal resistance from the LED junction to solder point.

Table

Table 6.1

6.1

6.1 Forward Voltage Rank (Note)

Forward Voltage Rank (Note)

Rank

1

2

3

4

Test Condition

IF = 60 mA, Ta = 25 , Tolerance ±0.1 V

Forward Voltage

(Min)

2.7

2.8

2.9

3.0

Forward Voltage

(Max)

2.8

2.9

3.0

3.1

Unit

V

Note: This LED lamp is sorted into forward voltage (VF) ranks shown above. Each reel includes the same rank LEDs.

Let the delivery ratio of each rank be unquestioned.

7.

7. Optical Characteristics (Note) (Unless otherwise specified, T

Optical Characteristics (Note) (Unless otherwise specified, T

Optical Characteristics (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Chromaticity

Luminous flux

Color temperature

Color rendering index

Symbol

Cx

Cy

φV

CCT

Ra

Note

(Note 1)

(Note 2)

(Note 3)

Test Condition

IF = 60 mA

Min



18.0



80

Typ.



21.8

6500



Max



25.5



Unit



lm

K



Note: The optical characteristics are for an aluminum board coated with white solder resist with a reflectivity of 90 %

or greater.

Note 1: See Fig. 7.1 and Table 7.1 for chromaticity rank.

Note 2: See Table 7.2 for luminous flux rank.

Note 3: Tolerance: ±2

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Fig.

Fig. 7.1

7.1

7.1 Chromaticity Rank (Note)

Chromaticity Rank (Note)

Note: Test conditions: IF = 60 mA, Ta = 25 , Tolerance: ±0.01

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Table

Table 7.1

7.1

7.1 Chromaticity Rank (Note)

Chromaticity Rank (Note)

Rank

1A1

1A2

1A3

1A4

1B1

1B2

1B3

1B4

Cx

0.3068

0.3058

0.3098

0.3106

0.3058

0.3048

0.3089

0.3098

0.3089

0.3130

0.3137

0.3106

0.3098

0.3137

0.3144

0.3048

0.3038

0.3080

0.3089

0.3038

0.3028

0.3072

0.3080

0.3072

0.3115

0.3123

0.3089

0.3080

0.3123

0.3130

Cy

0.3113

0.3160

0.3199

0.3150

0.3160

0.3207

0.3249

0.3199

0.3249

0.3290

0.3238

0.3150

0.3199

0.3238

0.3186

0.3207

0.3256

0.3298

0.3249

0.3256

0.3304

0.3348

0.3298

0.3348

0.3391

0.3341

0.3249

0.3298

0.3341

0.3290

Rank

1C1

1C2

1C3

1C4

1D1

1D2

1D3

1D4

Cx

0.3130

0.3123

0.3166

0.3172

0.3123

0.3115

0.3160

0.3166

0.3160

0.3205

0.3209

0.3172

0.3166

0.3209

0.3213

0.3144

0.3137

0.3177

0.3183

0.3137

0.3130

0.3172

0.3177

0.3172

0.3213

0.3217

0.3183

0.3177

0.3217

0.3221

Cy

0.3290

0.3341

0.3384

0.3332

0.3341

0.3391

0.3436

0.3384

0.3436

0.3481

0.3427

0.3332

0.3384

0.3427

0.3373

0.3186

0.3238

0.3278

0.3224

0.3238

0.3290

0.3332

0.3278

0.3332

0.3373

0.3317

0.3224

0.3278

0.3317

0.3261

Note: This LED lamp is sorted into chromaticity coordinate groups shown above. Each reel includes the same rank

LEDs. Let the delivery ratio of each rank be unquestioned.

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Table

Table 7.2

7.2

7.2 Luminous Flux Rank (Note)

Luminous Flux Rank (Note)

Rank

C13A

C13B

C14A

C14B

Test Condition

IF = 60 mA, Ta = 25 , Tolerance ±10 %

Luminous Flux (Min)

18.0

19.6

21.4

23.3

Luminous Flux (Max)

19.6

21.4

23.3

25.5

Unit

lm

Note: This LED lamp is sorted into luminous flux ranks shown above. Each reel includes the same rank LEDs. Let

the delivery ratio of each rank be unquestioned.

Rank notations: The luminous flux, chromaticity and VF ranks are printed on labels as shown below:

Example: 1A3 C14A 2

1A3: Chromaticity rank

C14A: Luminous flux rank

2: VF rank

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8.

8. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 8.1

8.1

8.1 I

I

IF

F

F - V

- V

- VF

F

FFig.

Fig.

Fig. 8.2

8.2

8.2 Relative Luminous Flux - I

Relative Luminous Flux - I

Relative Luminous Flux - IF

F

Fig.

Fig. 8.3

8.3

8.3 Relative Luminous Flux - T

Relative Luminous Flux - T

Relative Luminous Flux - Ta

a

aFig.

Fig.

Fig. 8.4

8.4

8.4 Chromaticity - I

Chromaticity - I

Chromaticity - IF

F

Fig.

Fig. 8.5

8.5

8.5 Chromaticity - T

Chromaticity - T

Chromaticity - Ta

a

aFig.

Fig.

Fig. 8.6

8.6

8.6 Wavelength Characteristic

Wavelength Characteristic

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TL1WK-DW1,L

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Fig.

Fig. 8.7

8.7

8.7 Radiation Pattern

Radiation Pattern

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

Note: The above optical characteristics curves are for an aluminum board coated with white solder resist with a

reflectivity of 90 % or greater.

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9.

9. Packing

Packing

9.1.

9.1. Moisture-Proof Packaging

Moisture-Proof Packaging

These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid

moisture absorption. The optical characteristics of the device may be affected by exposure to moisture in the air

before soldering and the device should therefore be stored under the following conditions:

• This moisture proof bag may be stored unopened within 12 months at the following conditions.

Temperature: 5  to 30 

Humidity: 90 % (max)

• After opening the moisture proof bag, the device should be assembled within 4 weeks in an environment of

5  to 30 /60 % RH or below.

• If upon opening, the moisture indicator card shows humidity 30 % or above (Color of indication changes to

pink) or the expiration date has passed, the device should be baked in taping with reel.

After baking, use the baked device within 72 hours, but perform baking only once.

Baking conditions: 60 ± 5 , for 12 to 24 hours.

Expiration date: 12 months from sealing date, which is imprinted on the label affixed.

• Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.

Furthermore, prevent the devices from being destructed against static electricity for baking of it.

• If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not

throw or drop the packed devices.

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10.

10. Mounting

Mounting

10.1.

10.1. Mounting Precautions

Mounting Precautions

• Do not apply mechanical stress to the resin body at high temperature.

The time taken for a device to return to the room temperature after reflow soldering depends on the

mounting board and environmental conditions.

• The resin body is easily scratched. Avoid friction against hard materials.

• When installing an assembled board into equipment, ensure that the devices on the board do not contact

with other components.

10.2.

10.2. Soldering

Soldering

Following show examples of reflow soldering.

• Temperature Profile (see following figures.)

Fig.

Fig. 10.2.1

10.2.1

10.2.1 Temperature Profile for

Temperature Profile for

Lead(Pb)-free Soldering (example)

Table 10.2.1 Temperature Profile for

Lead(Pb)-free Soldering (example)

• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed

the condition as a evaluation. Please perform reflow soldering under the above conditions.

• Please perform the first reflow soldering with reference to the above temperature profile and within 4

weeks of opening the package.

• If a second reflow process is necessary, reflow soldering should be performed within 168 h of the first

reflow under the above conditions. Storage conditions before the second reflow soldering: 30 , 60 % RH

(max)

• Do not perform wave soldering.

• Do not make soldering corrections manually.

10.3.

10.3. Land Pattern Dimensions (for reference only)

Land Pattern Dimensions (for reference only)

Fig.

Fig. 10.3.1

10.3.1

10.3.1 (Unit: mm)

(Unit: mm)

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11.

11. Cleaning

Cleaning

• Flux cleaning should be completed free of residual reactive ion such as Na, Cl, etc. Organic solvent acts

upon water and generates corrosive gas such as hydrogen chloride. There are some cases where the device

is degraded.

• Effective solvent seriously affects package and resin, and may cause inferior device. In actually using it,

please sufficiently check whether there is nothing inferior on the device.

• Ultrasonic cleaning that provides effective cleaning for short time much affects on the device. so coherence

between resin and lead metal is degraded by cleaning solvent during long ultrasonic cleaning. We

recommend to take ultrasonic cleaning for the device at a minimum range. The influences on a device is

occurred by the output of an ultrasonic wave and set board, please sufficiently check whether there is

nothing inferior on the device.

12.

12. Tape Specifications

Tape Specifications

12.1.

12.1. Product Naming Conventions

Product Naming Conventions

The type of package used for shipment is denoted by a symbol suffix after the part number. The method of

classification is as below. (this method, however does not apply to products whose electrical characteristics differ

from standard Toshiba specifications)

Example: TL1WK-DW1,L

Toshiba part number: TL1WK-DW1

Packing type: L (Taping)

12.2.

12.2. Handling Precautions

Handling Precautions

The tape is antistatic-coated. However, if the tape is charged with excess static electricity, devices might

cling to the tape or waggle in the tape when the cover tape peeled off. Be aware of the following to avoid

this:

 Use an ionizer to neutralize the ions when utilizing an automatic mounter.

 For transport and temporary storage of devices, use containers (boxes, jigs, bags) that are made with

antistatic materials or materials that dissipate static electricity.

12.3.

12.3. Tape Dimensions

Tape Dimensions

Table

Table 12.3.1

12.3.1

12.3.1 Tape Dimensions (Unit: mm)

Tape Dimensions (Unit: mm)

Dimensions

Tolerance

D

1.5

+0.1/-0

E

1.75

±0.1

P0

4.0

±0.05

t

0.2

±0.05

F

3.5

±0.05

D1

0.2

±0.05

P2

2.0

±0.05

W

8.0

±0.1

P

2.0

±0.05

A0

0.74

+0.03/

-0.02

B0

0.74

+0.03/

-0.02

K0

0.48

±0.03

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12.4.

12.4. Reel Specification

Reel Specification

12.4.1.

12.4.1. Reel Dimensions

Reel Dimensions

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TL1WK-DW1,L

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12.4.2.

12.4.2. Tape Leader and Trailer

Tape Leader and Trailer

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12.5.

12.5. Packing Form

Packing Form

Each reel is sealed in an aluminum pack with silica gel. Packing quantity is as shown below.

• Reel: 5,000 pcs

• Carton: 25,000 pcs

• Sealed aluminum pack with silica gel

12.6.

12.6. Label Format

Label Format

Label example for TL1WK-DW1,L and label location are as shown below.

12.6.1.

12.6.1. Label Example

Label Example

12.6.2.

12.6.2. Label Details

Label Details

No. (# refer to the above

label example)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

Information for Toshiba Use

Part No.

ADD code

Lot code

Rank symbol

Storage condition after opening

Packing quantity

Key code

Country of origin

Remarks

TL1WK-DW1,L

(O

Example: 270xxxxx

Example: 1A3C14A2

Use under 5 - 30 /60 %RH within 4 weeks

Example: 5,000 pcs

Example: 12345

Example: JAPAN

12.6.3.

12.6.3. Label Location

Label Location

Fig.

Fig. 12.6.3.1

12.6.3.1

12.6.3.1 Label Position on the Reel

Label Position on the Reel

Label Position on the Reel Fig.

Fig.

Fig. 12.6.3.2

12.6.3.2

12.6.3.2 Label Position on the Carton

Label Position on the Carton

Aluminum pack:The aluminum pack in which the reel is supplied also has the label attached to center of one side.

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13.

13. Internal Circuit

Internal Circuit

1: Anode

2: Cathode

Package Dimensions

Unit: mm

Weight: 0.0003 g (typ.)

Package Name(s)

TOSHIBA: 4-1K1

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RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE").

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,

equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,

trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,

elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR

IF YOU USE PRODUCT FOR

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representative.

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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

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FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

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OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and

regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all

applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

2014-09-04

Rev.1.0