MR10Q010SC - EVERSPIN TECHNOLOGIES

MR10Q010

• High bandwidth – Read and Write at 52MB/sec

• Quad I/O with the use of dual purpose pins to maintain a low pin count

• Operates in both standard, single SPI mode and high speed quad SPI mode

• Fast quad Read and Write with quad address input and quad I/O

• Intended for next generation RAID controllers, server system logs, storage device

buers, and embedded system data and program memory

• Data is non-volatile with retention greater than 20 years

• Automatic data protection on power loss

• Unlimited write endurance

• Low-current sleep mode

• Dual 3.3v VDD / 1.8v VDDQ power supply

• Tamper Detect function will detect possible data modication from outside mag-

netic elds.

• Quad Peripheral Interface (QPI) mode is supported to enhance system performance

for Execute in Place (XIP) operation.

• MSL Level 3.

The MR10Q010 is the ideal memory solution for applications that must store and retrieve data and programs quickly

using a small number of pins, low power, and choice of a 24-ball BGA or a 16-pin SOIC package. The four I/O’s in Quad

SPI mode allow very fast reads and writes, making it an attractive alternative to conventional parallel data bus inter-

faces in next generation RAID controllers, server system logs, storage device buers, and embedded system data and

program memory.

Using Everspin’s patented MRAM technology, both reads and writes can occur randomly in memory with no delay

between writes.

Standard Serial Peripheral Interface (SPI), Quad SPI and Quad Peripheral Interface (QPI) modes are supported at a clock

rate up to 104MHz. XIP operation is supported for Read commands in all three modes.

The MR10Q010 Quad SPI MRAM is organized as 131,072 words of 8 bits.

16-SOIC

DESCRIPTION

1 Mb High Speed Quad SPI MRAM

RoHS

Mode Command Set Utility Commands XIP Command Operation

SPI Mode Read 40MHz. Write, Fast Read

104MHz

Write Enable/Disable, Sleep Mode, Read/Write

Status Register, Tamper Detect, Read Device ID,

Enable QPI Mode

Fast Read

Quad SPI Mode Quad I/O mode Read/Write data,

or both address and data None. Fast Read Quad Output, Fast Read

Quad Address and Data

QPI Mode Enables command instruction

entry in quad I/O mode. (2 clocks) Disable QPI Mode. Fast Read, Fast Read Quad Output,

Fast Read Quad Address and Data

Operational Overview

FEATURES

24-BGA

MR10Q010

2MR10Q010 Revision 5.6, 6/2018

TABLE OF CONTENTS

Operational Overview ....................................................................................................................1

OVERVIEW ............................................................................................................................................7

Table 1 – Operational Parameters Summary ...................................................................................................... 7

Operation in 3.3v Data Bus Systems - Evaluation Board Available .............................................7

Figure 1 – MR10Q010 Block Diagram .................................................................................................................... 8

Figure 2 – System Conguration ............................................................................................................................. 9

Figure 3 – 16-SOIC Package Pin Assignments ..................................................................................................10

Table 2 – 16-SOIC Pin Functions ............................................................................................................................ 10

Figure 4 – 24-BGA Package Ball Assignments ..................................................................................................12

Table 3 – 24-BGA Ball Functions ............................................................................................................................ 12

STATUS REGISTER ............................................................................................................................. 14

Table 4 – Status Register Bit Denitions ............................................................................................................. 14

Memory Protection Modes .......................................................................................................... 15

Table 5 – Memory Protection Modes ..................................................................................................................15

Block Protection Modes ............................................................................................................... 15

Table 6 – Block Memory Write Protection ..........................................................................................................15

SPI COMMUNICATIONS PROTOCOL ................................................................................................ 16

SPI MODE COMMANDS .................................................................................................................... 16

Table 7 – SPI Mode Commands Overview ......................................................................................................... 17

SPI Mode Commands Overview .................................................................................................. 17

Read Status Register (RDSR) ........................................................................................................ 18

Figure 5 – Read Status Register (RDSR) Command Operation .................................................................. 18

Write Enable (WREN) .................................................................................................................... 19

Figure 6 – Write Enable (WREN) Command Operation ................................................................................ 19

Write Disable (WRDI) .................................................................................................................... 20

Figure 7 – Write Disable (WRDI) Command Operation ................................................................................ 20

MR10Q010

Write Status Register (WRSR) ...................................................................................................... 21

Figure 8 – Write Status Register (WRSR) Command Operation ................................................................21

Read Data Bytes (READ) ............................................................................................................... 22

Figure 9 – Read Data Bytes (READ) Command Operation ...........................................................................22

Fast Read Data Bytes (FREAD) ..................................................................................................... 23

Figure 10 – Fast Read Data Bytes (FREAD) Command Operation .............................................................23

Write Data Bytes (WRITE) ............................................................................................................. 24

Figure 11 – Write Data Bytes (WRITE) Command Operation ......................................................................24

Enter Sleep Mode (SLEEP) ............................................................................................................ 25

Figure 12 – Enter Sleep Mode (SLEEP) Command Operation .....................................................................25

Exit Sleep Mode (WAKE) ............................................................................................................... 26

Figure 13 – Exit Sleep Mode (WAKE) Command Operation ........................................................................26

Tamper Detect (TDET) .................................................................................................................. 27

Figure 14 – Tamper Detect (TDET) Command Operation ............................................................................27

Tamper Detect Exit (TDETX) ........................................................................................................ 28

Figure 15 – Tamper Detect Exit (TDETX) Command Operation ................................................................. 28

Read ID (RDID) .............................................................................................................................. 29

Figure 16 – Read ID (RDID) Command Operation ...........................................................................................29

Table 8 – Device ID for MR10Q010 .......................................................................................... 30

QUAD SPI MODE COMMANDS ......................................................................................................... 31

Quad SPI Mode Commands Overview ........................................................................................ 31

Table 9 – Quad SPI Mode Commands Overview .............................................................................................31

Fast Read Quad Output (FRQO) .................................................................................................. 32

Figure 17 – Fast Read Quad Output (FRQO) Command Operation .......................................................... 33

Fast Read Quad Address and Data (FRQAD) .............................................................................. 34

Figure 18 – Fast Read Quad Address and Data (FRQAD) Command Operation ..................................35

Table of Contents (Cont’d)

MR10Q010

4MR10Q010 Revision 5.6, 6/2018

Fast Write Quad Data (FWQD) ...................................................................................................... 36

Figure 19 – Fast Write Quad Data (FWQD) Command Operation .............................................................36

Fast Write Quad Address and Data (FWQAD) ............................................................................. 37

Figure 20 – Fast Write Quad Address and Data (FWQAD) Command Operation ................................37

QPI MODE .......................................................................................................................................... 38

Table 10 – SPI Mode Command Structures in QPI Mode .............................................................................38

Table 11 – Quad SPI Mode Command Structures in QPI Mode .................................................................39

Enable QPI (EQPI) Command ....................................................................................................... 40

Figure 21 – Enable QPI Mode (EQPI) Command Operation .......................................................................40

Disable QPI (DQPI) Command ..................................................................................................... 41

Figure 22 – Disable QPI Mode (DQPI) Command Timing ............................................................................ 41

EXECUTE IN PLACE XIP MODE....................................................................................................... 42

Table 12 – Mode Byte Denitions to Set/Reset XIP Mode ...........................................................................42

Table 13 – XIP Mode with FREAD Command ....................................................................................................43

Figure 23 – FREAD Command- Set XIP Mode - Initial Access .....................................................................44

Figure 24 – FREAD Command - XIP Mode Set - Next Access .....................................................................45

Figure 25 – FREAD Command - XIP Mode Exit ................................................................................................. 46

Table 14 – XIP Operation with FRQO Command .............................................................................................47

Figure 26 – FRQO Command - Set XIP Mode - Initial Access ....................................................................48

Figure 27 – FRQO Command - XIP Mode Set - Next Access .......................................................................49

Figure 28 – FRQO Command - XIP Mode Exit ...................................................................................................50

Table 15 – XIP Operation with FRQAD Command ..........................................................................................51

Figure 29 – FRQAD Command - Set XIP Mode - Initial Access ..................................................................52

Figure 30 – FRQAD Command - XIP Mode Set - Next Access ....................................................................53

Figure 31 – FRQAD Command - XIP Mode Exit ................................................................................................ 54

ELECTRICAL SPECIFICATIONS ......................................................................................................... 55

Table of Contents (Cont’d)

MR10Q010

Table 16 – Absolute Maximum Ratings ...........................................................................................................55

Table 17 – Operating Conditions ..........................................................................................................................56

Table 18 – DC Characteristics .................................................................................................................................56

Table 19 – Power Supply Characteristics ............................................................................................................57

Table 20 – Capacitance ............................................................................................................................................. 57

TIMING SPECIFICATIONS ................................................................................................................. 58

AC Measurement Conditions ....................................................................................................... 58

Table 21 – AC Measurement Conditions ............................................................................................................58

Figure 32 – Output Load for Impedance Parameter Measurements .......................................................58

Figure 33 – Output Load for all Other Parameter Measurements .............................................................58

Power Up Timing .......................................................................................................................... 59

Table 22 – Power-Up Delay Minimum Voltages and Timing ....................................................................... 59

Figure 34 – Power-Up Timing ................................................................................................................................ 60

AC Timing Parameters .................................................................................................................. 61

Table 23 – AC Timing Parameters .........................................................................................................................61

Figure 35 – Synchronous Data Timing (READ) .................................................................................................63

Figure 36 – Synchronous Data Timing Fast Read (FREAD) ...........................................................................63

Figure 37 – Synchronous Data Timing (WRITE) ...............................................................................................64

Figure 38 – Synchronous Data Timing Fast Write Quad Data and Fast Write Quad Address and

Data (FWQD and FWQAD) .............................................................................................................................. 64

Figure 39 – HOLD Timing .......................................................................................................................................65

PART NUMBERS AND ORDERING .................................................................................................... 66

Table 24 – Part Numbering System ......................................................................................................................66

Table 25 – Ordering Part Numbers .......................................................................................................................66

PACKAGE CHARACTERISTICS .......................................................................................................... 67

Table of Contents (Cont’d)

MR10Q010

6MR10Q010 Revision 5.6, 6/2018

Table 26 – Thermal Resistance 16-pin SOIC .....................................................................................................67

Figure 40 – 16-SOIC Package Outline .................................................................................................................68

Figure 41 – 24 Ball BGA Package Outline .......................................................................................................... 70

HOW TO REACH US ........................................................................................................................... 72

Table of Contents (Cont’d)

MR10Q010

The Serial Peripheral Interface, SPI, is becoming increasingly popular in system design due to the reduced

pin count of the serial interface and increasing data bandwidth oered when compared against x8 or x16

parallel interface architectures. The SPI interface has evolved from a single data line to a four data line, or

quad architecture. This interface provides a data bandwidth in excess of 50Mbytes/sec.

SPI is currently well-established in microcontroller/microprocessor based systems. The Everspin family of

single I/O SPI MRAM is popular in smart meter applications and a variety of other embedded systems. How-

ever, the 40MHz limitation with a single data I/O may be too slow for higher performance applications such

as the next generation RAID controllers, server system logs, and storage device buers .

Operating at 52MB/second for both Read and Write the Everspin 1Mb Quad I/O SPI MRAM will meet the

needs of these applications. And as a non-volatile memory with over 20 years of data retention, this SPI

memory family is equally suited for embedded system data and program memory.

The Quad Peripheral Interface, QPI, mode provides a lower overhead to load commands, which will improve

system throughput when operating in an Execute in Place, XIP, environment. This added feature will make

the device attractive in embedded applications that store program code in an external memory. QPI eec-

tively increases the eective clock rate and, when combined with Quad SPI instructions, Quad SPI memory

performance will outstrip asynchronous parallel memories.

OVERVIEW

Table 1 – Operational Parameters Summary

Density Interface Voltage

(V)

Read/

Write

Active Current

R/W (mA)

Standby

Current

(mA)

Sleep

Current

(A)

Package

1 Mb 104MHz Quad SPI 3.3v VDD

1.8v VDDQ

52MB/sec 60/100 8.0 100 16-SOIC

Operation in 3.3v Data Bus Systems - Evaluation Board Available

The Everspin MR10Q010 Quad SPI Serial MRAM requires a 3.3v VDD power supply and is designed to operate

on a 1.8v I/O bus. Adapting the MR10Q010 to operate on a 3.3v data bus can be done by interfacing it to the

bus through a level translator.

An evaluation board is available to test this adaptation of the MR10Q010 in an existing system. It can be

connected to the bus at the board position currently occupied by a SPI or Quad SPI E2PROM and operate

with the MR10Q010 I/O levels translated for operation on a 3.3v bus.

Contact Everspin for more information about the MR10Q010 3.3v evaluation board and adapting your 3.3v

bus system to operate with MR10Q010 MRAM.

MR10Q010

8MR10Q010 Revision 5.6, 6/2018

Figure 1 – MR10Q010 Block Diagram

SCK

WP or I/O2

HOLD or I/O3

SO or I/O1

Data I/O

Instrucon Decode

Control Logic

Write Protect

Clock Generator

Nonvolale Status

1 Mb

SPI MRAM

Array

Serial I/O

Interface

SI or I/O0

Address Register

Counter

MR10Q010

MOSI or I/O0

MISO or I/O1

(Master Out - Slave In)

SCK

SPI

Micro Controller

I/O1

I/O2

I/O0

HOLD or I/O3 (1)

CS (1)

WP or I/O2 (1)

HOLD

I/O3

SCK

I/O1

I/O2

I/O0

HOLD

I/O3

HOLD or I/O3 (2)

CS (2)

WP or I/O2 (2)

(Master In - Slave Out)

Figure 2 – System Conguration

MR10Q010

10 MR10Q010 Revision 5.6, 6/2018

Table 2 – 16-SOIC Pin Functions

Signal

Name Pin SPI Mode Quad SPI

Mode 1Description

CS 7 Chip Select Chip Select

An active low chip select for the serial MRAM. When chip select is

high, the memory is powered down to minimize standby power,

inputs are ignored and the serial output pin is Hi-Z. Multiple serial

memories can share a common set of data pins by using a unique

chip select for each memory.

SO (I/O1) 8 Serial Output I/O 1

SPI Mode: The data output pin is driven during a read operation and

remains Hi-Z at all other times. SO is Hi-Z when HOLD is low. Data

transitions on the data output occur on the falling edge of SCK.

Quad SPI Mode: Bidirectional I/O to serially write instructions, ad-

dresses or data to the device on the rising edge of SCK or read data

output from the device on the falling edge of SCK.

Table continues on next page.

16-SOIC

HOLD (I/O 3)

VDDQ

VDD

VSS

SCK

SI (I/O 0)

VSSQ

SO (I/O 1)

WP (I/O 2)

TOP VIEW

Figure 3 – 16-SOIC Package Pin Assignments

MR10Q010

16-SOIC Pin Functions - Continued

Signal

Name Pin SPI Mode Quad SPI

Mode 1Description

WP (I/O2) 9 Write Protect I/O 2

SPI Mode: A low on the write protect input prevents write opera-

tions to the Status Register.

Quad SPI Mode: Bidirectional I/O to serially write instructions, ad-

dresses or data to the device on the rising edge of SCK or read data

output from the device on the falling edge of SCK.

VSS 11, 14 Ground Ground Power supply ground pin.

VSSQ 10 Ground Ground I/O Voltage ground pin.

SI (I/O0) 15 Serial Input I/O 0

SPI Mode: All data is input to the device through this pin. This pin

is sampled on the rising edge of SCK and ignored at other times. SI

can be tied to SO to create a single bidirectional data bus if desired.

Quad SPI Mode: Bidirectional I/O to serially write instructions, ad-

dresses or data to the device on the rising edge of SCK or read data

output from the device on the falling edge of SCK.

SCK 16 Clock Clock

Synchronizes the operation of the MRAM. The clock can operate up

to 104 MHz to shift commands, address, and data into the memory.

Inputs are captured on the rising edge of clock. Data outputs from

the MRAM occur on the falling edge of clock. The serial MRAM sup-

ports both SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1,

CPHA=1). In Mode 0, the clock is normally low. In Mode 3, the clock

is normally high. Memory operation is static so the clock can be

stopped at any time.

HOLD

(I/O3)1 HOLD I/O 3

SPI Mode: A low on the HOLD pin interrupts a memory operation

for another task. When HOLD is low, the current operation is sus-

pended. The device will ignore transitions on the CS and SCK when

HOLD is low. All transitions of HOLD must occur while CS is low.

Quad SPI Mode: Bidirectional I/O to serially write instructions, ad-

dresses or data to the device on the rising edge of SCK or read data

output from the device on the falling edge of SCK.

VDD 3, 6 Power Supply Power Supply Power supply voltage from +3.0 to +3.6 volts.

VDDQ 2I/O Bus Power

Supply

I/O Bus Power

Supply I/O Bus supply voltage from +1.7 volts to +1.9 volts.

MR10Q010

12 MR10Q010 Revision 5.6, 6/2018

Table 3 – 24-BGA Ball Functions

Signal

Name Ball SPI Mode Quad SPI

Mode 1Description

CS C2 Chip Select Chip Select

An active low chip select for the serial MRAM. When chip select is

high, the memory is powered down to minimize standby power,

inputs are ignored and the serial output pin is Hi-Z. Multiple serial

memories can share a common set of data pins by using a unique

chip select for each memory.

SO (I/O1) D2 Serial Output I/O 1

SPI Mode: The data output pin is driven during a read operation and

remains Hi-Z at all other times. SO is Hi-Z when HOLD is low. Data

transitions on the data output occur on the falling edge of SCK.

Quad SPI Mode: Bidirectional I/O to serially write instructions, ad-

dresses or data to the device on the rising edge of SCK or read data

output from the device on the falling edge of SCK.

Table continues on next page.

Figure 4 – 24-BGA Package Ball Assignments

1 2 3 4 5

A B C D E

NCNC NC NC

NC SCK

NC NC NC NC

VDD

VSS

VDDQ

CS WP

IO2

IO3

IO1

IO0

HOLD

• 24-ball BGA package.

• 8mm x 6mm package outline.

• Serial NOR Flash pinout compatible.

• VDDQ on ball E4 to support 1.8v I/O.

• No VSSQ ball.

MR10Q010

24-BGA Ball Functions - Continued

Signal

Name Ball SPI Mode Quad SPI

Mode 1Description

WP (I/O2) C4 Write Protect I/O 2

SPI Mode: A low on the write protect input prevents write opera-

tions to the Status Register.

Quad SPI Mode: Bidirectional I/O to serially write instructions, ad-

dresses or data to the device on the rising edge of SCK or read data

output from the device on the falling edge of SCK.

VSS B3 Ground Ground Power supply ground pin.

SI (I/O0) D3 Serial Input I/O 0

SPI Mode: All data is input to the device through this pin. This pin

is sampled on the rising edge of SCK and ignored at other times. SI

can be tied to SO to create a single bidirectional data bus if desired.

Quad SPI Mode: Bidirectional I/O to serially write instructions, ad-

dresses or data to the device on the rising edge of SCK or read data

output from the device on the falling edge of SCK.

SCK B2 Clock Clock

Synchronizes the operation of the MRAM. The clock can operate up

to 104 MHz to shift commands, address, and data into the memory.

Inputs are captured on the rising edge of clock. Data outputs from

the MRAM occur on the falling edge of clock. The serial MRAM sup-

ports both SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1,

CPHA=1). In Mode 0, the clock is normally low. In Mode 3, the clock

is normally high. Memory operation is static so the clock can be

stopped at any time.

HOLD

(I/O3)D4 HOLD I/O 3

SPI Mode: A low on the HOLD pin interrupts a memory operation

for another task. When HOLD is low, the current operation is sus-

pended. The device will ignore transitions on the CS and SCK when

HOLD is low. All transitions of HOLD must occur while CS is low.

Quad SPI Mode: Bidirectional I/O to serially write instructions, ad-

dresses or data to the device on the rising edge of SCK or read data

output from the device on the falling edge of SCK.

VDD B4 Power Supply Power Supply Power supply voltage from +3.0 to +3.6 volts.

VDDQ E4 I/O Bus Power

Supply

I/O Bus Power

Supply I/O Bus supply voltage from +1.7 volts to +1.9 volts.

MR10Q010

14 MR10Q010 Revision 5.6, 6/2018

The status register consists of the 8 bits shown in Table 3 below.

The Status Register Write Disable bit (SRWD, Bit 7) is used in conjunction with the Write Enable Latch (WEL,

bit 1) and the Write Protection pin (WP) to provide hardware memory block protection. Their usage for

memory block protection is dened in “Table 5 – Memory Protection Modes” . The Status Register Write Dis-

able bit is non-volatile and will remain set whenever power is removed from the memory. The WEL bit (Bit 7)

is volatile and set by the Write Enable command. It is set to “0” at power up and reset to “0” when recovering

from a loss of power.

The status of memory block protection is indicated by the states of bits BP0 and BP1 (Bits 2 and 3) and are

also dened in “Table 5 – Memory Protection Modes” on page 15. BP0 and BP1 are non-volatile and re-

main set if power is removed from the memory.

The QPI Mode bit (Bit 6) indicates whether the memory is in QPI mode or not. Its value is set when the En-

able QPI (EQPI) or Disable QPI (DQPI) commands are invoked. Logic “1” indicates QPI mode is enabled. The

QPI Mode Bit is volatile and set to “0” at power up and reset to “0” when recovering from a loss of power.

The fast writing speed of the MR10Q010 does not require write status bit information (Normally Bit 0). The

state of reserved bits 4, 5, and 0 can be modied by the user but do not aect memory operation.

All bits in the status register are pre-set at the factory to the “0” state.

Non-reserved Status Register bits are non-volatile with the exception of the WEL and QPI Mode which are

reset to 0 upon power cycling.

STATUS REGISTER

Table 4 – Status Register Bit Denitions

Bit Denitions:

7 - SRWD - Status Register Write Disable

6 - QPI Mode bit. Logic 1 = The device is in QPI Mode. Set by the Enable QPI (page 40) and Disable QPI Commands (page

41). Cannot be modied by the Write Status Register Command (page 21). Reset to “0” upon any power cycling.

5 - R2 - Reserved bit 2

4 - R1 - Reserved bit 1

3 - BP1 - Block Protect bit 1

2 - BP0 - Block Protect bit 0

1 - WEL - Write Enable Latch bit. Set by the Write Enable (page 19) Command. Reset to “0” upon any power cycling.

0 - R0 - Reserved bit 0. This is the “Write in Progress” bit for many memory devices. For MR10Q010, the “Write in progress” bit (bit

0) is not written by the memory because there is no write delay with MRAM.

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

SRWD

(Non volatile)

QPI Mode

(Volatile) R2 R1 BP1

(Non-Volatile)

BP0

(Non-Volatile)

WEL

(Volatile) R0

MR10Q010

WEL SRWD WP Protected Blocks Unprotected Blocks Status

0 X X Protected Protected Protected

1 0 X Protected Writable Writable

1 1 Low Protected Writable Protected

1 1 High Protected Writable Writable

Table 5 – Memory Protection Modes

Table 6 – Block Memory Write Protection

The memory enters hardware block protection when the WP input is low and the Status Register Write Dis-

able (SRWD) Bit is set to 1. The memory leaves hardware block protection only when the WP pin goes high.

While WP is low, the write protection blocks for the memory are determined by the status register bits BP0

and BP1 and cannot be modied without taking the WP signal high again.

If the WP signal is high (independent of the status of SRWD Bit), the memory is in software protection mode.

This means that block write protection is controlled solely by the status register BP0 and BP1 block write pro-

tect bits and this information can be modied using the WRSR command.

Status Register Memory Contents

BP1 BP0 Protected Area Unprotected Area

0 0 None All Memory

0 1 Upper Quarter Lower Three-Quarters

1 0 Upper Half Lower Half

1 1 All None

Block Protection Modes

When WEL is reset to 0, writes to all blocks and the status register are protected. When WEL is set to 1, BP0

and BP1 determine which memory blocks are protected. While SRWD is reset to 0 and WEL is set to 1, status

BP1.

Memory Protection Modes

MR10Q010

16 MR10Q010 Revision 5.6, 6/2018

SPI MODE COMMANDS

All memory transactions start when CS is brought low, selecting the memory. The rst byte is an 8-bit com-

mand code in hexadecimal. The subsequent 24 bits entered are address input. Following the address input

(except for the FREAD command) the device will read/write data beginning at the address entered.

For the FREAD command the Mode Byte must be entered following the address. The Mode Byte will either

set or reset the XIP mode. See ”Execute in Place (XIP) Mode” on page 42.

There is only one command performed per CS active period. CS must go inactive before another command

can be accepted. Note: To avoid partial or aborted accesses, memory access must remain active (CS low) for

a multiple of 8 clocks from CS going low (the end of a byte.)

At power up, the default operational mode is SPI mode.

SPI COMMUNICATIONS PROTOCOL

The MR10Q010 can be operated in either SPI Mode 0 (CPOL=0, CPHA =0) or SPI Mode 3 (CPOL=1, CPHA=1).

For both modes, inputs are captured on the rising edge of the clock and data outputs occur on the falling

edge of the clock. When not conveying data, SCK remains low for Mode 0; while in Mode 3, SCK is high.

The memory determines the mode of operation (Mode 0 or Mode 3) based upon the state of the SCK when

CS falls.

All memory transactions start when CS is brought low to the memory. The rst byte is a command code.

Depending upon the command, subsequent bytes of address are input. Data is either input or output.

There is only one command performed per CS active period. CS must go inactive before another command

can be accepted. To ensure proper part operation according to specications, it is necessary to terminate

each access by raising CS at the end of a byte (a multiple of 8 clock cycles from CS dropping to avoid partial

or aborted accesses.

MR10Q010

Name Operation Code Description

RDSR Read Status Register 05h Returns the contents of the 8 Status Register bits.

WREN Write Enable 06h Sets the Write Enable Latch (WEL) bit in the status register to 1.

WRDI Write Disable 04h Sets the Write Enable Latch (WEL) bit in the status register to 0.

WRSR Write Status Register 01h Writes new values to the entire Status Register.

READ Read Data Bytes 03h Continuously reads data bytes starting at an initial address specied.

FREAD 1Fast Read Data Bytes 0Bh High-speed READ with XIP operation option.

WRITE Write Data Bytes 02h Continuously writes data bytes starting at an address specied.

SLEEP Enter Sleep Mode B9h Initiates Sleep Mode.

WAKE Exit Sleep Mode ABh Terminates Sleep Mode.

TDET Tamper Detect 17h Returns 4 data bytes indicating corrupted or uncorrupted memory.

RDID Read ID 4Bh Returns the Everspin device ID assigned by JEDEC.

Table 7 – SPI Mode Commands Overview

SPI Mode Commands Overview

Notes:

1. FREAD has the option of using XIP operational mode. See “Execute in Place (XIP) Mode” on page 42 for details of XIP mode

with the FREAD command.

MR10Q010

18 MR10Q010 Revision 5.6, 6/2018

The Status Register can be read at any time to check the status of the Write Enable Latch Bit, status register

Write Protect Bit, QPI mode, and the block write protect bits. The RDSR command is entered by driving CS

low, sending the command code, and then driving CS high.

See “Table 3 – Status Register Bit Denitions” on page 11 for Status Register Bit denitions.

Read Status Register (RDSR)

Figure 5 – Read Status Register (RDSR) Command Operation

SCK

Status Register Bits

High Impedance High Z

10 2 3 4 5 6 7 8 9 10 11 12 13 14 15

00000101

76543210

Instruction (05h)

Mode 3

Mode 0

Clock Number 2

Name Operation 0 - 7 18 - 15 16 - 23 24 - 31 32 - 39 40 - n

RDSR Read Status Register 05h S7-S0 3- - - -

Notes:

1. Clocks 0 - 7 are the command byte.

2. See “AC Timing Parameters” on page 61 for timing requirements.

3. See “Table 3 – Status Register Bit Denitions” on page 11 for status register bit denitions.

MR10Q010

The Write Enable (WREN) command sets the Write Enable Latch Bit (WEL) in the status register (Bit 1). The

Write Enable Latch must be set prior to writing in the status register or the memory. The WREN command is

entered by driving CS low, sending the command code, and then driving CS high.

See “Table 3 – Status Register Bit Denitions” on page 11 for Status Register Bit denitions.

Write Enable (WREN)

Figure 6 – Write Enable (WREN) Command Operation

Instruction (06h)

High Impedance

Mode 3

Mode 0

Mode 3

Mode 0

10 234567

00000110

SCK

Clock Number 1

Name Operation 0 - 7 28 - 15 16 - 23 24 - 31 32 - 39 40 - n

WREN Write Enable 06h - - - - -

Notes:

1. See “AC Timing Parameters” on page 61 for timing requirements.

2. Clocks 0 - 7 are the command byte.

MR10Q010

20 MR10Q010 Revision 5.6, 6/2018

Figure 7 – Write Disable (WRDI) Command Operation

Write Disable (WRDI)

SCK

Instruction (04h)

High Impedance

Mode 3

Mode 0

Mode 3

Mode 0

10 234567

00000100

The Write Disable (WRDI) command resets the Write Enable Latch (WEL) bit in the status register (bit 1) to 0.

This prevents writes to status register or memory. The WRDI command is entered by driving CS low, sending

the command code, and then driving CS high.

The Write Enable Latch (WEL) is reset to 0 on power-up or when the WRDI command is completed.

See “Table 3 – Status Register Bit Denitions” on page 11 for Status Register bit denitions.

Clock Number 1

Name Operation 0 - 7 28 - 15 16 - 23 24 - 31 32 - 39 40 - n

WRDI Write Disable 04h - - - - -

Notes:

1. See “AC Timing Parameters” on page 61 for timing requirements.

2. Clocks 0 - 7 are the command byte.

MR10Q010

The Write Status Register (WRSR) command allows new values for certain bits to be written to the Status

executing a WREN command while pin WP the SRWD Bit correspond to values that make the status register

writable as seen in Table 5 on page 15.

QPI Mode Bit, Bit 6, and the WEL Bit, Bit 0, are set by other commands and cannot be changed by this com-

mand.

The WRSR command is entered by driving CS low, sending the command code and status register write data

byte, and then driving CS high.

Figure 8 – Write Status Register (WRSR) Command Operation

Write Status Register (WRSR)

SCK

Status Register In

High Impedance

Instruction (01h)

0000000176 (DC) 54321

MSB

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Mode 3

Mode 0

0 (DC)

Clock Number

Name Operation 0 - 7 18 - 15 216 - 23 24 - 31 32 - 39 40 - n

WRSR Write Status Register 01h S7-S0 - - - -

Notes:

1. Clocks 0 - 7 are the command byte.

2. Neither the QPI Mode Bit, Bit 6, or the WEL Bit, bit 0, can be changed by this command.

Notes:

1. Neither the QPI Mode Bit, Bit 6, or the WEL Bit, bit 0, can be changed by this command. Treat as Don’t Care.

MR10Q010

22 MR10Q010 Revision 5.6, 6/2018

The Read Data Bytes (READ) command allows data bytes to be continuously read starting at an initial ad-

dress specied by the 24-bit address entry. The data bytes are read out sequentially from memory until the

read operation is terminated by bringing CS high. The entire memory can be read in a single command.

The address counter will roll over to 0000H when the address reaches the top of memory.

The READ command is entered by driving CS low and sending the command code. The memory drives the

read data bytes on the SO pin. Reads continue as long as the memory is clocked. (Maximum READ clock

frequency 40MHz.) The command is terminated by bringing CS high.

Figure 9 – Read Data Bytes (READ) Command Operation

Read Data Bytes (READ)

SCK

24-Bit Address

High Impedance

Instruction (03h)

Data Out 1

Data Out 2

0 0 0 0 0 0 1 1 212223 3

765432107

210

MSB

0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39

Data Clocked Out Continuously until CS high.

Mode 3

Mode 0

Clock Number

Name Operation 0 - 7 18 - 15 16 - 23 24 - 31 32 - 39 40 - n

READ Read Data Bytes 03h A23-A16 A15-A8 A7-A0 D7-D0, until CS high

Notes:

1. Clocks 0 - 7 are the command byte.

2. For timing details, see “Figure 35 – Synchronous Data Timing (READ)” on page 63.

MR10Q010

Fast Read Data Bytes (FREAD)

The Fast Read Data Bytes FREAD command is similar to the READ command except that the device can be

operated at the highest frequency (fSCK = 104MHz ) and the command has an XIP operation option. For

more detail on the XIP option, see “Table 13 – XIP Mode with FREAD Command” on page 43.

The FREAD command is entered by driving CS low and sending the command code. The memory drives the

read data bytes on the SO pin. Reads continue as long as the memory is clocked. The command is termi-

nated by bringing CS high.

Figure 10 – Fast Read Data Bytes (FREAD) Command Operation

SCK

012345678910 28 29 30 31

24-Bit AddressInstruction (0Bh)

0 0 0 0 1 0 1 1 212223 3 2 1 0

MSB

SO High Impedance

LSB

SCK

31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

Mode Bits Set /Reset XIP Mode

SO High Impedance

7 6 5 4 3 2 1 0

Data Out 1

7 6 5 4 3 2 1 0

Data Out 2

Mode 3

Mode 0

0M5 M4M7 M6 M3 M2 M1 M0

Data Clocked Out Continuously until CS high.

Clock Number

Name Operation 0 - 7 18 - 15 16 - 23 24 - 31 32 - 39 40 - n

FREAD Fast Read Data Bytes 0Bh A23-A16 A15-A8 A7-A0 Mode bits 2

(7-0)

D7-D0, until

CS high

Notes:

1. Clocks 0 - 7 are the command byte.

2. Mode Byte to Set/Reset XIP operation. Set/Continue XIP Mode = EFh. Reset XIP Mode FFh (exit XIP). See “Execute in Place

(XIP) Mode” on page 42 for more detailed information on XIP operation with FREAD.

3. For timing details, see “Figure 36 – Synchronous Data Timing Fast Read (FREAD)” on page 63.

MR10Q010

24 MR10Q010 Revision 5.6, 6/2018

Figure 11 – Write Data Bytes (WRITE) Command Operation

The Write Data Bytes (WRITE) command allows data bytes to be written starting at an address specied by

the 24-bit address. The data bytes are written sequentially in memory until the write operation is terminat-

ed by bringing CS high. The entire memory can be written in a single command. The address counter will

roll over to 0000h when the address reaches the top of memory.

MRAM is a random access memory rather than a page, sector, or block organized memory so it is ideal for

both program and data storage. Unlike EEPROM or Flash Memory, MRAM can write data bytes continuously

at its maximum rated clock speed without write delays or data polling. Back to back WRITE commands to

any random location in memory can be executed without write delay.

The WRITE command is entered by driving CS low, sending the command code, and then sequential write

data bytes. Writes continue as long as the memory is clocked. The command is terminated by bringing CS

high.

Write Data Bytes (WRITE)

SCK

24-Bit Address

High Impedance

Instruction (02h)

00000010232221 321076543210

MSB MSB

0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39

Mode 3

Mode 0

Data Byte 1

SCK

Data Byte 3

High Impedance

Data Byte NData Byte 2

34 210 76543210

MSB

76543210765

MSB

40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

Clock Number

Name Operation 0 - 7 18 - 15 16 - 23 24 - 31 32 - 39 40 - n

WRITE Write Data Bytes 02h A23-A16 A15-A8 A7-A0 D7-D0, until CS high

Notes:

1. Clocks 0 - 7 are the command byte.

2. For timing details see “Figure 37 – Synchronous Data Timing (WRITE)” on page 64.

MR10Q010

The Enter Sleep Mode (SLEEP) command turns o all MRAM power regulators in order to reduce the overall

chip standby power to 15 μA typical. The SLEEP command is entered by driving CS low, sending the com-

mand code, and then driving CS high. The standby current is achieved after time, tDP. See “Table 23 – AC

Timing Parameters” on page 61 for the tDP value.

If power is removed when the part is in sleep mode, upon power restoration, the part enters normal standby.

The only valid command following SLEEP mode entry is a WAKE command.

Figure 12 – Enter Sleep Mode (SLEEP) Command Operation

Enter Sleep Mode (SLEEP)

SCK

Standby CurrentActive Current

Mode 3

Mode 0

Sleep Mode Current

Instruction (B9h)

10111001

01234567

Clock Number

Name Operation 0 - 7 18 - 15 16 - 23 24 - 31 32 - 39 40 - n

SLEEP Enter Sleep Mode B9h - - - - -

Notes:

1. Clocks 0 - 7 are the command byte.

MR10Q010

26 MR10Q010 Revision 5.6, 6/2018

Figure 13 – Exit Sleep Mode (WAKE) Command Operation

Exit Sleep Mode (WAKE)

SCK

Sleep Mode Current Standby Current

Instruction (ABh)

10101 011

01234567

RDP

Mode 3

Mode 0

The Exit Sleep Mode (WAKE) command turns on internal MRAM power regulators to allow normal operation.

The WAKE command is entered by driving CS low, sending the command code, and then driving CS high.

The memory returns to standby mode after tRDP. See “Table 23 – AC Timing Parameters” on page 61 for

the tRPD value.

The CS pin must remain high until the tRDP period is over. WAKE must be executed after sleep mode entry

and prior to any other command when the device is in Sleep mode.

Clock Number

Name Operation 0 - 7 18 - 15 16 - 23 24 - 31 32 - 39 40 - n

WAKE Exit Sleep Mode ABh - - - - -

Notes:

1. Clocks 0 - 7 are the command byte.

MR10Q010

Tamper Detect (TDET)

The Tamper Detect command is used to check whether the memory contents have been corrupted by ex-

posure to external magnetic elds. The command is invoked by entering the command code followed by

the 8-bit Mode Byte. The device reads dedicated pre-programmed memory bits located around the memory

physical array. The contents of these bits are compared to reference bits that are hard programmed into the

device via a metal mask. The result of the comparison is returned in 32 status bits of data on SO beginning

after the last Mode Byte clock.

All 0’s in the 32 TDET status bits indicates that the tamper check bits are correct against the reference bits

and the memory has not been corrupted. Presence of any 1’s in the 32-bit string indicates that at least one

of the check bits does not match its reference bit and the memory contents have likely been corrupted.

Following CS high, any new command can be entered on the next access, except another TDET command.

If it is necessary to immediately enter another TDET command, a Tamper Detect Exit (TDETX) command must

be issued rst to reset the device for another Tamper Detect sequence.

Figure 14 – Tamper Detect (TDET) Command Operation

TDET Status Bits

SCK

Instruction (4Bh)

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 44 45 460

Mode Bits

0 1 0 0 11 0 1

T31 T30

T29

T3 T2 T1 T0

High Impedance High-Z

Don’t Care

M7 M6 M5 M4 M3 M2 M1 M0

1 1 1 1 1 1 1 1

Don’t Care

Clock Number

Name Operation 0 - 7 18 - 15 16 - 47 48 - n

TDET Tamper Detect 17h Mode Byte

bits 7 - 0 3T31 - T0 2CS high

Notes:

1. Clocks 0 - 7 are the command byte.

2. 32 Tamper Detect indication bits. Any 1’s present in the 32-bit string indicate probable corruption of the memory contents.

3. In the TDET command operation, the Mode Byte is used as a time delay to read the check and reference bits. The Mode Byte

must be set to FFh.

Notes:

1. In the TDET command operation, the Mode Byte must be set to FFh.

MR10Q010

28 MR10Q010 Revision 5.6, 6/2018

Figure 15 – Tamper Detect Exit (TDETX) Command Operation

Clock Number

Name Operation 0 - 7 18 - n 2

TDETX Tamper Detect Exit 07h CS high. Any command can be entered on next access.

Notes:

1. Clocks 0 - 7 are the command byte.

2. After CS goes high any other command can be given on the next access.

Tamper Detect Exit (TDETX)

After running a TDET command, any other command can be run as the next command, except another TDET

command. If another TDET command is to be run, then the Tamper Detect Exit (TDETX) command must

be run rst to reset the device. This is necessary only if immediately running another TDET command. See

“Tamper Detect (TDET)” on page 27.

MR10Q010

Read ID (RDID)

The Read Device ID command (RDID) returns 40 bits of information that identify the Everspin device. The

command is invoked with CS low, and sending command code 4Bh on the Serial Input (SI) pin. See “Fig-

ure 16 – Read ID (RDID) Command Operation” below. After 8 clocks for the Mode Byte, 40 bits of data

uniquely identifying the Everspin device are returned on the Serial Out (SO) pin. See “Table 8 – Device ID for

MR10Q010”. If CS remains low after reading the 40 ID bits, additional clocks with CS low will return zeros on

SO until CS goes high.

Figure 16 – Read ID (RDID) Command Operation

Device ID Data Bits

SCK

Instruction (4Bh)

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 50 51 520

Mode Bits

010010

Bit 39 Bit 38 Bit 37 Bit 36 Bit 35 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

5453

High Impedance High-Z

Don’t Care

Mode 3

Mode 0

1 1

M7 M6 M5 M4 M3 M2 M1 M0

1 1 1 1 1 1 1 1

Notes:

1. Clocks 0 - 7 are the command byte.

2. In the RDID command operation, the Mode Byte is used as a time delay to read the device ID bits. The Mode Byte must be

set to FFh.

3. For the Everspin device ID codes, see “Table 8 – Device ID for MR10Q010” on page 30.

Clock Number

Name Operation 0 - 7 18 - 15 16 - 23 24 - 31 32 - 39 40 - n

RDID Read ID 4Bh Mode Byte 2

Bits 7 - 0 Device ID 3 Clocks 16 - 55

Notes:

1. In the RDID command operation, the Mode Byte must be set to FFh.

MR10Q010

30 MR10Q010 Revision 5.6, 6/2018

Complete Hexadecimal and Binary Device ID for MR10Q010

Hexadecimal 076B111111

Binary 0000_0111_0110_1011_0001_0001_0001_0001_0001_0001

RDID Device ID for MR10Q010

Bit # 39 - 24 23 - 20 19 - 16 15 - 12 11 - 8 7 - 4 3 - 0

Meaning Manufacturer’s ID

(JEP 106AH) Technology Interface Speed Density Voltage Die Rev

MR10Q010 6Bh, eighth bank Toggle

MRAM Quad IO SPI 104MHz 1 Mb 3.3v VDD /

1.8v VDDQ

Binary 0000_0111_0110_1011 0001 0001 0001 0001 0001 0001

Table 8 – Device ID for MR10Q010

MR10Q010

QUAD SPI MODE COMMANDS

Quad SPI commands allow data to be transferred to or from the device at least four times the rate of conven-

tional SPI mode. When using Quad SPI commands the DI and DO pins become bidirectional IO0 and IO1, and

the WP and HOLD pins become IO2 and IO3 respectively. Address and data information can be input to the

device on four IO’s and data output can be read from four IO’s, oering a signicant improvement in continu-

ous and random access transfers. XIP mode operation is available for FRQO and FRQAD commands.

Name Operation Code Description

FRQO 1Fast Read Quad Output 6Bh Initial address entry on IO0, returns data continuously in Quad SPI

Mode on all four I/O. Has XIP operation option.

FWQD Fast Write Quad Data 32h Initial address entry on IO0, writes data continuously in Quad SPI

Mode on all four I/O.

FRQAD 1Fast Read Quad Address

and Data EBh Initial address entry on all four IO’s, returns data continuously in

quad mode on all four I/O’s. Has XIP operation option.

FWQAD Fast Write Quad Address

and Data 12h Initial address entry on all four IO’s, writes data continuously in quad

mode on all four I/O’s.

Table 9 – Quad SPI Mode Commands Overview

Quad SPI Mode Commands Overview

Notes:

1. XIP mode option. See “Execute in Place (XIP) Mode” on page 42 for details of how to use FRQD and FRQAD in XIP mode.

MR10Q010

32 MR10Q010 Revision 5.6, 6/2018

Fast Read Quad Output (FRQO)

The Fast Read Quad Output (6Bh) command is similar to the Fast Read Output except that a data byte is

output on the four I/O pins, requiring only two clocks. An XIP mode is available for this command. See

“Table 14 – XIP Operation with FRQO Command” on page 47 for more information about XIP mode op-

eration. The I/O pins should be high impedance prior to the falling edge of the rst Mode clock. The FRQO

command is entered by driving CS low and sending the command code. The memory drives the read data

bytes on the IO pins. Reads continue as long as the memory is clocked. The command is terminated by

bringing CS high.

Commmand Operation and Timing next page.

MR10Q010

SCK

012345678910 28 29 30 31

24-Bit AddressInstruction (6Bh)

01101011 212223 3210

MSB LSB

Mode 3

Mode 0

IO0

IO1

High Impedance

IO2

IO3

SCK

31 32 33 34 35 36 37 38 39 40 41

Mode Bits

IO0

IO1

IO2

IO3

IO switches from Input to Output

404 0 4 0 4 0

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

(Low)

LSB

High

M0M4

M1M5

M2M6

M3M7

Data Clocked Out Continuously until CS high.

Set / Reset XIP

Note:

1. The I/O pins should be high impedance prior to the falling edge of the second mode clock.

Figure 17 – Fast Read Quad Output (FRQO) Command Operation

Clock Number

Name Title 0 - 7 18 - 15 16 - 23 24 - 31 32 - 33 34 - 35 36 - n

FRQO Fast Read Quad Output 6Bh A23-A16 A15 - A8 A7- A0 M7- M0 2D7 - D0, until CS high 3

Notes:

1. Clocks 0 - 7 are the command byte. All commands and address bits on I/O0.

2. Mode Byte. See “Execute in Place (XIP) Mode” on page 42 for more information on XIP operation with FRQO.

3. Quad Mode data output. I/O0 switches from Input to Output. I/O1-3 active outputs until CS returns high. tCSH must be ob-

served for valid output when bringing CS high.

MR10Q010

34 MR10Q010 Revision 5.6, 6/2018

Fast Read Quad Address and Data (FRQAD)

The Fast Read Quad Address and Data (FRQAD) command is similar to the FRQO command except that the

address bits are loaded into the four I/O’s, requiring six clocks instead of 24. The data bytes also are read

from the four I/O’s as shown in Figure 18 below. An XIP operating mode is available for this command. See

“Table 15 – XIP Operation with FRQAD Command” on page 51 for more information on the XIP operating

mode for this command. The FRQAD command is entered by driving CS low and sending the command

code. The memory drives the read data bytes on the IO pins. Reads continue as long as the memory is

clocked. The command is terminated by bringing CS high.

Commmand Operation and Timing next page.

MR10Q010

SCK

01234567

Instruction (EBh)

11101011

Mode 3

Mode 0

IO0

SCK

13 14 15 16 17 18 19 20 21 22 23

Mode

Bits

IO0

IO1

IO2

IO3

1620 8 4 0

(Low)

A23 - 16 A15 - 8 A7 - 0

24-Bit Address

131721 9 5 1

141822 10 6 2

151923 11 7 3

High Impedance

High

IO switches from Input to Output

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

404 0 4 0 4 04

IO1

IO2

IO3

8 9 10 11 12 13 14 15

Mode Bits

M0M4

M1M5

M2M6

M3M7

Data Clocked Out Continuously until CS high.

Note:

1. The I/O pins should be high impedance prior to the falling edge of the second mode clock.

Figure 18 – Fast Read Quad Address and Data (FRQAD) Command Operation

Notes:

1. Clocks 0 - 7 are the command byte. All commands and address bits on I/O0.

2. Mode Byte. See “Execute in Place (XIP) Mode” on page 42 for more information on XIP operation with FRQAD.

3. Quad Mode data output. I/O0 switches from Input to Output. I/O1-3 active outputs until CS returns high. tCSH must be ob-

served for valid output when bringing CS high.

4. For timing details, see “Figure 38 – Synchronous Data Timing Fast Write Quad Data and Fast Write Quad Address and Data

(FWQD and FWQAD)” on page 64.

Clock Number

Name Description 0 - 7 18 - 13 414- 15 216 - 17 18 - n

FRQAD Fast Read Quad Address

and Data EBh A23 - A0 M7 - M0 2D7 - D0 every two clocks until CS high 3

MR10Q010

36 MR10Q010 Revision 5.6, 6/2018

Fast Write Quad Data (FWQD)

The Fast Write Quad Data FWQD command provides a high speed write capability to the memory using four

I/O’s for data input. The FWQD command can operate at the highest frequency, fSCK = 104MHz.

The FWQD command is entered by driving CS low and sending the command code (32h). Data is input on

all four I/O’s and Writes continue as long as the memory is clocked. The command is terminated by bringing

CS high.

Figure 19 – Fast Write Quad Data (FWQD) Command Operation

SCK

01234567

Mode 3

Mode 0

8 9 10 29 30 31

SCK

31 32 33 34 35 36 37 38 39

(Low)

IO0

IO1

IO2

IO3

Data Bytes

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

404 0 4 0 4 04

Byte n

Instruction (32h)

00110010

24-Bit Address

High Impedance

High

2223 21 210

Data Writes Continuously until CS high.

Notes:

1. Clocks 0 - 7 are the command byte. All commands and address bits on I/O0.

2. Quad Mode address input. I/O0 remains input. I/O1-3 active inputs until CS returns high.

3. For timing details, see “Figure 38 – Synchronous Data Timing Fast Write Quad Data and Fast Write Quad Address and Data

(FWQD and FWQAD)” on page 64.

Clock Number

Name Title 0 - 7 18 - 15 16 - 23 24 - 31 32 - 33 34 - 35 36 - n

FWQD Fast Write Quad Data 32h A23-A16 A15 - A8 A7- A0 D7 - D0 every two clocks until CS

high 2

MR10Q010

Fast Write Quad Address and Data (FWQAD)

The Fast Write Quad Address and Data Command (FWQAD) provides a very fast write at both the highest

frequency and fewest clock cycles. The 24-bit address is input on all four I/O’s, reducing the number of clock

cycles. The data bytes to be written are also input on all four I/O’s following the address bits. The FWQAD

command can operate at the highest frequency, fSCK = 104MHz.

The FWQAD command is entered by driving CS low and sending the command code (12h). Data are input

on all four I/O’s and Writes continue as long as the memory is clocked. The command is terminated by bring-

ing CS high.

Figure 20 – Fast Write Quad Address and Data (FWQAD) Command Operation

SCK

01234567

Instruction (12h)

00010010

Mode 3

Mode 0

SCK

13 14 15 16 17 18 19 20 21

1620 8 4 0

(Low)

A23 - 16 A15 - 8 A7 - 0

24-Bit Address

131721 9 5 1

141822 10 6 2

151923 11 7 3

High Impedance

High

8 9 10 11 12 13

Data Bytes

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

404 0 4 0 4 04

Byte n

Data Writes Continuously until CS high.

Clock Number

Name Description 0 - 7 18 - 13 414 - 15 216 - n

FWQAD Fast Write Quad Address

and Data 12h A23 - A0 D7 - D0 every two clocks until CS high 2

Notes:

1. Clocks 0 - 7 are the command byte. All commands and address bits on I/O0.

2. Quad Mode address input. I/O0 remains input. I/O1-3 active inputs until CS returns high.

MR10Q010

38 MR10Q010 Revision 5.6, 6/2018

QPI MODE

QPI Mode is designed to reduce command entry overhead in an XIP environment. QPI mode allows the

instruction code to be entered on all four I/O’s, which reduces the number of clock cycles required for com-

mand entry to two from eight. Otherwise, all SPI or Quad SPI commands operate normally.

In SPI or Quad SPI mode device operation is determined by which command is entered. To operate in QPI

Mode, the device must be specically placed into QPI Mode by invoking the Enable QPI Command. When

in QPI Mode, the Status Register Bit 6 is set to 1 and will reset to 0 when either power is removed from the

device or the QPI Mode is exited with an DQPI command.

At power up, QPI mode is disabled.

Table 10 – SPI Mode Command Structures in QPI Mode

Clock Number

Name Description 0 - 1 12 - 9 10 - 17 18 - 25 26 - 33 34 - n

RDSR Read Status Register 05h S7-S0 - - - -

WREN Write Enable 06h - - - - -

WRDI Write Disable 04h - - - - -

WRSR Write Status Register 01h S7-S0 - - - -

READ Read Data Bytes 03h A23-A16 A15-A8 A7-A0 D7-D0 until CS high

FREAD Fast Read Data Bytes 08h A23-A16 A15-A8 A7-A0 M7 - M0 2 D7-D0 until

CS high

WRITE Write Data Bytes 02h A23-A16 A15-A8 A7-A0 D7-D0 until CS high

SLEEP Enter Sleep Mode B9h - - - - -

WAKE Exit Sleep Mode ABh - - - - -

TDET Tamper Detect 17h M7 - M0 3 T7 - T0

RDID Read ID 4Bh M7 - M0 3 Device ID 40 bits

DQPI Disable QPI FFh -----

Notes:

1. Clocks 0 - 1 are the command bits while in QPI mode.

2. M7 - M0 is the Mode Byte to Set/Reset XIP Mode. Set XIP Mode = EFh; Reset XIP Mode = FFh.

3. Mode Byte must be FFh for TDET and RDID.

MR10Q010

Clock Number

Name Description 0 - 1 12 - 9 10 - 17 18 - 25 26 - 27 28 - n

DQPI Disable QPI FFh -----

FRQO Fast Read Quad

Output 6Bh A23-A16 A15-A8 A7-A0 M7 - M0 2 D7-D0 until

CS high

FWQD Fast Write Quad Data 32h A23-A16 A15-A8 A7-A0 D7-D0 until CS high

Clock Number

Name Description 0 - 1 12 - 3 4 - 5 6 - 7 8 - 9 10 - n

FRQAD Fast Read Quad Ad-

dress and Data EBh A23-A16 A15-A8 A7-A0 M7 - M0 2D7-D0 until

CS high

FWQAD Fast Write Quad Ad-

dress and Data 12h A23-A16 A15-A8 A7-A0 D7-D0 until CS high

Table 11 – Quad SPI Mode Command Structures in QPI Mode

Notes:

1. Clocks 0 - 1 are the command bits while in QPI mode.

2. Mode Byte. Set/Reset XIP operating mode. See “Execute in Place (XIP) Mode” on page 42.

MR10Q010

40 MR10Q010 Revision 5.6, 6/2018

Enable QPI (EQPI) Command

Figure 21 – Enable QPI Mode (EQPI) Command Operation

The Enable QPI command is used to enter the device into QPI mode. The command code, 38h, is entered

on the DI pin. The command is entered by driving CS low and sending the command code. The command is

terminated by driving CS high. When in QPI Mode, the Status Register Bit 6 is set to “1” and the device stays

in QPI mode until a power-on reset or the Disable QPI command is entered.

SCK

01234567

Instruction (38h)

001110 0

Mode 3

Mode 0

High Impedance

Clock Number

Name Description 0 - 7 18 9 - n

EQPI Enable QPI Mode 38h CS high In QPI Mode

Notes:

1. Clocks 0 - 7 are the command byte.

MR10Q010

Disable QPI (DQPI) Command

Figure 22 – Disable QPI Mode (DQPI) Command Timing

The Disable QPI command is used to exit QPI mode and return to the standard SPI/Quad SPI mode and set

the Status Register Bit 6 to “0”.

The command code FFh is entered on all four IO’s in just two clock cycles as shown below. The command is

entered by driving CS low and sending the command code. The command is terminated by driving CS high.

SCK

0 1

Instruction (FFh)

Mode 3

Mode 0

1 1

Clock Number

Name Description 0 - 1 12 9 - n

DQPI Disable QPI Mode FFh CS high Now in SPI / Quad SPI Mode

Notes:

1. Clocks 0 - 1 are the command byte on all four I/O.

MR10Q010

42 MR10Q010 Revision 5.6, 6/2018

EXECUTE IN PLACE XIP MODE

Execute in Place (XIP) mode provides faster read operations by not requiring a command code for each

new starting address during consecutive reads. This improves random access time and eliminates the need

to shadow code onto RAM for fast execution. The read commands supported in XIP mode are FREAD (SPI

Mode), FRQO, and FRQAD (both Quad SPI Mode commands).

XIP may be run when in QPI mode. Entering or exiting XIP mode will not aect other aspects of QPI mode

operation. The device will stay in QPI mode until QPI is disabled with the DQPI command.

XIP mode for these commands is Set or Reset by entering the Mode Byte as shown in “Table 12 – Mode Byte

Denitions to Set/Reset XIP Mode” on page 42 below.

In XIP Mode it is possible to perform a series of reads beginning at dierent addresses without having to

load the command code for every new starting address / CS cycle. XIP can be entered or exited during

these commands at any time and in any sequence. If it is necessary to perform another operation, not

supported by XIP, such as a write, then XIP must be exited before the new command code is entered for the

desired operation.

Table 12 – Mode Byte Denitions to Set/Reset XIP Mode

XIP Operation Hex M7 M6 M5 M4 M3 M2 M1 M0

Set/Continue EF 1 1101111

Reset/Stop (Default) FF 1 1111111

MR10Q010

Initial Command Clock Number

SPI Mode 0 - 7 18 - 31 32 - 39 40 - 47 48 - n

QPI Mode 0 - 1 13 - 26 27 - 34 35 - 42 43 - n

FREAD Fast Read Data Bytes 0Bh A23-A0 M7 - M0 2D7 - D0 Read Next Byte

24-bit Address Set XIP

Mode 3

Read Data

Byte Repeat until CS goes high.

Table 13 – XIP Mode with FREAD Command

Notes:

1. Command code eight bits.

2. Mode Byte will Set/Reset the XIP mode. See “Table 12 – Mode Byte Denitions to Set/Reset XIP Mode” on page 42 above

for the Set/Reset XIP mode bit denitions.

3. If the XIP mode is not Set on the initial command, the command operates in normal SPI Mode until CS high. And, on the next

new address, the FREAD the command must be reentered. If XIP Mode has been Set during this initial command entry, the

command still operates normally until CS goes high. But on the next CS low, the device remains in FREAD Command mode.

No command is entered and the initial read address is entered on the rst clock. See the table below.

If XIP Set - Next CS Low Clock Number

Either SPI or QPI Mode 0 - 23 1 24 - 31 32 - 39 40 - n

FREAD Fast Read Data Bytes A23-A0 M7 - M0 D7 - D0 Read Next Byte

If XIP Mode is Set, the Command need

not be reentered. Initial 24-bit ad-

dress entry begins on the rst clock.

24-bit Address Set/Reset XIP

Mode

Read Data

Byte Repeat until CS goes high.

Notes:

1. In XIP mode, the last command code sent remains in eect. The starting address is entered beginning on the rst clock after

CS low.

2. If XIP Mode is Reset, the device is out of XIP mode and any command may be entered on the next access.

MR10Q010 Revision 5.6, 6/2018

MR10Q010

SCK

012345678910 28 29 30 31

24-Bit AddressInstruction (0Bh)

0 0 0 0 1 0 1 1 212223 3 2 1 0

MSB

SO High Impedance

LSB

SCK

31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

EFh Set XIP Mode

SO High Impedance

7 6 5 4 3 2 1 0

Read Data Byte

7 6 5 4 3 2 1 0

Read Next Byte

Mode 3

Mode 0

Data Clocked Out Continuously until CS high.

11111111

LSB

Note:

1. XIP Mode code FFh: Reset XIP Mode. After this access a comnmand must be entered on the next access. Any new command may be en-

tered, including the original command.

MR10Q010

Table 14 – XIP Operation with FRQO Command

Initial Command Clock Number

Quad SPI Mode 0 - 7 18 - 31 32 - 33 34 - 35 36 - n

QPI Mode 0 - 1 12 - 25 26 - 27 28 - 29 30 - n

FRQO Fast Read Quad

Output 6Bh A23-A0 M7 - M0 2D7 - D0 Read Next Byte

24-bit Address Set XIP

Mode 3

Read Data

Byte Repeat until CS goes high.

Notes:

1. Command code eight bits.

2. Mode Byte entered Set/Reset the XIP mode. See “Table 12 – Mode Byte Denitions to Set/Reset XIP Mode” on page 42

above for the Set/Reset XIP mode bit denitions.

3. If the XIP mode is not set on the initial command, the command operates in normal SPI Mode until CS high. And, on the next

FRQO the command must be reentered. If XIP has been set during this initial command entry, the command still operates

normally until CS goes high. But on the next CS low, the device remains in FRQO Command mode, and the initial read ad-

dress is entered on the rst clock. See the table below.

If XIP Set - Next CS Low

Either Quad SPI or QPI Mode 0 - 23 24 - 25 26 - 27 28 - n

FRQO Set Fast Read Quad

Output A23-A0 M7 - M0 D7 - D0 Read Next Byte

If XIP Mode is Set, the Command

need not be reentered. Initial 24-bit

address entry begins on the rst

clock.

24-bit Address Set/Reset XIP

Mode Read Data Byte Repeat until CS goes high.

Notes:

1. In XIP operating mode, the last command code sent remains in eect and no command entry is required on the next access.

MR10Q010

48 MR10Q010 Revision 5.6, 6/2018

Figure 26 – FRQO Command - Set XIP Mode - Initial Access

SCK

012345678910 28 29 30 31

24-Bit AddressInstruction (6Bh)

01101011 212223 3210

MSB LSB

Mode 3

Mode 0

High Impedance

SCK

31 32 33 34 35 36 37 38 39 40 41

EFh

IO switches from Input to Output

404 0 4 0 4 0

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

(Low)

LSB

High

Data Clocked Out Continuously until CS high.

Set XIP

Mode

1,2

Notes:

1. Initial access, XIP Mode Byte set for next access.

2. The I/O pins should be high impedance prior to the falling edge of the second mode clock.

MR10Q010

Figure 27 – FRQO Command - XIP Mode Set - Next Access

SCK

23 24 25 26 27 28 29 30 31 32 33

EFh

IO0

IO1

IO2

IO3

IO switches from Input to Output

404 0 4 0 4 0

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

(Low)

LSB

Data Clocked Out Continuously until CS high.

Set (Continue)

XIP

Mode

1,2

SCK

012 20 21 22 23

24-Bit Address

212223 3 2 1 0

MSB LSB

Mode 3

Mode 0

IO0

IO1

High Impedance

IO2

IO3

High

Notes:

1. Next access, set to continue XIP Mode.

2. The I/O pins should be high impedance prior to the falling edge of the second mode clock.

MR10Q010

50 MR10Q010 Revision 5.6, 6/2018

Figure 28 – FRQO Command - XIP Mode Exit

SCK

012 20 21 22 23

24-Bit Address

212223 3 2 1 0

MSB LSB

Mode 3

Mode 0

IO0

IO1

High Impedance

IO2

IO3

High

SCK

FFh

IO0

IO1

IO2

IO3

IO switches from Input to Output

404 0 4 0 4 0

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

(Low)

LSB

Data Clocked Out Continuously until CS high.

Reset

XIP

Mode

1,2

23 24 25 26 27 28 29 30 31 32 33

Notes:

1. XIP Mode Byte FFh. Exit XIP Mode.

2. The I/O pins should be high impedance prior to the falling edge of the second mode clock.

3. After this access a command must be entered on the next access. Any new command may be entered, including the original

command.

MR10Q010

Table 15 – XIP Operation with FRQAD Command

Initial Command Clock Number

Quad SPI Mode 0 - 7 18 - 13 14 - 15 16 - 17 18 - n

QPI Mode 0 - 1 12 - 7 8 - 9 10 - 11 12 - n

FRQAD Fast Read Quad Ad-

dress and Data EBh A23-A0 M7 - M0 2D7 - D0 Read Next Byte

24-bit Address Set XIP

Mode 3

Read Data

Byte Repeat until CS goes high.

Notes:

1. Command code eight bits.

2. Mode Byte entered Set/Reset the XIP mode. See “Table 12 – Mode Byte Denitions to Set/Reset XIP Mode” on page 42

above for the Set/Reset XIP mode bit denitions.

3. If the XIP mode is not set on the initial command, the command operates in normal SPI Mode until CS high. And, on the next

FRQAD the command must be reentered. If XIP has been set during this initial command entry, the command still operates

normally until CS goes high. But on the next CS low, the device remains in FREAD Command mode, and the initial read ad-

dress is entered on the rst clock. See the table below.

If XIP Set - Next CS Low

Either Quad SPI or QPI Mode 0 - 5 6 - 7 8 - 9 10 - n

FRQAD Set Fast Read Quad Ad-

dress and Data A23-A0 M7 - M0 D7 - D0 Read Next Byte

If XIP Mode is Set, the Command

need not be reentered. Initial 24-bit

address entry begins on the rst

clock.

24-bit Address Set/Reset XIP

Mode Read Data Byte Repeat until CS goes high.

Notes:

1. In XIP operating mode, the last command code sent remains in eect and no command entry is required on the next access.

MR10Q010

52 MR10Q010 Revision 5.6, 6/2018

Figure 29 – FRQAD Command - Set XIP Mode - Initial Access

SCK

01234567

Instruction (EBh)

11101011

Mode 3

Mode 0

SCK

13 14 15 16 17 18 19 20 21 22 23

EFh

Set XIP

Mode

1620 8 4 0

(Low)

A23 - 16 A15 - 8 A7 - 0

24-Bit Address

131721 9 5 1

141822 10 6 2

151923 11 7 3

High Impedance

High

IO switches from Input to Output

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

404 0 4 0 4 04

8 9 10 11 12 13

Data Clocked Out Continuously until CS high.

Notes:

1. Initial access, XIP Mode Byte set for next access.

2. The I/O pins should be high impedance prior to the falling edge of the second mode clock.

MR10Q010

Figure 30 – FRQAD Command - XIP Mode Set - Next Access

SCK

Mode 3

Mode 0

IO01620 8 4 0

A23 - 16 A15 - 8 A7 - 0

24-Bit Address

131721 9 5 1

141822 10 6 2

151923 11 7 3

IO1

IO2

IO3

012345

EFh

Set (Continue)

XIP Mode

IO0

IO1

IO2

IO3

(Low)

IO switches from Input to Output

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

404 0 4 0 4 04

Data Clocked Out Continuously until CS high.

SCK

5 6 7 8 9 10 11 12 13 14 15

Notes:

1. Next access, set to continue XIP Mode.

2. The I/O pins should be high impedance prior to the falling edge of the second mode clock.

MR10Q010

54 MR10Q010 Revision 5.6, 6/2018

Figure 31 – FRQAD Command - XIP Mode Exit

SCK

Mode 3

Mode 0

1620 8 4 0

A23 - 16 A15 - 8 A7 - 0

24-Bit Address

131721 9 5 1

141822 10 6 2

151923 11 7 3

012345

SCK

FFh

Reset (Exit)

XIP Mode

(Low)

IO switches from Input to Output

515 1 5 1 5 1

626 2 6 2 6 2

737 3 7 3 7 3

Byte 1 Byte 2 Byte 3 Byte 4

404 0 4 0 4 04

Data Clocked Out Continuously until CS high.

5 6 7 8 9 10 11 12 13 14 15

Notes:

1. XIP Mode Byte FFh. Exit XIP Mode.

2. The I/O pins should be high impedance prior to the falling edge of the second mode clock.

3. After this access a command must be entered on the next access. Any new command may be entered, including the original

command.

MR10Q010

This device contains circuitry to protect the inputs against damage caused by high static voltages or electric

elds. However, it is advised that normal precautions be taken to avoid application of any voltage greater

than maximum rated voltages to these high-impedance (Hi-Z) circuits.

The device also contains protection against external magnetic elds. Precautions should be taken to avoid

application of any magnetic eld more intense than the maximum eld intensity specied in the maximum

ratings.

Symbol Parameter Conditions Value Unit

VDD Supply voltage 1-0.5 to 4.0 V

VDDQ I/O Bus Supply voltage 1 -0.5 to 2.4 V

VIN Voltage on any pin 1-0.5 to VDDQ + 0.5 V

IOUT Output current per pin ±20 mA

TBIAS Temperature under bias Commercial Grade -45 to 95 °C

Tstg Storage Temperature -55 to 150 °C

TLead Lead temperature during solder (3 minute max) 260 °C

Hmax_write Maximum magnetic eld during write Write 12,000 A/m

Hmax_read

Maximum magnetic eld during read or

standby Read or Standby 12,000 A/m

Notes:

1. All voltages are referenced to VSS. The DC value of VIN must not exceed actual applied VDD by more than 0.5V. The AC value of

VIN must not exceed applied VDD by more than 2V for 10ns with IIN limited to less than 20mA.

Table 16 – Absolute Maximum Ratings

ELECTRICAL SPECIFICATIONS

Permanent device damage may occur if absolute maximum ratings are exceeded. Functional operation should be restricted to

recommended operating conditions. Exposure to excessive voltages or magnetic elds could aect device reliability.

MR10Q010

56 MR10Q010 Revision 5.6, 6/2018

Symbol Parameter Conditions Min Typical Max Unit

VDD Power supply voltage 3.0 3.3 3.6 V

VDDQ I/O Bus Power supply voltage 1.7 1.8 2.0 V

VIH Input high voltage 1.4 VDDQ + 0.2 V

VIL Input low voltage -0.2 0.4 V

Ambient temperature

under bias

Commercial Grade 0 70 °C

Industrial Grade -40 85 °C

Extended Grade -40 105 °C

Table 17 – Operating Conditions

Symbol Parameter Conditions Min Max Unit

IIL Input leakage current - ±2 μA

IOL Output leakage current - ±2 μA

VOL Output low voltage IOL = 4mA - 0.4 V

VOH Output high voltage IOH = -100μA 1.4 - V

Table 18 – DC Characteristics

MR10Q010

Symbol Parameter Conditions Typical Max Unit

IDDR Active Read Current

SPI @ 1 MHz 5.0 11 mA

SPI @ 40 MHz 12 17 mA

Quad SPI @

104MHz - 60 mA

IDDW Active Write Current

@ 1 MHz 9.0 25 mA

@ 40 MHz 28 42 mA

Quad SPI @

104MHz - 100 mA

IDDQ Active VDDQ Current Note 1 - 3 mA

ISB1

AC Standby Current (CS High = VIH. No other

restrictions on other inputs.) f ≤104MHz - 8 mA

ISB1Q

AC Standby Current on VDDQ supply (CS High =

VIH. No other restrictions on other inputs.) f ≤104MHz - 1 mA

ISB2 CMOS Standby Current (CS High) f = 0 MHz - 3 mA

ISB2Q

CMOS Standby Current on VDDQ Supply (CS

High) f = 0 MHz - 10 μA

IZZ Standby Sleep Mode Current (CS High) Sleep Mode - 100 μA

Table 19 – Power Supply Characteristics

Symbol Parameter Typical Max Unit

CIn Control input capacitance 1- 6 pF

CI/O Input/Output capacitance 1- 8 pF

Notes:

1. ƒ = 1.0 MHz, dV = 3.0 V, TA = 25 °C, periodically sampled rather than 100% tested.

Table 20 – Capacitance

Note

1. IDDQ Conditions: Quad SPI at 104MHz, VDDQ = 2.0v, VIH = 1.8v, VIL = 0v.

MR10Q010

58 MR10Q010 Revision 5.6, 6/2018

Table 21 – AC Measurement Conditions

Figure 32 – Output Load for Impedance Parameter Measurements

Figure 33 – Output Load for all Other Parameter Measurements

Parameter Value Unit

Logic input timing measurement reference level 0.9 V

Logic output timing measurement reference level 0.9 V

Logic input pulse levels 0 to 1.6 V

Input rise/fall time 2 ns

Output load for low and high impedance parameters See Figure 32

Output load for all other timing parameters See Figure 33

TIMING SPECIFICATIONS

Output

VL = VDCQ /2

RL = 50Ω

Output

1.8V

R230 pF

AC Measurement Conditions

MR10Q010

To provide protection for data during initial power up, power loss or brownout, whenever VDD falls below

VWIDD or VDDQ falls below VWIDDQ the device cannot be selected (CS is restricted from going low) and the

device is inhibited from Read or Write operations. See “Table 22 – Power-Up Delay Minimum Voltages and

Timing” below.

Power Up Delay Time

During initial power up or when recovering from brownout or power loss, a power up delay time (tPU)

must be added to the time required for voltages to rise to their specied minimum voltages (VDD(min) and

VDDQ(min)) before normal operations may commence. This time is required to insure that the device internal

voltages have stabilized. See “Table 22 – Power-Up Delay Minimum Voltages and Timing” below.

tPU is measured from the time that both VDD and VDDQ have reached their specied minimum voltages. See

“Figure 34 – Power-Up Timing” for an illustration of the timing.

During initial startup or power loss recovery the CS pin should always track VDDQ (up to VDDQ + 0.2 V) or

VIH, whichever is lower, and remain high for the total startup time, tPU. In most systems, this means that CS

should be pulled up to VDDQ with a resistor. Any logic that drives other inputs or IOs should hold the signals

at VDDQ until normal operation can commence.

Symbol Parameter Min Unit

VWIDD Write Inhibit Voltage 2.2 V

VWIDDQ I/O Write Inhibit Voltage 1.2 V

tPU Power Up Delay Time 400 μs

Table 22 – Power-Up Delay Minimum Voltages and Timing

Power Up Timing

MR10Q010

60 MR10Q010 Revision 5.6, 6/2018

Figure 34 – Power-Up Timing

BROWNOUT or

POWER LOSS

VDDQ min

NORMAL

OPERATION

tPU

STARTUP

TIME

INITIAL

POWER ON

VDD min

VWIDD

VWIQQ

VDDQ

VDD

READ/WRITE operations

inhibited

NORMAL

OPERATION

RECOVER

TIME

READ/WRITE operations

inhibited

Note: CS may not be enabled until tPU startup or recovery time is met.

MR10Q010

Symbol Parameter Min Typical Max Unit

fSCK

SCK Clock Frequency for all instructions except READ - - 104 MHz

SCK Clock freq for READ - - 40 MHz

tRI Input Rise Time - - 50 ns

tRF Input Fall Time - - 50 ns

tWH SCK High Time except READ 4 - - ns

tWHR SCK High Time READ 11 - - ns

tWL SCK Low Time except READ 4 - - ns

tWLR SCK Low Time READ 12 - - ns

Synchronous Data Timing see Figures 35, 36, 37, 38

tCSS CS Setup Time 5 - - ns

tCSH CS Hold Time 5 - - ns

tSU Data In Setup Time 2 - - ns

tH Data In Hold Time 5 - - ns

tVOutput Valid - - 7 ns

tHO Output Hold Time 1.5 - - ns

tCS CS High Time at end of all Cycles except Writes 10 - - ns

tCSW CS High Time at end of Write Cycles 50 - - ns

Table 23 – AC Timing Parameters

AC Timing Parameters

MR10Q010

62 MR10Q010 Revision 5.6, 6/2018

Symbol Parameter Min Typical Max Unit

HOLD Timing see Figure 39

tHD HOLD Setup Time 2 - - ns

tCD HOLD Hold Time 2 - - ns

tLZ HOLD to Output Low Impedance - - 12 ns

tHZ HOLD to Output High Impedance - - 7 ns

Other Timing Specications

tWPS WP Setup To CS Low 5 - - ns

tWPH WP Hold From CS High 5 - - ns

tDP Sleep Mode Entry Time - - 3 μs

tRDP Sleep Mode Exit Time - - 400 μs

tDIS Output Disable Time - - 7 ns

AC Timing Parameters - Continued

MR10Q010

Figure 35 – Synchronous Data Timing (READ)

Figure 36 – Synchronous Data Timing Fast Read (FREAD)

MR10Q010

64 MR10Q010 Revision 5.6, 6/2018

Figure 37 – Synchronous Data Timing (WRITE)

Figure 38 – Synchronous Data Timing Fast Write Quad Data and

Fast Write Quad Address and Data (FWQD and FWQAD)

SCK

CSS

tWL

CSH

CSW

SCK

I/O

CSS

tWL

CSH

CSW

MR10Q010

SCK

HOLD

tCD

Figure 39 – HOLD Timing

MR10Q010

66 MR10Q010 Revision 5.6, 6/2018

PART NUMBERS AND ORDERING

Table 24 – Part Numbering System

Memory Interface Density Revision Temp Package Ship Grade

Example Ordering Part Number MR 10Q 010 C SC R

MRAM (Toggle) MR

104MHz Quad SPI Family 10Q

1 Mb 010

4 Mb 040

16Mb 160

No Revision Blank

Revision A A

Revision B B

Commercial 0 to 70°C Blank

Industrial -40 to 85°C C

16-pin SOIC SC

Tray Blank

Tape and Reel R

Customer Samples CS

Mass Production Blank

Extended -40 to 105°C V

24-ball BGA MB

Table 25 – Ordering Part Numbers

Temp Grade Temperature Package Shipping Container Order Part Number

Commercial 0 to 70°C

16-SOIC Trays MR10Q010SC

Tape and Reel MR10Q010SCR

24-BGA Trays MR10Q010MB

Tape and Reel MR10Q010MBR

Industrial -40 to 85°C

16-SOIC Trays MR10Q010CSC

Tape and Reel MR10Q010CSCR

24-BGA Trays MR10Q010CMB

Tape and Reel MR10Q010CMBR

Extended -40 to 105°C

16-SOIC Trays MR10Q010VSC

Tape and Reel MR10Q010VSCR

24-BGA Trays MR10Q010VMB

Tape and Reel MR10Q010VMBR

MR10Q010

PACKAGE CHARACTERISTICS

Table 26 – Thermal Resistance 16-pin SOIC

Velocity TA 1 PD 2TJ Max 3 ΘJA4ΘJB 5 ΘJC 6

m/s °C W °C °C/W

25 0.792

71.0 58.1

30.6 31.6

1 64.5 49.9

2 62.8 47.7

3 61.8 46.4

Notes:

1. TA - Ambient temperature.

2. PD - Power dissipation at maximum VDD and IDDW.

3. TJ Max - Maximum junction temperature reached at maximum power dissipation.

4. ΘJA - Junction to ambient.

5. ΘJB - Junction to board.

6. ΘJC - Junction to package case.

All thermal resistance values are estimated by simulation.

MR10Q010

68 MR10Q010 Revision 5.6, 6/2018

Figure 40 – 16-SOIC Package Outline

Dimensions next page.

LL1

MR10Q010

16-SOIC Package Outline - Dimensions

Symbol JEDEC MS - 013 (AA)

issue (mm)

Everspin POD 16L SOIC PKG OUTLINE

DWG. 300 MIL (mm)

Ref MIN NOM MAX MIN NOM MAX

A - - 2.65 2.46 2.56 2.64

A1 0.10 - 0.30 0.127 0.22 0.29

A2 2.05 - - 2.29 2.34 2.39

b 0.31 - 0.51 0.35 0.41 0.51

c 0.20 - 0.33 0.23 0.25 0.32

D 10.30 BSC 10.21 10.34 10.46

E 10.30 BSC 10.16 10.31 10.63

E1 7.50 BSC 7.44 7.52 7.59

L 0.40 - 1.27 0.61 0.81 1.02

L1 1.40 REF N/A

e 1.27 BSC 1.27 BSC

Θ 0° - 8° 0° 5° 8°

MR10Q010 Revision 5.6, 6/2018

MR10Q010

Figure 41 – 24 Ball BGA Package Outline

MR10Q010

Revision Date Description of Change

1.7 February 26, 2013 Initial Release Preliminary.

1.8 March 7, 2013 Revision to Table 5. Revision to HOLD timing Table 15. Corrected package illustration.

1.9 May 14, 2013 Added QPI Commands.

2.0 October 24, 2013 Removed QPI Commands, TDET and reference to XIP. These features will be released in a

future product revision.

3.0 April 17, 2014

Major revision. Complete restructure of command section. Added QPI Mode, TDET,

TDETX commands and XIP operating mode commands, instructions and timing diagrams.

Removed Preliminary watermark from all pages. Removed Max and Typical values for

VWIDD and VWIDDQ.

4.0 December 17,

2014

Added ISB1Q, ISB2, ISB2Q, IDDQ values. Revisions to Command Descriptions for FRQO and

FRQAD. Revisions to Note 3 for Command Timing Diagrams for FRQO and FRQAD. Added

package thermal resistance table. IDD values in Table 8 have been updated.

4.1 March 20, 2015 Revised Table 23: tCS updated. tV (min) now unspecied. tHO (min) revised to 1.5ns.

4.2 May 19, 2015 Revised Everspin contact information.

4.3 June 11, 2015 Corrected Japan Sales Oce telephone number.

5.0 August 12, 2015 Added 6x8mm 24-ball BGA package outline and dimensions.

5.1 January 26, 2017 Table 23: Revised tWHR = 11ns; tWLR = 12ns. 16-SOIC package options released to MP.

24-BGA now qualied.

5.2 February 1, 2017 Figures 35 and 36 - Synchronous Data Timing. Added timing detail for tV and tHO.

5.3 December 4, 2017 Figure 40 updated with new dimensions

5.4 January 26, 2018 Added extended temperature range to the data sheet.

5.5 March 15, 2018 Added extended range to Table 17

5.6 June 1, 2018 Updated table 24

REVISION HISTORY

MR10Q010

72 MR10Q010 Revision 5.6, 6/2018

Information in this document is provided solely to enable system and soft-

ware implementers to use Everspin Technologies products. There are no

express or implied licenses granted hereunder to design or fabricate any

integrated circuit or circuits based on the information in this document.

Everspin Technologies reserves the right to make changes without further

notice to any products herein. Everspin makes no warranty, representa-

tion or guarantee regarding the suitability of its products for any particu-

lar purpose, nor does Everspin Technologies assume any liability arising

out of the application or use of any product or circuit, and specically

disclaims any and all liability, including without limitation consequential

or incidental damages. “Typical” parameters, which may be provided in

Everspin Technologies data sheets and/or specications can and do vary

in dierent applications and actual performance may vary over time. All

operating parameters including “Typicals” must be validated for each cus-

tomer application by customer’s technical experts. Everspin Technologies

does not convey any license under its patent rights nor the rights of oth-

ers. Everspin Technologies products are not designed, intended, or au-

thorized for use as components in systems intended for surgical implant

into the body, or other applications intended to support or sustain life, or

for any other application in which the failure of the Everspin Technologies

product could create a situation where personal injury or death may oc-

cur. Should Buyer purchase or use Everspin Technologies products for any

such unintended or unauthorized application, Buyer shall indemnify and

hold Everspin Technologies and its ocers, employees, subsidiaries, ali-

ates, and distributors harmless against all claims, costs, damages, and ex-

penses, and reasonable attorney fees arising out of, directly or indirectly,

any claim of personal injury or death associated with such unintended or

unauthorized use, even if such claim alleges that Everspin Technologies

was negligent regarding the design or manufacture of the part. Everspin™

and the Everspin logo are trademarks of Everspin Technologies, Inc. All

other product or service names are the property of their respective owners.

HOW TO REACH US

Contact Information:

How to Reach Us:

Home Page:

www.everspin.com

World Wide Information Request

WW Headquarters - Chandler, AZ

5670 W. Chandler Blvd., Suite 100

Chandler, Arizona 85226

Tel: +1-877-480-MRAM (6726)

Local Tel: +1-480-347-1111

Fax: +1-480-347-1175

support@everspin.com

orders@everspin.com

sales@everspin.com

Europe, Middle East and Africa

Everspin Europe Support

support.europe@everspin.com

Japan

Everspin Japan Support

support.japan@everspin.com

Asia Pacic

Everspin Asia Support

support.asia@everspin.com