PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS - Z-PakTM
uClamp0541Z
Ultra Small μClamp®
1-Line ESD Protection
Description Features
Nominal Dimensions Schematic
2/6/2015
Applications
Mechanical Characteristics
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
Portable Instrumentation
Digital Lines
Tablet PC
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. It is
designed to replace 0201 size multilayer varistors (MLVs)
in portable applications such as cell phones, notebook
computers, and other portable electronics. It features
large cross-sectional area junctions for conducting high
transient currents. This device offers desirable charac-
teristics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
μClamp®0541Z is in a 2-pin SLP0603P2X3 package. It
measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with lead-free NiAu. Each
device will protect one line operating at 5 volts. It
gives the designer the flexibility to protect single lines in
applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
High ESD withstand Voltage: +/-17kV (Contact/Air)
per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
Ultra-small 020020
020020
0201 pack1 pack
1 pack1 pack
1 packageage
ageage
age
Protects one data or power line
Low reverse current: <10nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: 6.5pF typical
Solid-state silicon-avalanche technology
SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
SLP0603P2X3 (Bottom View)
1
2
0.32
0.62
0.25
0.16
0.355 BSC
0.22
2© 2015 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
uClamp0541Z
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
3© 2015 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
uClamp0541Z
Non-Repetitive Peak Pulse Power vs. Pulse Time
Typical Characteristics
TLP Characteristic
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2)
Junction Capacitance vs. Reverse Voltage
0.001
0.01
0.1
1
0.1 1 10 100
Pulse Duration - tp (µs)
Peak Pulse Power - PPP (kW)
0
5
10
15
0 0.5 1 1.5 2 2.5
Peak Pulse Current - IPP (A)
Clamping V olta ge - VC (V)
Waveform
Parameters:
tr = 8μs
td = 20μs
0
0.2
0.4
0.6
0.8
1
1.2
012345
Reverse Voltage - VR (V)
CJ(VR) / CJ(VR=0)
f = 1 MHz
-10
0
10
20
30
40
-10 0 10 20 30 40 50 60 70 80
Time (ns)
Vol t age (V)
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuat or. ESD gun ret ur n pat h
connect e d t o ESD ground pl an e
0
5
10
15
20
25
0 5 10 15 20 25
TLP Voltage (V)
TLP Cu rrent ( A )
Transmission Line Pulse Test (TLP)
Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
-40
-30
-20
-10
0
10
-10 0 10 20 30 40 50 60 70 80
Time (ns)
Voltage ( V )
Measured with 50 Ohm scope
input impedanc e , 2GH z bandwidt h.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
co nne ct e d to ESD gr ound plane
4© 2015 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
uClamp0541Z
Typical Characteristics
Typical Insertion Loss S21
START
. 030 MHz 3 STOP 000 . 000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -2.0678 dB
800 MHz
2: -2.2545 dB
900 MHz
3: -6.6417 dB
1.8 GHz
4: -12.722 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
1
GHz
100
MHz 3
GHz
10
MHz
1
MHz
1 2
3
4
5
-42 dB
-48 dB
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
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0.270
0.250
0.298
0.272
0.175
Stencil Aperture
Mounting Pad
Package
Recommended Mounting Pattern
5© 2015 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
uClamp0541Z
Outline Drawing - SLP0603P2X3
Land Pattern - SLP0603P2X3
aaa
N
E
L
e
DIM
A
0.18
0.355
0.14
0.285
0.08
2
0.16
0.32
0.355 BSC
MILLIMETERS
MAX
0.24
0.265
DIMENSIONS
MIN
0.20
NOM
0.235
0.22
0.25
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
BOTTOM VIEW
b
D0.585 0.655
0.62
bbb 0.10
D
E
AB
A1
aaa C
C
A
SEATING
PLANE
e
bbb C A B
TOP VIEW
A1 0.00 0.02 0.025
bxN
2xL
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
Y
G
C
MILLIMETERS
(0.425)
0.675
0.250
0.175
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Z
X 0.270
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Y
Z
X
G
(C)
6© 2015 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
uClamp0541Z
Marking Code
Notes:
1) MicroClamp, uClamp and μClamp are trademarks of
Semtech Corporation
K
Ordering Information
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Notes:
1) Dots represent matrix date code
7© 2015 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
uClamp0541Z
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Bo
Note: All dimensions in mm unless otherwise specified
Date Code Location
(Away from Sprocket Holes)
K
K
K
K
K
Carrier Tape Specification
Plastic Tape
Paper Tape
Device Orientation in Tape
8© 2015 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
uClamp0541Z
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
