Preliminary Information
WS1111
WR20310-001
17
Power Amplifier Module for CDMA/AMPS(824-849MHz)
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2. MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive to damage induced by absorbed
moisture and temperature. WAVICS follows JEDEC Standard J-STD 020A. Each component
and package type is classified for moisture sensitivity by soaking a known dry package at various
temperatures and relative humidity, and times. After soak, the components are subjected to three
consecutive simulated reflows.
The out of bag exposure time maximum limits are determined by the classification test describe
above which corresponds to an MSL classification level 6 to 1 according to the JEDEC standard
IPC/JEDEC J-STD-020A and J-STD-033.
WS1111 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers
Exposure Time (MET) for this part is 168 hours. After this time period, the part would need to be
removed from the reel, de-taped and then re-bake.
Mandatory bake before use. After bake, must be reflowed within
the time limit specified on the label
6
24 hours5a
48 hours5
72 hours4
168 hours3
4 weeks2a
1 year2
Unlimited at =< 30
o
C/85% RH1
Floor Life (out of bag) at factory ambient =< 30
o
C/60% RH or as
stated
MSL Level
Table 2. Moisture Classification Level and Floor Life
NOTE: The MSL Level is marked on the MSL Label on each shipping bag.
MSL classification reflow temperature for the WS1111 is targeted at 235
o
C +5/-0
o
C. Figure 1 and
Table 3 show typical SMT profile for maximum temperature of 240
o
C.
HANDLING AND STORAGE