Surface Mount Schottky Barrier Rectifier Diode NSD Series FEATURES * * * * * VOLTAGE: 20 TO 100 VOLTS, CURRENT: 1.0 & 2.0 AMPERE FLAT PACK - LOW PROFILE, FOR SURFACE MOUNT APPLICATIONS FAST RESPONSE AND LOW FORWARD VOLTAGE HIGH TEMPERATURE SOLDERING (250OC/10 SECONDS) EASY PICK AND PLACE RoHS Compliant includes all homogeneous materials *See Part Number System for Details CATHODE 1.25~1.45 2.54~2.79 MECHANICAL DATA: SIZE: SMA/DO-214AC CASE: Molded epoxy TERMINALS: Solder plated Copper alloy POLARITY: Indicated by cathode band STANDARD PACKAGING: 12mm tape (EIA-RS-481) WEIGHT: 0.064 gram 3.99~4.50 4.93~5.28 1.98~2.29 .8~1.3 0.76~1.27 PART NUMBERING SYSTEM 0.1~0.2 NSD 14 TR 5K F Dimensions (millimeters) RoHS Compliant Reel qty: (5K & 7.5K) Tape and Reel Voltage & Current Designator (See ratings tables) Series MAXIMUM RATINGS (At TA=250C unless otherwise noted) Ratings Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3ms single half sine-wave supreimposed on rated load (JEDEC method) Symbol VRRM VRMS VDC Io NSD12 NSD13 NSD14 NSD15 NSD16 NSD18 NSD19 NSD100 UNITS 20 30 40 50 60 80 90 100 Volts 14 21 28 35 42 56 64 71 Volts 20 30 40 50 60 80 90 100 Volts IFSM (Note 2) RqJL CJ TJ, TSTG TRR Maximum Thermal Resistance Typical Junction Capacitance (Note 1) Operating and Storage Temperature Range Typical Reverse Recovery Time 110 1.0 Amps 30 Amps 25 C/W 80 -55 ~ +150 15 70 pF C nS ELECTRICAL CHARACTERISTICS (At TA=250C unless otherwise noted) Characteristics Maximum Forward Voltage at 1.0A DC @TA=25C Maximum DC Reverse Current at Rated DC Blocking Voltage (Note 3) @TA=100C NOTES: Symbol VF IR NSD12 NSD13 0.50 NSD14 NSD15 NSD16 0.65 0.5 10.0 NSD18 NSD19 NSD100 UNITS 0.85 Volts mAmps mAmps 1. Measured at 1.0MHz and applied average voltage of 4.0VDC. 2. Thermal resistance junction to terminal, 5mm2 (0.013 mm Thick) copper land patterns. 3. Pulse width 300uS, 2% duty cycle. (R) NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com 1 Surface Mount Schottky Barrier Rectifier Diode NSD Series RATING AND CHARACTERISTIC CURVES (NSD12 THRU NSD100) FIG. 2 - MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 1.0 50 .8 NSD15, 16 .6 NSD12~14 .4 Single Phase Half Wave 60Hz Resistive or Inductive Load .2 0 PEAK FORWARD SURGE CURRENT, (A) AVERAGE FORWARD RECTIFIED CURRENT, (A) FIG. 1 - FORWARD CURRENT DERATING CURVE 8.3ms Single Half Sine-Wave (JEDEC Method) TJ=125OC 40 30 20 10 0 0 25 50 75 100 125 150 175 O AMBIENT TEMPERATURE, ( C) 1 2 4 6 8 10 20 40 60 80 100 NUMBER OF CYCLES AT 60Hz (R) 2 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com Surface Mount Schottky Barrier Rectifier Diode NSD Series MAXIMUM RATINGS (At TA=250C unless otherwise noted) Ratings Symbol NSD22 NSD23 NSD24 NSD25 Maximum Recurrent Peak Reverse Voltage VRRM 20 30 40 Maximum RMS Voltage VRMS 14 21 28 Maximum DC Blocking Voltage VDC 20 30 40 Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) lo 2.0 Amps IFSM 50 Amps 75.0 17.0 Typical Junction Capacitance (Note 1) Rth-JA Rth-JL CJ 220 180 Operating and Storage Temperature Range TJ/TSTG -65 to +125/-65 to +150 -65 to +150 Typical Thermal Resistance NSD26 UNITS 50 60 Volts 35 42 Volts 50 60 Volts o C/W pF o C ELECTRICAL CHARACTERISTICS (At TA=250C unless otherwise noted) Characteristics Symbol Maximum Forward Voltage at 2.0A DC VF Maximum DC Reverse Current at @TA=25C Rated DC Blocking Voltage @TA=100oC NSD22 NSD23 NSD24 NSD25 0.50 NSD26 UNITS 0.70 Volts 0.5 IR mAmps 20.0 10.0 mAmps NOTE: 1. Measured at 1.0 MHz and applied average voltage of 4.0VDC. Fig. 1 - Derated Curve for Output Rectifier Current Average Forward Current Amperes 2.0 Fig. 2 - Typcial Junction Capacitance 500 Resistive or Inductive Load TJ=25C f=1.0MHz Vsig=50mV p-p 1.5 NSD22 ~ NSD24 NSD22 & NSD24 100 1.0 0.5 NSD22 ~ NSD24 NSD25 ~ NSD26 PCB Mounted on 0.2x0.2"(5.0x5.0mm) Copper Pad Areas 10 0.1 1.0 10 100 Reverse Voltage, Volts 0 50 60 70 80 90 100 110 120 130 140 150 160 Lead Temperature,C Fig. 3 - Typical Reverse Current Characteristics Peak Forward Surge Current Amperes Fig. 4 - Maximum Non-Repetive Peak Forward Surge Current 100 TA=125C CJ, Capacitnce, pF 10 1 TA=75C 0.1 50 8.3ms Single Half Sine-Wave (JEDEC Method) at Rated TL 40 Fig. 5 - Typical Instantaneous Forward Characteristics 100 10 30 Pulse Width=300S 1% Duty Cycle 20 TJ=125C 10 0 TJ=25C 1 1 10 TJ=150C 100 Number of Cycles at 60Hz TA=25C 0.01 0.001 0.1 Percentage of Rated Peak Reverse Voltage, % 0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Instantanesous Forward Voltage, Volts (R) NIC COMPONENTS 0 www.niccomp.com www.lowESR.com www.RFpassives.com 3 Surface Mount Schottky Barrier Rectifier Diode NSD Series MAXIMUM RATINGS (At TA=250C unless otherwise noted) Ratings Symbol NSD32 NSD33 NSD34 NSD35 NSD36 UNITS Maximum Recurrent Peak Reverse Voltage VRRM 20 30 40 50 60 Volts Maximum RMS Voltage VRMS 14 21 28 35 42 Volts Maximum DC Blocking Voltage VDC 20 30 40 50 60 Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) lo 3.0 Amps IFSM 80 Amps 55.0 17.0 Typical Junction Capacitance (Note 1) Rth-JA Rth-JL CJ Operating and Storage Temperature Range TJ/TSTG Typical Thermal Resistance Volts o C/W pF -55 to +125/-55 to +150 o -55 to +150 C ELECTRICAL CHARACTERISTICS (At TA=250C unless otherwise noted) Characteristics Symbol Maximum Forward Voltage at 3.0A DC NSD32 NSD33 VF Maximum DC Reverse Current at @TA=25C Rated DC Blocking Voltage @TA=100oC NSD34 NSD35 0.50 NSD36 UNITS 0.60 Volts 0.5 IR mAmps 20.0 10.0 mAmps NOTE: 1. Measured at 1.0 MHz and applied average voltage of 4.0VDC. Resistive or Inductive Load 3.0 NSD35~ NSD36 2.5 NSD32 ~ NSD34 2.0 1.5 PCB Mounted on 0.55 x 0.55" (14 x 14mm) Copper Pad Areas 1.0 0.5 0 Fig. 3 - Typcial Junction Capacitance Fig. 2 - Maximum Non-Repetive Peak Forward Surge Current Peak Forward Surge Current Amperes Average Forward Current Amperes Fig. 1 - Derated Curve for Output Rectifier Current 100 1000 80 60 40 100 20 0 1 10 100 NSD32 ~ NSD34 NSD35 ~ NSD36 Number of Cycles at 60Hz 50 60 70 80 90 100 110 120 130 140 150 160 10 Lead Temperature,C 0.1 20 10 TJ = 125C TA=125C CJ, Capacitnce, pF Pulse Width=300S 1% Duty Cycle TJ = 25C 1 0.1 NSD32 ~ NSD34 NSD35 ~ NSD36 1 TA=75C 0.1 10 100 Fig. 6 - Maximum Non-Repetive Peak Forward Surge Current 100 10 1 0.01 0.01 0.1 1 10 100 t1 Pulse Duraton, sec. 0.01 0.01 TA=25C 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Instantanesous Forward Voltage, Volts Tanscient Theral Impedance, CW Fig. 5 - Typical Reverse Current Characteristics 30 TJ = 150C 1.0 Reverse Voltage, Volts Fig. 4 - Typical Instantaneous Forward Characteristics 10 TJ=25C f=1.0MHz Vsig=50mV p-p At Rated TL 8.3ms Single Half Sine-wave (JEDEC Method) NSD32 ~ NSD34 NSD35 ~ NSD36 0.001 Percentage of Rated Peak Reverse Voltage, % (R) 4 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com Surface Mount Diodes NRD And NSD Series TAPING AND MOUNTING SPECIFICATIONS P0 P1 B W F E d P A D1 D1 T C D W1 RECOMMENDED LAND PATTERN REEL QUANTITIES Reel Size Dimensions (mm) A 1.2-1.8 B Reel Quantity 13 inch (330mm) 5,000 & 7,500 pcs A C A B 1.5-2.2 C 2.7 max. Item Symbol Specifications (mm) Specifications (inch) Carrier Width A 3.2 max. .126 max. Carrier Length B 7.8 max. .307 max. Carrier Depth C 4.5 max. .177 max. Sprocket Hole d 1.5 0.1 .059 .004 Reel Outside Diameter D 178 2.0 7.00 .079 Reel Inner Diameter D1 50 min. 1.969 min. Feed Hole Diameter D2 13.0 0.5 .512 .020 Sprocket Hole Position E 1.75 0.1 .069 .004 Punch Hole Position F 5.5 0.1 .217 .004 Punch Hole Pitch P 4.0 0.1 .157 .004 Sprocket Hole Pitch P0 4.0 0.1 .157 .004 Embossment Center P1 2.0 0.05 .079 .002 Overall Tape Thickness T 1.1 max. .043 max. Tape Width W 12.0 0.3 .472 .012 Reel Width W1 18.4 max. .724 max. NOTE: Devices are packed in accordance with EIA standard RS-481-A and specifications given above. (R) NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com 5