Alpha Industries, Inc. [781] 935-5150 •Fax [617] 824-4579 •Email sales@alphaind.com •www.alphaind.com 1
Specifications subject to change without notice. 6/99A
Chip On Board Mixer Quads
Features
■High Volume Automatic Assembly
■For Microwave MIC Assembly and
Automated High Volume Manufacturing
■Mechanically Rugged Design
■100% DC Tested
■Three Barrier Heights for Customized
Mixer Performance
Description
Alpha’s ceramic Chip on Board (COB) mixer quads are
designed f or high performance RF and microwa v e receiver
applications. These devices utilize Alpha’s advanced
silicon beamless Schottky technology, combined with
precision ceramic COB assemb ly techniques, to achie ve
a high degree of device reliability in commercial
applications.P erf ormance to 10 GHz is a vailab le with the
ring quads in the 106 package, which employs via hole
technology resulting in metalized contacts on the bottom
side and eliminating the need for wire bonds to topside
contacts.
Characteristic Value
Maximum Current (IMAX) 50 mA
Power Dissipation (PD) CW 75 mW/Junction
Storage Temperature (TST) -65°C to +175°C
Operating Temperature (TOP) -65°C to +150°C
ESD Human Body Model Class 1B
Absolute Maximum Ratings
Part Number Barrier VF @ 1 mA (∆∆) VF @ 1 mA1CJ@ 0 V (∆∆) CT@ 0 V2RT@ 10 mA Outline
(mV) (mV) (pF) (pF) (ΩΩ)Drawing
Min. Max. Max. Min. Max. Max. Max.
Ring Quad (to 6 GHz)
DMF3926-101 Low 200 260 15 0.3 0.5 0.07 8 101
DME3927-101 Medium 300 400 15 0.3 0.5 0.07 8 101
DMJ3928-101 High 525 625 15 0.3 0.5 0.07 8 101
Ring Quad (to 10 GHz)
DMF3948-106 Low 250 310 15 0.05 0.15 0.07 15 106
DME3949-106 Medium 350 450 15 0.05 0.15 0.07 15 106
DMJ3950-106 High 575 675 15 0.05 0.15 0.07 15 106
Crossover Ring Quad (to 6 GHz)
DMF3926-100 Low 200 260 15 0.3 0.5 0.07 8 100
DME3927-100 Medium 300 400 15 0.3 0.5 0.07 8 100
DMJ3928-100 High 525 625 15 0.3 0.5 0.07 8 100
Back-to-Back Crossover Quad (to 6 GHz)
DMF3945-103 Low 200 260 15 0.3 0.5 0.07 8 103
DME3946-103 Medium 300 400 15 0.3 0.5 0.07 8 103
DMJ3947-103 High 525 625 15 0.3 0.5 0.07 8 103
Part Number Barrier VF @ 1 mA (∆∆) VF @ CJ@ 0 V (∆∆) CT@ 0 V2RT@ 10 mA VB@ 10 µµAOutline
(mV) 1 mA1 (mV) (pF) (pF) (ΩΩ) (V) Drawing
Min. Max. Max. Min. Max. Max. Max. Min.
Bridge Quad (to 6 GHz)
DMF3929-102 Low 200 260 15 0.3 0.5 0.07 8 2 102
DME3930-102 Medium 300 400 15 0.3 0.5 0.07 8 3 102
DMJ3931-102 High 525 625 15 0.3 0.5 0.07 8 4 102
Chip On Board Mixer Quads
2Alpha Industries, Inc. [781] 935-5150 •Fax [617] 824-4579 •Email sales@alphaind.com •www.alphaind.com
Specifications subject to change without notice. 6/99A
Electrical Specifications at 25°C
SPICE Model Parameters (Per Junction)
Parameter Unit DMF3926 DME3927 DMJ3928 DMF3948 DME3949 DMJ3950DMF3929 DME3930 DMJ3931
DMF3945 DME3946 DMJ3947
IS A 2.5E–07 1.3E–09 9.0E–13 4.4E–08 9.3E–10 3.3E–13
RSΩ4 4 4 9 9 9
N 1.04 1.04 1.04 1.04 1.04 1.04
TT s 1E–11 1E–11 1E–11 1E–11 1E–11 1E–11
CJ0 pF 0.42 0.39 0.39 0.11 0.10 0.10
M 0.32 0.37 0.42 0.32 0.37 0.42
EGeV 0.69 0.69 0.69 0.69 0.69 0.69
XTI 2 2 2 2 2 2
FC0.5 0.5 0.5 0.5 0.5 0.5
BVV 2 3 4 3 4 5
IBV A 1.0E–05 1.0E–05 1.0E–05 1.0E–05 1.0E–05 1.0E–05
VJV 0.495 0.595 0.800 0.495 0.595 0.800
1. Forward voltage difference between package electrodes.
2. Capacitance difference between package electrodes.
Chip On Board Mixer Quads
Alpha Industries, Inc. [781] 935-5150 •Fax [617] 824-4579 •Email sales@alphaind.com •www.alphaind.com 3
Specifications subject to change without notice. 6/99A
100, 101, 102
106
103
GLASS NOT
SHOWN FOR CLARITY
INK DOT 0.010 (0.25 mm) DIA. MIN.
COLOR PER INTERNAL SPECIFICATION
0.026
(0.66 mm) MIN.
0.005 (0.13 mm)
0.001 (0.02 mm) TYP.
()
GLASS DAM
0.100 (2.54 mm)
+0.002 (0.05 mm)
-0.004 (0.10 mm)
EPOXY ENCAPSULATION
(BLACK)
0.040
(1.02 mm)
MAX. 0.020 (0.51 mm)
± 0.002 (0.05 mm)
0.020 (0.51 mm)
X 0.010 (0.25 mm)
ORIENTATION MARK
0.120 (3.05 mm)
+0.002 (0.05 mm)
-0.004 (0.10 mm)
0.030 (0.76 mm)
±0.003 (0.08 mm)
SQ.
EPOXY
ENCAPSULATION
EPOXY
ENCAPSULATION
0.024
(0.61 mm)
0.026
(0.66 mm)
0.017
(0.43 mm)
0.003
(0.08 mm) TYP.
0.003
(0.08 mm)
TYP
45˚ REF.
0.085 (2.159 mm) SQ.
0.020 (0.51 mm) MAX.
0.015
(0.38 mm)
GLASS GOLD METALIZATION Pd/Pt /Ag METALIZATION
Notes:
1. Bottom side is free of metalization.
2. The minimum specified area of the contact pads (0.017 x 0.022) shall
be free of epoxy.
CERAMIC SUBSTRATE
0.050
(1.27 mm)
MAX. 0.020 (0.51 mm)
±0.002 (0.05 mm)
0.130 (3.30 mm)
±0.003 (0.08 mm)
0.140 (3.56 mm)
± 0.003 (0.08 mm)
0.025 (0.64 mm)
±0.003 (0.08 mm)
0.020
(0.51 mm)
±0.003
(0.08 mm)
ORIENTATION
DOT 1
65
23
4
SCHEMATIC
DOT
