LM2931Z5.0G - ON SEMICONDUCTOR

October, 2013 − Rev. 0 1Publication Order Number:

MBR860MFS/D

MBR860MFS, NRVB860MFS

SWITCHMODE

Power Rectifiers

These state−of−the−art devices have the following features:

Features

•Low Power Loss / High Efficiency

•New Package Provides Capability of Inspection and Probe After

Board Mounting

•Guardring for Stress Protection

•Low Forward Voltage Drop

•175°C Operating Junction Temperature

•Wettable Flacks Option Available

•NRVB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

•These are Pb−Free Devices

Mechanical Characteristics:

•Case: Epoxy, Molded

•Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.

•Lead Finish: 100% Matte Sn (Tin)

•Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

•Device Meets MSL 1 Requirements

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

VR60

Average Rectified Forward Current

(Rated VR, TC = 165°C) IF(AV) 8.0 A

Peak Repetitive Forward Current,

(Rated VR, Square Wave,

20 kHz, TC = 165°C)

IFRM 16 A

Non−Repetitive Peak Surge Current

(Surge Applied at Rated Load

Conditions Halfwave, Single

Phase, 60 Hz)

IFSM 150 A

Storage Temperature Range Tstg −65 to +175 °C

Operating Junction Temperature TJ−55 to +175 °C

Unclamped Inductive Switching

Energy (10 mH Inductor,

Non−repetitive)

EAS 40 mJ

ESD Rating (Human Body Model) 3B

ESD Rating (Machine Model) M4

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

NOTE: The heat generated must be less than the thermal conductivity from

Junction−to−Ambient: dPD/dTJ < 1/RJA.

Device Package Shipping†

ORDERING INFORMATION

MBR860MFST1G SO−8 FL

(Pb−Free) 1500 /

Tape & Reel

SCHOTTKY BARRIER

RECTIFIERS

8 AMPERES

60 VOLTS

http://onsemi.com

1,2,3 5,6

SO−8 FLAT LEAD

CASE 488AA

STYLE 2

B860 = Specific Device Code

A = Assembly Location

Y = Year

W = Work Week

ZZ = Lot Traceability

MARKING

DIAGRAM

B860

AYWZZ

Not Used

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

MBR860MFST3G SO−8 FL

(Pb−Free) 5000 /

Tape & Reel

NRVB860MFST1G SO−8 FL

(Pb−Free) 1500 /

Tape & Reel

NRVB860MFST3G SO−8 FL

(Pb−Free) 5000 /

Tape & Reel

MBR860MFS, NRVB860MFS

http://onsemi.com

THERMAL CHARACTERISTICS

Characteristic Symbol Typ Max Unit

Thermal Resistance, Junction−to−Case, Steady State

(Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board) RθJC − 2.0 °C/W

ELECTRICAL CHARACTERISTICS

Instantaneous Forward Voltage (Note 1)

(iF = 8 Amps, TJ = 125°C)

(iF = 8 Amps, TJ = 25°C)

vF0.60

0.65 0.72

0.80

Instantaneous Reverse Current (Note 1)

(Rated dc Voltage, TJ = 125°C)

(Rated dc Voltage, TJ = 25°C)

iR25

0.015 75

0.150

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%.

TYPICAL CHARACTERISTICS

Figure 1. Typical Instantaneous Forward

Characteristics Figure 2. Maximum Instantaneous Forward

Characteristics

VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)

0.70.60.50.40.30.20.10

0.1

100

0.70.60.50.40.30.20.10

0.1

100

Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics

VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)

6050403020100

1.E−10 6050403020100

iF, INSTANTANEOUS FORWARD

CURRENT (A)

iF, INSTANTANEOUS FORWARD

CURRENT (A)

IR, INSTANTANEOUS REVERSE CURRENT (A)

0.8

TA = 175°C

125°C

150°C

25°C −40°C

0.8 0.9 1.0

TA = 175°C

125°C

150°C

25°C −40°C

1.E−09

1.E−08

1.E−07

1.E−06

1.E−05

1.E−04

1.E−03

1.E−02

1.E−01

1.E+00

IR, INSTANTANEOUS REVERSE CURRENT (A)

TA = 175°C

TA = 150°C

TA = 125°C

TA = 25°C

TA = −40°C

TA = 175°C

TA = 150°C

TA = 125°C

TA = 25°C

TA = −40°C

1.E−10

1.E−09

1.E−08

1.E−07

1.E−06

1.E−05

1.E−04

1.E−03

1.E−02

1.E−01

1.E+00

MBR860MFS, NRVB860MFS

http://onsemi.com

TYPICAL CHARACTERISTICS

Figure 5. Typical Junction Capacitance Figure 6. Current Derating TO−220AB

VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C)

6050403020100

100

1,000

1801601401201008060

Figure 7. Forward Power Dissipation

IF(AV), AVERAGE FORW ARD CURRENT (A)

43210

Figure 8. Thermal Response

PULSE TIME (sec)

0.010.001 100.0001 1000.00001 1,0000.000001

0.001

0.01

0.1

100

C, JUNCTION CAPACITANCE (pF)

IF(AV), AVERAGE FORW ARD

CURRENT (A)

PF(AV), AVERAGE FORWARD POW-

ER DISSIPATION (W)

R(t) (°C/W)

TJ = 25°C

RqJC = 2.0°C/W

Square Wave

TJ = 175°C

Square Wave

IPK/IAV = 20

IPK/IAV = 10

IPK/IAV = 5

10.1

Single Pulse

50% Duty Cycle

20%

10%

Assumes 25°C ambient and soldered to

a 600 mm2 − oz copper pad on PCB

MBR860MFS, NRVB860MFS

http://onsemi.com

PACKAGE DIMENSIONS

DFN6 5x6, 1.27P

(SO−8FL)

CASE 488AA

ISSUE H

STYLE 2:

PIN 1. ANODE

2. ANODE

3. ANODE

4. NO CONNECT

5. CATHODE

M3.00 3.40

q0 −−−

3.80

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION D1 AND E1 DO NOT INCLUDE

MOLD FLASH PROTRUSIONS OR GATE

BURRS.

1234

TOP VIEW

SIDE VIEW

BOTTOM VIEW

E1 q

0.20 C

2 X

DIM MIN NOM

MILLIMETERS

A0.90 1.00

A1 0.00 −−−

b0.33 0.41

c0.23 0.28

D5.15 BSC

D1 4.70 4.90

D2 3.80 4.00

E6.15 BSC

E1 5.70 5.90

E2 3.45 3.65

e1.27 BSC

G0.51 0.61

K1.20 1.35

L0.51 0.61

L1 0.05 0.17

0.10 C

DETAIL A

e/2

A0.10 B

0.05 cL

DETAIL A

3 X

4 X

SEATING

PLANE

MAX

1.10

0.05

0.51

0.33

5.10

4.20

6.10

3.85

0.71

1.50

0.71

0.20

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.270

0.750

1.000

0.905

0.475

4.530

1.530

4.560

0.495

3.200

1.330

0.965

3X 4X

PIN 5

(EXPOSED PAD)

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MBR860MFS/D

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