MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision
www.vishay.com Vishay Beyschlag
Revision: 11-Jul-2018 1Document Number: 28767
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Precision Metal Film Leaded Resistors
DESIGN SUPPORT TOOLS
DESCRIPTION
MBA/SMA 0204, MBB/SMA 0207, and MBE/SMA 0414
precision leaded thin film resistors combine the proven
reliability of the professional products with an advanced
level of precision and stability. Therefore they are perfectly
suited for applications in the fields of test and measuring
equipment along with industrial and medical electronics.
FEATURES
• IECQ-CECC approved according to
EN 140101-806
• Superior overall stability: class 0.05
• Wide precision ohmic range: 10 to 1.5 M
• Radial version available for MBB/SMA 0207
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Test and measuring equipment
• Industrial electronics
• Medical electronics
Notes
• MB_ series has been merged with the related SMA series to form one series “MB_/SMA__”
(1) Please refer to APPLICATION INFORMATION below
click logo to get started
Available
Models
TECHNICAL SPECIFICATIONS
DESCRIPTION MBA/SMA 0204 MBB/SMA 0207 MBE/SMA 0414
DIN size 0204 0207 0414
CECC size A B D
Resistance range 22 to 332 k10 to 1 M22 to 1.5 M
Resistance tolerance ± 0.25 %; ± 0.1 %
Temperature coefficient ± 25 ppm/K; ± 15 ppm/K
Rated dissipation, P70 0.25W 0.40W 0.65W
Operating voltage, Umax. AC/DC 200 V 350 V 500 V
Operating temperature range (1) -55 °C to +125 °C
Peak permissible film temperature (1) 125 °C 125 °C 125 °C
Insulation voltage:
1 min; Uins 300V 500V 800V
Continuous 75 V 75 V 75 V
Failure rate: FITobserved 0.1 x 10-9/h
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APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow
support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is
not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder
joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and
temperature limits in order to maintain a desired stability.
Notes
• Radial version (RB, UB) cannot be qualified according to CECC so these can only be ordered with variant N or S
(1) Approval is according to EN 140101-806, version A
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
Operation mode Precision Standard
Climatic category -10 °C / +85 °C / 56 days -55 °C / +125 °C / 56 days
Rated dissipation, P70
MBA/SMA 0204 0.07 W 0.25 W
MBB/SMA 0207 0.11 W 0.40 W
MBE/SMA 0414 0.17 W 0.65 W
Applied maximum film temperature,
F max. 85 °C 125 °C
Max. resistance change at rated
dissipation |R/R max.|, after:
MBA/SMA 0204 100 to 100 k100 to 100 k
1000 h 0.05 % 0.25 %
8000 h 0.1 % 0.5 %
225 000 h 0.3 % 1.5 %
MBB/SMA 0207 100 to 270 k100 to 270 k
1000 h 0.03 % 0.15 %
8000 h 0.1 % 0.5 %
225 000 h 0.3 % 1.5 %
MBE/SMA 0414 100 to 470 k100 to 470 k
1000 h 0.05 % 0.25 %
8000 h 0.1 % 0.5 %
225 000 h 0.3 % 1.5 %
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE TCR TOLERANCE RESISTANCE (1) E-SERIES
MBA/SMA 0204
± 25 ppm/K ± 0.25 % 22 to 332 kE96; E192
± 0.1 % 43 to 332 kE96; E192
± 15 ppm/K ± 0.25 % 22 to 221 kE96; E192
± 0.1 % 43 to 221 kE96; E192
MBB/SMA 0207
± 25 ppm/K ± 0.25 % 10 to 1 ME96; E192
± 0.1 % 10 to 1 ME96; E192
± 15 ppm/K ± 0.25 % 10 to 1 ME96; E192
± 0.1 % 10 to 1 ME96; E192
MBE/SMA 0414
± 25 ppm/K ± 0.25 % 22 to 1.5 ME96; E192
± 0.1 % 43 to 1 ME96; E192
± 15 ppm/K ± 0.25 % 22 to 1 ME96; E192
± 0.1 % 43 to 1 ME96; E192
MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision
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Revision: 11-Jul-2018 3Document Number: 28767
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Note
• The products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER
Note
• For details related to packaging specs, refer datasheet link www.vishay.com/doc?28721
PART NUMBER AND PRODUCT DESCRIPTION - CECC APPROVED PRODUCTS
PART NUMBER: MBB0207VD1001BCT00
TYPE / SIZE VARIANT TCR RESISTANCE TOLERANCE PACKAGING Special
MBA0204 =
MBA/SMA 0204
MBB0207 =
MBB/SMA 0207
MBE0414 =
MBE/SMA 0414
V = CECC 06
N = RB radial
5 mm for
MBB/SMA 0207
S = UB radial
2.5 mm for
MBB/SMA 0207
E = ± 15 ppm/K
D = ± 25 ppm/K
3 digit value
1 digit multiplier
MULTIPLIER
8 = *10-2 2 = *102
9 = *10-1 3 = *103
0 = *100 4 = *104
1 = *101 5 = *105
B = ± 0.1 %
C = ± 0.25 %
CT
C1
N4
00 = standard
L0 = welding joint
not lacquered for
MBB/SMA 0207
KL = lacquered
welding joint for
MBA/SMA 0204
PRODUCT DESCRIPTION: MBB/SMA 0207-25 0.1 % CECC 06 CT 1K0
MBB/SMA 0207 - 25 0.1 % CECC 06 CT 1K0
TYPE / SIZE TCR TOLERANCE VARIANT PACKAGING RESISTANCE
MBA/SMA 0204
MBB/SMA 0207
MBE/SMA 0414
± 15 ppm/K
± 25 ppm/K
± 0.1 %
± 0.25 %
CECC 06
CECC 06 L0
CECC 06 KL
CT
C1
N4
1K0 = 1 k
51R1 = 51.1
PACKAGING
TYPE CODE QUANTITY PACKAGING STYLE WIDTH PITCH DIMENSIONS
MBA/SMA 0204
C1 1000 Taped acc. to IEC 60286-1
fan-folded in a box 53 mm 5 mm
184 mm x 75 mm x 42 mm
CT 5000 330 mm x 75 mm x 55 mm
MBB/SMA 0207
C1 1000 Taped acc. to IEC 60286-1
fan-folded in a box 53 mm 5 mm
184 mm x 74 mm x 42 mm
CT 5000 324 mm x 77 mm x 82 mm
MBB/SMA 0207
UB = 2.5 mm pitch
N4 4000 Taped acc. to IEC 60286-2
fan-folded in a box -
12.7 mm
330 mm x 262 mm x 45 mm
R4 4000 Taped acc. to IEC 60286-2
on a reel - 330 mm x 253 mm x 48 mm
MBB/SMA 0207
UB = 5.0 mm pitch
N4 4000 Taped acc. to IEC 60286-2
fan-folded in a box - 330 mm x 262 mm x 45 mm
R4 4000 Taped acc. to IEC 60286-2
on a reel - 330 mm x 253 mm x 48 mm
MBE/SMA 0414 C1 1000 Taped acc. to IEC 60286-1
fan-folded in a box 63 mm 5 mm 374 mm x 84 mm x 47 mm
B2 VD10BCT0BM 701000
MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision
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DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic body and conditioned to achieve the desired
temperature coefficient. Plated steel termination caps are
firmly pressed on the metallized rods. A special laser is used
to achieve the target value by smoothly cutting a helical
groove in the resistive layer without damaging the ceramics.
Connecting wires of electrolytic copper plated with 100 %
pure tin are welded to the termination caps. The resistor
elements are covered by a light blue protective coating
designed for electrical, mechanical and climatic protection.
Four or five color code rings designate the resistance value
and tolerance in accordance with IEC 60062.
The result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual resistors. Only accepted products are stuck
directly on the adhesive tapes in accordance with
IEC 60286-1 or for the radial versions in accordance to
IEC 60286-2.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (1)
• The Global Automotive Declarable Substance List
(GADSL) (2)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (3) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
ASSEMBLY
The resistors are suitable for processing on automatic
insertion equipment and cutting and bending machines.
Excellent solderability is proven, even after extended
storage. They are suitable for automatic soldering using
wave or dipping.
The resistors are completely lead (Pb)-free, the pure tin
plating provides compatibility with lead (Pb)-free and
lead-containing soldering processes. The immunity of the
plating against tin whisker growth, in compliance with
IEC 60068-2-82, has been proven under extensive testing.
The encapsulant is resistant to cleaning solvent specified in
IEC 60115-1 (3). The suitability of conformal coatings, if
applied, shall be qualified by appropriate means to ensure
the long-term stability of the whole system.
All products comply with GADSL (1) and the IEC 62474 (2) list
of legal restrictions on hazardous substances. This includes
full compliance with the following directives:
• 2000/53/EC End of Vehicle Life Directive (ELV) and
Annex II (ELVII)
• 2011/65/EU Restriction of the use of Hazardous
Substances Directive (RoHS)
• 2002/96/EC Waste Electrical and Electrical Equipment
Directive (WEEE)
APPROVALS
The resistors (CECC version) are approved within the
IECQ-CECC Quality Assessment System for Electronic
Components to the detail specification EN 140101-806
which refers to EN 60115-1 and EN 140100 and the variety
of environmental test procedures of the IEC 60068
series. Conformity is attested by the use of the CECC logo
( ) as the Mark of Conformity on the package label for the
CECC version.
Vishay Beyschlag has achieved “Approval of
Manufacturer” in accordance with IEC QC 001002-3,
clause 2. The release certificate for “Technology Approval
Schedule” in accordance with CECC 240001 based on
IEC QC 001002-3, clause 6 is granted for the Vishay
Beyschlag manufacturing process.
RELATED PRODUCTS
For a corelated range of professional TCR and tolerance
specifications see the datasheet:
• “Professional Thin Film Leaded Resistors”,
www.vishay.com/doc?28766
For products approved to EN 140101-806, version E, with
established reliability and failure rate level E7
(Quality factor Q = 0.1), see the datasheet:
• “Established Reliability Thin Film Leaded Resistors”,
www.vishay.com/doc?28768
Notes
(1) Global Automotive Declarable Substance List, see www.gadsl.org
(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European
trade organisation representing the information and communications technology and consumer electronics), see
www.digitaleurope.org/SearchResults.aspx?Search=eicta.
All products comply with the IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry
(3) Other cleaning solvents with aggressive chemicals should be evaluated in actual cleaning process for their suitability
MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision
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Revision: 11-Jul-2018 5Document Number: 28767
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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FUNCTIONAL PERFORMANCE
-55
Ambient Temperature in °C
Power in %
0 50 70 100 125 155 180
Derating
20
0
40
60
80
100
Precision Mode
Standard Mode
85
-25 25
0
W
40
K
60
0.2
20
00.1 0.3 0.4 0.5 0.6 0.7 0.8
MBE/SMA 0414
MBA/SMA 0204
MBB/SMA 0207
Load
P
Temperature Rise
T
r
Temperature Rise
Rise of the surface temperature.
0.01
0.1
1
100 Ω
µV/V
MBE/SMA 0414
MBA/SMA 0204
MBB/SMA 0207
1K 10K 100K 1M 10M
Resistance Value
R
Current Noise
A
1
Current Noise A1 in accordance with IEC 60195
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TEST PROCEDURES AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
• EN 60115-1, Generic specification (includes tests)
• EN 140100, Sectional specification (includes schedule for
qualification approval)
• EN 140101-806 (successor of CECC 40101-806), Detail
specification (includes schedule for conformance
inspection)
Most of the components are approved in accordance with
the European CECC-system, where applicable. The Test
Procedures and Requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above. The testing also covers most of the
requirements specified by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068-2-xx
test method and under standard atmospheric conditions in
accordance with IEC 60068-1, 5.3. Climatic category
LCT/UCT/56 (rated temperature range: Lower category
temperature, upper category temperature; damp heat,
steady state, test duration: 56 days) is valid.
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For testing the components are mounted on a test board in
accordance with IEC 60115-1, 4.31 unless otherwise
specified.
In the Test Procedures and Requirements table, only the
tests and requirements are listed with reference to the
relevant clauses of IEC 60115-1 and IEC 60068-2-xx test
methods. A short description of the test procedure is also
given.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE
(R max.)
Stability for product types: STABILITY
CLASS 0.05
STABILITY
CLASS 0.1
STABILITY
CLASS 0.25
MBA/SMA 0204 100 to 100 k43 to 221 k22 to 332 k
MBB/SMA 0207 100 to 270 k43 to 510 k22 to 1 M
MBE/SMA 0414 100 to 470 k43 to 1 M22 to 1.5 M
4.5 - Resistance - ± 0.25 %; ± 0.1 %
4.7 - Voltage proof URMS = Uins; 60 s No flashover or breakdown
4.8 - Temperature
coefficient
At 20/LCT/20 °C and
20/UCT/20 °C ± 25 ppm/K; ± 15 ppm/K
4.13 - Short time
overload
Room temperature;
U = 2.5 x or
U = 2x Umax.; 5 s
± (0.01 % R+0.01 )
no visible damage
± (0.02 % R + 0.01 )
no visible damage
± (0.05 % R +0.01 )
no visible damage
4.16
21 (Ua1)
21 (Ub)
21 (Uc)
Robustness of
terminations Tensile, bending and torsion ± (0.01 % R+0.01 ) ± (0.02 % R + 0.01 ) ± (0.05 % R + 0.01 )
4.17 20 (Ta) Solderability
+235 °C; 2 s
solder bath method;
SnPb40 Good tinning ( 95 % covered, no visible damage)
+245 °C; 3 s
solder bath method;
SnAg3Cu0.5
4.18.2 20 (Tb) Resistance to
soldering heat
Unmounted components;
(270 ± 3)°C;
(10± 1)s
± (0.01 % R+0.01 )
no visible damage
± (0.02 % R+0.01 )
no visible damage
± (0.05 % R+0.01 )
no visible damage
4.19 14 (Na)
Rapid
change of
temperature
30min at LCT = -55 °C
30min at UCT = 125 °C
5cycles ± (0.01 % R+0.01 )
no visible damage
± (0.02 % R +0.01 )
no visible damage
± (0.05 % R +0.01 )
no visible damage
MBA/SMA 0204: 500 cycles
MBB/SMA 0207: 200 cycles
MBE/SMA 0414: 100 cycles
± (0.25 % R+0.05 )
no visible damage
± (0.25 % R +0.05 )
no visible damage
± (0.25 % R +0.05 )
no visible damage
4.22 6 Vibration
10 sweep cycles per direction;
10 Hz to2000 Hz
1.5 mm or 200 m/s2
± (0.01 % R+0.01 ) ± (0.02 % R + 0.01 ) ± (0.05 % R + 0.01 )
P70 x R
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Notes
(1) ± (0.03 % R + 0.01) for MBB/SMA 0207
(2) ± (0.15 % R + 0.05 ) for MBB/SMA 0207
4.23 Climatic
sequence:
± (0.05 % R + 0.01 )
no visible damage
± (0.1 % R + 0.01 )
no visible damage
± (0.25 % R +0.05 )
no visible damage
4.23.2 2 (Ba) Dry heat 125 °C; 16h
4.23.3 30 (Db) Damp heat,
cyclic
55 °C; 24h;
90 %to100 %RH;
1 cycle
4.23.4 1 (Aa) Cold -55 °C; 2h
4.23.5 13 (M) Low air
pressure
8.5kPa; 2h;
15 °Cto35 °C
4.23.6 30 (Db) Damp heat,
cyclic
55 °C; 5days;
95% to100 %RH; 5 cycles
4.23.7 DC load Apply rated power for 1 min
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C;
56days;
(93 ± 3) %RH
± (0.05 % R+ 0.01 ) ± (0.1 % R + 0.01 ) ± (0.25 % R+0.05 )
4.25.1
-
Endurance
at 70 °C:
Precision
operation
mode
U =or
U = Umax.;
1.5 h on; 0.5 h off
70 °C; 1000 h ± (0.05 % R + 0.01 ) (1) ± (0.1 % R + 0.01 ) ± (0.25 % R + 0.05 ) (2)
70 °C; 8000 h ± (0.1 % R+0.01) ± (0.2 % R+0.01 ) ± (0.5 % R+0.05 )
-
Endurance
at 70 °C:
Standard
operation
mode
U =or
U = Umax.;
1.5 h on; 0.5 h off
70 °C; 1000 h ± (0.25 % R + 0.05 ) (2) --
70 °C; 8000 h ± (0.5 % R+0.05 )- -
4.25.3 -
Endurance at
upper
category
temperature
85 °C; 1000 h
125°C; 1000 h
-
± (0.05 % R + 0.01 )
-
± (0.1 % R + 0.01 )
-
± (0.25 % R + 0.05 )
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol
+23 °C; toothbrush method
Marking legible;
No visible damage
4.40 -
Electrostatic
discharge
(human body
model)
IEC 61340-3-1;
3 pos. + 3 neg.
MBA/SMA 0204: 2 kV
MBB/SMA 0207: 4 kV
MBE/SMA 0414: 6 kV
± (0.5 % R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE
(R max.)
Stability for product types: STABILITY
CLASS 0.05
STABILITY
CLASS 0.1
STABILITY
CLASS 0.25
MBA/SMA 0204 100 to 100 k43 to 221 k22 to 332 k
MBB/SMA 0207 100 to 270 k43 to 510 k22 to 1 M
MBE/SMA 0414 100 to 470 k43 to 1 M22 to 1.5 M
P70 x R
P70 x R
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Revision: 11-Jul-2018 8Document Number: 28767
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DIMENSIONS
Note
(1) For 7.5 M < 10.0 mm, use version MBB/SMA 0207... L0 (welding joint not lacquered)
MBB/SMA 0207 WITH RADIAL TAPING
LEAD SPACING (UB = 2.5 mm), SIZE 0207
LEAD SPACING (RB = 5.0 mm), SIZE 0207
DIMENSIONS - Leaded resistor types, mass and relevant physical dimensions
TYPE Dmax.
(mm)
Lmax.
(mm)
dnom.
(mm)
Imin.
(mm)
Mmin.
(mm)
MASS
(mg)
MBA/SMA 0204 1.6 3.6 0.5 29.0 5.0 125
MBB/SMA 0207 (1) 2.5 6.3 0.6 28.0 10.0 (1) 220
MBE/SMA 0414 4.0 11.9 0.8 31.0 15.0 700
M
IL
d
D
L
H
C
H1
F
P
3 max.
Insulated
W
Direction of unreeling
DIMENSIONS in millimeters
Pitch of components P 12.7 ± 1.0
Lead spacing F 2.5 + 0.6 / - 0.1
Width of carrier tape W 18.0 + 1.0 / - 0.5
Body to hole center H 18.0 ± 2.0
Height for cutting (max.) L 11
Height for bending C 2.5 + 0 / - 0.5
Height for insertion (max.) H1 32
H1
L
H
C
P
FH0
W
Insulated
3 max.
Direction of unreeling
DIMENSIONS in millimeters
Pitch of components P 12.7 ± 1.0
Lead spacing F 5.0 + 0.6 / - 0.1
Width of carrier tape W 18.0 + 1.0 / - 0.5
Body to hole center H 18.0 ± 2.0
Lead crimp to hole center H016.0 ± 0.5
Height for cutting (max.) L 11
Height for bending C 2.5 + 0 / - 0.5
Height for insertion (max.) H132
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HISTORICAL 12NC INFORMATION
• The resistors had a 12-digit numeric code starting with
2312
• The subsequent 4 digits indicated the resistor type,
specification and packaging; see the 12NC table
• The remaining 4 digits indicated the resistance value:
- The first 3 digits indicated the resistance value
- The last digit indicated the resistance decade in
accordance with resistance decade table shown below
Resistance Decade
Historical 12NC Example
The 12NC code of a MBA 0204 resistor, value 47 k and
TCR 25 with ± 0.1 % tolerance, supplied on bandolier in a
box of 5000 units was: 2312 906 74703.
RESISTANCE DECADE LAST DIGIT
10 to99.9 9
100 to999 1
1 k to 9.99 k2
10 k to99.9 k3
100k to999 k4
1M to9.99 M5
HISTORICAL 12NC - Resistor type and packaging
DESCRIPTION 2312 ... ..... (BANDOLIER)
AMMOPACK REEL
TYPE TCR TOL. C1 1000 UNITS CT 5000 UNITS R1 1000 UNITS R2 2500 UNITS RP 5000 UNITS
MBA 0204
± 25 ppm/K ± 0.25 % 901 6.... 906 6.... 701 6.... - 806 6....
± 0.1 % 901 7.... 906 7.... 701 7.... - 806 7....
± 15 ppm/K ± 0.25 % 902 6.... 907 6.... 702 6.... - 807 6....
± 0.1 % 902 7.... 907 7.... 702 7.... - 807 7....
MBB 0207
± 25 ppm/K ± 0.25 % 911 6.... 916 6.... 711 6.... - 816 6....
± 0.1 % 911 7.... 916 7.... 711 7.... - 816 7....
± 15 ppm/K ± 0.25 % 912 6.... 917 6.... 712 6.... - 817 6....
± 0.1 % 912 7.... 917 7.... 712 7.... - 817 7....
MBE 0414
± 25 ppm/K ± 0.25 % 921 6.... - - 826 6.... -
± 0.1 % 921 7.... - - 826 7.... -
± 15 ppm/K ± 0.25 % 922 6.... - - 827 6.... -
± 0.1 % 922 7.... - - 827 7.... -
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