100344
100344 Low Power 8-Bit Latch with Cut-Off Drivers
Literature Number: SNOS132
100344
Low Power 8-Bit Latch with Cut-Off Drivers
General Description
The 100344 contains eight D-type latches, individual inputs
(D
n
), outputs (Q
n
), a common enable pin (E), latch enable
(LE), and output enable pin (OEN). A Q output follows its D
input when both E and LE are LOW. When either E or LE (or
both) are HIGH, a latch stores the last valid data present on
its D input prior to E or LE going HIGH.
A HIGH on OEN holds the outputs in a cut-off state. The
cut-off state is designed to be more negative than a normal
ECL LOW level. This allows the output emitter-followers to
turn off when the termination supply is −2.0V, presenting a
high impedance to the data bus. This high impedance re-
duces termination power and prevents loss of low state
noise margin when several loads share the bus.
The 100344 outputs are designed to drive a doubly termi-
nated 50transmission line (25load impedance). All in-
puts have 50 kpull-down resistors.
Features
nCut-off drivers
nDrives 25load
nLow power operation
n2000V ESD protection
nVoltage compensated operating range =−4.2V to −5.7V
nAvailable to MIL-STD-883
Logic Symbol Pin Names Description
D
0
–D
7
Data Inputs
EEnable Input
LE Latch Enable Input
OEN Output Enable Input
Q
0
–Q
7
Data Outputs
Connection Diagrams
DS100317-4
24-Pin DIP
DS100317-1
24-Pin Quad Cerpak
DS100317-2
August 1998
100344 Low Power 8-Bit Latch with Cut-Off Drivers
© 1998 National Semiconductor Corporation DS100317 www.national.com
Logic Diagram
Truth Table
Inputs Outputs
D
n
E LE OEN Q
n
LLL L L
HLL L H
X H X L Latched (Note 1)
X X H L Latched (Note 1)
X X X H Cutoff
H=HIGH Voltage level
L=LOW Voltage level
Cutoff =lower-than-LOW state
X=Don’t Care
Note 1: Retains data present before either LE or E go HIGH.
DS100317-5
www.national.com 2
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Above which the useful life may be impaired
Storage Temperature (T
STG
) −65˚C to +150˚C
Maximum Junction Temperature (T
J
)
Ceramic +175˚C
V
EE
Pin Potential to Ground Pin −7.0V to +0.5V
Input Voltage (DC) V
EE
to +0.5V
Output Current (DC Output HIGH) −100 mA
ESD (Note 3) 2000V
Recommended Operating
Conditions
Case Temperature (T
C
)
Military −55˚C to +125˚C
Supply Voltage (V
EE
) −5.7V to −4.2V
Note 2: Absolute maximum ratings are those values beyond which the de-
vice may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Note 3: ESD testing conforms to MIL-STD-883, Method 3015.
Military Version
DC Electrical Characteristics
V
EE
=−4.2V to −5.7V, V
CC
=V
CCA
=GND, T
C
=−55˚C to +125˚C
Symbol Parameter Min Max Units T
C
Conditions Notes
V
OH
Output HIGH Voltage −1025 −870 mV 0˚C to
(Notes 4, 5,
6)
+125˚C
−1085 −870 mV −55˚C V
IN
=V
IH
(Max) Loading with
V
OL
Output LOW Voltage −1830 −1620 mV 0˚C to or V
IL
(Min) 25to −2.0V
+125˚C
−1830 −1555 mV −55˚C
V
OHC
Output HIGH Voltage −1035 mV 0˚C to
(Notes 4, 5,
6)
+125˚C
−1085 mV −55˚C V
IN
=V
IH
(Min) Loading with
V
OLC
Output LOW Voltage −1610 mV 0˚C to or V
IL
(Max) 25to −2.0V
+125˚C
−1555 mV −55˚C
V
OLZ
Cutoff LOW Voltage −1950 0˚C to V
IN
=V
IH
(Min) (Notes 4, 5,
6)
mV +125˚C or V
IL
(Max) OEN =HIGH
−1850 −55˚C
V
IH
Input HIGH Voltage −1165 −870 mV −55˚C to Guaranteed HIGH Signal (Notes 4, 5,
6, 7)
+125˚C for All Inputs
V
IL
Input LOW Voltage −1830 −1475 mV −55˚C to Guaranteed LOW Signal (Notes 4, 5,
6, 7)
+125˚C for All Inputs
I
IL
Input LOW Current 0.50 µA −55˚C to V
EE
=−4.2V (Notes 4, 5,
6, 7)
+125˚C V
IN
=V
IL
(Min)
I
IH
Input HIGH Current 240 µA 0˚C to V
EE
=−5.7V (Notes 4, 5,
6)
+125˚C V
IN
=V
IH
(Max)
340 µA −55˚C
I
EE
Power Supply Current −55˚C to Inputs Open (Notes 4, 5,
6)
−195 −73 mA +125˚C V
EE
=−4.2V to −4.8V
−205 −73 V
EE
=−4.2V to −5.7V
Note 4: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.
Note 5: Screen tested 100%on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.
Note 6: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups A1, 2, 3, 7, and 8.
Note 7: Guaranteed by applying specified input condition and testing VOH/VOL.
www.national.com3
AC Electrical Characteristics
V
EE
=−4.2V to −5.7V, V
CC
=V
CCA
=GND
Symbol Parameter T
C
=−55˚C T
C
=+25˚C T
C
=+125˚C Units Conditions Notes
Min Max Min Max Min Max
t
PLH
Propagation Delay 0.50 2.60 0.70 2.60 0.70 3.10 ns
Figures 1, 2
(Notes 8, 9,
10, 12)
t
PHL
D
n
to Output
t
PLH
Propagation Delay 0.80 3.30 1.00 3.30 1.10 3.80 ns
Figures 1, 4
(Notes 8, 9,
10, 12)
t
PHL
LE, E to Output
t
PZH
Propagation Delay 1.00 4.60 1.10 4.20 1.20 4.40 ns
Figures 1, 2
(Notes 8, 9,
10, 12)
t
PHZ
OEN to Output 0.70 3.00 0.70 2.80 0.70 3.20
t
TLH
Transition Time 0.40 2.50 0.40 2.40 0.40 2.70 ns
Figures 1, 3
(Note 11)
t
THL
20%to 80%,80
%to
20%
t
s
Setup Time (Note 11)
D
0
–D
7
1.50 1.50 1.70 ns
Figures 1, 3
t
h
Hold Time (Note 11)
D
0
–D
7
0.60 0.60 0.60 ns
Figures 1, 3
t
pw
(H) Pulse Width HIGH (Note 11)
LE, E 2.40 2.40 2.40 ns
Figures 1, 3
Note 8: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
after power-up. This provides “cold start” specs which can be considered a worst case condition at cold temperatures.
Note 9: Screen tested 100%on each device at +25˚C temperature only, Subgroup A9.
Note 10: Sample tested (Method 5005, Table I) on each manufactured lot at +25˚C, Subgroup A9, and at +125˚C and −55˚C temperatures, SubgroupsA10 andA11.
Note 11: Not tested at +25˚C, +125˚C, and −55˚C temperature (design characterization data).
Note 12: The propagation delay specified is for single output switching. Delays may vary up to 300 ps with multiple outputs switching.
Test Circuitry
DS100317-6
Notes:
VCC,V
CCA =+2V, VEE =−2.5V
L1 and L2 =equal length 50impedance lines
RT=50terminator internal to scope
Decoupling 0.1 µF from GND to VCC and VEE
All unused outputs are loaded with 25to GND
CL=Fixture and stray capacitance 3pF
FIGURE 1. AC Test Circuit
www.national.com 4
Switching Waveforms
DS100317-7
FIGURE 2. Propagation Delay and Cutoff Times
DS100317-8
FIGURE 3. Setup, Hold and Pulse Width Times
DS100317-9
FIGURE 4. Propagation Delay LE, E to Q
www.national.com5
6
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead Ceramic Dual-In-Line Package (0.400" Wide) (D)
NS Package Number J24E
24-Lead Quad Cerpak (F)
NS Package Number W24B
www.national.com7
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-
VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-
CONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or sys-
tems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose fail-
ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: support@nsc.com
www.national.com
National Semiconductor
Europe Fax: +49 (0) 1 80-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 1 80-530 85 85
English Tel: +49 (0) 1 80-532 78 32
Français Tel: +49 (0) 1 80-532 93 58
Italiano Tel: +49 (0) 1 80-534 16 80
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: sea.support@nsc.com
National Semiconductor
Japan Ltd.
Tel: 81-3-5620-6175
Fax: 81-3-5620-6179
100344 Low Power 8-Bit Latch with Cut-Off Drivers
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated