Specifications
Contacts:
Material: Phosphor Bronze
Plating: 50 microinches gold
Barrier underplating: 100 microinches nickel
Resistance:
Initial: 20 milliohms max.
After durability testing: 30 milliohms max.
(500 mating cycles)
PCB Terminals:
Solderability 60/40
Shield Material: Tin-plated phosphor bronze
Housing Material: Black glass-filled polyester
(Valox 457)
Dielectric Withstanding Voltage:
Line-to-line and line-to-ground 1000 VAC for
60 seconds
Printed Circuit Board Retention:
Before soldering: 1 lb. minimum
After soldering: 20 lb. minimum
Model dimensions and PC board layout on pages 170 to 174.
ZSeries
Unfiltered low profile jack in RJ11 and RJ45 models.
Shielded and unshielded models available.
Part Numbers
RJ11-6Z RJ45-8Z
RJ11-6Z3 RJ45-8Z3
RJ11-6Z4 RJ45-8Z4
Shield 3
RJ11 Shield 4
RJ45
UL Recognized
Z Series — Low Profile Unfiltered Modular Jack
181
Catalog 1654001 Dimensions are in inches and Dimensions are shown for USA Cust. Svc.: 1-800-468-2023 www.corcom.com
Revised 05-07 millimeters unless otherwise reference purposes only. CORCOM Prods: 1-847-680-7400 www.tycoelectronics.com
specified. Values in italics Specifications subject Germany: 49-89-6089-0
are metric equivalents. to change.
Signal Line Products
ZSeries
CORCOM Product Guide