PRELIMINARY DATA SHEET MICRONAS Edition March 12, 2004 6251-615-1PD CDC 3272G-C Automotive Controller MICRONAS CDC 3272G-C PRELIMINARY DATA SHEET Contents Page Section Title 3 3 5 6 1. 1.1. 1.2. 1.3. Introduction Features Abbreviations Block Diagram 7 7 8 8 9 2. 2.1. 2.2. 2.3. 2.4. Packages and Pins Package Outline Dimensions Pin Assignment Pin Function Description External Components 11 11 12 13 15 3. 3.1. 3.2. 3.3. 3.4. Electrical Data Absolute Maximum Ratings Recommended Operating Conditions Characteristics Recommended Quartz Crystal Characteristics 17 4. CPU and Clock System 19 5. Memory and Special Function ROM (SFR) System 21 21 6. 6.1. Core Logic Control Word (CW) 23 7. IRQ Interrupt Controller Unit (ICU) 25 25 8. 8.1. Hardware Options Functional Description 27 27 32 33 9. 9.1. 9.2. 9.3. Register Cross Reference Table 8-Bit I/O Region 32-Bit I/O Region Modified Registers 35 10. Differences 36 11. Data Sheet History 2 March 12, 2004; 6251-615-1PD Micronas CDC 3272G-C PRELIMINARY DATA SHEET 1. Introduction Release Note: Revision bars changes to the previous edition. indicate significant interfaces and PWM outputs and a crystal clock multiplying PLL. The device is a microcontroller for use in automotive applications. The on-chip CPU is an ARM processor ARM7TDMI with 32-bit data and address bus, which supports Thumb format instructions. This document provides Mask ROM-derivative-specific information. General information on operating the IC can be found in the document "CDC32xxG-C Automotive Controller - Family User Manual, CDC3205G-C Automotive Controller" (6251-579-1PD)". The chip contains timer/counters, interrupt controller, multi channel AD converter, stepper motor and LCD driver, CAN 1.1. Features Table 1-1: CDC32xxG-C Family Feature List This Device: Item CDC3205G-C EMU CDC3207G-C MCM Flash CDC3257G-C2 MCM Flash CDC3272G-C Mask ROM CDC3231G-C Mask ROM 12 kByte 16 kByte 6 kByte 256 kByte Flash (128K x 16) top boot conf. 384 kByte (96K x 32/ 192K x 16) 128 kByte (32K x 32/ 64K x 16) Core CPU 32-bit ARM7TDMI CPU-Active Operation Modes DEEP SLOW, SLOW, FAST and PLL Power Saving Modes (CPU Inactive) IDLE, WAKE and STANDBY CPU clock multiplication PLL delivering up to 50 MHz EMI Reduction Mode selectable in PLL mode Oscillators 4 to 5 MHz Quartz and 20 to 50 kHz Internal RC RAM, zero wait state, 32 bit wide 32 kByte ROM ROMless, ext. up to 4M x 32/ 8M x 16 Boot ROM 8 kByte (Special Function ROM) Digital Watchdog Central Clock Divider Interrupt Controller expanding IRQ 40 inputs, 16 priority levels 26 inputs, 16 priority levels Port Interrupts including Slope Selection 6 inputs 5 inputs Port Wake-Up Inputs including Slope / Level Selection 10 inputs Patch Module 10 ROM locations Boot System allows in-system downloading of external code to Flash memory via JTAG - Device Lock Module Inhibits Access to internal Firmware, Lock settable by Customer - Micronas 512 kByte Flash (256K x 16) top boot conf. March 12, 2004; 6251-615-1PD 3 CDC 3272G-C PRELIMINARY DATA SHEET Table 1-1: CDC32xxG-C Family Feature List, continued This Device: Item CDC3205G-C EMU CDC3207G-C MCM Flash CDC3257G-C2 MCM Flash CDC3272G-C Mask ROM CDC3231G-C Mask ROM Analog Reset/Alarm Combined Input for Regulator Input Supervision Clock and Supply Supervision 10-bit ADC, charge balance type 16 channels (each selectable as digital input) ADC Reference VREF Pin, P1.0 Pin, P1.1 Pin or VREFINT Internal Bandgap selectable Comparators P06COMP with 1/2 AVDD reference, WAITCOMP with Internal Bandgap reference LCD Internal processing of all analog voltages for the LCD driver Communication DMA 3 DMA Channels, one each for serving the Graphics Bus interface, SPI0 and SPI1 - UART 2: UART0 and UART1 UART0 Synchronous Serial Peripheral Interfaces 2: SPI0 and SPI1, DMA supported Full CAN modules V2.0B with 512-byte object RAM each (LCAN000E) 4: CAN0, CAN1, CAN2 and CAN3 DIGITbus 1 master module - I2C 2 master modules: I2C0 and I2C1 I2C0 Graphics Bus Interface 8-bit data bus, DMA supported, e.g., for connection of EPSON SED 1560 LCD controller - Universal Ports selectable as 4:1 mux LCD Segment/Backplane lines or Digital I/O Ports up to 52 I/O or 48 LCD segment lines (= 192 segments), individually configurable as I/O or LCD up to 50 I/O or 46LCD segment lines (=184 segments) Universal Port Slew Rate SW-selectable Stepper Motor Control Modules with High-Current Ports 7 Modules, 32 dI/dt controlled ports 4 Modules 23 dI/dt controlled ports PWM Modules, each configurable as two 8-bit PWMs or one 16-bit PWM 6 Modules: PWM0/1, PWM2/3, PWM4/5, PWM6/7, PWM8/9 and PWM10/11 5 Modules: PWM0/1, PWM2/3, PWM4/5, PWM6/7, PWM8/9 Phase-Frequency Modulator 2: PFM0 and PFM1 - Audio Module with auto-decay SW selectable Clock outputs 2 2: CAN0 and CAN1 1: CAN0 Input & Output 4 March 12, 2004; 6251-615-1PD Micronas CDC 3272G-C PRELIMINARY DATA SHEET Table 1-1: CDC32xxG-C Family Feature List, continued This Device: Item CDC3205G-C EMU CDC3207G-C MCM Flash CDC3257G-C2 MCM Flash CDC3272G-C Mask ROM Polling / Flash Timer Output 1 High-Current Port output operable in Power Saving Modes CDC3231G-C Mask ROM Timers & Counters 16-bit free running counters with Capture/Compare modules CCC0 with 4 CAPCOM CCC1 with 2 CAPCOM 16-bit timers 1: T0 8-bit timers 4: T1, T2, T3 and T4 Real Time Clock, Delivering Hours, Minutes and Seconds CCC0 with 4 CAPCOM Miscellaneous Scalable layout in CAN, RAM and ROM - Various randomly selectable HW options Set by copy from user program storage during system start-up JTAG interface allows Flash programming On Chip Debug Aids Embedded Trace Module, JTAG JTAG Core Bond-Out - Supply Voltage 3.5 to 5.5 V (limited I/O performance below 4.5 V) Case Temperature Range 0 to +70 C -40 to +105 C Type Ceramic 257PGA Plastic 128QFP 0.5 mm pitch Bonded Pins 256 128 126 111 Package 128 ARM and Thumb are the registered trademarks of ARM Limited. ARM7TDMI is the trademark of ARM Limited. 1.2. Abbreviations ADC AM CAN CAPCOM CCC CPU DMA ERM ETM I2C LCD P06COMP PWM Micronas Analog-to-Digital Converter Audio Module Controller Area Network Module Capture/Compare Module Capture/Compare Counter Central Processing Unit Direct Memory Access Module EMI Reduction Mode Embedded Trace Module I2C Interface Module Liquid Crystal Display Module P0.6 Alarm Comparator Pulse Width Modulator Module SM SPI T UART WAITCOMP March 12, 2004; 6251-615-1PD Stepper Motor Control Module Serial Synchronous Peripheral Interface Timer Universal Asynchronous Receiver Transmitter Wait Comparator 5 CDC 3272G-C PRELIMINARY DATA SHEET 1.3. Block Diagram UVDD UVSS VDD VSS Reset/Alarm Test 2.5V Reg. Watchdog Clock PLL/ERM ARM7TDMI CPU RTC Power Saving 2.5V Reg. JTAG Test and Debug Interface PPort0 SRAM 4k x 32 UPort0 HPort4 HVDD0 HVSS0 HVDD1 HVSS1 HVDD2 HVSS2 HVDD3 HVSS3 UPort1 4 UPort2 HPort1 HPort2 4 HPort5 4 HPort6 4 7 UPort3 Bridge 8 4 4 3 4 6 8 UART 0 LCD Control Stepper Motor Control UART 1 Audio Module 8Bit PWM 0 8/16B PWM 1 SPI 0 16Bit Timer 0 16Bit CCC 0 8Bit Timer 1 CAPCOM 0 8Bit Timer 2 CAPCOM 1 CAPCOM 2 Clock Out 0 8Bit PWM 2 8Bit Timer 3 Clock Out 1 8/16B PWM 3 8Bit Timer 4 8Bit PWM 4 CAN 0 Phase-Freq.Modulator 0 CAN 1 Phase-Freq.Modulator 1 SPI 1 8/16B PWM 5 CAPCOM 3 16Bit CCC 1 CAPCOM 4 CAPCOM 5 8Bit PWM 6 8/16B PWM 7 8Bit PWM 8 HPort7 4 HPort3 4 Patch 10 Locations UPort4 HPort0 Bandgap Ref. 8 UPort5 Special Function ROM 4k x 16 8 UPort6 ROM 96k x 32 UPort7 Memory Controller Wait Comp. 16/32 Bridge 32 10Bit ADC 4 5 DMA Logic P06 Comp. 4 XTAL1 XTAL2 UPort8 2 40 Input Interrupt Controller PPort1 8 PPort2 8 TEST TEST2 RC Oscillator WAIT WAITH VREFINT VREF AVDD AVSS BVDD RESETQ 8/16B PWM 9 8Bit PWM 10 DIGITbus 8/16B PWM 11 I2 C 0 I2 C 1 Fig. 1-1: CDC3272G-C block diagram 6 March 12, 2004; 6251-615-1PD Micronas CDC 3272G-C PRELIMINARY DATA SHEET 2. Packages and Pins 2.1. Package Outline Dimensions Fig. 2-1: PMQFP128-2: Plastic Metric Quad Flat Package, 128 leads, 14 x 20 x 2.7 mm3 Ordering code: QK Weight approximately 1.8 g Micronas March 12, 2004; 6251-615-1PD 7 CDC 3272G-C PRELIMINARY DATA SHEET 2.2. Pin Assignment Pin Functions LCD Port Port Basic Mode Special Out Special In Function SEG3.1 CC1-OUT CC1-IN / TMS U3.1 SEG3.0 CC2-OUT CC2-IN / TDI U3.0 TEST2 UVDD UVSS SEG2.6 DIGIT-OUT DIGIT-IN U2.6 SEG2.5 CC1-OUT UART0-RX U2.5 SEG2.4 UART0-TX DIGIT-IN/CC1-IN U2.4 SEG2.3 CC2-OUT UART1-RX U2.3 SEG2.2 UART1-TX CC2-IN U2.2 SEG7.7 CO0 U7.7/GD7 SEG7.6 CO1 U7.6/GD6 SEG7.5 LCK/PFM1 U7.5/GD5 SEG7.4 CC5-OUT CC5-IN U7.4/GD4 NC NC SEG5.3 CC4-OUT CC4-IN U5.3/GD3 SEG5.2 SDA1 SDA1 U5.2/GD2 SEG5.1 SCL1 SCL1 U5.1/GD1 SEG5.0 PFM0 U5.0/GD0 SEG2.1 SDA0 WP6/SDA0/CAN0U2.1 RX SEG2.0 SCL0/CAN0-TX SCL0 U2.0 SEG1.7 PFM0 WP0/PINT0 U1.7 SEG1.6 INTRES/CO0 PINT1 U1.6 SEG1.5 CO1/CO0Q PINT2 U1.5 TEST RESETQ/ALARMQ XTAL2 XTAL1 VSS VDD SEG1.4 ITSTOUT/AM-OUT U1.4 SEG1.3 MTO/AM-PWM WP3 U1.3 SEG1.2 INTRES/T0-OUT MTI/ITSTIN U1.2 SEG1.1 T1-OUT U1.1 SEG1.0 T2-OUT U1.0 SEG0.7 T3-OUT WP4 U0.7 SEG0.6 CC3-OUT/T4-OUT CC3-IN U0.6 SEG0.5 CC3-OUT PINT4 U0.5 SEG0.4 CO1 PINT5 U0.4 SEG0.3 PWM0 U0.3 SEG0.2 PWM1 U0.2 SEG0.1 PWM2 U0.1 SEG0.0 PWM3 U0.0 SME1+/PWM4 SME-COMP3 H7.3 SME1-/PWM6 SME-COMP2 H7.2 SME2+/PWM8 SME-COMP1 H7.1 SME2-/PWM9 SME-COMP0 H7.0 HVDD2 HVSS2 PWM8 H6.3 PWM9 H6.2 PWM10 H6.1 PWM11 H6.0 SMD1+ SMD-COMP3 H5.3 SMD1SMD-COMP2 H5.2 HVDD0 HVSS0 SMD2+ SMD-COMP1 H5.1 SMD2SMD-COMP0 H5.0 SMA1+ SMA-COMP3 H4.3 SMA1SMA-COMP2 H4.2 SMA2+ SMA-COMP1 H4.1 SMA2SMA-COMP0 H4.0 Not Pin e No. 1,2 1,2 1,2 1,2 1,2 1,2 1 1 1 1 1 1 1 1 1,2 1,2 1,2 1,2 1,2 1,2 116 117 118 119 120 121 122 123 124 125 126 127 128 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 128 116 115 103 1 102 38 65 39 51 52 64 NC = not connected, leave vacant (...) = future usage Pin Not No. e Basic Function 115 U3.2 114 U3.3 113 U3.4 112 U3.5 111 U3.6 110 U3.7 109 U4.0 108 U4.1 107 U4.2 106 U4.3 105 1,2 U8.0 104 1,2 U8.1 103 1,2 U8.2 102 1,2 U8.3 101 1,2 U8.4 100 1,2 U8.5 99 1 U6.0 98 1 U6.1 97 1 U6.2 96 1 P2.0 95 P2.1 94 P0.0 93 P0.1 92 P0.2 91 P0.3 90 P0.4 89 P0.5 88 P0.6 87 P0.7 86 WAITH 85 WAIT 84 BVDD 83 AVSS 82 AVDD 81 VREFINT 80 VREF 79 P1.0 78 P1.1 77 P1.2 76 P1.3 75 P1.4 74 P1.5 73 P1.6 72 P1.7 71 1 H0.0 70 1 H0.1 69 1 H0.2 68 1 H0.3 67 1,2 HVSS3 66 1,2 HVDD3 65 1,2 H1.0 64 1,2 H1.1 63 1,2 H1.2 62 1,2 H1.3 61 H2.0 60 H2.1 59 HVSS1 58 HVDD1 57 H2.2 56 H2.3 55 H3.0 54 H3.1 53 H3.2 52 H3.3 Pin Functions Port Port Special In Special Out CC0-IN / TCK CC0-OUT CO0/TDO SPI0-CLK-IN SPI0-CLK-OUT SPI0-D-IN TO3 SPI0-D-OUT SPI1-CLK-IN SPI1-CLK-OUT SPI1-D-IN CC0-OUT CC0-IN SPI1-D-OUT CAN0-TX CAN0-RX/WP5 TO2 CC4-OUT CC3-OUT LCD-CLK-IN WP9 LCD-CLK-OUT LCD-SYNC-IN PINT3/WP8 LCD-SYNC-OUT CAN1-TX CAN1-RX/WP7 GOEQ GWEQ LCD Mode SEG3.2 SEG3.3 SEG3.4 SEG3.5 SEG3.6 SEG3.7 BP0 BP1 BP2 BP3 SEG8.0 SEG8.1 SEG8.2 SEG8.3 SEG8.4 SEG8.5 SEG6.0 SEG6.1 SEG6.2 CC4-IN P0.6 Comp. VREF0/WP1 VREF1/WP2 PINT0 PINT1 PINT2 PINT3 PINT4 PINT5 SMG-COMP0 SMG-COMP1 SMG-COMP2 SMG-COMP3 SMG2-/PWM7 SMG2+/PWM5 SMG1-/PWM3/POL SMG1+/PWM1 SMF-COMP0 SMF-COMP1 SMF-COMP2 SMF-COMP3 SMC-COMP0 SMC-COMP1 SMF2SMF2+ SMF1SMF1+ SMC2SMC2+ SMC-COMP2 SMC-COMP3 SMB-COMP0 SMB-COMP1 SMB-COMP2 SMB-COMP3 SMC1SMC1+ SMB2SMB2+ SMB1SMB1+ Fig. 2-2: Pin Assignment 2.3. Pin Function Description (differing from document "CDC32xxG-C Automotive Controller - Family User Manual, CDC3205G-C Automotive Controller" (6251-579-1PD)) TEST2 For normal operation with internal code connect TEST2 to System Ground (no internal pull-down). 8 March 12, 2004; 6251-615-1PD Micronas CDC 3272G-C PRELIMINARY DATA SHEET 2.4. External Components +5V Supply UVDD 4 x 100n to 150n 100n to 150n 5V System Ground +5V Supply HVDD0 to 3 UVSS HVSS0 to 3 System Ground AVDD Analog Supply 2.5V VDD 10 Tantal Low ESR 220n Ceramic X7R VSS 100n to 150n VREFINT XTAL1 5V 18p 10n, Ceramic 2.5V 18p +5V Supply BVDD XTAL2 4k7 Resetq Analog Ground AVSS 150n Ceramic X7R 47n RESETQ Fig. 2-3: CDC3207G-C: Recommended external supply and quartz connection. To provide effective decoupling and to improve EMC behavior, the small decoupling capacitors must be located as close to the supply pins as possible. The self-inductance of these capacitors and the parasitic inductance and capacitance of the interconnecting traces determine the self-resonant frequency of the decoupling network. Too low a frequency will reduce decoupling effectiveness, will increase RF emissions and may adversely affect device operation. XTAL1 and XTAL2 quartz connections are especially sensitive to capacitive coupling from other pc board signals. It is strongly recommended to place quartz and oscillation capacitors as close to the pins as possible and to shield the XTAL1 and XTAL2 traces from other signals by embedding them in a VSS trace. The RESETQ pin adjacent to XTAL2 should be supplied with a 47 nF capacitor, to prevent fast RESETQ transients from being coupled into XTAL2, to prevent XTAL2 from coupling into RESETQ, and to guarantee a time constant of 200 s sufficient for proper Wake Reset functionality. Micronas March 12, 2004; 6251-615-1PD 9 CDC 3272G-C 10 PRELIMINARY DATA SHEET March 12, 2004; 6251-615-1PD Micronas CDC 3272G-C PRELIMINARY DATA SHEET 3. Electrical Data 3.1. Absolute Maximum Ratings Stresses beyond those listed in the "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these conditions is not implied. Exposure to absolute maximum ratings conditions for extended periods will affect device reliability. This device contains circuitry to protect the inputs and outputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than absolute maximum-rated voltages to this high-impedance circuit. Table 3-1: Absolute Maximum Ratings (All voltages listed are referenced to ground (UVSS = HVSSn = AVSS = 0 V), except where noted. All GND pins except VSS must be connected to a low-resistive ground plane close to the IC). Symbol Parameter Pin Name Limit Values Min. Max. Unit VSUP Main Supply Voltage Analog Supply Voltage SM Supply Voltage UVDD AVDD HVDDn -0.3 6.0 V VREG Core Supply Voltage PLL Supply Voltage VDD BVDD -0.3 3.0 V ISUP Core Supply Current Main Supply Current VDD, VSS, UVDD, UVSS -100 100 mA Analog Supply Current AVDD, AVSS -20 20 mA SM Supply Current @TCASE=105C, Duty Factor=0.71 1) HVDDn HVSSn -250 250 mA PLL Supply Current BVDD -20 20 mA Input Voltage U-Ports, XTAL,RESETQ, TEST, TEST2 UVSS-0.5 UVDD+0.7 V P-Ports VREF UVSS-0.5 AVDD+0.7 V H-Ports HVSS-0.5 HVDD+0.7 V Vin Iin Input Current all Inputs 0 2 mA Io Output Current U-Ports, RESETQ, WAITH -5 5 mA H-Ports -60 60 mA indefinite s toshsl Duration of Short Circuit to UVSS or UVDD, Port SLOW Mode enabled Tj Junction Temperature under Bias -45 115 C Ts Storage Temperature -45 125 C Pmax Maximum Power Dissipation 0.8 W 1) U-Ports, except in DP Mode This condition represents the worst case load with regard to the intended application Micronas March 12, 2004; 6251-615-1PD 11 CDC 3272G-C PRELIMINARY DATA SHEET 3.2. Recommended Operating Conditions Do not insert the device into a live socket. Instead, apply power by switching on the external power supply. Keep UVDD=AVDD during all power-up and power-down sequences. Functional operation of the device beyond those indicated in the "Recommended Operating Conditions/Characteristics" is not implied and may result in unpredictable behavior, reduce reliability and lifetime of the device. Table 3-2: Recommended Operating Conditions (All voltages listed are referenced to ground (UVSS = HVSSn = AVSS = 0 V), except where noted. All GND pins except VSS must be connected to a low-resistive ground plane close to the IC). Symbol Parameter Pin Name Limit Values Min. Typ. Unit Max. dVDD Ripple, Peak to Peak UVDD AVDD BVDD VDD 200 mV dVDD/dt Supply Voltage Up/Down Ramping Rate UVDD AVDD 20 V/s fXTAL XTAL Clock Frequency XTAL1 5 MHz fSYS CPU Clock Frequency, PLL on fBUS Program Storage Clock Frequency, PLL on Vil (see Table 2-2 for a list of input types and their supply voltages) Automotive Low Input Voltage U-Ports H-Ports P-Ports 0.5*xVDD V CMOS Low Input Voltage U-Ports, TEST, TEST2 H-Ports P-Ports 0.3*xVDD V Vih (see Table 2-2 for a list of input types and their supply voltages) Automotive High Input Voltage U-Ports H-Ports P-Ports 0.86*xVDD V CMOS High Input Voltage U-Ports,TEST, TEST2 H-Ports P-Ports 0.7*xVDD V RVil Reset Active Input Voltage RESETQ 0.75 V WRVil Reset Active Input Voltage during Power Saving Modes and Wake Reset RESETQ 0.4 V RVim Reset Inactive and Alarm Active Input Voltage RESETQ 1.5 2.3 V RVih Reset Inactive and Alarm Inactive Input Voltage RESETQ 3.2 V WRVih Reset Inactive Input Voltage during Power Saving Modes and Wake Reset RESETQ UVDD-0.4V V 12 4 4 For a list of available settings see Tables 4-1 and 4-2. March 12, 2004; 6251-615-1PD Micronas CDC 3272G-C PRELIMINARY DATA SHEET Table 3-2: Recommended Operating Conditions, continued (All voltages listed are referenced to ground (UVSS = HVSSn = AVSS = 0 V), except where noted. All GND pins except VSS must be connected to a low-resistive ground plane close to the IC). Symbol Parameter Pin Name Limit Values Min. Typ. Unit Max. VREFi Ext. ADC Reference Input Voltage VREF 2.56 AVDD V PVi ADC Port Input Voltage referenced to int. VREF Reference P-Ports 0 VREFi V 0 VREFINT ADC Port Input Voltage referenced to ext. VREFINT Reference 3.3. Characteristics Listed are only those characteristics that differ from Chapter 3.3 of Document "CDC32xxG-C Automotive Controller - Family User Manual, CDC3205G-C Automotive Controller" (6251-579-1PD). All not differing characteristics, that are not listed here, apply, but in a TCASE temperature range extended to -40 C to +105 C Table 3-3: Characteristics UVSS = HVSSn = AVSS = 0 V, 3.5 V < AVDD = UVDD < 5.5 V, 4.75 V < HVDDn < 5.25 V, TCASE = -40 C to +105 C, fXTAL = 5 MHz, external components according to Fig. 2-3 (unless otherwise noted) Symbol Parameter Limit Values Pin Name Min. Typ.1) Unit Test Conditions measured on Micronas typical 2-layer board, 1s1p, described in document "Integrated Circuits - Thermal Characterization of Packages" (6200-2661E) (modified JESD51.3) Max. Package Rthjc Thermal Resistance from Junction to Case 10 C/W Rthja Thermal Resistance from Junction to Ambient 36 C/W Supply Currents (CMOS levels on all inputs, i.e. Vil=xVSS0.3V and Vih=xVDD0.3V, no loads on outputs) UIDDp UVDD PLL Mode Supply Current UVDD 50 mA fSYS=24MHz UIDDf UVDD FAST Mode Supply Current UVDD 22 mA all Modules OFF, 2) UIDDs UVDD SLOW Mode Supply Current UVDD see Fig. 3-1 1.4 mA all Modules OFF 2) 3) UIDDd UVDD DEEP SLOW Mode Supply Current UVDD see Fig. 3-1 0.9 mA all Modules OFF 3) UIDDw UVDD WAKE Mode Supply Current UVDD 20 50 A RC and XTAL oscillators OFF 0 1) Typical values describe typical behavior at room temperature (25 C, unless otherwise noted), with typical Recommended Operating Conditions applied, and are not 100% tested. 2 ) Value may be exceeded with unusual Hardware Option setting 3) Measured with external clock. Add 120 A for operation on typical quartz with SR0.XTAL = 0 (Oscillator RUN mode). Micronas March 12, 2004; 6251-615-1PD 13 CDC 3272G-C PRELIMINARY DATA SHEET Table 3-3: Characteristics, continued UVSS = HVSSn = AVSS = 0 V, 3.5 V < AVDD = UVDD < 5.5 V, 4.75 V < HVDDn < 5.25 V, TCASE = -40 C to +105 C, fXTAL = 5 MHz, external components according to Fig. 2-3 (unless otherwise noted) Symbol Parameter Limit Values Pin Name UIDDi AIDDa AIDDq UVDD STANDBY Mode Supply Current UVDD IDLE Mode Supply Current AVDD Active Supply Current Quiescent Supply Current HIDDq Test Conditions Typ.1) Max. UVDD 35 75 A RC oscillator ON, XTAL OFF UVDD 60 100 A XTAL oscillator ON, RC OFF 3) UVDD 50 TBD A RC oscillator ON, XTAL OFF 75 TBD A XTAL oscillator ON, RC OFF 3) 0.35 0.6 mA ADC ON, PLL OFF 1 2 mA ADC and PLL ON, fSYS=24MHz Min. UIDDst Unit AVDD AVDD 0 1 10 A SLOW, DEEP SLOW and power saving modes, ADC and PLL OFF Sum of all HVDDn 0 1 40 A no Output Activity, SM Module OFF TEST2 -1 1 A 0