Common mode ESD filter LXES**D series Document No. LX-1-1126 Rev1.1 p1/35 1. This specification shall be applied to the ESD Protection Device. LXES11DAA2-135 LXES21DAA4-136 LXES11DAA2-137 LXES21DAA4-138 LXES21DAA4-140 LXES18DAA4-167 LXES0NDAA2-172 LXES18DAA4-182 LXES0NDAA2-183 LXES18DAA4-184 LXES0NDAA2-185 2. Par Number Configuration LXES 11 D AA 2 - 135 Product ID LXES = ESD Protection device Dimension Code Unit : mm Code Dimension 11 1.25 x 1.0 21 2.0 x 1.25 0N 0.87 x 0.67 18 1.6 x 0.8 Type (D : Common mode ESD filter) Control Code Number of channel Serial Number RoHS Compliant Halogen free T/R only. MURATA MFG. CO., LTD. p2/35 3.CONSTRUCTION, DIMENSIONS 3 - 1 DIMENSIONS LXES11D series Top View Mark L W T a1 Side View 1 Dimension 1.25 +/-0.1 1.0 +/-0.1 0.75 +/-0.1 0.3 +/-0.1 Side View 2 Bottom View Unit : mm Dimension 0.25 +/-0.15 0.2 +/-0.1 0.2 +/-0.15 0.55 +/-0.05 Mark a2 b1 b2 p LXES21Dseries Top View Side View 1 Side View 2 Unit : mm Mark L W T a1 Dimension 2.0 +/-0.1 1.25 +/-0.1 0.80 +0.1/-0.05 0.25 +/-0.1 Mark a2 b1 b2 p Unit : mm Dimension 0.2 +/-0.15 0.25 +/-0.1 0.2 +/-0.15 0.5 +/-0.05 MURATA MFG. CO., LTD. Bottom View p3/35 LXES0NDseries Top View Mark L W T Side View 1 Dimension 0.870.05 0.670.05 0.470.05 Mark a b c Side View 2 Unit : mm Dimension 0.200.05 0.150.05 0.400.05 LXES18Dseries Top View (4) Side View 1 (3) (2) (1) (7) (8) (9) Side View 2 (5) (10) (6) Mark L W T a1 Dimension 1.6 +/-0.1 0.8 +/-0.1 0.5 +/-0.05 0.2 +/-0.1 Unit : mm Mark a2 b1 b2 p Unit : mm Dimension 0.15 +/-0.1 0.2 +/-0.1 0.15+/-0.1 0.4 +/-0.05 MURATA MFG. CO., LTD. Bottom View p4/35 3 - 2 Circuit Diagram LXES11D series / LXES0ND series LXES21D series/ LXES18D series (9) (8) (5) (10) (6) (5) (10) (5) (10) (1) (2) TERMINAL CONFIGURATION This device is bi-directional. 3 - 3 Product Weight P/N LXES11D series LXES21D series LXES0ND series LXES18D series (7) Weight [mg] 3.0 7.1 1.0 2.3 MURATA MFG. CO., LTD. (3) (4) p5/35 4.CHARACTERISTICS 4 - 1 Ratings Parameter Rated Voltage Rated Current Operating Temperature Storage Temperature Rating 5 60 -40 to +85 -40 to +85 Unit V mA 4 - 2 Electrical Characteristics (T=25) P/N Parameter Common mode impedance DC Resistance LXES11DAA2-135 Capacitance LXES21DAA4-136 ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) P/N Parameter Common mode impedance DC Resistance LXES11DAA2-137 Capacitance LXES21DAA4-138 ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) P/N Parameter Common mode impedance DC Resistance Capacitance LXES21DAA4-140 ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) P/N Parameter Common mode impedance DC Resistance Capacitance LXES18DAA4-167 ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Conditions @100MHz 1MHzVbias=0V Conditions @100MHz 1MHzVbias=0V Conditions @100MHz 1MHzVbias=0V Conditions @100MHz 1MHzVbias=0V MURATA MFG. CO., LTD. MIN TYP MAX Units 60 3 0.4 pF -15 15 kV -15 15 kV MIN TYP MAX Units 35 2 0.4 pF -15 15 kV -15 15 kV MIN TYP MAX Units 90 4 0.4 pF -15 15 kV -15 15 kV MIN TYP MAX Units 90 5 0.4 pF -15 15 kV -15 15 kV p6/35 P/N LXES0NDAA2-172 P/N LXES18DAA4-182 LXES0NDAA2-183 P/N LXES18DAA4-184 LXES0NDAA2-185 Parameter Common mode impedance DC Resistance Capacitance ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Parameter Common mode impedance DC Resistance Capacitance ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Parameter Common mode impedance DC Resistance Capacitance ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Conditions @100MHz 1MHzVbias=0V Conditions @100MHz 1MHzVbias=0V Conditions @100MHz 1MHzVbias=0V MURATA MFG. CO., LTD. MIN TYP MAX Units 75 5 0.4 pF -15 15 kV -15 15 kV MIN TYP MAX Units 25 4 0.4 pF -15 15 kV -15 15 kV MIN TYP MAX Units 50 5 0.4 pF -15 15 kV -15 15 kV p7/35 4 - 3 Typical Characteristic LXES11DAA2-135 200 Voltage[V] 150 100 50 0 -10 0 10 20 30 Time[nsec] 40 50 ESD Waveform (IEC61000-4-28kV Contact) LXES21DAA4-136 200 Voltage[V] 150 100 50 0 -10 0 10 20 30 Time[nsec] 40 50 ESD Waveform (IEC61000-4-28kV Contact) LXES11DAA2-137 200 Voltage[V] 150 100 50 0 -10 0 10 20 30 Time[nsec] 40 ESD Waveform (IEC61000-4-28kV Contact) MURATA MFG. CO., LTD. 50 p8/35 LXES21DAA4-138 200 Voltage[V] 150 100 50 0 -10 0 10 20 30 40 50 Time[nsec] ESD Waveform (IEC61000-4-28kV Contact) LXES21DAA4-140 200 Voltage[V] 150 100 50 0 -10 0 10 20 30 40 Time[nsec] ESD Waveform (IEC61000-4-28kV Contact) MURATA MFG. CO., LTD. 50 p9/35 LXES18DAA4-167 300 Voltage[V] 250 200 150 100 50 0 -10 0 10 20 30 40 50 Time[nsec] ESD Waveform (IEC61000-4-28kV Contact) LXES0NDAA2-172 300 Voltage[V] 250 200 150 100 50 0 -10 0 10 20 30 40 50 Time[nsec] ESD Waveform (IEC61000-4-28kV Contact) LXES18DAA4-182 300 Voltage[V] 250 200 150 100 50 0 -10 0 10 20 30 Time[nsec] 40 ESD Waveform (IEC61000-4-28kV Contact) MURATA MFG. CO., LTD. 50 p10/35 LXES18DAA4-183 300 Voltage[V] 250 200 150 100 50 0 -10 0 10 20 30 Time[nsec] 40 50 ESD Waveform (IEC61000-4-28kV Contact) LXES18DAA4-184 300 Voltage[V] 250 200 150 100 50 0 -10 0 10 20 30 Time[nsec] 40 50 ESD Waveform (IEC61000-4-28kV Contact) LXES0NDAA2-185 300 Voltage[V] 250 200 150 100 50 0 -10 0 10 20 30 Time[nsec] 40 ESD Waveform (IEC61000-4-28kV Contact) MURATA MFG. CO., LTD. 50 p11/35 S parameter LXES11DAA2-135 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] LXES21DAA4-136 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] LXES11DAA2-137 Sdd21 0 Scc21 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] MURATA MFG. CO., LTD. p12/35 LXES21DAA4-138 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] LXES21DAA4-140 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] LXES18DAA4-167 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] MURATA MFG. CO., LTD. p13/35 LXES0NDAA2-172 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] LXES18DAA4-182 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] MURATA MFG. CO., LTD. p14/35 LXES0NDAA2-183 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] LXES18DAA4-184 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] LXES0NDAA2-185 Sdd21 Scc21 0 S[dB] -10 -20 -30 -40 -50 0.01 0.1 1 Frequency[GHz] MURATA MFG. CO., LTD. p15/35 Signal Integrity HDMI 1080P 48bit 0ohm w/t LXES11DAA2-135 Signal Integrity USB2.0 0ohm w/t LXES11DAA2-135 Signal Integrity USB3.0 0ohm w/t LXES11DAA2-135 MURATA MFG. CO., LTD. p16/35 Signal Integrity HDMI 1080P 48bit 0ohm w/t LXES21DAA4-136 Signal Integrity USB2.0 0ohm w/t LXES21DAA4-136 Signal Integrity USB3.0 0ohm w/t LXES21DAA4-136 MURATA MFG. CO., LTD. p17/35 Signal Integrity HDMI 1080P 48bit 0ohm w/t LXES11DAA2-137 Signal Integrity USB2.0 0ohm w/t LXES11DAA2-137 Signal Integrity USB3.0 0ohm w/t LXES11DAA2-137 MURATA MFG. CO., LTD. p18/35 Signal Integrity HDMI 1080P 48bit 0ohm w/t LXES21DAA4-138 Signal Integrity USB2.0 0ohm w/t LXES21DAA4-138 Signal Integrity USB3.0 0ohm w/t LXES21DAA4-138 MURATA MFG. CO., LTD. p19/35 Signal Integrity HDMI 1080P 48bit 0ohm Signal Integrity USB2.0 0ohm Signal Integrity USB3.0 0ohm w/t LXES21DAA4-140 w/t LXES21DAA4-140 w/t LXES21DAA4-140 MURATA MFG. CO., LTD. p20/35 5.Reliability Test No. Items Specifications No severe damages Satisfy dimension specifications 1 2 Vibration Resistance Test Methods Result (Fail) 22 G (0) 22 G (0) 22 G (0) 22 G (0) 22 G (0) 22 G (0) Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Frequency : 10~2000 Hz Acceleration : 196 m/s2 Direction : X,Y,Z 3 axis Period : 2 h on each directionTotal 6 h. Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock Shock Number Acceleration : 14,700 m/s2 Period : 0.3 ms. Cycle : 3 times 3 Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.2 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection No damage with 1.6mm deflection Solder specimens onto test jig shown below. Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken. Pushing force is applied to longitudinal direction. Pushing Direction 4 5 Soldering strength (Push Strength) Solderability of Termination Appearance Resistance to Soldering Heat 6 (Reflow) Electrical specifications 5N Minimum Specimen 95% of the terminations is to be soldered evenly and continuously. No severe damages Satisfy specifications listed in paragraph 42 over operational temperature range Jig Immerse specimens first an ethanol solution of rosin, then in a Pb free solder solution for 30.5 sec. at 2455 C. Preheat : 10 0-120 C, 60 sec. Solder Paste : Sn-3.0Ag-0.5Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) Preheat Temperature Preheat Period High Temperature High Temp. Period Peak Temperature : 150-200 C : 120+/ -60 s : 217 : 105+/-45 s : 260+0/ -5 C Specimens are soldered twice with the above condition, and then kept in room condition for 24 h before measurements. MURATA MFG. CO., LTD. No. 7 8 9 10 Items High Temp. Exposure Temperature Cycle Specifications Appeara nce Electrical Specifica tions No severe damages Satisfy specifications listed in paragraph 4-2 over operational temperature range Number Test Methods Temperature : 85+2/-0 C Period : 1000+48/-0 h Room Condition : 2 ~ 24 h p21/35 Result (Fail) 22 G (0) 22 G (0) 22 G (0) 22 G (0) Set the specimens to the supporting jig in the same manner and under the same conditions as Fig.1 and conduct the 100 cycles according to the temperatures and time shown in the following table. Set it for 2 to 24 h at room temperature, then measure. Step Temp(C) Time(min) 1 Min. Operating Temp.+0/-3 303 2 Max. Operating Temp.+3/-0 303 Humidity (Steady State) Temperature852 Humidity8090 %RH Period1000+48/-0 h Room Condition2 24 h Low Temp. Exposure Temperature-402 Period1000+48/-0 h Room Condition2 24 h MURATA MFG. CO., LTD. p22/35 Fig. 1 Reference Land Pattern LXES11D series Mark Dimension a 0.6 b 1.4 c 0.2 d 0.75 Mark e f g Unit : mm Dimension 1.75 0.3 0.25 Notes : this land layout is for reference purpose only. LXES21D series Mark Dimension a 0.5 b 1.5 c 0.25 d 0.25 Mark e f g Unit : mm Dimension 0.5 0.25 0.75 Notes : this land layout is for reference purpose only. MURATA MFG. CO., LTD. p23/35 LXES0ND series Mark Dimension a 0.2 b 0.4 c 0.265 Mark d e f Unit : mm Dimension 0.39 0.095 0.17 Notes: this land layout is for reference purpose only. LXES18D series Mark Dimension a 0.35 b 1.3 c 0.2 d 0.2 Mark e f g Unit : mm Dimension 0.47 0.15 0.48 Notes : this land layout is for reference purpose only. MURATA MFG. CO., LTD. p24/35 Fig. 2 Testing board Unit : mm 40 Land Land pattern is same as figure1 Glass-fluorine board t1.6 Copper thickness over 35 m 100 Mounted situation (Unit : mm) CHIP 45 45 Test method (Unit : mm) 20 50 R230 deflection MURATA MFG. CO., LTD. p25/35 6.Tape and Reel Packing (1) LXES11D series Dimensions of Tape Mark L W T a b Dimension (1.40) (1.20) 1.03 max 2.00 +/-0.05 4.00 +/-0.1 (2) LXES21D series Dimensions of Tape Mark c d e f g Unit : mm Dimension 4.00 +/-0.1 3.50 +/-0.05 1.75 +/-0.10 8.00 +/-0.2 1.55+/-0.05 e d f L W a c b Mark L W T a b Dimension (2.25) (1.45) 1.1 max 2.00 +/-0.05 4.00 +/-0.1 Mark c d e f g Unit : mm Dimension 4.00 +/-0.1 3.50 +/-0.05 1.75 +/-0.10 8.00 +/-0.2 1.55+/-0.05 MURATA MFG. CO., LTD. T p26/35 (3) LXES0ND series Dimensions of Tape e d f L a W c b Mark L W T a b Dimension (1.0) (0.8) 0.64 max 2.00 +/-0.05 2.00 +/-0.1 Mark c d e f g Unit : mm Dimension 4.00 +/-0.1 3.50 +/-0.05 1.75 +/-0.10 8.00 +/-0.10 1.55+/-0.05 (4) LXES18D series Dimensions of Tape Mark L W T a b Dimension (1.8) (1.0) 0.64 max 4.00 +/-0.1 4.00 +/-0.1 Mark c d e f g Unit : mm Dimension 2.00 +/-0.05 1.75 +/-0.1 3.50 +/-0.05 8.00 1.50 MURATA MFG. CO., LTD. T p27/35 (3) Dimensions of Reel a d e b c Symbol a b c Dimension 2.0 +/-0.5 13.0+/-0.2 9.0+1.0/-0 (4) Packaging P/N LXES11D series LXES21D series LXES0ND series LXES18D series pcs / reel 3,000 3,000 10,000 4,000 MURATA MFG. CO., LTD. Unit : mm d e 60+1.0/- 180+0/0 1.5 p28/35 (5) Taping Diagrams [1] Feeding Hole : As specified in (1) (2) [2] Hole for chip : As specified in (1) (2) [3] Cover tape : 50 m in thickness [4] Base tape : As specified in (1) (2) [3] [1] [2] [3] [4] Marking Direction LXES11D series Feeding hole Feedeng Direction Chip LXES21D series Feeding hole Feedeng Direction Chip MURATA MFG. CO., LTD. p29/35 LXES0ND series LXES18D series Feeding Hole Feeding Direction Chip MURATA MFG. CO., LTD. p30/35 (6) Leader and Tail tape Tail tape (No components) Components No components Leader tape (Cover tape alone) Over160mm Over100mm Over400mm Feeding direction (7) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (8) Material : Base tape Reel ...... Plastic(LXES11D series/ LXES21D series) ...... Paper(LXES0ND series/ LXES18D series) ...... Plastic Base tape, Reel and Top tape have an anti-ESD function. (9) Peeling of force : 0.1~1.0 N in the direction of peeling as shown below. 0.11.0N 165 to 180 Cover tape Base tape MURATA MFG. CO., LTD. p31/35 NOTICE 1. Storage Conditions: To avoid damaging the solderability of the external electrodes, be sure to observe the following points. - Store products where the ambient temperature is 15 to 35 C and humidity 45 to 75% RH. (Packing materials, In particular, may be deformed at the temperature over 40 C.). - Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.). - Stored products should be used within 6 months of receipt. is exceeded. Solderability should be verified if this period This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020) 2. Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products due to the nature of ceramics structure. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 4. Notice for Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. MURATA MFG. CO., LTD. p32/35 5. Soldering Conditions: Carefully perform preheating so that the temperature difference (T) between the solder and products surface should be in the following range. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions. Soldering method Soldering iron method Reflow method Temperature <=130 C - Soldering iron method conditions are indicated below. Kind of iron Item Soldering iron wattage Temperature of iron-tip Iron contact time Ceramics heater <=18 W <=350 C within 3 sec - Diameter of iron-tip : 3.0 mm max. - Do not allow the iron-tip to directly touch the ceramic element. Reflow soldering standard conditions(Example) 255-260 C 20-40 sec Temperature (C) MAX260 C 255 C 217 C Cooling down slowly 200 C 150 C Pre-heating 60-180 sec 60-150 sec. Time (s.) Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. MURATA MFG. CO., LTD. p33/35 Amount of Solder Paste: - Ensure that solder is applied smoothly to a minimum height of 0.2 to 0.5 mm at the end surface of the external electrodes. If too much or little solder is applied, there is high possibility that the mechanical strength will be insufficient, creating the variation of characteristics. Amount of solder paste Chip High <Unacceptable> Lead wire of component mounted later Chassis Solder (Grounding solder) Chip Land Lead wire of leaded component Soldering iron PCB <Improvements by land division > Solder resist Solder resist Chip MURATA MFG. CO., LTD. Solder resist p34/35 6. Cleaning Conditions: Any cleaning is not permitted.. 7. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NO x etc.). - In an atmosphere containing combustible and volatile gases. - In a dusty environment. - Direct sunlight - Water splashing place. - Humid place where water condenses. - In a freezing environment. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: (1) Installation of protection circuits or other protective device to improve system safety (2) Installation of redundant circuits in the case of single-circuit failure 8. Input Current and Voltage Capacity: Products shall be used in the input current and voltage capacity as specified in this specification. Inform Murata beforehand, in case that the components are used beyond such input current and voltage capacity range. 9. Limitation of Applications: The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring extremely high reliability following the application listed below, you should consult with the Murata staff in advance. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment. - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Data-procession equipment. - Application which malfunction or operational error may endanger human life and property of assets. - Application which related to occurrence the serious damage - Application of similar complexity and/ or reliability requirements to the applications listed in the above. MURATA MFG. CO., LTD. p35/35 ! Note: Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. Product specifications are subject to change or our products in it may be discontinued without advance notice. This catalog is for reference only and not an official product specification document, therefore, please review and approve our official product specification before ordering this product. Note: This catalog is for reference only and not an official product specifica tion document, therefore, please review and approve our official product specification before ordering this product. MURATA MFG. CO., LTD.