Document Number: 001-98525 Rev. *A Page 4 of 83
Table of Contents
Distinctive Characteristics .................................................. 2
General Description ............................................................. 3
1. Product Selector Guide............................................... 5
2. Block Diagram.............................................................. 5
3. Connection Diagrams.................................................. 6
4. Pin Descripti ons......................................................... 10
5. Logic Symbols ........................................................... 11
6. Ordering Inform ation–S29GL032N........................... 13
7. Ordering Inform ation–S29GL064N........................... 15
7.1 Valid Combinations...................................................... 15
8. Device Bus Operations.............................................. 16
8.1 Word/Byte Configuration.............. ... ................ ............. 16
8.2 Requirements for Reading Array Data......................... 16
8.3 Writing Commands/Command Sequences.................. 17
8.4 Standby Mode.............................................................. 18
8.5 Automatic Sleep Mode................................................. 18
8.6 RESET#: Hardware Reset Pin..................................... 18
8.7 Output Disable Mode................................................... 18
8.8 Autoselect Mode.......................... ................................ 28
8.9 Advanced Sector Protection........................................ 30
8.10 Lock Register.............. ... ... ................ ........................... 30
8.11 Persistent Sector Protection ........................................ 31
8.12 Password Sector Protection......................................... 33
8.13 Password and Password Protection Mode Lock Bit .... 33
8.14 Persistent Protection Bit Lock (PPB Lock Bit).............. 34
8.15 Secured Silicon Sector Flash Memory Regi on ............ 34
8.16 Write Protect (WP#/ACC) ............................................ 35
8.17 Hardware Data Protection....................... ... ... .. ............. 35
9. Common Flash Memory Interface (CFI)................... 36
10. Command Definitions................................................ 40
10.1 Reading Array Data ..................................................... 40
10.2 Reset Command............ ... ........................................... 40
10.3 Autoselect Command Sequence ................................. 41
10.4 Enter/Exit Secured Silicon Sector
Command Sequence................................................... 41
10.5 Program Suspend/Program Resume
Command Sequence................................................... 45
10.6 Chip Erase Command Sequence ................................ 46
10.7 Sector Erase Command Sequence ............................. 47
10.8 Erase Suspend/Erase Resume Commands................ 49
10.9 Command Definitions................................................... 50
10.10Write Operation Status................................................ 55
10.11DQ7: Data# Polling...................................................... 55
10.12RY/BY#: Ready/Busy# ........................... ... ................. . 56
10.13DQ6: Toggle Bit I......................................................... 57
10.14DQ2: Toggle Bit II........................................................ 58
10.15Reading Toggle Bits DQ6/DQ2 ................................... 59
10.16DQ5: Exceeded Timing Limits..................................... 59
10.17DQ3: Sector Erase Timer............................................ 59
10.18DQ1: Write-to-Buffer Abort.......................................... 59
11. Absolute Maximum Ratings....................................... 60
12. Operating Ranges....................................................... 61
13. DC Characteristics...................................................... 62
14. Test Conditions........................................................... 63
14.1 Key to Switching Waveforms........................................ 63
15. AC Characteristics...................................................... 64
16. Erase And Programming Performance..................... 73
17. Physical Dimen sion s.................................................. 75
17.1 TS048—48-Pin Standard Thi n Small
Outline Package (TSOP).............................................. 75
17.2 TS056—56-Pin Standard Thi n Small
Outline Package (TSOP).............................................. 76
17.3 VBK048—Ball Fine-pitch Ball
Grid Array (BGA) 8.15x 6.15 mm Package................... 77
17.4 LAA064—64-Ball Fortified Ball
Grid Array (BGA) 13 x 11 mm Package........................ 78
17.5 LAE064-64-Ball Fortified Ball
Grid Array (BGA) 9 x 9 mm Package............................ 79
18. Revision History.......................................................... 80