Approval sheet
Open Mode Series
Page 6 of 10 ASC_ Open Mode_012O_AS Oct. 2012
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Condition Requirements
1.
Visual and
Mechanical
--- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance * Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1kHz±10%
D.F. ≤2.5%
4.
Dielectric
Strength
* To apply voltage:
100V ≥2.5 times VDC
200V~300V ≥2 times VDC
500V ≥1.5 times VDC
* Cut-off, set at 10mA
* TEST= 15 sec.
* RAMP=0
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
100V, To apply rated voltage for max. 120 sec.
≥200V, To apply rated voltage for 60 sec.
≥10GΩ or RxC≥100Ω-F whichever is smaller.
X7R=100V: RxC≥100Ω-F
6.
Temperature
Coefficient
With no electrical load.
Operating temperature: -55~125°C at 25°C
Within ±15%.
7.
Adhesive
Strength of
Termination
* Pressurizing force:
5N (≤0603) and 10N (>0603)
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second
until the deflection becomes 1 mm and then the pressure
shall be maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: X7R: within ±12.5%
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured
before the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before immerse the
capacitor in a eutectic solder.
* Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: X7R: within ±7.5%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.