PGA Sockets Low Insertion Force PGA Sockets
.100” (2.54mm) Standard Grid
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Cat. 16 Rev. 1
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. inch/(mm)
Footprint Dash #
If Applicable*
1 RIS 068 - 04 M G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
KIS - Peel-A-Way
FIS - FR-4
RIS - New Hi-Temp Molded
Number of Pins
004 to 484
*Footprints available online or
in separate booklet. See options on next page
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
RoHS Compliant:
G - Gold
T - Tin/Lead
®
Footprint Dash #
If Applicable*
1 ESX 503 - 234 M G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
KSX - Peel-A-Way
ESX - New Hi-Temp Molded
CSX - Hi-Temp Molded s
Number of Pins
004 to 2209
*Footprints available online or
in separate booklet. See options
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead s
RoHS Compliant:
G - Gold
T - Tin/Lead s
®
s = Not RoHS Compliant
RIS replaces HCIS, HCS, CIS, and CS.
Description: FR-4 (FIS)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Description: Peel-A-Way®(KIS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description: Molded (RIS)
Material: High Temp.Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Table of Models
Options
How To Order
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
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.062
(1.57)
PC Board
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.100
(2.54)
PC Board
Features:
•Low insertion force (1 oz. average
per pin)
•Screw-machined terminals with
multiple finger contacts for
reliability
• Closed bottom terminal for 100%
anti-wicking of solder
• Tapered entry for ease of insertion
• Custom designs available
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Tape Sealant - add 3M to end of part number
•Removable tape seal protects plated contact in harsh environments
•Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
•Spray flux without contaminating contact area
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Polyimide
Film
.005
(.13)
PGA Sockets
Low Insertion Force PGA Sockets
.100” (2.54mm) Standard Grid
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Cat. 16 Rev. 1
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Additional standard and custom terminals available.
See Terminals section online or consult factory.
.020 Dia.
(.51)
.125
(3.18)
.165
(4.19)
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
Standard Quick-Turn Terminals
Solder Preform Terminals
Type -04 Type -51 Type -01 Type -29
.157/(3.99) Hole Depth
.072 Dia.
(1.83)
.028 Dia.
(.71)
.120
(3.05)
.110
(2.79)
.058 Dia.
(1.47)
.038 Dia.
(.97)
.155
(3.94)
.031
(.79)
.020 Dia.
(.51)
.170
(4.32)
.165
(4.19)
.072 Dia.
(1.83)
Type -33 Type -50 Type -85 Type -176
.058 Dia.
(1.47)
.155
(3.95)
.031
(.79)
.034 Dia.
(.86)
Molded or FR-4 only Molded or FR-4 only
Type -210
Peel-A-Way® only
.058 Dia.
(1.47)
.034 Dia.
(.86)
.015
(.38) .155
(3.94)
.072 Dia.
(1.83)
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
.058 Dia.
(1.47)
.038 Dia.
(.97)
.155
(3.94)
.031
(.79)
Solder
Preform
Tin/Lead: Type -150 Tin/Lead: Type -151 Tin/Lead: Type -111
PC Board
Preform After
Solder Flow
Solder Preform
Intrusive Reflow Application
•Combines the labor of socket loading and solder
application into one operation.
•Eliminates the use of solder paste and screening
operation.
•Eliminates solder bridges and/or solder shorts
due to excess solder.
•Ensures a reliable solder joint with controlled
solder volume.
•Ideal for surface mount and mixed technology
applications.
• For custom solder preform terminal applications
consult factory.
Footprints:
•Full grid insulators loaded to your
specific footprint
•Open centers available upon
request (consult factory)
•Hundreds of footprints available
online
•Use our online Build-A-Part
feature or download a Footprints
Booklet in PDF format
.100/(2.54) Typ.
1.600 Sq.
(40.64)
200 Pins
Footprint Number 200-1
16 x 16 rows
Lead-free: Type -811 Lead-free: Type -812 Lead-free: Type -810
Available Online:
•Extraction Tools
•RoHS Qualification Test Report
Peel-A-Way® only Peel-A-Way® only Peel-A-Way® only Peel-A-Way® only
Peel-A-Way® only