Vacuum Fluorescent Display Module
Hardware Specification
Model: GU256X64C-3900B
Specification No: DS-1615-0001-01
Date of Issue: October 27, 2010 (00)
Revision: March 1, 2011 (01)
Published by
NORITAKE ITRON Corp. / Japan
http://www.noritake-itron.jp
This specification is subject to change without prior notice.
RoHS 2002/95/EC
This product complies with RoHS Directive 2002/95/EC
GU256X64C-3900B Hardware Specification
- 1 -
Contents
Contents .................................................................................................................................................................. 1
1 General Description ..................................................................................................................................... 2
1.1 Scope ........................................................................................................................................................ 2
1.2 Construction ............................................................................................................................................. 2
1.3 Outline....................................................................................................................................................... 2
1.4 Block Diagram ......................................................................................................................................... 2
2 General-purpose I/O port ............................................................................................................................ 3
3 Electrical Specifications ............................................................................................................................. 3
3.1 Absolute Maximum Ratings ................................................................................................................... 3
3.2 Electrical Ratings .................................................................................................................................... 3
3.3 Electrical Characteristics ........................................................................................................................ 4
4 Environmental Specifications.................................................................................................................... 5
5 Optical Specifications .................................................................................................................................. 5
6 Physical Specifications ............................................................................................................................... 5
7 Applicable Specifications ........................................................................................................................... 5
8 Interface........................................................................................................................................................... 5
8.1 Interface timing ........................................................................................................................................ 5
8.1.1 Parallel interface timing 1 (Not applicable for bit image data transfer in DMA mode) ..................... 5
8.1.2 Parallel interface timing 2 (Applicable for bit image data transfer in DMA mode) ............................ 6
8.1.3 RS-232 Asynchronous serial interface timing ..................................................................................... 6
9 Setup ................................................................................................................................................................ 7
9.1 DIP-Switch (SW1) ................................................................................................................................... 7
10 Connectors ................................................................................................................................................. 7
10.1 Parallel interface & Power connector (CN2) ....................................................................................... 7
10.2 RS-232 Interface & Power connector (CN3) ....................................................................................... 7
10.3 General-purpose I/O Port through-holes (CN1) ................................................................................. 7
10.4 Connector position .................................................................................................................................. 8
11 Physical Dimensions ................................................................................................................................... 9
Notice for the Cautious Handling of VFD Modules .................................................................................... 10
Revision history ................................................................................................................................................... 11
GU256X64C-3900B Hardware Specification
- 2 -
Note: FROM re-write rating is
approximately 10,000 times.
1 General Description
1.1 Scope
This specification covers the hardware aspects of the GU256X64C-3900B vacuum fluorescent graphic
display module.
1.2 Construction
The module consists of a 256 × 64 dot graphic BD-VFD, refresh RAM, character generator, DC/DC
converter, display controller, and all necessary control logic. The module can simultaneously display
graphic patterns and characters on the screen.
1.3 Outline
Power supply: + 5 VDC only
Interface: Parallel interface (CMOS)
Serial interface (Asynchronous, RS-232 -level)
I/O port: 12 bits General-purpose I/O port
Protocol: Direct mode
Packet mode
Function: Character display
Graphic display
Control command
Display action command
Draw command
Window function
General-purpose I/O port control
Macro, Program Macro function
Character and Bit Image download function
Memory SW
Display power auto-OFF function
General-purpose data storage
For full details, refer to:
DS-1600-0008-XX: GU-3900B series “General Function” Software Specification.
DS-1600-0006-XX: “Program Macro” software specification.
1.4 Block Diagram
DC/DC
Converter
F1 Filament
Anode/Grid
F2 Filament
GND
VCC
RS-232
interface IC
FROM (32Mbit)
Firmware
Fonts
Memory SW
BD-VFD
Parallel I/F
Connecter
RS-232 I/F
Connecter
DIP-SW
I/O Port
Through-holes
GU256X64C-3900B Hardware Specification
- 3 -
+5V
CPU
GU256X64C-3900B
47kΩ
47kΩ
47kΩ
47kΩ
47Ω
47Ω
47Ω
Port0-b7
Port0-b0
Port1-b3
Port1-b0
General-purpose I/O Port
Input/Output port
×8
Input/Output port
×4
VCC
+5V
VCC
GND
GND
47Ω
2 General-purpose I/O port
Refer to 3.3 Electrical Characteristics, “General-purpose I/O port supply Voltage”.
For controlling, refer to “General Function” Software Specification, “I/O Port Input / Output setting”, “I/O Port
Output”, and “I/O Port Input”.
3 Electrical Specifications
3.1 Absolute Maximum Ratings
Power Supply Voltage
Parameter
Symbol
Min.
Typ.
Max.
Unit
Note
Power Supply Voltage
VCC
−0.3
-
+6.0
VDC
Logic Supply Voltage
Parameter
Symbol
Min.
Typ.
Max.
Unit
Note
Parallel I/F
D0 – D7, /WR
VpIN
−0.3
-
Vcc+0.3
VDC
RS-232 I/F
RXD, DSR
VsIN
−25
-
+25
VDC
I/O port supply Voltage
Parameter
Symbol
Min.
Typ.
Max.
Unit
Note
I/O port
Port 0, Port 1
ViIN
−0.3
-
Vcc+0.3
VDC
3.2 Electrical Ratings
Parameter
Symbol
Min.
Typ.
Max.
Unit
Note
Power Supply Voltage
VCC
4.75
5.0
5.25
VDC
All driving voltage for the VFD is converted from the on-board DC/DC converter.
GU256X64C-3900B Hardware Specification
- 4 -
3.3 Electrical Characteristics
Logic input/output condition
Measuring Conditions: Ambient temperature = 25 ºC, VCC=5.0VDC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Note
Parallel I/F
Logic input current
D0 – D7, /WR
IpIH
-
-
1.0
uADC
-
-
IpIL
-
-
−200
uADC
-
-
Logic input voltage
D0 – D7, /WR
VpIH
0.8VCC
VCC
VDC
-
-
VpIL
0
0.2VCC
VDC
-
-
Logic output voltage
RDY
VpOH
3.5
VCC
VDC
IOH=−10μA
(1)
VpOL
0
0.6
VDC
IOL=4mA
RS-232 I/F
Logic input voltage
RXD, DSR
VsIH
3
-
15
VDC
-
-
VsIL
−15
-
−3
VDC
-
-
Logic output voltage
TXD, DTR
VsOH
5
-
-
VDC
RL=3kΩ
-
VsOL
-
-
−5
VDC
-
Logic input Impedance
RXD, DSR
RsIN
3
-
7
kΩ
-
(1) “RDY” terminal is open collector (pulled-up by 47kΩ)
General-purpose I/O port supply Voltage
Measuring Conditions: Ambient temperature = 25 ºC, VCC=5.0VDC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Note
General-purpose
I/O port
Logic input current
Port 0, 1
IiIH
-
-
1.0
μADC
-
-
IiIL
-
-
−200
μADC
-
-
Logic input voltage
Port 0, 1
ViIH
4.1
-
VCC
VDC
-
-
ViIL
0
-
0.8
VDC
-
-
Logic output voltage
Port 0, 1
ViOH
VCC−0.6
-
-
VDC
IOH=−200μA
-
ViOL
-
-
0.5
VDC
IOL=1.6mA
General-purpose I/O port output permissible current
Measuring Conditions: Ambient temperature = 25 ºC, VCC=5.0VDC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Note
General-purpose
I/O port
Output permissible
current Port 0, 1
(Single port)
IiOH
-
-
1.5
mADC
-
-
IiOL
-
-
3
mADC
-
-
Output permissible
current Port 0, 1
(Sum of all ports)
IiOH
-
-
8
mADC
-
-
IiOL
-
-
30
mADC
-
-
Output current should not exceed the values in the above table.
If driving LED or other device directly, insert appropriate current limiter into output line.
Power Supply condition
Measuring Conditions: Ambient temperature = 25 ºC, VCC=5.0VDC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Power Supply Current 1
ICC1
-
0.43
0.56
ADC
All dots ON
Power Supply Current 2
ICC2
-
0.33
0.43
ADC
All dots OFF
Power Supply Current 3
ICC3
-
80
120
mADC
Display power OFF
Power Consumption
-
2.15
2.80
W
All dots ON
Note:
The rise time of supply voltage should not exceed 100ms.
Inrush current at power-on may exceed twice normal current.
Display power OFF: Refer to “General Function” Software Specification, “Display power
ON/OFF/auto-OFF” command.
Vcc
TR
RDY
R47kΩ
Module
Display
Controller
GU256X64C-3900B Hardware Specification
- 5 -
4 Environmental Specifications
Operating temperature: −40 to +85 ºC
Storage temperature: −40 to +85 ºC
Storage humidity: 20 to 80 % R.H (Non Condensing)
Vibration (non-operating): 10-55-10Hz, all amplitude 1mm, 30 minutes, X-Y-Z
Shock (non-operating): 392m/s2 (40G) 9ms X-Y-Z, 3 times each direction
5 Optical Specifications
Luminance: 250cd/m2 Min. (500cd/m2 Typ.)
Color of illumination: Green (Blue Green)
6 Physical Specifications
Number of dots: 16,384 (256 × 64)
Display area: 83.08mm × 20.68mm (X × Y)
Dot size: 0.2mm × 0.2mm (X × Y)
Dot pitch: 0.325mm × 0.325mm (X × Y)
Weight: Approximately 65g
7 Applicable Specifications
Applicable reliability specification: TT-99-3102
Applicable production specification: TT-98-3413
8 Interface
Parallel and RS-232 Serial interfaces are available on this module.
8.1 Interface timing
8.1.1 Parallel interface timing 1 (Not applicable for bit image data transfer in DMA mode)
Note: RDY=0 (BUSY) is output after every byte.
Internal receive buffer capacity is 256 bytes. After data is input, RDY signal is immediately set to
RDY=0 (BUSY) until the received byte is stored to the receive buffer. If the internal receive buffer is
full, RDY signal will remain BUSY until space for 1 byte becomes available. The required time for
this varies, depending on the type of commands and rate at which data is input. The RDY signal
should always be checked before writing data.
Min.
10ns
Min.
50ns
Max.
500ns
1μs
RDY
D0-D7
/WR
Min.
100ns
READY
BUSY
1
0
1
0
GU256X64C-3900B Hardware Specification
- 6 -
8.1.2 Parallel interface timing 2 (Applicable for bit image data transfer in DMA mode)
Note: Monitoring RDY signal is not necessary for bit image data transfer in DMA mode.
8.1.3 RS-232 Asynchronous serial interface timing
The above timing is RS-232 level. Logical value is the inverse of the above. (VsIH: 0, VsIL: 1)
Interface:
Baud rate
4800, 9600, 19200, 38400 (default), 57600, 115200bps
(Selected by DIP SW and Memory-SW)
Parity
None (default), Even, Odd
Format
Start (1 bit) + Data (8 bits) [+ Parity (1 bit)] + Stop (1 bit)
Handshake
DTR, DSR
Buffer Capacity
Receive buffer
256 bytes
Transmit buffer
128 bytes
DTR signal change timing
DTR change
1 (READY) → 0 (BUSY)
0 (BUSY) → 1 (READY)
Receive buffer space
32 bytes or less
64 bytes or more
DTR
RXD
Min.
0μs
0
1
DSR
TXD
Min.
0μs
Max.
2 bytes
0
1
READY
BUSY
READY
BUSY
Max.
24 bytes
Min.
10ns
Min.
50ns
Min.
15μs
D0-D7
/WR
Min.
100ns
1
0
1
0
GU256X64C-3900B Hardware Specification
- 7 -
9 Setup
9.1 DIP-Switch (SW1)
SW No.
Function
Default
1
Display address select
(For multi-connection)
Off
2
Off
3
Off
4
Off
5
RS-232 interface setting
Off
6
Command mode select
Off
7
Operating Mode select
Off
8
Protocol select
Off
For DIP-SW setup details, refer to “General Function” Software Specification, “Setup”.
10 Connectors
10.1 Parallel interface & Power connector (CN2)
Pin
No.
Signal
name
Function
Direction
Pin
No.
Signal
name
Function
Direction
1
D7
Data input
Input
2
D6
Data input
Input
3
D5
Data input
Input
4
D4
Data input
Input
5
D3
Data input
Input
6
D2
Data input
Input
7
D1
Data input
Input
8
D0
Data input
Input
9
GND
Ground
Input
10
/WR
Data write
Input
11
GND
Ground
Input
12
RDY
Display READY
Output
13
GND
Ground
Input
14
GND
Ground
Input
15
VCC
Power supply (5V)
Input
16
VCC
Power supply (5V)
Input
10.2 RS-232 Interface & Power connector (CN3)
Pin No.
Signal name
Function
Direction
1
RXD
Data receive
Input
2
DTR
Display busy
Output
3
DSR
Host busy
Input
4
TXD
Data send
Output
5
TEST *
TEST (Factory use only)
Input
6
VCC
Power supply (5V)
Input
7
GND
Ground
Input
* Factory use only (leave this pin open)
10.3 General-purpose I/O Port through-holes (CN1)
Pin
No.
Signal
name
Function
Direction
Pin
No.
Signal
name
Function
Direction
1
Bit 7
Input/Output
Port 0
Input/Output
8
Bit 0
Port 0
Input/Output
2
Bit 6
9
Bit 3
Input/Output
Port 1
Input/Output
3
Bit 5
10
Bit 2
4
Bit 4
11
Bit 1
5
Bit 3
12
Bit 0
6
Bit 2
13
VCC
Power supply (5V)
Input
7
Bit 1
14
GND
Ground
Input
GU256X64C-3900B Hardware Specification
- 8 -
10.4 Connector position
pin 1
pin 16
pin 2
pin 15
P
C
B
pin 1
pin 7
RS-232 Interface & Power connector
JST: B7B-XH-A or equivalent
Parallel interface & Power connector
IRISO: IMSA-9032B-16P or equivalent
GU256X64C-3900B Hardware Specification
- 9 -
11 Physical Dimensions
GU256X64C-3900B Hardware Specification
- 10 -
Notice for the Cautious Handling of VFD Modules
Handling and Usage Precautions:
Please carefully follow the appropriate product application notes and operation standards for proper usage, safe handling, and
maximum performance.
[VFD tubes are made of glass]
The edges of the VFD glass envelope are not smooth, so it is necessary to handle carefully to avoid injuries to hands.
Use caution to avoid breaking the VFD glass envelope, to prevent injury from sharp glass particles.
The tip of the exhaust pipe is fragile so avoid shock from impact.
It is recommended to allow sufficient open space surrounding the exhaust pipe to avoid possible damage.
Please design the PCB for the VFD module within 0.3 mm warping tolerance to avoid any forces that may damage the
display due to PCB distortion causing a breakdown of the electrical circuit leading to VFD failure.
[High voltage]
Avoid touching conductive electrical parts, because the VFD module uses high voltage exceeding 30 – 100 volts.
Even when electric power is turned off, it may take more than one minute for the electrical current to discharge.
[Cable connection]
Do not unplug the power and/or data cables of VFD modules during operation, because unrecoverable damage may
result.
Sending input signals to the VFD module when not powered can cause I/O port damage.
It is recommended to use a 30cm or shorter signal cable to prevent functional failures.
[Electrostatic charge]
VFD modules need electrostatic-free packaging and protection from electrostatic charges during handling and usage.
[Structure]
During operation, VFD and VFD modules generate heat. Please consider sufficient heat radiation dissipation using heat
sink solutions.
Preferably, use UL-grade materials or components in conjunction with VFD modules.
Warp and twist movement causes stress and may break VFDs and VFD modules. Please adhere to allowances within
0.3mm at the point of attachment.
[Power]
Apply regulated power to the VFD module within specified voltages to protect from failures.
VFD modules may draw in-rush current exceeding twice the typical current at power-on, so a power supply with sufficient
capacity and quick starting of the power regulator is recommended.
VFD module needs a specified voltage at the point of connection. Please use an adequate power cable to avoid a
decrease in voltage. As a safety measure, a fuse or other over-current protection is recommended.
[Operating consideration]
Illuminating phosphor will decrease in brightness during extended operation. If a fixed pattern illuminates for an extended
period (several hours), the phosphor efficiency will decrease compared to the non-operating phosphor, causing
non-uniform brightness. Please consider programming the display patterns to use all phosphor segments evenly.
Scrolling may be a consideration for a period of time to refresh the phosphor condition and improve even illumination of
the pixels.
A signal cable 30cm or less is recommended to avoid possible disturbances to the signal.
[Storage and operating environment]
Please use VFD modules under the recommended specified environmental conditions. Salty, sulfuric and dusty
environments may damage the VFD module even during storage.
[Disposal]
VFD uses lead-containing materials (RoHS directive exempts these lead compounds in the glass for electronic devices).
When discarding VFDs or VFD modules, please adhere to applicable laws and regulations.
[Other cautions]
Although the VFD module is designed to be protected from electrical noise, please plan your circuitry to exclude as much
noise as possible.
Do not reconstruct or repair the VFD module without our authorization. We cannot assure the quality or reliability of
unauthorized reconstructed VFD modules.
Notice:
We do not authorize the use of any patents that may be inherent in these specifications.
Neither whole nor partial copying of these specifications is permitted without our approval. If necessary, please ask for
assistance from our sales consultant.
This product is not designed for military, aerospace, medical or other life-critical applications. If you choose to use this
product for these applications, please ask us for prior consultation or we cannot accept responsibility for problems that
may occur. MBBZ-009-S18A
GU256X64C-3900B Hardware Specification
- 11 -
Revision history
Specification number
Date
Revision
DS-1615-0001-00
Oct. 27, 2010
Initial Issue.
DS-1615-0001-01
Mar. 1, 2011
·The complementary information (VsIH: 0, VsIL: 1) has been added to "8.1.3
RS-232 Asynchronous serial interface timing".
·“11 Physical Dimensions” has been changed.
·"Notice for the Cautious Handling VFD Modules" has been revised.
·”Revision history” has been added.
Mouser Electronics
Authorized Distributor
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GU256X64C-3900B