BALF-2690-02D3 50 ohm nominal input / conjugate match balun for STLC2690, with integrated harmonic filter Datasheet - production data Description STMicroelectronics BALF-2690-02D3 is a balun design to transform single ended signal to differential signals in Bluetooth applications. This BALF-2690-02D3 has been customized for STLC2690 Bluetooth transceiver with less than 1.2 dB insertion losses in the bandwidth (2400 MHz-2500 MHz). Flip-Chip package 4 bumps Features * 50 nominal input / matched output differential impedance The BALF-2690-02D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate which optimize RF performance. Figure 1. Device configuration (top view) * Integrated harmonic filter 1 * Low insertion loss * Low amplitude imbalance 2 A SE * Low phase imbalance * Small footprint < 1.54 mm GND B DIFF C Benefits * Very low profile (< 560 m after reflow) * High RF performance DIFF * RF BOM and area reduction Applications * Bluetooth STLC2690 application * Mobile phone application Figure 2. Application schematic Antenna STLC2690 BALF-2690-02D3 RF_P Z IN RF_N GND September 2015 This is information on a product in full production. DocID025234 Rev 4 1/9 www.st.com 9 Characteristics 1 BALF-2690-02D3 Characteristics Table 1. Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. PIN Typ. Max. 10 13 Input power RFIN VESD TOP ESD rating, human body model (JESD22-A114-C) all I/O one at a time while others connected to GND 2000 ESD rating, machine model, all I/O 200 Operating temperature range -40 dBm V +85 C Table 2. Impedances (Tamb = 25 C) Value Symbol Parameter Unit Min. ZDIFF ZSE Nominal differential impedance Typ. Max. matched to STLC2690 Nominal single-ended impedance 50 Table 3. RF performance (Tamb = 25 C) Value Symbol Parameter Test condition Unit Min. f Frequency range (bandwidth) IL Insertion loss in bandwidth RL_SE 2/9 2400 Return loss in bandwidth 15 imb Output phase imbalance (single ended) -10 Aimb Output amplitude imbalance -1 Common mode rejection (SSC12) 20 CMRR Typ. Att2fo 2nd harmonic S21 attenuation 4800-5000 MHz 31 Att3f0 3rd harmonic S21 attenuation 7200-7500 MHz 36 Max. 2500 MHz +1.2 dB 21 dB 0.5 +10 1 dB dB dB DocID025234 Rev 4 BALF-2690-02D3 1.1 Characteristics Measurements Figure 3. Return loss (Tamb = 25 C) Figure 4. Insertion loss (Tamb = 25 C) (dB) -15.0 -0.5 (dB) -0.6 -17.5 -0.7 -0.8 -20.0 -0.9 -22.5 -1.0 -25.0 -1.2 -1.1 -1.3 -27.5 -1.4 F (GHz) F (GHz) -30.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 -1.5 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 5. Phase imbalance (Tamb = 25 C) Figure 6. Amplitude imbalance (Tamb = 25 C) (dB) (deg) 15 1.0 0.9 10 0.8 0.7 5 0.6 0 0.5 0.4 -5 0.3 -10 0.2 F (GHz) -15 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 0.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 7. Transmission: 2nd harmonic (dB) (Tamb = 25 C) Figure 8. Transmission: 3rd harmonic (dB) (Tamb = 25 C) -25.0 (dB) 0.1 F (GHz) -25.0 -27.5 -27.5 -30.0 -30.0 -32.5 -32.5 -35.0 -35.0 -37.5 -40.0 4.80 (dB) -37.5 F (GHz) F (GHz) 4.82 4.84 4.86 4.88 4.90 4.92 4.94 4.96 4.98 -40.0 5.0 7.20 DocID025234 Rev 4 7.25 7.30 7.35 7.40 7.45 7.50 3/9 Characteristics BALF-2690-02D3 Figure 9. Transmission (dB) 0 (dB) -10 -20 -30 -40 -50 -60 F (GHz) -70 0 4/9 1 2 3 4 5 DocID025234 Rev 4 6 7 8 9 10 BALF-2690-02D3 2 Package information Package information * Epoxy meets UL94, V0 * Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Flip-Chip package information Figure 10. Flip-Chip package outline 7RSYLHZ VLGHYLHZ $ $ %RWWRPYLHZ 6( 'LDPE I' 6( ' ' FFF & *1' & *1' ' ' ',)) ',)) 2.1 ',)) ',)) I' ( I( ( I( $ Table 4. Flip-Chip package mechanical data Parameter Description Min. Typ. Max. Unit A Bump height + substrate thickness 0.570 0.630 0.690 mm A1 Bump height 0.155 0.205 0.255 mm A2 Substrate thickness 0.400 mm b Bump diameter 0.215 0.255 0.295 mm D Y dimension of the die 1.590 1.640 1.690 mm D1 Y pitch 0.660 mm D2 Y pitch2 0.540 mm E X dimension of the die E1 X pitch 0.500 mm fD Distance from bump to edge of die on Y axis 0.225 mm fE Distance from bump to edge of die on X axis 0.215 mm 0.890 0.940 ccc 0.990 0.05 $ 0.025 DocID025234 Rev 4 mm mm mm 5/9 Package information BALF-2690-02D3 Figure 11. Footprint ',)) 6( P ',)) *1' P Figure 12. Footprint - 3 mils stencil -non solder mask defined P Figure 13. Footprint - 3 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG Figure 14. Footprint - 5 mils stencil -non solder mask defined 6/9 P Figure 15. Footprint - 5 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP DocID025234 Rev 4 BALF-2690-02D3 Package information Figure 16. Marking Figure 17. Recommended land pattern 800 m Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode Width 120 m x x z y ww Pads diameter 220 m (Solder mask opening 300 m) GND clearance 130m 'RWLGHQWLI\LQJ3LQ $ORFDWLRQ Figure 18. Flip Chip tape and reel specifications 67 67 67 [[] \ZZ [[] \ZZ [[] \ZZ $OOGLPHQVLRQVDUHW\SLFDOYDOXHVLQPP Note: 8VHUGLUHFWLRQRIXQUHHOLQJ More information is available in the STMicroelectronics application notes: AN2348 Flip-Chip: "Package description and recommendations for use" DocID025234 Rev 4 7/9 Ordering information 3 BALF-2690-02D3 Ordering information Table 5. Ordering information 4 Order code Marking Weight Base Qty Delivery mode BALF-2690-02D3 SP 1.81 mg 5000 Tape and Reel Revision history Table 6. Document revision history 8/9 Date Revision Changes 27-Sep-2013 1 Initial release 19-Dec-2013 2 Added product weight in Table 5 and updated Table 1. 19-Nov-2014 3 Added tape and reel dimensions. 02-Sep-2015 4 Updated Figure 10. Added Figure 12, Figure 13, Figure 14, Figure 15 and Table 4. DocID025234 Rev 4 BALF-2690-02D3 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2015 STMicroelectronics - All rights reserved DocID025234 Rev 4 9/9