This is information on a product in full production.
September 2015 DocID025234 Rev 4 1/9
9
BALF-2690-02D3
50 ohm nominal input / conjugate match balun for STLC2690,
with integrated harmonic filter
Datasheet − production data
Features
•50 Ω nom inal input / matched output differential
impedance
•Integrated harmonic filter
•Low insertion loss
•Low amplitude imbalance
•Low phase imbalance
•Sm all footpr int < 1.54 mm²
Benefits
•Very low profile (< 560 µm after re flow)
•High RF performance
•RF BOM and area reduct ion
Applications
•Blu etooth STLC26 90 application
•Mobi le phone appl ication
Description
STMicroelectronics BALF-2690-02D3 is a balun
design to transform single ended signa l to
differential signals in Bluetooth applications. This
BALF-2690-02D3 has been cus tomized for
STL C2690 B luetooth transceiver with less than
1.2 dB insertion losses in the bandwidth
(2400 MHz-2500 MHz).
The BALF -2690-02D3 has been designed using
STMicroel ec tronics IPD (integrated passive
device ) technolog y on non-cond uctive glass
substrate which optimize RF performance.
Figure 1. Device configuration (top view)
Figure 2. Application sch em atic
Flip-Chip package 4 bumps
DIFF DIFF
SE
12
A
B
GND
C
ZIN
BALF-2690-02D3
STLC2690
Antenna
GND
RF_P
RF_N
www.st.com
Characteristics BALF-2690-02D3
2/9 DocID025234 Rev 4
1 Characteristics
Table 1. Absolute maximum rati ng s (limiting values)
Symbol Parameter Value Unit
Min. Typ. Max.
PIN Input power RFIN 10 13 dBm
VESD
ESD rating, human body model (JESD22-A114-C) all I/O one at a time
whil e others connected to GND 2000 V
ESD rating, machine model, all I/ O 200
TOP Operating temperature range -40 +85 °C
Table 2. I m pedanc es (Tamb = 25 °C)
Symbol Parameter Value Unit
Min. Typ. Max.
ZDIFF Nominal differen ti al impedance matched to ST LC2690 Ω
ZSE Nominal si ngle-ended i m pedance 50
Tabl e 3. RF performance (Tamb = 25 °C)
Symbol Parameter Test condition Value Unit
Min. Typ. Max.
f Frequency range (bandwidth) 2400 2500 MHz
ILInsertion loss in bandwidth +1.2 dB
RL_SE Return loss in bandwidth 15 21 dB
φimb Out put phase imbalance (single ended) -10 +1 0 °
Aimb Output amplitude imbalance -1 0.5 1 dB
CMRR Common mode re jection (SSC12)20dB
Att2fo 2n d harmonic S21 attenuation 4800-5000 MHz 31 dB
Att3f0 3rd harm onic S21 attenuation 7200-7500 MHz 36
DocID025234 Rev 4 3/9
BALF-2690-02D3 Characteristics
1.1 Measurements
Figure 3. Return loss (Tamb = 25 °C) Figure 4. Insertion loss (Tamb = 25 °C)
(dB)
-15.0
-17.5
-20.0
-22.5
-25.0
-27.5
F (GHz)
2.502.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49
-30.0
(dB)
F (GHz)
-0.5
-0.9
-0.6
-1.0
-0.7
-1.1
-0.8
-1.2
-1.3
-1.4
2.502.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49
-1.5
Figure 5. Pha se imb alance (Tamb = 25 °C) Figure 6. Amplitude imbala nce (Tamb = 25 °C)
(deg)
15
10
5
0
-5
-10
2.502.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49
F (GHz)
-15
(dB)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
F (GHz)
2.502.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.492.40
0.0
Figure 7. Transmission: 2nd harmonic (dB)
(Tamb =25 °C) Figure 8. Transmission: 3rd harmonic (dB)
(Tamb = 25 °C)
(dB)
F (GHz)
-25.0
-27.5
-30.0
-32.5
-35.0
-37.5
-40.0
4.80 4.82 4.84 4.86 4.88 4.90 4.92 4.94 4.96 4.98 5.0
Characteristics BALF-2690-02D3
4/9 DocID025234 Rev 4
Figure 9. Transmissi on (dB)
(dB)
F (GHz)
0
-10
-20
-30
-40
-50
-60
-70
03456789
10
12
DocID025234 Rev 4 5/9
BALF-269 0-02D3 Packag e informati on
2 Package information
•Epoxy meets UL94, V0
•Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages , depe nding on their level of environmen tal co mpl iance. ECO PA CK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark .
2.1 Flip-Chip package information
Figure 10. Flip-Chip package outline
Tabl e 4. Flip-Chip pack age mechanical data
Parameter Description Min. Typ. Max. Unit
A Bump height + substr ate thickness 0.570 0.630 0.690 mm
A1 Bump height 0.155 0.205 0.255 mm
A2 Substrate thicknes s 0.400 mm
b Bump diameter 0.215 0.255 0.295 mm
D Y dimension of the die 1.590 1.640 1.690 mm
D1 Y pitch 0.660 mm
D2 Y pitch2 0.540 mm
E X dimension of the die 0. 890 0.940 0.990 mm
E1 X pitch 0.500 mm
fD Dist ance from bump to edge of di e on Y
axis 0.225 mm
fE Dist ance from bump to edge of di e on X
axis 0.215 mm
ccc 0.05 mm
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6/9 DocID025234 Rev 4
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DocID025234 Rev 4 7/9
BALF-269 0-02D3 Packag e informati on
Figure 18. Flip Chip tape and reel specifications
Note: More information is available in the STMicroelectronics application not es:
AN2348 Flip-Chip: “Package desc ription and recommendations for use”
Figure 16. Marking Figure 17. Recommended land p attern
x
y
x
w
z
w
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing
location
yww = datecode
800 µm
Pads diameter 220 µm
(Solder mask
opening 300 µm)
GND clearance 130µm
Width 120 µm
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Order ing information BALF-2690-02D3
8/9 DocID025234 Rev 4
3 Ordering information
4 Revision history
Table 5. Ordering information
Order code Marking Weight Base Qty Delivery mode
BALF-2690-02D3 SP 1.81 mg 5000 Tape and Reel
Table 6. Document revision history
Date Revision Changes
27-Sep-2013 1 Initial rel ease
19-Dec-2013 2 Added product weigh t in Table 5 and updated Table 1.
19-Nov-2014 3 Added tape and reel dimensions.
02-Sep-2015 4 Updated Figure 10. Added Figure 12, Figure 13, Figure 14,
Figure 15 and Table 4.
DocID025234 Rev 4 9/9
BALF-2690-02D3
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the design of Purchasers’ products.
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